plastic shrink small outline package/transparent; 16 leads (straight leads); ...

SOT734-1
plastic shrink small outline package/transparent; 16 leads
(straight leads); body width 4.4 mm
20 June 2016
Package information
1. Package summary
Terminal position code
D (double)
Package type descriptive code
SSOP16T
Package type industry code
SSOP16T
Package style descriptive code
SSOP (shrink small outline package)
Package body material type
P (plastic)
Mounting method type
S (surface mount)
Issue date
9-11-2001
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
5.1
-
5.2
5.3
mm
E
package width
4.3
-
4.4
4.5
mm
A2
package height
1.1
-
1.2
1.3
mm
e
nominal pitch
-
-
0.65
-
mm
n2
actual quantity of termination
-
-
16
-
SOT734-1
NXP Semiconductors
plastic shrink small outline package/transparent; 16 leads (straight leads); body width 4.4 mm
2. Package outline
SSOP16T: plastic shrink small outline package/transparent; 16 leads (straight); body width 4.4 mm SOT734-1
D
E
Dw
A
y
X
c
HE
pin 1 index
v M A
Z
9
16
A6
A7
A2
pin 1 index
L
detail X
1
8
bp
e
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
A6
A7
bp
c
D(1)
Dw(2)
E(1)
e
HE
L
v
w
y
Z(1)
mm
1.3
1.1
0.37
0.17
0.25
0.15
0.32
0.20
0.25
0.13
5.3
5.1
2.1
1.9
4.5
4.3
0.65
6.7
6.5
1.1
0.2
0.13
0.1
0.48
0.18
Notes
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
2. Sensor area
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
01-11-09
SOT734-1
Fig. 1.
ISSUE DATE
Package outline SSOP16T (SOT734-1)
SOT734-1
Package information
All information provided in this document is subject to legal disclaimers.
20 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT734-1
NXP Semiconductors
plastic shrink small outline package/transparent; 16 leads (straight leads); body width 4.4 mm
3. Soldering
Footprint information for reflow soldering of package
SOT734-1
7.65
6.9
5.0
0.4
5.6
5.2 5.15
0.65
5.0
7.4
placement area
occupied area
solder resist
solder lands
solder paste
0.075
Dimensions in mm
Issue date
Fig. 2.
16-06-14
16-06-15
sot734-1_fr
Reflow soldering footprint for SSOP16T (SOT734-1)
SOT734-1
Package information
All information provided in this document is subject to legal disclaimers.
20 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT734-1
NXP Semiconductors
plastic shrink small outline package/transparent; 16 leads (straight leads); body width 4.4 mm
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT734-1
Package information
All information provided in this document is subject to legal disclaimers.
20 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT734-1
NXP Semiconductors
plastic shrink small outline package/transparent; 16 leads (straight leads); body width 4.4 mm
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 June 2016
SOT734-1
Package information
All information provided in this document is subject to legal disclaimers.
20 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5