PACKAGE OPTION ADDENDUM www.ti.com 17-May-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMV821M5 NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 A14 LMV821M5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A14 LMV821M5X NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 85 A14 LMV821M5X/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A14 LMV821M7 NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 85 A15 LMV821M7/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A15 LMV821M7X NRND SC70 DCK 5 3000 TBD Call TI Call TI -40 to 85 A15 LMV821M7X/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A15 LMV822M NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMV 822M LMV822M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMV 822M LMV822MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 V822 LMV822MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM & no Sb/Br) -40 to 85 V822 -40 to 85 V822 Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM & no Sb/Br) -40 to 85 V822 LMV822MMX NRND VSSOP DGK 8 LMV822MMX/NOPB ACTIVE VSSOP DGK 8 3500 TBD LMV822MX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMV 822M LMV822MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMV 822M LMV822Q1MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AKAA LMV822Q1MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AKAA LMV824M NRND SOIC D 14 55 TBD Call TI Call TI -40 to 85 LMV824M LMV824M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMV824M Addendum-Page 1 Call TI Call TI Samples PACKAGE OPTION ADDENDUM www.ti.com 17-May-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMV824MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 LMV824 MT LMV824MTX NRND TSSOP PW 14 2500 TBD Call TI Call TI -40 to 85 LMV824 MT LMV824MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 LMV824 MT LMV824MX NRND SOIC D 14 2500 TBD Call TI Call TI -40 to 85 LMV824M LMV824MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMV824M LMV824NDGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV824N LMV824Q1MA/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV824Q1 MA LMV824Q1MAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV824Q1 MA LMV824Q1MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV824 Q1MT LMV824Q1MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV824 Q1MT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 17-May-2016 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LMV822-N, LMV822-N-Q1, LMV824-N, LMV824-N-Q1 : • Catalog: LMV822-N, LMV824-N • Automotive: LMV822-N-Q1, LMV824-N-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3