Reflow soldering footprint Footprint information for reflow soldering of WLCSP49 package LPC5410_NSMD Hx P P Hy see detail X recommend stencil thickness: 0.1 mm solder land (SL) solder paste deposit (SP) solder land plus solder paste solder resist opening (SR) SL occupied area SP SR Dimensions in mm P SL SP SR Hx Hy 0.4 0.24 0.27 0.31 3.5 3.5 www.nxp.com © NXP Semiconductors N.V. 2014 detail X Issue date 14-04-08 14-11-05 wlcsp49_lpc5410_fr All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights. Printed in the Netherlands