Package outline Air cavity plastic earless flanged package; 6 leads SOT1275-2 D F A 7 w1 D1 B L U1 b1 v B A c H1 5 θ 1 2 6 s α Z1 Z U2 H E1 E A 3 4 b e Q w2 0 B 5 10 mm scale θ s v w1 w2 15° 0.7 0.5 0.5 0.5 0.5 U2 Z Z1 α 5° Dimensions (mm dimensions are derived from the original inch dimensions) Unit A max 4.01 nom min 3.40 mm b b1 3.94 1.14 3.68 0.89 c D D1 E E1 0.178 20.42 20.37 9.8 9.75 0.127 20.12 20.17 9.5 9.55 e 8.89 F H H1 L Q U1 1.14 19.4 12.8 25.4 1.68 20.7 9.91 3.67 5.79 65° 0.94 19.2 12.6 25.2 1.45 20.5 9.70 3.17 5.29 61° sot1275-2_po Outline version References IEC JEDEC Issue date 14-06-12 14-06-23 SOT1275-2 www.nxp.com JEITA European projection © NXP Semiconductors N.V. 2014 All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights. Printed in the Netherlands