PHILIPS TEA1703T

TEA1703T
GreenChip SMPS standby control IC
Rev. 2.3 — 28 April 2011
Product data sheet
1. General description
The TEA1703T is a low power standby controller IC intended to be used in applications
which require an extreme low no-load standby power.
The TEA1703T includes circuitry for detecting output voltage, output power and switching.
The TEA1703T integrates a switched-mode optocoupler driver, which enables an
optocoupler to be driven with a high peak current while keeping the required power low1.
The TEA1703T’s typical current consumption is 30 μA. In a typical notebook adapter
application the TEA1703T’s power consumption is less than 0.5 mW.
2. Features and benefits
„ Switched-Mode Power Supply (SMPS) standby controller IC enabling very low power
standby operation
„ Large input voltage range (5 V up to 30 V)
„ Very low supply current (30 μA) typical
„ Switched-mode optocoupler driver output (NXP Semiconductors patented)
„ Easy application, only 6 pins to connect
3. Applications
The device can be used in applications that require a very low power no-load standby.
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
TEA1703T
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
1.
NXP Semiconductors patented.
TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
5. Block diagram
TEA1703T
0.94 µA
REFERENCE
AND
SUPPLY
1
VCC
8
voltage sense
VSENSE
1.22 V
2
GND
power sense
3
OPTO
0.5 V
1.3 µA
7
6
switch detect
OSCILLATOR
PSENSE
SWDET
4
n.c.
5
n.c.
001aan119
Fig 1.
Block diagram
6. Pinning information
6.1 Pinning
VCC
1
8
VSENSE
GND
2
7
PSENSE
OPTO
3
6
SWDET
n.c.
4
5
n.c.
TEA1703T
001aan120
Fig 2.
Pin configuration (SOT96-1)
6.2 Pin description
Table 2.
TEA1703T
Product data sheet
Pin description
Symbol
Pin
Description
VCC
1
supply voltage
GND
2
ground
OPTO
3
optocoupler driver
n.c.
4, 5
not connected
SWDET
6
switch detect input
PSENSE
7
power sense input
VSENSE
8
voltage sense input
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Rev. 2.3 — 28 April 2011
© NXP B.V. 2011. All rights reserved.
2 of 15
TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
7. Functional description
7.1 General control
The TEA1703T contains a standby controller for switched-mode power supplies. Typical
configurations are shown in Figure 3 and Figure 4.
Typically the TEA1703T senses the output voltage and output power of a switched-mode
power supply. The output voltage is sensed via a resistive divider network connected to
pin VSENSE. The output power is sensed by determining the switching frequency of the
converter using an external filtering network. The converter output power is dependent on
the switching frequency, such as in a discontinuous conduction mode flyback converter
which has a fixed primary peak current during low load operation.
A switching detection input on pin SWDET disables the TEA1703T output when the
primary-side controller is not switching. TEA1753’s pin VINSENSE is used to reset a
latched protection and for standby control. If the TEA1753 is not switching due to latched
protection, the TEA1703T will not activate standby mode. Activating standby mode resets
latched protection.
When configured with the TEA1733, switching detection is only required if the
primary-side VCC (TEA1733 pin 1) is discharged below the latched protection reset level.
In Figure 4 a Zener diode is connected in series with the NPN transistor which discharges
VCC on pin 1. The Zener diode is chosen to keep VCC on pin 1 just below the TEA1733’s
VCC start-up level while the application is in standby mode, guaranteeing a short restart
time. If the Zener diode is omitted, the switching detection input must be connected as
shown in Figure 4, otherwise pin VCC can be connected via a series resistor to a fixed
voltage.
The TEA1703T has an open-drain optocoupler driver output with an integrated diode to
pin VCC. The optocoupler is efficiently driven in pulse mode which ensures that the
optocoupler’s Current Transfer Ratio (CTR) remains high; see Section 7.7 and
Section 7.8.
TEA1703T
Product data sheet
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Rev. 2.3 — 28 April 2011
© NXP B.V. 2011. All rights reserved.
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NXP Semiconductors
TEA1703T
Product data sheet
Vout
opto controller
Rev. 2.3 — 28 April 2011
11
9
16
13
opto on/off
10
6
VSENSE
PSENSE
TEA1753T
8
1
7
2
VCC
GND
7
4
opto on/off
1
3
2
TEA1703T
SWDET
14
n.c.
opto controller
Typical configuration of TEA1703T with TEA1753
3
5
4
OPTO
n.c.
001aan121
TEA1703T
4 of 15
© NXP B.V. 2011. All rights reserved.
Fig 3.
6
GreenChip SMPS standby control IC
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12
8
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NXP Semiconductors
TEA1703T
Product data sheet
Rev. 2.3 — 28 April 2011
All information provided in this document is subject to legal disclaimers.
4
5
6
opto on/off
Θ
opto controller
3
TEA1733T
2
7
8
opto controller
opto on/off
1
VSENSE
PSENSE
8
1
7
2
VCC
GND
TEA1703T
n.c.
6
3
5
4
OPTO
n.c.
001aan122
Typical configuration of TEA1703T with TEA1733
TEA1703T
5 of 15
© NXP B.V. 2011. All rights reserved.
Fig 4.
GreenChip SMPS standby control IC
SWDET
TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
7.2 Standby operation
When the output load of the switched-mode power supply falls, the voltage on pin
PSENSE also falls. When the voltage on pin PSENSE falls below the Vth(Psense) level, the
TEA1703T activates its pin OPTO output as soon as its pin SWDET current is above the
Ith(det)sw level.
In a typical application, the switched-mode power supply is disabled by the TEA1703T as
soon as its pin OPTO output is activated. The application’s output voltage will then start to
fall. After a period dependent on the output load and the output capacitor value, the
VSENSE voltage falls below the Vth(Vsense) level and the OPTO output is disabled again.
This restarts the primary-side converter.
If the output load remains low, the application reverts to standby mode again after the
output capacitor has been recharged. When a normal load is detected, the converter
resumes normal operation; see Figure 5.
output load
Vo(nom)
output voltage
Vth(Vsense)
VSENSE
PSENSE
Vth(Psense)
Ith(det)sw
SWDET
OPTO
primary side
converter active
normal operation
low output
load
Fig 5.
standby
stopping
SMPS
standby
re-starting stopping
SMPS
SMPS
normal operation
re-starting
SMPS
001aan123
Standby operation signals
7.3 Voltage sensing (pin VSENSE)
If the voltage on pin VSENSE is above the Vth(Vsense) level, pin VSENSE outputs a current
IO(Vsense), which, in combination with the external resistive divider, creates a hysteresis on
the adapter output voltage level. In a typical application, the effective output voltage
hysteresis is larger than that set by IO(Vsense) and the resistive divider. This is because the
external PSENSE filter circuit keeps the PSENSE voltage above the Vth(Psense) level as
long as the output capacitor is not charged to the normal output voltage level.
TEA1703T
Product data sheet
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Rev. 2.3 — 28 April 2011
© NXP B.V. 2011. All rights reserved.
6 of 15
TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
7.4 Power sensing (pin PSENSE)
Output power sensing is implemented using an external filter network on pin PSENSE.
The PSENSE input is not latched internally. If, during standby mode, pin PSENSE is
pulled above the Vth(Psense) level, the OPTO output is disabled.
7.5 Switching detection (pin SWDET)
A switching detection pin is provided to prevent applications resetting a latched protection
of the primary-side converter, such as the TEA1753. The standby mode can only be
activated when the current into pin SWDET is above the Ith(det)sw level.
The SWDET signal is latched internally. As soon as the OPTO output is activated, the
SWDET signal is ignored.
If the SWDET input is not needed, it can be connected to pin VCC via a series resistor.
The current into pin SWDET must be above the Ith(det)sw level when the switched mode
power supply is in normal operation.
7.6 Optocoupler output (pin OPTO)
The optocoupler output is an open-drain output with an integrated diode connected to
pin VCC. The output is driven with a fixed frequency (fosc,) and a fixed on-time (ton(OPTO)).
The optocoupler diode current can be set by choosing the value of the series inductor.
The current is not limited internally.
7.7 Optocoupler CTR
The CTR of a typical optocoupler falls significantly when small opto-diode currents are
used. With low optocoupler output currents, a significantly higher diode current is needed
for a typical low-cost optocoupler.
In low standby power operation of the switched-mode power supply it is necessary to
keep all currents low. To maintain a high CTR, the optocoupler diode can be driven with a
high current and a small duty cycle. The average driving current will still be low.
Figure 6 shows a typical optocoupler CTR plotted for a DC-driven opto-diode and a
pulse-driven opto-diode. The pulse-driven diode is driven with a 2 mA duty cycle
modulated current. The CTR remains high even for a very small average diode current
(low duty cycle) when the diode is pulse-driven, while the CTR for a DC-driven
optocoupler falls to a few percent.
TEA1703T
Product data sheet
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Rev. 2.3 — 28 April 2011
© NXP B.V. 2011. All rights reserved.
7 of 15
TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
001aan124
1000
CTR
(%)
(1)
100
(2)
10
1
1
102
10
105
103
104
(average) diode current (μA)
(1) Pulse driven.
(2) DC driven.
Fig 6.
Typical optocoupler CTR
7.8 Optocoupler drive
If a series resistor is used to limit the optocoupler diode current and the output voltage of
the application is 19 V, about 95 % of the driving energy is lost in the series resistor. The
efficiency to drive the optocoupler is therefore not more than about 5 %.
In the intended application, the optocoupler is active in standby, therefore, the energy
needed to drive the optocoupler must be as low as possible.
To improve the efficiency of the optocoupler drive, the optocoupler diode can be driven
with a series inductor. The optocoupler diode is then driven like a switched-mode power
supply2. Driving the optocoupler with a series inductor improves the efficiency by a factor
of 10 compared to driving it with a series resistor.
opto on/off
1
3
lOPTO
2
001aan125
Fig 7.
2.
Switched-mode optocoupler driver
NXP Semiconductors patented.
TEA1703T
Product data sheet
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Rev. 2.3 — 28 April 2011
© NXP B.V. 2011. All rights reserved.
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TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
VCC
VOPTO
IOPTO
001aan126
Fig 8.
Switched-mode optocoupler drive signals
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
continuous
−0.4
+30
V
VVSENSE
voltage on pin VSENSE
current limited
−0.4
+5
V
VPSENSE
voltage on pin PSENSE
current limited
−0.4
+3
V
VOPTO
voltage on pin OPTO
current limited
−0.4
VCC + 2
V
Voltages
Currents
IVSENSE
current on pin VSENSE
−1
+1
mA
IPSENSE
current on pin PSENSE
−1
+1
mA
ISWDET
current on pin SWDET
−1
+1
mA
IOPTO
current on pin OPTO
−1
+25
mA
-
0.5
W
General
Tamb < 75 °C
Ptot
total power dissipation
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−40
+150
°C
ESD
VESD
electrostatic discharge
voltage
class 1
human body model
[1]
-
2000
V
machine model
[2]
-
200
V
-
500
V
charged device model
TEA1703T
Product data sheet
[1]
Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[2]
Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor.
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Rev. 2.3 — 28 April 2011
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TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
9. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient
in free air; JEDEC test board
160
K/W
Rth(j-c)
thermal resistance from junction to case
in free air; JEDEC test board
72
K/W
10. Characteristics
Table 5.
Characteristics
Tamb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage management (pin VCC)
VCC(min)
minimum supply voltage
3.5
4
4.5
V
ICC(oper)
operating supply current
28
31
35
μA
1.17
1.22
1.31
V
VVSENSE > 1.2 V
−1.10
−0.94
−0.75
μA
VVSENSE < 1.2 V
−30
−11
−5
nA
Voltage sensing (pin VSENSE)
Vth(Vsense)
voltage sense threshold voltage
IO(Vsense)
voltage sense output current
Power sensing (pin PSENSE)
Vth(Psense)
power sense threshold voltage
0.45
0.5
0.55
V
IO(Psense)
power sense output current
−30
−11
−5
nA
0.8
1.3
2
μA
ISWDET = 1.3 μA
0.7
0.74
0.8
V
VOPTO = 1 V
90
100
110
Ω
1.2
1.42
1.65
μs
-
-
100
nA
24
28
33
kHz
Switching detection (pin SWDET)
Ith(det)sw
switching detection threshold
current
Vdet(sw)
switching detection voltage
Optocoupler output (pin OPTO)
RDSon
drain-source on-state resistance
ton(OPTO)
on-time on pin OPTO
ILZ
off-state leakage current
fosc
oscillator frequency
TEA1703T
Product data sheet
VOPTO = VCC
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Rev. 2.3 — 28 April 2011
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TEA1703T
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GreenChip SMPS standby control IC
11. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
4
1
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
inches
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
o
8
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Package outline SOT96-1 (SO8)
TEA1703T
Product data sheet
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Rev. 2.3 — 28 April 2011
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GreenChip SMPS standby control IC
12. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1703T v.2.3
20110428
Product data sheet
-
TEA1703T v.2.2
TEA1703T v.2.2
20110303
Objective data sheet
-
TEA1703T v.2.1
TEA1703T v.2.1
20110228
Objective data sheet
-
TEA1703T v.2
TEA1703T v.2
20110126
Objective data sheet
-
TEA1703T v.1
TEA1703T v.1
20110103
Objective data sheet
-
-
TEA1703T
Product data sheet
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13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
TEA1703T
Product data sheet
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Rev. 2.3 — 28 April 2011
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13 of 15
TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEA1703T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2.3 — 28 April 2011
© NXP B.V. 2011. All rights reserved.
14 of 15
TEA1703T
NXP Semiconductors
GreenChip SMPS standby control IC
15. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
General control . . . . . . . . . . . . . . . . . . . . . . . . . 3
Standby operation. . . . . . . . . . . . . . . . . . . . . . . 6
Voltage sensing (pin VSENSE). . . . . . . . . . . . . 6
Power sensing (pin PSENSE) . . . . . . . . . . . . . 7
Switching detection (pin SWDET). . . . . . . . . . . 7
Optocoupler output (pin OPTO) . . . . . . . . . . . . 7
Optocoupler CTR . . . . . . . . . . . . . . . . . . . . . . . 7
Optocoupler drive . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 28 April 2011
Document identifier: TEA1703T