HT1x HITAG 1 transponder IC Rev. 3.1 — 10 December 2014 210531 Product short data sheet COMPANY PUBLIC 1. General description HITAG 1 based transponders are highly integrated and do not need any additional components beside the external coil. Data between Key (RWD) and transponder is transmitted bidirectionally, in Half Duplex Mode. The HITAG 1 transponder IC offers also an encrypted data transmission. The AntiCollision (AC) Mode, which is used mainly in long range operation, allows to handle several transponders that are at the same time in the communication field of the antenna, thus achieving highest operating reliability and permitting to handle several transponders quickly and simultaneously. The HITAG 1 transponder IC provides two protocol modes, Standard and Advanced Mode. The Advanced Protocol Mode operates compared to the Standard Protocol Mode with an increased number of Startbits and a 8-bit Cyclic Redundancy Check (CRC) sent by the transponder IC at read operations. HITAG 1 transponder IC offer a memory of 2 kbit. 2. Features and benefits Identification transponder for use in contactless applications Operating frequency 125 kHz Data transmission and energy supply via RF link, no internal battery Non-volatile memory of 2 kbit Organized in 64 pages, 4 bytes each 10 years non-volatile data retention 100000 erase/write cycles Selective read/write protection of memory content Mutual authentication function 3. Applications Logistics Asset tracking Gas cylinder ID Industrial automation HT1x NXP Semiconductors HITAG 1 transponder IC 4. Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit Tamb 55 C 10 - - year 100000 - - cycle 189 210 231 pF Wafer EEPROM characteristics tret retention time Nendu(W) write endurance Interface characteristics input capacitance Ci between LA and LB HT1ICS3002W/V6F 5. Ordering information Table 2. Ordering information Type number Name Description HT1ICS3002W/V6F Wafer sawn wafer on FFC, 150 m, 8 inch, UV, inkless - HT1MOA4S30/E/3 PLLMC plastic leadless module carrier package; 35 mm SOT500-2[1] wide tape [1] HT1X_SDS Product short data sheet COMPANY PUBLIC Package Version This package is also known as MOA4 All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 10 December 2014 210531 © NXP B.V. 2014. All rights reserved. 2 of 9 HT1x NXP Semiconductors HITAG 1 transponder IC 6. Block diagram The HITAG 1 transponder IC requires no external power supply. The contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the RWD. The interface also demodulates data transmitted from the RWD to the HITAG 1 transponder IC, and modulates the magnetic field for data transmission from the HITAG 1 transponder IC to the RWD. Data are stored in a non-volatile memory (EEPROM). The memory has a capacity of 2 kbit and is organized in blocks. ANALOGUE RF INTERFACE DIGITAL CONTROL EEPROM VREG PAD VDD RECT ANTICOLLISION DEMOD READ/WRITE CONTROL data in TRANSPONDER Cres ACCESS CONTROL MOD data out EEPROM INTERFACE CONTROL R/W CLK PAD clock RF INTERFACE CONTROL SEQUENCER CHARGE PUMP 001aai334 Fig 1. HT1X_SDS Product short data sheet COMPANY PUBLIC Block diagram of HITAG 1 transponder IC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 10 December 2014 210531 © NXP B.V. 2014. All rights reserved. 3 of 9 HT1x NXP Semiconductors HITAG 1 transponder IC 7. Functional description 7.1 Memory map The 2 kbit memory area of the HITAG 1 transponder IC is divided into 16 blocks. Each block comprises 4 pages with 4 bytes (1 byte = 8 bits) each. A page is the smallest access unit. Addressing is done pagewise (page 0 to 63) whereas access is gained either pagewise or blockwise by entering the respective start address. Block access is only available for blocks 2 to 15, page access is available for pages 0 to 63. public Block 0 secret or public user data r/w or OTP secret user data wo or 0 Logdata 1B Logdata 0A Logdata 1A r/w or 0 Logdata 0B Block 7 Block 8 public r/w or ro Key B user data Block 4 ro Configuration Key A Block 1 secret Serial Number r/w ro r/w wo OTP 0 read only read/write write only one time programmable neither read nor write Block 15 Configuration of the memory is done in the configuration page aaa-000324 Fig 2. Memory map Areas (or settings) with light dark background can be configured by the customer within the Configuration Page (page 1 of block 0). HT1X_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 10 December 2014 210531 © NXP B.V. 2014. All rights reserved. 4 of 9 HT1x NXP Semiconductors HITAG 1 transponder IC 8. Limiting values Table 3. Limiting values - HT1ICS3002W/V6F[1] Symbol Parameter Min Max Unit VDD supply voltage 0.5 6.5 V VESD electrostatic discharge voltage MIL-STD 883D, Method 3015.7, Human Body 2 - kV Ilu latch-up current MIL-STD 883D, Method 3023 100 - mA Ii(max) maximum input current IN1-IN2 - 30 mA Tj junction temperature 55 +140 C [1] Conditions Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. Table 4. Limiting values - HT1MOA4S30 [1] Symbol Parameter Tstg storage temperature Tamb ambient temperature [1] Conditions Min Max Unit 55 +125 C Rth(j-a) 30 K/W @ Iin = 30 mA 25 +85 C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. 9. Abbreviations Table 5. HT1X_SDS Product short data sheet COMPANY PUBLIC Abbreviations Acronym Description AC AntiCollision CRC Cyclic Redundancy Check EEPROM Electrically Erasable Programmable Read-Only Memory IC Integrated Circuit RF Radio Frequency RWD Read Write Device All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 10 December 2014 210531 © NXP B.V. 2014. All rights reserved. 5 of 9 HT1x NXP Semiconductors HITAG 1 transponder IC 10. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes HT1X_SDS v.3.1 20141210 Product short data sheet - HT1X_SDS v.3.0 Modifications: HT1X_SDS v.3.0 HT1X_SDS Product short data sheet COMPANY PUBLIC • • • Section 11 “Legal information”: License statement “ICs with HITAG functionality” removed Section 5 “Ordering information”: updated Table 4: Title updated 20110916 Product short data sheet - All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 10 December 2014 210531 - © NXP B.V. 2014. All rights reserved. 6 of 9 HT1x NXP Semiconductors HITAG 1 transponder IC 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. HT1X_SDS Product short data sheet COMPANY PUBLIC Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 10 December 2014 210531 © NXP B.V. 2014. All rights reserved. 7 of 9 HT1x NXP Semiconductors HITAG 1 transponder IC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. HITAG — is a trademark of NXP Semiconductors N.V. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] HT1X_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 10 December 2014 210531 © NXP B.V. 2014. All rights reserved. 8 of 9 HT1x NXP Semiconductors HITAG 1 transponder IC 13. Contents 1 2 3 4 5 6 7 7.1 8 9 10 11 11.1 11.2 11.3 11.4 12 13 General description . . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . Functional description . . . . . . . . . . . . . . . . . . . Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 2 2 3 4 4 5 5 6 7 7 7 7 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 December 2014 210531