PACKAGE OPTION ADDENDUM www.ti.com 18-Dec-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty TLV2460AQDRQ1 OBSOLETE SOIC D 8 TLV2460AQPWRG4Q1 ACTIVE TSSOP PW 8 TLV2460AQPWRQ1 OBSOLETE TSSOP PW 8 TLV2460QDRQ1 OBSOLETE SOIC D 8 TLV2460QPWRG4Q1 ACTIVE TSSOP PW 8 TLV2460QPWRQ1 OBSOLETE TSSOP PW TLV2461AQDRQ1 OBSOLETE SOIC D TLV2461AQPWRG4Q1 ACTIVE TSSOP PW 8 TLV2461AQPWRQ1 OBSOLETE TSSOP PW TLV2461QDRQ1 OBSOLETE SOIC D TLV2461QPWRG4Q1 ACTIVE TSSOP PW 8 TLV2461QPWRQ1 OBSOLETE TSSOP PW 8 TLV2462AQDRG4Q1 ACTIVE SOIC D 8 TLV2462AQDRQ1 ACTIVE SOIC D TLV2462AQPWRG4Q1 ACTIVE TSSOP TLV2462AQPWRQ1 ACTIVE TLV2462QDGKRQ1 2000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TBD Call TI Call TI -40 to 125 2460AQ Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2460AQ TBD Call TI Call TI -40 to 125 TBD Call TI Call TI -40 to 125 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 8 TBD Call TI Call TI -40 to 125 8 TBD Call TI Call TI -40 to 125 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 8 TBD Call TI Call TI -40 to 125 8 TBD Call TI Call TI -40 to 125 2461Q1 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2461Q1 TBD Call TI Call TI -40 to 125 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AQ 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AQ PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AQ TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AQ ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 QVM TLV2462QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462Q1 TLV2462QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462Q1 TLV2462QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462Q1 TLV2462QPWRQ1 OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 2000 2000 2000 Addendum-Page 1 2460Q1 2461AQ Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Dec-2015 Status (1) Package Type Package Pins Package Drawing Qty TLV2463AQDRQ1 OBSOLETE SOIC D 14 TLV2463AQPWRG4Q1 ACTIVE TSSOP PW 14 TLV2463AQPWRQ1 OBSOLETE TSSOP PW TLV2463QDRQ1 OBSOLETE SOIC D TLV2463QPWRG4Q1 ACTIVE TSSOP PW 14 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) (4/5) TBD Call TI Call TI -40 to 125 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 14 TBD Call TI Call TI -40 to 125 14 TBD Call TI Call TI -40 to 125 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2000 Device Marking 2463AQ1 2463Q1 TLV2463QPWRQ1 OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 TLV2464AQPWRG4Q1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2464AQ TLV2464AQPWRQ1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2464AQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Dec-2015 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV2460-Q1, TLV2460A-Q1, TLV2461-Q1, TLV2461A-Q1, TLV2462-Q1, TLV2462A-Q1, TLV2463-Q1, TLV2463A-Q1, TLV2464A-Q1 : • Catalog: TLV2460, TLV2460A, TLV2461, TLV2461A, TLV2462, TLV2462A, TLV2463, TLV2463A, TLV2464A • Enhanced Product: TLV2462A-EP, TLV2464A-EP • Military: TLV2460M, TLV2461M, TLV2462M, TLV2462AM, TLV2463AM NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications Addendum-Page 3