TEA1703T GreenChip SMPS standby control IC Rev. 2.3 — 28 April 2011 Product data sheet 1. General description The TEA1703T is a low power standby controller IC intended to be used in applications which require an extreme low no-load standby power. The TEA1703T includes circuitry for detecting output voltage, output power and switching. The TEA1703T integrates a switched-mode optocoupler driver, which enables an optocoupler to be driven with a high peak current while keeping the required power low1. The TEA1703T’s typical current consumption is 30 μA. In a typical notebook adapter application the TEA1703T’s power consumption is less than 0.5 mW. 2. Features and benefits Switched-Mode Power Supply (SMPS) standby controller IC enabling very low power standby operation Large input voltage range (5 V up to 30 V) Very low supply current (30 μA) typical Switched-mode optocoupler driver output (NXP Semiconductors patented) Easy application, only 6 pins to connect 3. Applications The device can be used in applications that require a very low power no-load standby. 4. Ordering information Table 1. Ordering information Type number Package Name Description Version TEA1703T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 1. NXP Semiconductors patented. TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 5. Block diagram TEA1703T 0.94 µA REFERENCE AND SUPPLY 1 VCC 8 voltage sense VSENSE 1.22 V 2 GND power sense 3 OPTO 0.5 V 1.3 µA 7 6 switch detect OSCILLATOR PSENSE SWDET 4 n.c. 5 n.c. 001aan119 Fig 1. Block diagram 6. Pinning information 6.1 Pinning VCC 1 8 VSENSE GND 2 7 PSENSE OPTO 3 6 SWDET n.c. 4 5 n.c. TEA1703T 001aan120 Fig 2. Pin configuration (SOT96-1) 6.2 Pin description Table 2. TEA1703T Product data sheet Pin description Symbol Pin Description VCC 1 supply voltage GND 2 ground OPTO 3 optocoupler driver n.c. 4, 5 not connected SWDET 6 switch detect input PSENSE 7 power sense input VSENSE 8 voltage sense input All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 2 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 7. Functional description 7.1 General control The TEA1703T contains a standby controller for switched-mode power supplies. Typical configurations are shown in Figure 3 and Figure 4. Typically the TEA1703T senses the output voltage and output power of a switched-mode power supply. The output voltage is sensed via a resistive divider network connected to pin VSENSE. The output power is sensed by determining the switching frequency of the converter using an external filtering network. The converter output power is dependent on the switching frequency, such as in a discontinuous conduction mode flyback converter which has a fixed primary peak current during low load operation. A switching detection input on pin SWDET disables the TEA1703T output when the primary-side controller is not switching. TEA1753’s pin VINSENSE is used to reset a latched protection and for standby control. If the TEA1753 is not switching due to latched protection, the TEA1703T will not activate standby mode. Activating standby mode resets latched protection. When configured with the TEA1733, switching detection is only required if the primary-side VCC (TEA1733 pin 1) is discharged below the latched protection reset level. In Figure 4 a Zener diode is connected in series with the NPN transistor which discharges VCC on pin 1. The Zener diode is chosen to keep VCC on pin 1 just below the TEA1733’s VCC start-up level while the application is in standby mode, guaranteeing a short restart time. If the Zener diode is omitted, the switching detection input must be connected as shown in Figure 4, otherwise pin VCC can be connected via a series resistor to a fixed voltage. The TEA1703T has an open-drain optocoupler driver output with an integrated diode to pin VCC. The optocoupler is efficiently driven in pulse mode which ensures that the optocoupler’s Current Transfer Ratio (CTR) remains high; see Section 7.7 and Section 7.8. TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 3 of 15 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors TEA1703T Product data sheet Vout opto controller Rev. 2.3 — 28 April 2011 11 9 16 13 opto on/off 10 6 VSENSE PSENSE TEA1753T 8 1 7 2 VCC GND 7 4 opto on/off 1 3 2 TEA1703T SWDET 14 n.c. opto controller Typical configuration of TEA1703T with TEA1753 3 5 4 OPTO n.c. 001aan121 TEA1703T 4 of 15 © NXP B.V. 2011. All rights reserved. Fig 3. 6 GreenChip SMPS standby control IC All information provided in this document is subject to legal disclaimers. 12 8 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors TEA1703T Product data sheet Rev. 2.3 — 28 April 2011 All information provided in this document is subject to legal disclaimers. 4 5 6 opto on/off Θ opto controller 3 TEA1733T 2 7 8 opto controller opto on/off 1 VSENSE PSENSE 8 1 7 2 VCC GND TEA1703T n.c. 6 3 5 4 OPTO n.c. 001aan122 Typical configuration of TEA1703T with TEA1733 TEA1703T 5 of 15 © NXP B.V. 2011. All rights reserved. Fig 4. GreenChip SMPS standby control IC SWDET TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 7.2 Standby operation When the output load of the switched-mode power supply falls, the voltage on pin PSENSE also falls. When the voltage on pin PSENSE falls below the Vth(Psense) level, the TEA1703T activates its pin OPTO output as soon as its pin SWDET current is above the Ith(det)sw level. In a typical application, the switched-mode power supply is disabled by the TEA1703T as soon as its pin OPTO output is activated. The application’s output voltage will then start to fall. After a period dependent on the output load and the output capacitor value, the VSENSE voltage falls below the Vth(Vsense) level and the OPTO output is disabled again. This restarts the primary-side converter. If the output load remains low, the application reverts to standby mode again after the output capacitor has been recharged. When a normal load is detected, the converter resumes normal operation; see Figure 5. output load Vo(nom) output voltage Vth(Vsense) VSENSE PSENSE Vth(Psense) Ith(det)sw SWDET OPTO primary side converter active normal operation low output load Fig 5. standby stopping SMPS standby re-starting stopping SMPS SMPS normal operation re-starting SMPS 001aan123 Standby operation signals 7.3 Voltage sensing (pin VSENSE) If the voltage on pin VSENSE is above the Vth(Vsense) level, pin VSENSE outputs a current IO(Vsense), which, in combination with the external resistive divider, creates a hysteresis on the adapter output voltage level. In a typical application, the effective output voltage hysteresis is larger than that set by IO(Vsense) and the resistive divider. This is because the external PSENSE filter circuit keeps the PSENSE voltage above the Vth(Psense) level as long as the output capacitor is not charged to the normal output voltage level. TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 6 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 7.4 Power sensing (pin PSENSE) Output power sensing is implemented using an external filter network on pin PSENSE. The PSENSE input is not latched internally. If, during standby mode, pin PSENSE is pulled above the Vth(Psense) level, the OPTO output is disabled. 7.5 Switching detection (pin SWDET) A switching detection pin is provided to prevent applications resetting a latched protection of the primary-side converter, such as the TEA1753. The standby mode can only be activated when the current into pin SWDET is above the Ith(det)sw level. The SWDET signal is latched internally. As soon as the OPTO output is activated, the SWDET signal is ignored. If the SWDET input is not needed, it can be connected to pin VCC via a series resistor. The current into pin SWDET must be above the Ith(det)sw level when the switched mode power supply is in normal operation. 7.6 Optocoupler output (pin OPTO) The optocoupler output is an open-drain output with an integrated diode connected to pin VCC. The output is driven with a fixed frequency (fosc,) and a fixed on-time (ton(OPTO)). The optocoupler diode current can be set by choosing the value of the series inductor. The current is not limited internally. 7.7 Optocoupler CTR The CTR of a typical optocoupler falls significantly when small opto-diode currents are used. With low optocoupler output currents, a significantly higher diode current is needed for a typical low-cost optocoupler. In low standby power operation of the switched-mode power supply it is necessary to keep all currents low. To maintain a high CTR, the optocoupler diode can be driven with a high current and a small duty cycle. The average driving current will still be low. Figure 6 shows a typical optocoupler CTR plotted for a DC-driven opto-diode and a pulse-driven opto-diode. The pulse-driven diode is driven with a 2 mA duty cycle modulated current. The CTR remains high even for a very small average diode current (low duty cycle) when the diode is pulse-driven, while the CTR for a DC-driven optocoupler falls to a few percent. TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 7 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 001aan124 1000 CTR (%) (1) 100 (2) 10 1 1 102 10 105 103 104 (average) diode current (μA) (1) Pulse driven. (2) DC driven. Fig 6. Typical optocoupler CTR 7.8 Optocoupler drive If a series resistor is used to limit the optocoupler diode current and the output voltage of the application is 19 V, about 95 % of the driving energy is lost in the series resistor. The efficiency to drive the optocoupler is therefore not more than about 5 %. In the intended application, the optocoupler is active in standby, therefore, the energy needed to drive the optocoupler must be as low as possible. To improve the efficiency of the optocoupler drive, the optocoupler diode can be driven with a series inductor. The optocoupler diode is then driven like a switched-mode power supply2. Driving the optocoupler with a series inductor improves the efficiency by a factor of 10 compared to driving it with a series resistor. opto on/off 1 3 lOPTO 2 001aan125 Fig 7. 2. Switched-mode optocoupler driver NXP Semiconductors patented. TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 8 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC VCC VOPTO IOPTO 001aan126 Fig 8. Switched-mode optocoupler drive signals 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage continuous −0.4 +30 V VVSENSE voltage on pin VSENSE current limited −0.4 +5 V VPSENSE voltage on pin PSENSE current limited −0.4 +3 V VOPTO voltage on pin OPTO current limited −0.4 VCC + 2 V Voltages Currents IVSENSE current on pin VSENSE −1 +1 mA IPSENSE current on pin PSENSE −1 +1 mA ISWDET current on pin SWDET −1 +1 mA IOPTO current on pin OPTO −1 +25 mA - 0.5 W General Tamb < 75 °C Ptot total power dissipation Tstg storage temperature −55 +150 °C Tj junction temperature −40 +150 °C ESD VESD electrostatic discharge voltage class 1 human body model [1] - 2000 V machine model [2] - 200 V - 500 V charged device model TEA1703T Product data sheet [1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor. All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 9 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 9. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; JEDEC test board 160 K/W Rth(j-c) thermal resistance from junction to case in free air; JEDEC test board 72 K/W 10. Characteristics Table 5. Characteristics Tamb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply voltage management (pin VCC) VCC(min) minimum supply voltage 3.5 4 4.5 V ICC(oper) operating supply current 28 31 35 μA 1.17 1.22 1.31 V VVSENSE > 1.2 V −1.10 −0.94 −0.75 μA VVSENSE < 1.2 V −30 −11 −5 nA Voltage sensing (pin VSENSE) Vth(Vsense) voltage sense threshold voltage IO(Vsense) voltage sense output current Power sensing (pin PSENSE) Vth(Psense) power sense threshold voltage 0.45 0.5 0.55 V IO(Psense) power sense output current −30 −11 −5 nA 0.8 1.3 2 μA ISWDET = 1.3 μA 0.7 0.74 0.8 V VOPTO = 1 V 90 100 110 Ω 1.2 1.42 1.65 μs - - 100 nA 24 28 33 kHz Switching detection (pin SWDET) Ith(det)sw switching detection threshold current Vdet(sw) switching detection voltage Optocoupler output (pin OPTO) RDSon drain-source on-state resistance ton(OPTO) on-time on pin OPTO ILZ off-state leakage current fosc oscillator frequency TEA1703T Product data sheet VOPTO = VCC All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 10 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 11. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ o 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 9. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Package outline SOT96-1 (SO8) TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 11 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 12. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA1703T v.2.3 20110428 Product data sheet - TEA1703T v.2.2 TEA1703T v.2.2 20110303 Objective data sheet - TEA1703T v.2.1 TEA1703T v.2.1 20110228 Objective data sheet - TEA1703T v.2 TEA1703T v.2 20110126 Objective data sheet - TEA1703T v.1 TEA1703T v.1 20110103 Objective data sheet - - TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 12 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 13 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TEA1703T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.3 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 14 of 15 TEA1703T NXP Semiconductors GreenChip SMPS standby control IC 15. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 General control . . . . . . . . . . . . . . . . . . . . . . . . . 3 Standby operation. . . . . . . . . . . . . . . . . . . . . . . 6 Voltage sensing (pin VSENSE). . . . . . . . . . . . . 6 Power sensing (pin PSENSE) . . . . . . . . . . . . . 7 Switching detection (pin SWDET). . . . . . . . . . . 7 Optocoupler output (pin OPTO) . . . . . . . . . . . . 7 Optocoupler CTR . . . . . . . . . . . . . . . . . . . . . . . 7 Optocoupler drive . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal characteristics . . . . . . . . . . . . . . . . . 10 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 28 April 2011 Document identifier: TEA1703T