sot1275-2_po

Package outline
Air cavity plastic earless flanged package; 6 leads
SOT1275-2
D
F
A
7
w1
D1
B
L
U1
b1
v
B
A
c
H1
5
θ
1
2
6
s
α
Z1
Z
U2
H
E1
E
A
3
4
b
e
Q
w2
0
B
5
10 mm
scale
θ
s
v
w1
w2
15°
0.7
0.5
0.5
0.5
0.5
U2
Z
Z1
α
5°
Dimensions (mm dimensions are derived from the original inch dimensions)
Unit
A
max 4.01
nom
min 3.40
mm
b
b1
3.94
1.14
3.68
0.89
c
D
D1
E
E1
0.178 20.42 20.37
9.8
9.75
0.127 20.12 20.17
9.5
9.55
e
8.89
F
H
H1
L
Q
U1
1.14
19.4
12.8
25.4
1.68
20.7
9.91 3.67
5.79
65°
0.94
19.2
12.6
25.2
1.45
20.5
9.70 3.17
5.29
61°
sot1275-2_po
Outline
version
References
IEC
JEDEC
Issue date
14-06-12
14-06-23
SOT1275-2
www.nxp.com
JEITA
European
projection
© NXP Semiconductors N.V. 2014
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Printed in the Netherlands