ATMEL AT34C02C-TH-B

Features
• Permanent and Reversible Software Write Protection for the First-half of the Array
– Software Procedure to Verify Write Protect Status
• Hardware Write Protection for the Entire Array
• Low-voltage and Standard-voltage Operation
•
•
•
•
•
•
•
•
•
•
•
– 1.7 (VCC = 1.7V to 5.5V)
Internally Organized 256 x 8
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
100 kHz (1.7V) and 400 kHz (2.7V and 5.0V) Compatibility
16-byte Page Write Modes
Partial Page Writes Are Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 8-lead TSSOP, and 8-ball
dBGA2 Packages
Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers
Two-wire Serial
EEPROM
with Permanent
and Reversible
Software Write
Protect
2K (256 x 8)
Description
The AT34C02C provides 2048 bits of serial electrically-erasable and programmable
read only memory (EEPROM) organized as 256 words of 8 bits each. The first-half of
the device incorporates a permanent and a reversible software write protection feature while hardware write protection for the entire array is available via an external pin.
Once the permanent software write protection is enabled, by sending a special command to the device, it cannot be reversed. However, the reversible software write
protection is enabled and can be reversed by sending a special command. The hardware write protection is controlled with the WP pin and can be used to protect the
entire array, whether or not the software write protection has been enabled. This
allows the user to protect none, first-half, or all of the array depending on the application. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operations are essential. The AT34C02C is available in space saving 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 8-lead
TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface.
It is available in 1.7V (1.7V to 5.5V).
AT34C02C
8-lead Ultra Thin Mini-MAP
8-ball dBGA2
8-lead TSSOP
A0
A1
A2
GND
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
VCC
WP
SCL
SDA
8
1
7
2
6
3
5
4
A0
A1
A2
GND
Bottom View
8
7
6
5
VCC
WP
SCL
SDA
1
2
3
4
A0
A1
A2
GND
(MLP 2x3) Bottom View
8-lead SOIC
A0
A1
A2
GND
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
Rev. 5185D–SEEPR–1/08
Table 0-1.
Pin Configurations
Pin Name
Function
A0 - A2
Address Inputs
SDA
Serial Data
SCL
Serial Clock Input
WP
Write Protect
1. Absolute Maximum Ratings*
Operating Temperature..................................–55°C to +125 °C
*NOTICE:
Storage Temperature .....................................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground .................................... –1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1-1.
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Block Diagram
VCC
GND
WP
START
STOP
LOGIC
SCL
SDA
SERIAL
CONTROL
LOGIC
WRITE PROTECT
CIRCUITRY
EN
H.V. PUMP/TIMING
LOAD
A2
A1
A0
R/W
COMP
LOAD
DATA WORD
ADDR/COUNTER
DATA RECOVERY
SOFTWARE WRITE
PROTECTED AREA
(00H - 7FH)
INC
X DEC
DEVICE
ADDRESS
COMPARATOR
EEPROM
Y DEC
DIN
SERIAL MUX
DOUT/ACK
LOGIC
DOUT
2
AT34C02C
5185D–SEEPR–1/08
AT34C02C
2. Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM
device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is opendrain driven and may be wire-ORed with any number of other open-drain or open collector
devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1, and A0 pins are device address inputs
that are hardwired (directly to GND or to Vcc) for compatibility with other AT24Cxx devices.
When the pins are hardwired, as many as eight 2K devices may be addressed on a single bus
system. (Device addressing is discussed in detail under “Device Addressing,” page 9.) A device
is selected when a corresponding hardware and software match is true. If these pins are left
floating, the A2, A1, and A0 pins will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer applications, Atmel recommends always
connecting the address pins to a known state. When using a pull-up resistor, Atmel recommends
using 10kΩ or less.
WRITE PROTECT (WP): The write protect input, when connected to GND, allows normal write
operations. When WP is connected directly to Vcc, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND. However, due to
capacitive coupling that may appear during customer applications, Atmel recommends always
connecting the WP pins to a known state. When using a pull-up resistor, Atmel recommends
using 10kΩ or less.
Table 2-1.
AT34C02C Write Protection Modes
WP Pin Status
Permanent Write Protect
Register
Reversible Write Protect
Register
Part of the Array Write
Protected
VCC
–
–
Full Array (2K)
GND or Floating
Not Programmed
Not Programmed
Normal Read/Write
GND or Floating
Programmed
–
First-Half of Array
(1K: 00H - 7FH)
GND or Floating
–
Programmed
First-Half of Array
(1K: 00H - 7FH)
Table 2-2.
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 100 kHz, VCC = +1.7V
Symbol
Test Condition
CI/O
CIN
Note:
Max
Units
Conditions
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
Input Capacitance (A0, A1, A2, SCL)
6
pF
VIN = 0V
1. This parameter is characterized and is not 100% tested.
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5185D–SEEPR–1/08
Table 2-3.
DC Characteristics
Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.7V to +5.5V, (unless otherwise noted)
Symbol
Parameter
Test Condition
VCC
Supply Voltage
ICC
Supply Current VCC = 5.0V
READ at 100 kHz
ICC
Supply Current VCC = 5.0V
ISB1
Max
Units
5.5
V
0.4
1.0
mA
WRITE at 100 kHz
2.0
3.0
mA
Standby Current VCC = 1.7V
VIN = VCC or VSS
0.6
3.0
µA
ISB2
Standby Current VCC = 3.6V
VIN = VCC or VSS
1.6
4.0
µA
ISB3
Standby Current VCC = 5.5V
VIN = VCC or VSS
8.0
18.0
µA
ILI
Input Leakage Current
VIN = VCC or VSS
0.10
3.0
µA
ILO
Output Leakage Current
VOUT = VCC or VSS
0.05
3.0
µA
Typ
1.7
(1)
–0.6
VCC x 0.3
V
(1)
VCC x 0.7
VCC + 0.5
V
Input Low Level
VIL
Min
VIH
Input High Level
VOL2
Output Low Level VCC = 3.0V
IOL = 2.1 mA
0.4
V
Output Low Level VCC = 1.7V
IOL = 0.15 mA
0.2
V
VOL1
Note:
1. VIL min and VIH max are reference only and are not tested.
Table 2-4.
AC Characteristics
Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.7V to +5.5V, CL = 1 TTL Gate and
100 pF (unless otherwise noted)
1.7V
Symbol
Parameter
Min
fSCL
Clock Frequency, SCL
tLOW
Clock Pulse Width Low
tHIGH
Clock Pulse Width High
2.7V, 5.0V
Max
Min
100
Max
Units
400
kHz
4.7
1.2
µs
4.0
0.6
µs
(1)
tI
Noise Suppression Time
100
tAA
Clock Low to Data Out Valid
0.1
tBUF
Time the bus must be free before a new
transmission can start(1)
4.7
1.2
µs
tHD.STA
Start Hold Time
4.0
0.6
µs
tSU.STA
Start Set-up Time
4.7
0.6
µs
tHD.DAT
Data In Hold Time
0
0
µs
tSU.DAT
Data In Set-up Time
200
100
ns
(1)
4.5
0.1
50
ns
0.9
µs
tR
Inputs Rise Time
1.0
0.3
µs
tF
Inputs Fall Time(1)
300
300
ns
tSU.STO
Stop Set-up Time
4
4.7
0.6
µs
AT34C02C
5185D–SEEPR–1/08
AT34C02C
Table 2-4.
AC Characteristics
Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.7V to +5.5V, CL = 1 TTL Gate and
100 pF (unless otherwise noted)
1.7V
Symbol
Parameter
Min
tDH
Data Out Hold Time
100
tWR
Write Cycle Time
Endurance(1)
25°C, Page Mode
Note:
2.7V, 5.0V
Max
Min
50
5
1M
Max
ns
5
1M
Units
ms
Write
Cycles
1. This parameter is characterized and is not 100% tested.
3. Memory Organization
AT34C02C, 2K Serial EEPROM: The 2K is internally organized with 16 pages of 16 bytes each.
Random word addressing requires a 8-bit data word address.
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5185D–SEEPR–1/08
4. Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external
device. Data on the SDA pin may change only during SCL low time periods (see Figure 4-3 on
page 7). Data changes during SCL high periods will indicate a start or stop condition as defined
below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which
must precede any other command (see Figure 4-4 on page 7).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a
read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 4-4 on page 7).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the
EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each
word. This happens during the ninth clock cycle.
STANDBY MODE: The AT34C02C features a low-power standby mode which is enabled: (a)
upon power-up or (b) after the receipt of the STOP bit and the completion of any internal
operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any Two-wire
part can be reset by following these steps:
(a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then (c) create
a start condition.
Figure 4-1.
6
Bus Timing SCL: Serial Clock SDA: Serial Data I/O
AT34C02C
5185D–SEEPR–1/08
AT34C02C
Figure 4-2.
Write Cycle Timing SCL: Serial Clock SDA: Serial Data I/O
SCL
SDA
8th BIT
ACK
WORDn
(1)
twr
STOP
CONDITION
Note:
START
CONDITION
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
Figure 4-3.
Data Validity
Figure 4-4.
Start and Stop Condition
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5185D–SEEPR–1/08
Figure 4-5.
Output Acknowledge
5. Device Addressing
The 2K EEPROM device requires an 8-bit device address word following a start condition to
enable the chip for a read or write operation (see Figure 8-1 on page 13).
The device address word consists of a mandatory one-zero sequence for the first four most-significant bits (1010) for normal read and write operations and 0110 for writing to the write protect
register.
The next 3 bits are the A2, A1 and A0 device address bits for the AT34C02C EEPROM. These 3
bits must compare to their corresponding hard-wired input pins.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is not
made, the chip will return to a standby state. The device will not acknowledge if the write protect
register has been programmed and the control code is 0110.
6. Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device
address word and acknowledgment. Upon receipt of this address, the EEPROM will again
respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data
word, the EEPROM will output a zero and the addressing device, such as a microcontroller,
must terminate the write sequence with a stop condition. At this time the EEPROM enters an
internally-timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this
write cycle and the EEPROM will not respond until the write is complete (see Figure 8-2 on page
13).
The device will acknowledge a write command, but not write the data, if the software or hardware write protection has been enabled. The write cycle time must be observed even when the
write protection is enabled.
PAGE WRITE: The 2K device is capable of 16-byte page write.
8
AT34C02C
5185D–SEEPR–1/08
AT34C02C
A page write is initiated the same as a byte write, but the microcontroller does not send a stop
condition after the first data word is clocked in. Instead, after the EEPROM acknowledges
receipt of the first data word, the microcontroller can transmit up to fifteen more data words. The
EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 1 on page 13).
The data word address lower four bits are internally incremented following the receipt of each
data word. The higher data word address bits are not incremented, retaining the memory page
row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than sixteen data words are
transmitted to the EEPROM, the data word address will “roll over” and previous data will be
overwritten. The address “roll over” during write is from the last byte of the current page to the
first byte of the same page.
The device will acknowledge a write command, but not write the data, if the software or hardware write protection has been enabled. The write cycle time must be observed even when the
write protection is enabled.
ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a
start condition followed by the device address word. The read/write bit is representative of the
operation desired. Only if the internal write cycle has completed will the EEPROM respond with
a zero allowing the read or write sequence to continue.
7. Write Protection
The software write protection, once enabled, write protects only the first-half of the array (00H 7FH) while the hardware write protection, via the WP pin, is used to protect the entire array.
PERMANENT SOFTWARE WRITE PROTECTION: The software write protection is enabled by
sending a command, similar to a normal write command, to the device which programs the permanent write protect register. This must be done with the WP pin low. The write protect register
is programmed by sending a write command with the device address of 0110 instead of 1010
with the address and data bit being don’t cares (see Figure 7-1 on page 10). Once the software
write protection has been enabled, the device will no longer acknowledge the 0110 control byte.
The software write protection cannot be reversed even if the device is powered down. The write
cycle time must be observed.
REVERSIBLE SOFTWARE WRITE PROTECTION: The reversible software write protection is
enabled by sending a command, similar to a normal write command, to the device which programs the reversible write protect register. This must be done with the WP pin low. The write
protect register is programmed by sending a write command 01100010 with pins A2 and A1 tied
to ground or don't connect and pin A0 connected to VHV (see Figure 7-2). The reversible write
protection can be reversed by sending a command 01100110 with pin A2 tied to ground or no
connect, pin A1 tied to VCC and pin A0 tied to VHV (see Figure 7-3).
HARDWARE WRITE PROTECTION: The WP pin can be connected to VCC, GND, or left floating. Connecting the WP pin to VCC will write protect the entire array, regardless of whether or not
the software write protection has been enabled. The software write protection register cannot be
programmed when the WP pin is connected to VCC. If the WP pin is connected to GND or left
floating, the write protection mode is determined by the status of the software write protect
register.
9
5185D–SEEPR–1/08
Figure 7-1.
Setting Permanent Write Protect Register (PSWP)
S
T
A
R
T
SDA LINE
CONTROL
BYTE
WORD
ADDRESS
S
T
O
P
DATA
0 1 1 0 A2 A1 A0 0
A
C
K
A
C
K
A
C
K
= Don't Care
Figure 7-2.
Setting Reversible Write Protect Register (RSWP)
S
T
A
R
T
SDA LINE
CONTROL
BYTE
WORD
ADDRESS
S
T
O
P
DATA
0 1 1 0 0 0 1 0
A
C
K
A
C
K
A
C
K
= Don't Care
Figure 7-3.
Clearing Reversible Write Protect Register (RSWP)
S
T
A
R
T
SDA LINE
CONTROL
BYTE
WORD
ADDRESS
S
T
O
P
DATA
0 1 1 0 0 1 1 0
A
C
K
A
C
K
A
C
K
= Don't Care
Table 7-1.
Write Protection
Pin
RW
Command
A2
A1
A0
B7
B6
B5
B4
B3
B2
B1
B0
Set PSWP
A2
A1
A0
0
1
1
0
A2
A1
A0
0
Set RSWP
0
0
VHV
0
1
1
0
0
0
1
0
Clear RSWP
0
1
VHV
0
1
1
0
0
1
1
0
Table 7-2.
VHV
VHV
Note:
10
Preamble
Min
Max
Units
7
10
V
VHV - VCC > 4.8V
AT34C02C
5185D–SEEPR–1/08
AT34C02C
Table 7-3.
WP Connected to GND or Floating
WP Connected to GND or Floating
Command
R/W Bit
Permanent
Write Protect
Register
PSWP
1010
R
X
X
ACK
1010
W
Programmed
X
ACK
Can write to second Half (80H - FFH) only
1010
W
X
Programmed
ACK
Can write to second Half (80H - FFH) only
1010
W
Not Programmed
Not Programmed
ACK
Can write to full array
Read PSWP
R
Programmed
X
No ACK
STOP - Indicates permanent write protect register is
programmed
Read PSWP
R
Not Programmed
X
ACK
Read out data don't care. Indicates PSWP register
is not programmed
Set PSWP
W
Programmed
X
No ACK
STOP - Indicates permanent write protect register is
programmed
Set PSWP
W
Not Programmed
X
ACK
Read RSWP
R
X
Programmed
No ACK
STOP - Indicates reversible write protect register is
programmed
Read RSWP
R
X
Not Programmed
ACK
Read out data don't care. Indicates RSWP register
is not programmed
Set RSWP
W
X
Programmed
No ACK
STOP - Indicates reversible write protect register is
programmed
Set RSWP
W
X
Not Programmed
ACK
Program reversible write protect register (reversible)
Clear RSWP
W
Programmed
X
No ACK
STOP - Indicates permanent write protect register is
programmed
Clear RSWP
W
Not Programmed
X
ACK
Table 7-4.
Reversible
Write Protect
Register RSWP
Acknowledgme
nt from Device
Action from Device
Program permanent write protect register
(irreversible)
Clear (unprogram) reversible write protect register
(reversible)
WP Connected to Vcc
WP Connected to Vcc
R/W Bit
Permanent
Write Protect
Register PSWP
Reversible
Write Protect
Register RSWP
Acknowledgme
nt from Device
1010
R
X
X
ACK
Read array
1010
W
X
X
ACK
Device Write Protect
Read
PSWP
R
Programmed
X
No ACK
STOP - Indicates permanent write protect register is
programmed
Read
PSWP
R
Not Programmed
X
ACK
Read out data don't care. Indicates PSWP register is
not programmed
Comman
d
Action from Device
11
5185D–SEEPR–1/08
WP Connected to Vcc
Set PSWP
W
Programmed
X
No ACK
Set PSWP
W
Not Programmed
X
ACK
Read
RSWP
R
X
Programmed
No ACK
Read
RSWP
R
X
Not Programmed
ACK
Set RSWP
W
X
Programmed
No ACK
Set RSWP
W
X
Not Programmed
ACK
Clear
RSWP
W
Programmed
X
No ACK
Clear
RSWP
W
Not Programmed
X
ACK
STOP - Indicates permanent write protect register is
programmed
Cannot program write protect registers
STOP - Indicates reversible write protect register is
programmed
Read out data don't care. Indicates RSWP register is
not programmed
STOP - Indicates reversible write protect register is
programmed
Cannot program write protect registers
STOP - Indicates permanent write protect register is
programmed
Cannot write to write protect registers
8. Read Operations
Read operations are initiated the same way as write operations with the exception that the
read/write select bit in the device address word is set to one. There are three read operations:
current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last
address accessed during the last read or write operation, incremented by one. This address
stays valid between operations as long as the chip power is maintained. The address “roll over”
during read is from the last byte of the last memory page to the first byte of the first page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged
by the EEPROM, the current address data word is serially clocked out. To end the command,
the microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 8-3 on page 14).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data
word address. Once the device address word and data word address are clocked in and
acknowledged by the EEPROM, the microcontroller must generate another start condition. The
microcontroller now initiates a current address read by sending a device address with the
read/write select bit high. The EEPROM acknowledges the device address and serially clocks
out the data word. To end the command, the microcontroller does not respond with a zero but
does generate a following stop condition (see Figure 8-4 on page 14).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an
acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment
the data word address and serially clock out sequential data words. When the memory address
limit is reached, the data word address will “roll over” and the sequential read will continue. The
sequential read operation is terminated when the microcontroller does not respond with a zero
but does generate a following stop condition (see Figure 8-5 on page 14).
12
AT34C02C
5185D–SEEPR–1/08
AT34C02C
PERMANENT WRITE PROTECT REGISTER (PSWP) STATUS: To find out if the register has
been programmed, the same procedure is used as to program the register except that the
R/W bit is set to 1. If the device sends an acknowledge, then the permanent write protect
register has not been programmed. Otherwise, it has been programmed and the device is
permanently write protected at the first half of the array.
Table 8-1.
PSWP Status
Pin
Preamble
RW
Command
A2
A1
A0
B7
B6
B5
B4
B3
B2
B1
B0
Read PSWP
A2
A1
A0
0
1
1
0
A2
A1
A0
1
REVERSIBLE WRITE PROTECT REGISTER(RSWP) STATUS: To find out if the register has
been programmed, the same procedure is used as to program the register except that the
R/W bit is set to 1. If the sends an device acknowledge, then the reversible write protect
register has not been programmed. Otherwise, it has been programmed and the device is
write protected (reversible) at the first half of the array.
Figure 8-1.
Device Address
Figure 8-2.
Byte Write
Figure 1. Page Write
13
5185D–SEEPR–1/08
Figure 8-3.
Current Address Read
Figure 8-4.
Random Read
Figure 8-5.
Sequential Read
14
AT34C02C
5185D–SEEPR–1/08
AT34C02C
AT34C02C Ordering Information
Ordering Code
Package
(1)
(NiPdAu Lead Finish)
8S1
AT34C02CN-SH-T (NiPdAu Lead Finish)
8S1
AT34C02CN-SH-B
(2)
(1)
(NiPdAu Lead Finish)
8A2
AT34C02C-TH-T(2) (NiPdAu Lead Finish)
8A2
(2)
8Y6
(2)
8U3-1
AT34C02C-TH-B
AT34C02CY6-YH-T (NiPdAu Lead Finish)
AT34C02CU3-UU-T
Notes:
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel; TSSOP, Ultra Thin Mini MAP and dBGA2 = 5K per reel.
Package Type
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8A2
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8Y6
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8U3-1
8-ball, die Ball Grid Array Package (dBGA2)
Options
–1.7
Low Voltage (1.7V to 5.5V)
15
5185D–SEEPR–1/08
9. New part marking
9.3
8-TSSOP
TOP MARK
Pin 1 Indicator (Dot)
|
|---|---|---|---|
*
H
Y
W
W
|---|---|---|---|---|
3
4
C
1 *
|---|---|---|---|---|
BOTTOM MARK
|---|---|---|---|---|---|---|
C
0
0
|---|---|---|---|---|---|---|
A
A
A
A
A
A
A
|---|---|---|---|---|---|---|
<- Pin 1 Indicator
Y =
6:
7:
8:
9:
16
SEAL YEAR
2006
0: 2010
2007
1: 2011
2008
2: 2012
2009
3: 2013
Country of Origin
Atmel Lot #
WW = SEAL WEEK
02 = Week 2
04 = Week 4
:: : :::: :
:: : :::: ::
50 = Week 50
52 = Week 52
AT34C02C
5185D–SEEPR–1/08
AT34C02C
9.4
8-SOIC
Seal Year
| Seal Week
|
|
|
|---|---|---|---|---|---|---|---|
A
T
M
L
H
Y
W
W
|---|---|---|---|---|---|---|---|
3
4
C
1
|---|---|---|---|---|---|---|---|
*
Lot Number
|---|---|---|---|---|---|---|---|
|
Pin 1 Indicator (Dot)
TOP MARK
Y =
6:
7:
8:
9:
SEAL YEAR
2006
0: 2010
2007
1: 2011
2008
2: 2012
2009
3: 2013
WW = SEAL WEEK
02 = Week 2
04 = Week 4
:: : :::: :
:: : :::: ::
50 = Week 50
52 = Week 52
Lot Number to Use ALL Characters in Marking
BOTTOM MARK
No Bottom Mark
17
5185D–SEEPR–1/08
9.5
8-Ultra Thin Mini MAP
TOP MARK
|---|---|---|
3
4
C
|---|---|---|
H
1
|---|---|---|
Y
X
X
|---|---|---|
*
|
Pin 1 Indicator (Dot)
Y = YEAR OF ASSEMBLY
XX = ATMEL LOT NUMBER TO COORESPOND WITH
NSEB TRACE CODE LOG BOOK.
(e.g. XX = AA, AB, AC,...AX, AY, AZ)
Y =
6:
7:
8:
9:
18
SEAL YEAR
2006
0: 2010
2007
1: 2011
2008
2: 2012
2009
3: 2013
AT34C02C
5185D–SEEPR–1/08
AT34C02C
9.6
dBGA2
TOP MARK
LINE 1------->
LINE 2------->
Y
4:
5:
6:
34CU
YMTC
|<--
Pin 1 This Corner
= ONE DIGIT YEAR CODE
2004
7: 2007
2005
8: 2008
2006
9: 2009
M = SEAL MONTH (USE ALPHA DESIGNATOR A-L)
A = JANUARY
B = FEBRUARY
" " """""""
J = OCTOBER
K = NOVEMBER
L = DECEMBER
TC = TRACE CODE (ATMEL LOT
NUMBERS TO CORRESPOND
WITH ATK TRACE CODE LOG BOOK)
19
5185D–SEEPR–1/08
10. Packaging Information
8S1 – JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL
A1
D
Side View
MIN
NOM
MAX
A
1.35
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.00
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
∅
0˚
–
8˚
Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
R
20
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
8S1
REV.
B
AT34C02C
5185D–SEEPR–1/08
AT34C02C
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
b
D
MIN
NOM
MAX
NOTE
2.90
3.00
3.10
2, 5
4.40
4.50
3, 5
E
E1
e
D
A2
6.40 BSC
4.30
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
Side View
L
0.65 BSC
0.45
L1
Notes:
4
0.60
0.75
1.00 REF
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
8A2
REV.
B
21
5185D–SEEPR–1/08
8Y6 – Mini-MAP
D2
A
b
(8X)
E
E2
Pin 1
Index
Area
Pin 1 ID
L (8X)
D
A2
e (6X)
A1
1.50 REF.
COMMON DIMENSIONS
(Unit of Measure = mm)
A3
SYMBOL
MIN
D
1.50
1.60
E2
-
-
1.40
A
-
-
0.60
A1
0.0
0.02
0.05
A2
-
-
0.55
L
0.20 REF
0.20
e
b
NOTE
3.00 BSC
1.40
A3
Notes:
MAX
2.00 BSC
E
D2
NOM
0.30
0.40
0.50 BSC
0.20
0.25
0.30
2
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
10/16/07
R
22
2325 Orchard Parkway
San Jose, CA 95131
DRAWING NO.
TITLE
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
8Y6
Dual No Lead Package (DFN) ,(MLP 2x3)
REV.
D
AT34C02C
5185D–SEEPR–1/08
AT34C02C
8U3-1 – dBGA2
E
D
1.
b
A1
PIN 1 BALL PAD CORNER
A2
Top View
A
Side View
PIN 1 BALL PAD CORNER
1
2
3
4
8
7
6
5
(d1)
d
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
Bottom View
8 SOLDER BALLS
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter
SYMBOL
MIN
A
0.71
0.81
0.91
A1
0.10
0.15
0.20
A2
0.40
0.45
0.50
b
0.20
0.25
0.30
D
MAX
NOM
NOTE
2
1.50 BSC
E
2.00 BSC
e
0.50 BSC
e1
0.25 REF
d
1.00 BSC
d1
0.25 REF
6/24/03
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
DRAWING NO.
REV.
PO8U3-1
A
23
5185D–SEEPR–1/08
11. Revision History
24
Doc. Rev.
Date
Comments
5185D
1/2008
Removed ‘preliminary’ status
5185C
8/2007
Updated to new template
Added Package Marking tables
5185B
3/2007
Implemented revision history
AT34C02C
5185D–SEEPR–1/08
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
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USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
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Japan
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Fax: (81) 3-3523-7581
Technical Support
[email protected]
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
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Literature Requests
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5185D–SEEPR–1/08