LX7206 Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports ® TM P RODUCTION D ATA S HEET LX7206 is an integrated low pass filter with ESD protection that filters out the undesired frequencies as well as protecting the port against both positive and negative ESD voltages. The device is a 3x2 array flip chip and measures 1.5 x 1.0 x 0.65 mm. The small size and profile of this device is ideally suited for portable applications. The absence of leadframe and bondwires minimizes inductance and optimizes the high frequency filter performance. LX7206 exceeds the requirements of IEC61000-4-2 (15KV air discharge and 8KV contact discharge). Flip Chip construction Bi-directional EMI/RFI low-pass filter ESD protection with integrated line termination resistor Bi-directional TVS protects against negative ESD voltages in audio applications Low TVS operating voltage (5.0V) Low leakage current 0.5mm Pitch Chip Scale Package designed for direct assembly on FR4 PCB using conventional assembly techniques bs ol et e Proliferation of digital portable electronic equipment has created a noisy environment in which all devices become susceptible to Electromagnetic Interference (EMI). Interference form cell phone frequencies of 800-900 MHz and 1.9GHz as well as the growing wireless LAN frequencies of 2.46GHz can couple into the audio port of a handheld device and adversely affect its performance. FCC Part 15 sets maximum allowable emission and immunity levels for all digital devices. WWW . Microsemi .C OM KEY FEATURES DESCRIPTION IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com APPLICATIONS BENEFITS Cell phones and Accessories Personal Digital Assistants (PDA’s) Pagers MP3 Players Desktops and Notebook Computers Digital Camcorders Filter response characterized up to 6 GHz Low insertion loss in the pass band >20dB attenuation in the 800-900 MHz range >15dB attenuation in the WLAN frequencies of 2.4GHz and 5.0-6.0 GHz PRODUCT HIGHLIGHT Device Schematic A1 C GND A3 Microphone Input A2, B2 B3 68 Ω C A Microphone Output C 1 2 3 LX7206 GND B Earpiece Output C O Earpiece Input B1 10 Ω A2, B2 PACKAGE ORDER INFO TJ (°C) -40 to 125 SP 0.5mm Pitch Chip Scale Package (CSP) LX7206ISP Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX7206ISP-TR) Copyright © 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX7206 ® TM Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT WWW . Microsemi .C OM Peak Pulse Power (tp = 8/20 µs ) IEC61000-4-5 .......................................... 250W Peak Pulse Current (tp = 8/20 µs ) IEC61000-4-5 ...........................................26A ESD Air Discharge per IEC61000-4-2 ......................................................... 30KV ESD Contact Discharge per IEC61000-4-2 .................................................. 30KV Operating Temperature ................................................................-40°C to +125°C Storage Temperature Range.........................................................-55°C to +150°C bs ol et e Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. SP PACKAGE (Top View) FUNCTIONAL PIN DESCRIPTION Name A1 B1 A2 & B2 A3 B3 Description Line 1 input Line 1 output Ground Line 2 input Line 2 output ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA otherwise noted. y O Parameter ` Symbol Test Conditions Min ≤ 70°C except where LX7206 Typ Max Units SECTION HEADER Copyright © 2004 Rev. 1.0, 2004-10-05 VRWM VBR IR RS RS TCOEFF C C 5.0 IR = 1mA VRWM = + -5.0V, T = 25°C Each Line VR = 2.5V, f = 1 MHz VR = 2.5V, f = 1 MHz 6 -1 9 61 115 115 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 10 68 200 145 145 1 11 75 175 175 V V µA Ω Ω ppm pF pF Page 2 ELECTRICALS Stand-Off Voltage Breakdown Voltage Leakage Current Series Resistance, A1 to B1 Series Resistance, A3 to B3 Temperature Coefficient of RS Capacitor, A1 or B1 to GND Capacitor, A3 or B3 to GND LX7206 ® TM Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports P RODUCTION D ATA S HEET RECOMMENDED PCB PARAMETERS WWW . Microsemi .C OM Parameter Value Cu pad size 0.275 +0.0/-0.025 mm Pad Pitch 0.5mm Pad Definition Non-Solder Mask Defined Solder Mask Opening 0.325 ± 0.025 mm 0.25 x 0.25 mm square, 0.125 mm thick, laser cut, electro-polished OSP (Organic Surface Preservative) bs ol et e Solder Stencil Pad Protective Finish Non-Solder Mask Defined Cu Pad (OSP finish) 0.275 mm dia. Solder Mask Opening 0.325 mm dia. Figure 1 – Recommended Non-Solder Mask Defined Pad 183 oC O Temperature (oC) 240 oC max 150 oC ~ 1min Flux Activation Zone ~2 min Solder Reflow Zone ~ 1min PACKAGE DATA Preheat Zone Cooling Zone Time (s) Figure 2 – Solder Reflow Profile. Maximum temperature is 240°C and maximum time above liquidous (183°C) is 60 seconds. Copyright © 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX7206 Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports ® TM P RODUCTION D ATA S HEET TEK Stopped Single Seq 0 Acqs 1Acqs WWW . Microsemi .C OM TEK Preview Single Seq bs ol et e 8KV Contact ESD 5.0V M 40.0ns Ch1 5.0V Chart 1 – 8KV ESD input pulse as per IEC61000-4-2. Vertical scale is equivalent to 5A/div. log 5dB/ REF 0dB S21 0 dB 0 dB -10 dB -10 dB Insertion Loss Insertion Loss S21 M 40.0ns Chart 2 – Clamping characteristics when device subjected to an 8KV ESD pulse. -20 dB -30 dB log 5dB/ REF 0dB -20 dB -30 dB -40 dB -40 dB 0.3 1 10 1000 100 6000 0.3 1 Chart 3 – Typical frequency response curce of the EMI filter (A1-B1) 100 1000 6000 Chart 4 – Typical frequency response curve of the EMI filter (A3-B3) 14 12 10 8 CHARTS Clamping Voltage VC(V) O 10 Frequency (MHz) Frequency (MHz) 6 Line To GND 4 GND to Line 2 0 0 5 10 15 20 Peak Pulse Current IPP(A) 25 30 Chart 5 – Clamping voltage versus Peak Pulse Current. Waveform parameters: tr = 8µs, td = 20µs. Per IEC61000-4-5 Copyright © 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX7206 Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports ® TM P RODUCTION D ATA S HEET PACKAGE DIMENSIONS WWW . Microsemi .C OM SP 0.5mm Chip Scale Package 1.5mm 0.25mm dia. 63/37 Sn/Pb Eutectic Solder Bumps 0.5mm B bs ol et e Pin A1 Identification Mark 0.5mm A 2 1 06 YWWA 1.0 mm 3 Y = Year | WW = Work Week | A = Lot Code SP Package – Bumps Up SP Package – Bump Side Down 06 YWWA 06 YWWA 06 YWWA Copyright © 2004 Rev. 1.0, 2004-10-05 MECHANICALS O Device Orientation in Tape Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX7206 Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports ® TM P RODUCTION D ATA S HEET A B C J P D MILLIMETERS MIN MAX 3.90 4.10 1.95 2.05 1.65 1.85 3.45 3.55 1.90 2.10 0.67 0.77 1.03 1.13 1.75 1.85 1.40 1.60 0.45 0.55 0.252 0.256 bs ol et e L Dim A B C D E F G H J K L WWW . Microsemi .C OM TAPE SPECIFICATIONS H K E 5°M A X G Copyright © 2004 Rev. 1.0, 2004-10-05 MECHANICALS O F Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX7206 ® TM Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports P RODUCTION D ATA S HEET NOTES O bs ol et e WWW . Microsemi .C OM NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7