INTEGRATED CIRCUITS 74ALVCH16825 18-bit buffer/driver (3-State) Product specification IC24 Data Handbook 1998 Jul 27 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 FEATURES PIN CONFIGURATION • Wide supply voltage range of 1.2V to 3.6V • Complies with JEDEC standard no. 8-1A. • CMOS low power consumption • Direct interface with TTL levels • Current drive ± 24 mA at 3.0 V • MULTIBYTETM flow-through standard pin-out architecture • Low inductance multiple VCC and GND pins for minimum noise and ground bounce • All data inputs have bus hold • Output drive capability 50Ω transmission lines @ 85°C DESCRIPTION The 74ALVCH16825 is an 18–bit non-inverting buffer/driver with 3-State outputs for bus-oriented applications. The 74ALVCH16825 consists of two 9-bit sections with separate output enable signals. For either 9-bit buffer section, the two output enable (1OE1 and 1OE2 or 2OE1 and 2OE2) inputs must both be LOW for corresponding D outputs to be active. If either output enable input is HIGH, the outputs of that 9-buffer section are in the high impedance state. The 74ALVCH16825 has active bus hold circuitry which is provided to hold unused or floating data inputs at a valid logic level. This feature eliminates the need for external pull-up or pull-down resistors. 1OE2 1OE1 1 56 1Y1 2 55 1A0 1Y1 3 54 1A1 GND 4 53 GND 1Y2 5 52 1A2 1Y3 6 51 1A3 VCC 7 50 VCC 1Y4 8 49 1A4 1Y5 9 48 1A5 1Y6 10 47 1A6 GND 11 46 GND 1Y7 12 45 1A7 1Y8 13 44 1A8 GND 14 43 GND GND 15 42 GND 2Y0 16 41 2A0 2Y1 17 40 2A1 GND 18 39 GND 2Y2 19 38 2A2 2Y3 20 37 2A3 2Y4 21 36 2A4 VCC 22 35 VCC 2Y5 23 34 2A5 2Y6 24 33 2A6 GND 25 32 GND 2Y7 26 31 2A7 2Y8 27 30 2A8 2OE1 28 29 2OE2 SH00139 QUICK REFERENCE DATA GND = 0V; Tamb = 25°C; tr = tf ≤ 2.5ns PARAMETER SYMBOL Propagation delay tPHL/tPLH CP to Qn CI Input capacitance CPD Power dissipation dissi ation capacitance ca acitance per er latch CONDITIONS VCC = 2.5V, CL = 30pF VCC = 3.3V, CL = 50pF VI = GND to VCC1 Output enabled Output disabled TYPICAL 2.0 2.0 4.0 19 3 UNIT ns pF pF F NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; (CL × VCC2 × fo) = sum of outputs. ORDERING INFORMATION PACKAGES 56-Pin Plastic Thin Shrink Small Outline (TSSOP) Type II 1998 Jul 27 TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DRAWING NUMBER –40°C to +85°C 74ALVCH16825 DGG ACH16825 DGG SOT364-1 2 853-2097 19785 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 PIN DESCRIPTION PIN NUMBER FUNCTION TABLE SYMBOL 1 1OE1 56 1OE2 55, 54, 52, 51, 49, 48, 47, 45, 44 Output enable input (active LOW) 1A0 to 1A8 Data inputs 2, 3, 5, 6, 8, 9, 10, 12, 13 1Y0 to 1Y8 Data outputs 4, 11, 14, 15, 18, 25, 32, 39, 42, 43, 46, 53 GND Ground (0V) 7, 22, 35, 50 VCC Positive supply voltage 28 2OE1 29 2OE2 43, 42, 41, 40, 38, 37, 36, 34, 33, 31 2A0 to 2A8 16, 17, 19, 20, 21, 23, 24, 26, 27 INPUTS NAME AND FUNCTION H L X Z nOE2 L L L L L L H H H X X Z X H X Z = = = = HIGH voltage level LOW voltage level Don’t care High impedance “off” state LOGIC SYMBOL (IEEE/IEC) Output enable input (active LOW) Data inputs 1OE1 2Y0 to 2Y8 A OUTPUT Y nOE1 1 & EN1 1OE2 56 Data outputs 2OE1 28 2OE2 29 & EN2 LOGIC SYMBOL 1A0 55 1 2 1Y0 3 1Y1 1A2 52 5 1Y2 1A3 51 6 1Y3 55 1A4 49 8 1Y4 54 1A5 48 9 1Y5 52 1A6 47 10 1Y6 51 1A7 45 12 1Y7 49 1A8 44 13 1Y8 48 2A0 41 16 2Y0 47 2A1 40 17 2Y1 19 2Y2 56 1OE1 1OE2 2 3 5 6 8 1A0 1Y0 1A1 1Y1 1A2 1Y2 1A3 1Y3 1A4 1Y4 1, 1 ∇ 1A1 54 1, 2 ∇ 1Y5 1A5 1Y6 1A6 1Y7 1A7 45 2A2 38 13 1Y8 1A8 44 2A3 37 20 2Y3 16 2Y0 2A0 41 2A4 36 21 2Y4 17 2Y1 40 2A5 34 23 2Y5 19 2Y2 38 2A6 33 24 2Y6 20 2Y3 2A3 37 2A7 31 26 2Y7 21 2Y4 2A4 36 2A8 30 27 2Y8 23 2Y5 2A5 34 24 2Y6 2A6 33 26 2Y7 2A7 31 27 2Y8 2A8 30 9 10 12 2A1 2A2 SH00141 2OE1 2OE2 28 29 SH00142 1998 Jul 27 3 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 LOGIC DIAGRAM BUS HOLD CIRCUIT VCC nOE1 nOE2 nAn Data Input nYn To internal circuit TO 8 OTHER CHANNELS SH00140 SW00044 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER CONDITIONS MIN MAX DC supply voltage 2.5V range (for max. speed performance @ 30 pF output load) 2.3 2.7 DC supply voltage 3.3V range (for max. speed performance @ 50 pF output load) 3.0 3.6 UNIT V VI DC Input voltage range 0 VCC V VO DC output voltage range 0 VCC V –40 +85 °C 0 0 20 10 ns/V Tamb Operating free-air temperature range tr, tf Input rise and fall times VCC = 2.3 to 3.0V VCC = 3.0 to 3.6V ABSOLUTE MAXIMUM RATINGS In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) SYMBOL VCC IIK PARAMETER CONDITIONS DC supply voltage DC input diode current VI 0 For control pins2 VI DC in input ut voltage IOK DC output diode current VO VCC or VO 0 VO DC output voltage Note 2 IO DC output source or sink current VO = 0 to VCC IGND, ICC Tstg PTOT For data inputs2 DC VCC or GND current Storage temperature range Power dissipation per package –plastic medium-shrink (SSOP) –plastic thin-medium-shrink (TSSOP) For temperature range: –40 to +125 °C above +55°C derate linearly with 11.3 mW/K above +55°C derate linearly with 8 mW/K RATING UNIT –0.5 to +4.6 V –50 mA –0.5 to +4.6 –0.5 to VCC +0.5 V 50 mA –0.5 to VCC +0.5 V 50 mA 100 mA –65 to +150 °C 850 600 mW NOTE: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Jul 27 4 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 DC ELECTRICAL CHARACTERISTICS Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER VIH HIGH level Input voltage VIL LOW level Input voltage VOH O HIGH level output voltage TEST CONDITIONS Temp = -40°C to +85°C MIN TYP1 VCC = 2.3 to 2.7V 1.7 1.2 VCC = 2.7 to 3.6V 2.0 1.5 UNIT MAX V VCC = 2.3 to 2.7V 1.2 0.7 VCC = 2.7 to 3.6V 1.5 0.8 V 3 to 3 6V; VI = VIH or VIL; IO = –100µA 100µA VCC = 2 2.3 3.6V; 02 VCC0.2 VCC VCC = 2.3V; VI = VIH or VIL; IO = –6mA VCC0.3 VCC0.08 VCC = 2.3V; VI = VIH or VIL; IO = –12mA VCC0.6 VCC0.26 VCC = 2.7V; VI = VIH or VIL; IO = –12mA VCC0.5 VCC0.14 VCC = 3.0V; VI = VIH or VIL; IO = –12mA VCC0.6 VCC0.09 VCC = 3.0V; VI = VIH or VIL; IO = –24mA VCC1.0 VCC0.28 V VCC = 2 2.3 3 to 3 3.6V; 6V; VI = VIH or VIL; IO = 100µA GND 0 20 0.20 V VCC = 2.3V; VI = VIH or VIL; IO = 6mA 0.07 0.40 V VCC = 2.3V; VI = VIH or VIL; IO = 12mA 0.15 0.70 VCC = 2.7V; VI = VIH or VIL; IO = 12mA 0.14 0.40 VCC = 3.0V; VI = VIH or VIL; IO = 24mA 0.27 0.55 Input leakage g current VCC = 2 2.3 3 to 3 3.6V; 6V; VI = VCC or GND 0.1 5 µA µ IOZ 3-State output OFF-state current VCC = 2.3 to 3.6V; VI = VIH or VIL; VO = VCC or GND 0.1 10 µA ICC Quiescent supply current VCC = 2.3 to 3.6V; VI = VCC or GND; IO = 0 0.2 40 µA ∆ICC Additional quiescent supply current VCC = 2.3V to 3.6V; VI = VCC – 0.6V; IO = 0 150 750 µA IBHL2 Bus hold LOW sustaining current IBHH2 Bus hold HIGH sustaining current IBHLO2 IBHHO2 VOL II LOW level output voltage VCC = 2.3V; VI = 0.7V 45 – VCC = 3.0V; VI = 0.8V 75 150 VCC = 2.3V; VI = 1.7V –45 VCC = 3.0V; VI = 2.0V –75 Bus hold LOW overdrive current VCC = 3.6V 500 µA Bus hold HIGH overdrive current VCC = 3.6V –500 µA NOTES: 1. All typical values are at Tamb = 25°C. 2. Valid for data inputs of bus hold parts. 1998 Jul 27 V 5 –175 µA µA Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 AC CHARACTERISTICS FOR VCC = 2.3V TO 2.7V RANGE GND = 0V; tr = tf ≤ 2.0ns; CL = 30pF LIMITS SYMBOL PARAMETER WAVEFORM VCC = 2.3 to 2.7V UNIT MIN TYP1 MAX tPHL/tPLH Propagation delay nAn to nYn 1, 3 1.0 2.0 4.1 ns tPZH/tPZL 3-State output enable time nOEn to nYn 2, 3 1.0 2.9 6.0 ns tPHZ/tPLZ 3-State output disable time nOEn to nYn 2,3 1.2 2.2 5.6 ns NOTE: 1. All typical values are at VCC = 3.3V and Tamb = 25°C. AC CHARACTERISTICS FOR VCC = 3.0V TO 3.6V RANGE AND VCC = 2.7V GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF SYMBOL PARAMETER WAVEFORM LIMITS LIMITS VCC = 3.3 ± 0.3V VCC = 2.7V UNIT MIN TYP1, 2 MAX MIN TYP1 MAX tPHL/tPLH Propagation delay nAn to nYn 1, 3 1.0 2.0 3.4 1.0 2.1 3.9 ns tPZH/tPZL 3-State output enable time nOEn to nYn 2, 3 1.0 2.8 4.7 1.0 2.9 5.7 ns tPHZ/tPLZ 3-State output disable time nOEn to nYn 2, 3 1.3 2.9 4.5 1.3 3.0 4.9 ns NOTES: 1. All typical values are measured Tamb = 25°C. 2. Typical value is measured at VCC = 3.3V AC WAVEFORMS FOR VCC = 2.3V TO 2.7V AND VCC < 2.3V RANGE VI VM = 0.5 VCC VX = VOL + 0.15V VY = VOH –0.15V VOL and VOH are the typical output voltage drop that occur with the output load. nOE INPUT VM GND tPLZ AC WAVEFORMS FOR VCC = 3.0V TO 3.6V AND VCC = 2.7V RANGE OUTPUT LOW-to-OFF OFF-to-LOW VM = 1.5 V VX = VOL + 0.3V VY = VOH –0.3V VOL and VOH are the typical output voltage drop that occur with the output load. V = 2.7V I V =V I CC VOL tPHZ OUTPUT HIGH-to-OFF OFF-to-HIGH VY VM GND outputs enabled VM outputs disabled outputs enabled SH00137 tPLH tPHL Waveform 2. 3-State enable and disable times VOH VM VOL SH00132 Waveform 1. Input (Dn) to output (Yn) propagation delay 1998 Jul 27 tPZH VOH GND Yn OUTPUT VM VX VI An INPUT tPZL VCC 6 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 TEST CIRCUIT S1 VCC RL = 500 Ω VO VI PULSE GENERATOR 2 * VCC Open GND D.U.T. RT RL = 500 Ω CL Test Circuit for switching times DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. SWITCH POSITION TEST tPLH/tPHL S1 Open tPLZ/tPZL 2 VCC tPHZ/tPZH GND VCC VI < 2.7V VCC 2.7–3.6V 2.7V SV00906 Waveform 3. Load circuitry for switching times 1998 Jul 27 7 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm 1998 Jul 27 8 SOT364-1 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 NOTES 1998 Jul 27 9 Philips Semiconductors Product specification 18-bit buffer/driver (3-State) 74ALVCH16825 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: 1998 Jul 27 10 Date of release: 07-98 9397-750-04555