74AXP1G06
Low-power inverter with open-drain output
Rev. 1 — 15 January 2014
Product data sheet
1. General description
The 74AXP1G06 is a single inverter with open-drain output.
Schmitt-trigger action at the input makes the circuit tolerant of slower input rise and fall
times.
This device ensures very low static and dynamic power consumption across the entire
VCC range from 0.7 V to 2.75 V. It is fully specified for partial power down applications
using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging
backflow current through the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.7 V to 2.75 V
Low input capacitance; CI = 0.5 pF (typical)
Low output capacitance; CO = 0.7 pF (typical)
Low dynamic power consumption; CPD = 1.0 pF at VCC = 1.2 V (typical)
Low static power consumption; ICC = 0.6 A (85 C maximum)
High noise immunity
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD 78 Class II
Input accepts voltages up to 2.75 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Multiple package options
Specified from 40 C to +85 C
74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74AXP1G06GM
40 C to +85 C
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1 1.45 0.5 mm
74AXP1G06GN
40 C to +85 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 0.9 1.0 0.35 mm
SOT1115
74AXP1G06GS
40 C to +85 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 1.0 1.0 0.35 mm
SOT1202
74AXP1G06GX
40 C to +85 C
X2SON5
X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8 0.8 0.35 mm
SOT1226
4. Marking
Table 2.
Marking
Type number
Marking code[1]
74AXP1G06GM
rR
74AXP1G06GN
rR
74AXP1G06GS
rR
74AXP1G06GX
rR
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
Y
2
A
Y
4
A
2
4
Y
A
GND
Fig 1.
Logic symbol
74AXP1G06
Product data sheet
mna620
mna619
mna618
Fig 2.
IEC logic symbol
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
Fig 3.
Logic diagram
© NXP B.V. 2014. All rights reserved.
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74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
6. Pinning information
6.1 Pinning
$;3*
$;3*
QF
9&&
QF
$
QF
*1'
<
9&&
<
*1'
$
DDD
DDD
7UDQVSDUHQWWRSYLHZ
7UDQVSDUHQWWRSYLHZ
Fig 4.
Pin configuration SOT886, SOT1115 and
SOT1202 (XSON6)
Fig 5.
Pin configuration SOT1226 (X2SON5)
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
X2SON5
XSON6
n.c.
1
1
not connected
A
2
2
data input
GND
3
3
ground (0 V)
Y
4
4
data output
n.c.
-
5
not connected
VCC
5
6
supply voltage
7. Functional description
Table 4.
Function table[1]
Input
Output
A
Y
L
Z
H
L
[1]
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
74AXP1G06
Product data sheet
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Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
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Low-power inverter with open-drain output
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
Conditions
VI < 0 V
[1]
VO < 0 V
[1]
Min
Max
Unit
0.5
+3.3
V
50
-
mA
0.5
+3.3
V
50
-
mA
0.5
+3.3
V
VO
output voltage
IO
output current
-
20
mA
ICC
supply current
-
50
mA
IGND
ground current
50
-
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
250
mW
[1]
VO = 0 V to VCC
Tamb = 40 C to +85 C
The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
0.7
2.75
V
VI
input voltage
0
2.75
V
VO
output voltage
Active mode
0
VCC
V
Power-down mode; VCC = 0 V
0
2.75
V
40
+85
C
0
200
ns/V
Tamb
ambient temperature
t/V
input transition rise and fall rate
74AXP1G06
Product data sheet
VCC = 0.7 V to 2.75 V
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
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74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions, unless otherwise specified; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Tamb = 40 C to +85 C
Conditions
Min
HIGH-level input
voltage
VIH
LOW-level input
voltage
VIL
LOW-level output
voltage
VOL
Unit
Typ 25 C Max 25 C Max 85 C
VCC = 0.75 V to 0.85 V
0.75VCC
-
-
-
V
VCC = 1.1 V to 1.95 V
0.65VCC
-
-
-
V
VCC = 2.3 V to 2.7 V
1.6
-
-
-
V
VCC = 0.75 V to 0.85 V
-
-
0.25VCC
0.25VCC
V
VCC = 1.1 V to 1.95 V
-
-
0.35VCC
0.35VCC
V
VCC = 2.3 V to 2.7 V
-
-
0.7
0.7
V
IO = 20 A; VCC = 0.7 V
-
0.01
-
-
V
IO = 100 A; VCC = 0.75 V
-
-
0.1
0.1
V
IO = 2 mA; VCC = 1.1 V
-
-
0.275
0.275
V
IO = 3 mA; VCC = 1.4 V
-
-
0.35
0.35
V
IO = 4.5 mA; VCC = 1.65 V
-
-
0.45
0.45
V
IO = 8 mA; VCC = 2.3 V
-
-
0.7
0.7
V
-
0.001
0.1
0.5
A
II
input leakage
current
VI = 0 V to 2.75 V;
VCC = 0 V to 2.75 V
[1]
IOZ
OFF-state output
current
VI = VIL; VO = 0 V to 2.75 V
[1]
-
0.02
0.1
0.5
A
IOFF
power-off leakage
current
VI or VO = 0 V to 2.75 V;
VCC = 0 V
[1]
-
0.01
0.1
0.5
A
IOFF
additional power-off VI or VO = 0 V or 2.75 V;
leakage current
VCC = 0 V to 0.1 V
[1]
-
0.02
0.1
0.5
A
ICC
supply current
VI = 0 V or VCC; IO = 0 A
[1]
-
0.01
0.3
0.6
A
ICC
additional supply
current
VI = VCC 0.5 V; IO = 0 A;
VCC = 2.5 V
-
2
100
150
A
[1]
All typical values are measured at VCC = 1.2 V.
74AXP1G06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
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74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 12.
Symbol Parameter
propagation
delay
tpd
Tamb = 25 C
Conditions
Tamb = 40 C to +85 C
Unit
Min
Typ[1]
Max
Min
Max
3
12
33
3
104
ns
VCC = 1.1 V to 1.3 V
2.2
5.1
7.9
2.0
8.3
ns
VCC = 1.4 V to 1.6 V
1.7
3.7
5.2
1.5
5.6
ns
VCC = 1.65 V to 1.95 V
1.4
3.5
5.3
1.2
5.6
ns
VCC = 2.3 V to 2.7 V
1.2
2.6
3.8
1.0
4.0
ns
-
-
-
0.9
-
ns
[2][3]
A to Y; see Figure 6
VCC = 0.75 V to 0.85 V
VCC = 2.7 V; see Figure 6
[4]
tt
transition time
CI
input capacitance VI = 0 V or VCC;
VCC = 0 V to 2.75 V
-
0.5
-
-
-
pF
CO
output
capacitance
-
0.7
-
-
-
pF
CPD
power dissipation fi = 1 MHz; VI = 0 V to VCC
capacitance
VCC = 0.75 V to 0.85 V
VO = 0 V; VCC = 0 V
[5]
-
0.9
-
-
-
pF
VCC = 1.1 V to 1.3 V
-
1.0
-
-
-
pF
VCC = 1.4 V to 1.6 V
-
1.0
-
-
-
pF
VCC = 1.65 V to 1.95 V
-
1.1
-
-
-
pF
VCC = 2.3 V to 2.7 V
-
1.3
-
-
-
pF
[1]
All typical values are measured at nominal VCC.
[2]
tpd is the same as tPZL and tPLZ.
[3]
For additional propagation delay (tPZL) values at different load capacitances see Figure 7 to Figure 11.
[4]
tt is the same as tTZL and tTLZ.
[5]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi + CL VCC2 fo where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V.
74AXP1G06
Product data sheet
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Rev. 1 — 15 January 2014
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NXP Semiconductors
Low-power inverter with open-drain output
12. Waveforms
9,
90
$LQSXW
*1'
W3=/
W3/=
9&&
<RXWSXW
90
9;
92/
W7=/
DDD
Measurement points are given in Table 9.
VOL is the typical output voltage level that occurs at the output load.
Fig 6.
The data input (A) to output (Y) propagation delays
Table 9.
Measurement points
Supply voltage
Input
VCC
VM
VI
tr = tf
Output
VM
VX
0.75 V to 1.6 V
0.5VCC
VCC
3.0 ns
0.5VCC
VOL 0.1 V
1.65 V to 2.7 V
0.5VCC
VCC
3.0 ns
0.5VCC
VOL 0.15 V
DDD
ǻW
QV
DDD
ǻW
QV
&/S)
Tamb = 40 C to +85 C unless otherwise specified.
&/S)
Tamb = 40 C to +85 C unless otherwise specified.
(1) Minimum: VCC = 2.7 V
(1) Minimum: VCC = 1.95 V
(2) Typical: Tamb = 25 C; VCC = 2.5 V
(2) Typical: Tamb = 25 C; VCC = 1.8 V
(3) Maximum: VCC = 2.3 V
Fig 7.
(3) Maximum: VCC = 1.65 V
Additional tPZL versus load capacitance
74AXP1G06
Product data sheet
Fig 8.
Additional tPZL versus load capacitance
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Rev. 1 — 15 January 2014
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74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
DDD
ǻWW
QV
DDD
ǻW
QV
&/S)
Tamb = 40 C to +85 C unless otherwise specified.
&/S)
Tamb = 40 C to +85 C unless otherwise specified.
(1) Minimum: VCC = 1.6 V
(1) Minimum: VCC = 1.3 V
(2) Typical: Tamb = 25 C; VCC = 1.5 V
(2) Typical: Tamb = 25 C; VCC = 1.2 V
(3) Maximum: VCC = 1.4 V
(3) Maximum: VCC = 1.1 V
Fig 9.
Additional tPZL versus load capacitance
Fig 10. Additional tPZL versus load capacitance
DDD
ǻW
QV
&/S)
Tamb = 40 C to +85 C unless otherwise specified.
(1) Minimum: VCC = 0.85 V
(2) Typical: Tamb = 25 C; VCC = 0.8 V
(3) Maximum: VCC = 0.75 V
Fig 11. Additional tPZL versus load capacitance
74AXP1G06
Product data sheet
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Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
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74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
9(;7
9&&
*
9,
5/
92
'87
57
&/
5/
PQD
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 12. Test circuit for measuring switching times
Table 10.
Test data
Supply voltage
Load
VCC
CL
RL
tPLH, tPHL
tPZL, tPLZ
0.75 V to 2.7 V
5 pF
10 k
0V
2 VCC
74AXP1G06
Product data sheet
VEXT
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Rev. 1 — 15 January 2014
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74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
13. Package outline
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74AXP1G06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
10 of 17
74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
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74AXP1G06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
11 of 17
74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
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74AXP1G06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
12 of 17
74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
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74AXP1G06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
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74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AXP1G06 v.1
20140115
Product data sheet
-
-
74AXP1G06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
14 of 17
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NXP Semiconductors
Low-power inverter with open-drain output
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74AXP1G06
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
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Low-power inverter with open-drain output
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AXP1G06
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 January 2014
© NXP B.V. 2014. All rights reserved.
16 of 17
74AXP1G06
NXP Semiconductors
Low-power inverter with open-drain output
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 January 2014
Document identifier: 74AXP1G06