BAS116H 75 V, low leakage diode in small SOD123F package Rev. 01 — 11 April 2005 Product data sheet 1. Product profile 1.1 General description Low leakage switching diode, encapsulated in a SOD123F small SMD plastic package. 1.2 Features ■ Small and flat lead SMD plastic package ■ Low leakage current 1.3 Applications ■ General-purpose switching 1.4 Quick reference data Table 1: Quick reference data Symbol Parameter IF forward current VR reverse voltage IR reverse current Conditions VR = 75 V Min Typ Max Unit - - 215 mA - - 75 V - 0.003 5.0 nA BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package 2. Pinning information Table 2: Pinning Pin Description 1 cathode 2 anode Simplified outline Symbol [1] 1 1 2 2 sym001 [1] The marking bar indicates the cathode. 3. Ordering information Table 3: Ordering information Type number BAS116H Package Name Description Version - plastic surface mounted package; 2 leads SOD123F 4. Marking Table 4: Marking codes Type number Marking code BAS116H B1 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VRRM repetitive peak reverse voltage - 85 V VR reverse voltage - 75 V IF forward current - 215 mA IFRM repetitive peak forward current - 500 mA IFSM non-repetitive peak forward current tp = 1 µs - 4 A tp = 1 ms - 1 A tp = 1 s - 0.5 A - 375 mW junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C Ptot total power dissipation Tj [1] Tamb ≤ 25 °C Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 9397 750 14881 Product data sheet [1] © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 April 2005 2 of 9 BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package 6. Thermal characteristics Table 6: Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient Rth(j-sp) thermal resistance from junction to solder point in free air [1] [2] Min Typ Max Unit - - 330 K/W - - 70 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table 7: Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit forward voltage IF = 1 mA [1] - - 0.90 mV IF = 10 mA [1] - - 1.00 mV IF = 50 mA [1] - - 1.10 mV IF = 150 mA [1] - - 1.25 mV Per diode VF IR Cd trr reverse current diode capacitance VR = 75 V - 0.003 5.0 nA VR = 75 V; Tj = 150 °C - 3 80.0 nA - 2 - pF - 0.8 3.0 µs VR = 0 V; f = 1 MHz reverse recovery time [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. [2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA 9397 750 14881 Product data sheet [2] © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 April 2005 3 of 9 BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package mlb752 300 IF (mA) mbg704 102 IFSM (A) 200 10 (1) (2) (3) 100 1 0 0 0.4 0.8 1.2 VF (V) 1.6 10−1 1 10 102 103 104 tp (µs) (1) Tamb = 150 °C; typical values Based on square wave currents (2) Tamb = 25 °C; typical values (1) Tj = 25 °C; prior to surge (3) Tamb = 25 °C; maximum values Fig 1. Forward current as a function of forward voltage mlb754 102 Fig 2. Non-repetitive peak forward current as a function of pulse duration mbg526 2 IR (nA) Cd (pF) (1) 10 1 1 10−1 (2) 10−2 10−3 0 0 50 100 150 Tj (°C) 200 0 5 10 15 VR (V) 20 Tamb = 25 °C; f = 1 MHz VR = 75 V (1) Maximum values (2) Typical values Fig 3. Reverse current as a function of junction temperature Fig 4. Diode capacitance as a function of reverse voltage; typical values 9397 750 14881 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 April 2005 4 of 9 BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package 8. Test information tr RS = 50 Ω V = VR + IF × RS tp t D.U.T. 10 % + IF IF SAMPLING OSCILLOSCOPE trr t Ri = 50 Ω VR (1) 90 % mga881 input signal output signal (1) IR = 1 mA Fig 5. Reverse recovery time test circuit and waveforms 9397 750 14881 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 April 2005 5 of 9 BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package 9. Package outline 1.7 1.5 1.2 1.0 1 0.55 0.35 3.6 3.4 2.7 2.5 2 0.70 0.55 0.25 0.10 Dimensions in mm 04-11-29 Fig 6. Package outline SOD123F 10. Packing information Table 8: Packing methods The -xxx numbers are the last three digits of the 12NC ordering code. [1] Type number BAS116H [1] Package SO123F Description Packing quantity 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 16. 11. Soldering 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD123F 9397 750 14881 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 April 2005 6 of 9 BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package 12. Revision history Table 9: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes BAS116H_1 20050411 Product data sheet - 9397 750 14881 - 9397 750 14881 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 April 2005 7 of 9 BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package 13. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 14. Definitions 15. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 16. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 14881 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 April 2005 8 of 9 BAS116H Philips Semiconductors 75 V, low leakage diode in small SOD123F package 17. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 6 6 6 7 8 8 8 8 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 11 April 2005 Document number: 9397 750 14881 Published in The Netherlands