KEMET T499_1

Product Update – T499 High Temperature (+175°C) Tantalum SMT Capacitors
KEMET Electronics Corp.
P. O. Box 5928
Greenville, SC 29606
The tantalum SMT capacitor in its solid-state structure
is typically rated as capable of 125°C applications. The
T498 tantalum surface mount capacitor introduced earlier
this year has a maximum temperature rating of 150°C.
Now with the introduction of the T499, the temperature
range capability has been extended to +175°C. The difference between the T499 and the standard tantalum capacitor lies within its material set and design. The materials
changed include the carbon, the silver epoxy, the silver
paint, the plastic molded encapsulant, and the leadframe.
These materials also differ from those changes incorporated with the T498. These materials still contain no lead
1
and are fully RoHS compliant. The standard finish on the
leadframe is a matte tin plating over nickel, and the device
is capable of the 260°C reflow profiles as defined in J2
STD-020C . A gold or tin-lead finish is also available by
changing the part number designation.
(864) 963-6300
www.kemet.com
The black compound has no discernable change in coloration when exposed to extended temperatures above
125°C. The marking on the package for the polarity stripe,
capacitance code, voltage rating, the KEMET logo, and the
print week code (PWC) are still created with a laser in a
dot matrix pattern. The effect does not create a coloration
change, but creates a surface abrasion as the laser removes
the reflectivity of the plastic surface in the desired pattern.
Figure 2. Depiction of “D” case, T499 SMT capacitors.
The unique marking (H+) is shown in Figure 2. An
explanation for the pattern with the markings is shown in
Figure 3.
Figure 1. Structure of new T499 tantalum capacitor.
Though similar to the earlier T498, the appearance of
this device is radically different from the previous SMT
tantalum capacitors from KEMET, in that the color is no
longer gold with brown lettering. The gold material has a
heat activation of color change from yellowish gold to
brown created in the presence of a controlled surface temperature rise. A laser flash through a mask is used to create the polarity and identifying marks on the gold plastic.
Using this material and process in the presence of higher
heats created an effect where the entire surface of the
package was turning brown, and the markings became indiscernible.
Figure 3. Component marking diagram for T499 capacitor.
©2005 KEMET Electronics Corp.
May 2005
The carbon, conductive epoxy, and the silver paint materials were chosen for the best offerings that would allow
the device to exist in the 175°C environment without degradation. The tantalum anode structure, the tantalumpentoxide, and the MnO2 cathode system have been
proven to withstand this temperature exposure without
degradation.
Voltage Rating
The voltage rating of a component is fixed so as to create an acceptable failure rate at accelerated life conditions.
Inability of a device to meet that criteria may cause the
voltage rating of the component to be reduced, or the component to be redesigned (thicker dielectric) to allow for
that failure rate to be achieved.
Accelerated life testing of this component at 175°C and
with 50% nameplate voltage applied has shown the failure
rate to be less than 0.5% per thousand-piece-hours. Failures were designated by positional fuse failure or parametric shifts beyond the initial limits.
For tantalum capacitors, a temperature related voltage
derating is required to maintain that acceptable failure rate.
The temperature-voltage derating of this device is slightly
different from the standard tantalum SMT capacitor.
These devices were created using thicker dielectrics for the
voltage ratings than is required for the standard product
line.
allows the 125°C rating to be at 78% of nameplate voltage,
and the 150°C rating to be at 64% of rated voltage.
Application Derating
We will use the guidelines established with the long
history of the commercial tantalum product to fix the recommended application at no more than 50% of the rated
voltage. For a T499 rated at 50 VDC, this would create a
recommended application of 25 VDC. This application
would then apply up to 85°C, at which point the temperature-voltage derating requirements effectively lower the
voltage rating of the part. At 175°C, this 50 VDC has a
temperature-voltage derated rating down to 25 VDC, and
following the 50% application guides, the recommended
maximum application is the 12.5 VDC.
It is very important to consider the failure rate at rated
voltage and 175°C is listed as 0.5% per thousand-piecehours; but that application derating will allow for an appreciably reduced failure rate. Actual testing has revealed
a failure rate less than 0.1% per thousand-piece-hours at
175°C and at the full rated voltage (50% of nameplate
voltage).
Figure 5. Recommended application voltages versus temperature.
Figure 4. Voltage-temperature derating for standard and T498 capacitors.
For the T499, T498 and the standard tantalum capacitors, the voltage rating up through 85°C is the same as the
nameplate voltage for the capacitor. For the standard capacitors above 85°C, the voltage rating is linearly reduced
from 100% of nameplate voltage at 85°C, down to 2/3rd
(67%) of nameplate voltage at 125°C. For the T499, the
voltage rating is linearly derated from the 100% rating at
85°C, down to 50% of nameplate voltage at 175°C. This
Using the voltage factor calculations from MIL3
HDBK-217F , at rated voltage the multiplying factor for
the failure rate is 5,909. Compared to “50% of rated” factor of 1.045, then the improvement in failure rate at 175°C
would be down from the 0.5% level stated for the T499 to
884 parts per billion-piece-hours. Remember though, the
rated voltage is changing with temperature as shown in
Figure 4. At temperatures up through 85°C, the recommended application voltage is 50% of nameplate voltage.
Above 85°C, the recommended application voltage is 50%
of the temperature-voltage derated level. For a standard
tantalum at 125°C, the recommended application voltage
is 50% of 67%, or 33% of the nameplate voltage. For a
T499 at 125°C, 150°C, and 175°C, the application be-
©2005 KEMET Electronics Corp.
December 2005
comes 39%, 32%, and 25%, respectively, of nameplate
voltage (Figure 5).
Power Rating
The power rating for capacitors is reflective of the allowable heat generated in the device and there is a direct
correlation between these two. Without a standard temperature rise defined, the majority of manufacturers use the
+20°C internal rise as an arbitrary figure in defining the
power capability for these devices. This arbitrary rise
added to the ambient temperature creates the absolute internal temperature of the component. Since capacitors are
life tested under DC or static stress, there is no temperature
rise at the maximum rated temperature of the device. Only
by using the positive tolerance of +2°C at this temperature,
can we define a “tested capability” at this temperature extreme. We then need to look at the difference between the
temperature extreme and the assigned or arbitrary rise of
+20°C, to calculate the point at which a power derating is
applied. For 175°C ratings, and an allowable rise of
+20°C, the power derating must begin above 155°C. The
power capability (allowing a +20°C rise) for this device is
the same from -55°C through 155°C. If the case power is
defined as 150mW, then the power capability is defined as
150mW for this temperature range. There is a linear reduction in that power capability then applied from 100% at
155°C, down to 15 mW (10% or 2°C/20°C) at 175°C.
Figure 6 shows this delineation.
ately after power is applied. Deltas in excess of +50°C
may lead to thermal gradients that could induce stresses
high enough to cause an internal fracture and failure.
It is evident from the plot of Figure 6 that the difference in these two types of capacitors create entirely different power capabilities between 105°C and 125°C. For example, the power dissipation for the standard tantalum at
125°C is down to 10% of the case defined power capability, while the T499 shows a capability at this temperature
of 100% of the case defined power. Consider that these
are two “D” case units and the actual power capability
here is 15 mW for the standard and 150 mW for the T499.
For devices of equal capacitance and ESR, the ripple capability for the T499 would increase by a factor of 3.16
(square root of 10).
The T499 also has advantages over the T498 (+150°C
rating)4. At 150°C, the T498 power capability becomes
10% of the 25°C rating, whereas the T499 maintains the
25°C capability up through 155°C (for standard +20°C
rise).
Application Areas
The ideal applications for these components begin
where the standard products’ end. At temperatures between 125°C and 170°C, these applications would still allow a 5°C margin or better, between the rating and the application. For new under hood, down-hole, and life-test
systems, these applications may be considered with the
T499 that were previously thought to be too precarious for
the standard tantalum.
References:
Figure 6. Power derating to maximum temperatures.
1.
RoHS –“Restriction on the use of certain Hazardous Substances in Electrical and Electronic Equipment” (European Union directive 2002 / 95 / EC)
2.
J-STD-020C – IPC/JEDEC Joint Industry Standard – Moisture/Reflow Sensitivity Classification
3.
MIL-HDBK-217F – Notice 2, Reliability Prediction of Electronic Equipment, Department of Defense, December 2, 1991,
Washington, DC.
4.
“Product Update – T498 High Temperature (+175°C) Tantalum SMT Capacitors”, KEMET Electronics Corp., Unpublished, KEMET Distributed, May, 2005
The allowable temperature rise is arbitrary and two
considerations must be weighed when choosing this figure.
First, the internal temperature rise plus the ambient must
never exceed the maximum temperature plus 2°C. To do
so would create an environment in which there is no reliability data to justify this application. Second, the rise
must be considered as a potential thermal shock condition
when the device is at ambient temperature and immedi©2005 KEMET Electronics Corp.
December 2005