ATMEL ATF1504ASV

Features
• High-density, High-performance, Electrically-erasable Complex
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Programmable Logic Device
– 3.0 to 3.6V Operating Range
– 64 Macrocells
– 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell
– 44, 68, 84, 100 Pins
– 15 ns Maximum Pin-to-pin Delay
– Registered Operation up to 77 MHz
– Enhanced Routing Resources
In-System Programmability (ISP) via JTAG
Flexible Logic Macrocell
– D/T/Latch Configurable Flip-flops
– Global and Individual Register Control Signals
– Global and Individual Output Enable
– Programmable Output Slew Rate
– Programmable Output Open-collector Option
– Maximum Logic Utilization by Burying a Register with a COM Output
Advanced Power Management Features
– Automatic 5 µA Standby for “L” Version
– Pin-controlled 100 µA Standby Mode (Typical)
– Programmable Pin-keeper Circuits on Inputs and I/Os
– Reduced-power Feature per Macrocell
Available in Commercial and Industrial Temperature Ranges
Available in 44-, 68-, and 84-lead PLCC; 44- and 100-lead TQFP; and 100-lead PQFP
Advanced EE Technology
– 100% Tested
– Completely Reprogrammable
– 10,000 Program/Erase Cycles
– 20 Year Data Retention
– 2000V ESD Protection
– 200 mA Latch-up Immunity
JTAG Boundary-scan Testing to IEEE Std. 1149.1-1990 and 1149.1a-1993 Supported
PCI-compliant
Security Fuse Feature
Low-voltage,
Complex
Programmable
Logic Device
ATF1504ASV
ATF1504ASVL
Enhanced Features
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Improved Connectivity (Additional Feedback Routing, Alternate Input Routing)
Output Enable Product Terms
Transparent-latch Mode
Combinatorial Output with Registered Feedback within Any Macrocell
Three Global Clock Pins
ITD (Input Transition Detection) Circuits on Global Clocks, Inputs and I/O
Fast Registered Input from Product Term
Programmable “Pin-keeper” Option
VCC Power-up Reset Option
Pull-up Option on JTAG Pins TMS and TDI
Advanced Power Management Features
– Edge-controlled Power-down “L”
– Individual Macrocell Power Option
– Disable ITD on Global Clocks, Inputs and I/O
Rev. 1409I–PLD–2/03
1
44-lead PLCC
Top View
I/O
I/O
I/O
I/O
GND
VCC
I/O
PD2/I/O
I/O
I/O
I/O
39
38
37
36
35
34
33
32
31
30
29
I/O
I/O/TDO
I/O
I/O
VCC
I/O
I/O
I/O/TCK
I/O
GND
I/O
84-lead PLCC
Top View
11
10
9
8
7
6
5
4
3
2
1
84
83
82
81
80
79
78
77
76
75
I/O
VCCIO
I/O/TDI
I/O
I/O
I/O
I/O
GND
I/O/PD1
I/O
I/O
I/O/TMS
I/O
I/O
VCCIO
I/O
I/O
I/O
I/O
I/O
GND
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
I/O
I/O
GND
I/O/TDO
I/O
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O
I/O/TCK
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O
GND
VCCINT
I/O
I/O
I/O/PD2
GND
I/O
I/O
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O
I/O
VCCIO
I/O
I/O
GND
VCCINT
I/O
I/O/PD2
GND
I/O
I/O
I/O
I/O
VCCIO
I/O
I/O
GND
I/O/TDO
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O/TCK
I/O
GND
I/O
I/O
I/O
I/O
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
I/O
I/O
I/O
GND
I/O
I/O
VCCINT
GCLK2/OE2/I
GCLR/I
OE1/I
GCLK1/I
GND
GCLK3/I/O
I/O
VCCIO
I/O
I/O
9
8
7
6
5
4
3
2
1
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
27
28
29
30
31
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38
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40
41
42
43
10
11
12
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14
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16
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18
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20
21
22
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24
25
26
7
8
9
10
11
12
13
14
15
16
17
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
VCCINT
GCLK2/OE2/I
I/GCLR
I/OE1
GCLK1/I
GND
GCLK3/I/O
I/O
I/O
VCCIO
1/O
I/O
I/O
68-lead PLCC
Top View
I/O
VCCIO
I/O/TD1
I/O
I/O
I/O
GND
I/O/PD1
I/O
I/O/TMS
I/O
VCCIO
I/O
I/O
I/O
I/O
GND
6
5
4
3
2
1
44
43
42
41
40
TDI/I/O
I/O
I/O
GND
PD1/I/O
I/O
I/O/TMS
I/O
VCC
I/O
I/O
I/O
I/O/TDO
I/O
I/O
VCC
I/O
I/O
I/O/TCK
I/O
GND
I/O
I/O
I/O
I/O
I/O
GND
VCC
I/O
PD2/I/O
I/O
I/O
I/O
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
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9
10
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12
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14
15
16
17
18
19
20
21
22
I/O/TDI
I/O
I/O
GND
PD1/I/O
I/O
TMS/I/O
I/O
VCC
I/O
I/O
18
19
20
21
22
23
24
25
26
27
28
44
43
42
41
40
39
38
37
36
35
34
I/O
I/O
I/O
VCC
GCLK2/OE2/I
GCLR/I
I/OE1
GCLK1/I
GND
GCLK3/I/O
I/O
I/O
I/O
I/O
VCC
GCLK2/OE2/I
GCLR/I
OE1/I
GCLK1/I
GND
GCLK3/I/O
I/O
44-lead TQFP
Top View
2
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
100-lead TQFP
Top View
100
99
98
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90
89
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84
83
82
81
80
79
78
77
76
I/O
I/O
I/O
GND
I/O
I/O
I/O
VCCINT
INPUT/OE2/GCLK2
INPUT/GCLR
INPUT/OE1
INPUT/GCLK1
GND
I/O/GCLK3
I/O
I/O
VCCIO
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
VCCINT
INPUT/OE2/GCLK2
INPUT/GCLR
INPUT/OE1
INPUT/GCLK1
GND
I/O/GCLK3
I/O
I/O
VCCIO
I/O
I/O
I/O
NC
NC
I/O
100-lead PQFP
Top View
NC
NC
VCCIO
I/O/TDI
NC
I/O
NC
I/O
I/O
I/O
GND
I/O/PD1
I/O
I/O
I/O/TMS
I/O
I/O
VCCIO
I/O
I/O
I/O
NC
I/O
NC
I/O
75
74
73
72
71
70
69
68
67
66
65
64
63
62
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60
59
58
57
56
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51
1
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4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
I/O
GND
I/O/TDO
NC
I/O
NC
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O
I/O/TCK
I/O
I/O
GND
I/O
I/O
I/O
NC
I/O
NC
I/O
VCCIO
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
NC
NC
I/O
I/O
GND
I/O/TDO
NC
I/O
NC
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O
I/O/TCK
I/O
I/O
GND
I/O
I/O
I/O
NC
I/O
NC
I/O
VCCIO
NC
NC
GND
NC
NC
I/O
I/O
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O
GND
VCCINT
I/O
I/O
I/O/PD2
GND
I/O
I/O
I/O
I/O
I/O
NC
NC
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
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56
55
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52
51
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
I/O
I/O
I/O
I/O
I/O
VCCIO
I/O
I/O
I/O
GND
VCCINT
I/O
I/O
I/O/PD2
GND
I/O
I/O
I/O
I/O
I/O
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
NC
NC
I/O
I/O
VCCIO
I/O/TDI
NC
I/O
NC
I/O
I/O
I/O
GND
I/O/PD1
I/O
I/O
I/O/TMS
I/O
I/O
VCCIO
I/O
I/O
I/O
NC
I/O
NC
I/O
GND
NC
NC
3
1409I–PLD–2/03
Description
The ATF1504ASV(L) is a high-performance, high-density complex programmable logic
device (CPLD) that utilizes Atmel’s proven electrically-erasable memory technology.
With 64 logic macrocells and up to 68 inputs, it easily integrates logic from several TTL,
SSI, MSI, LSI and classic PLDs. The ATF1504ASV(L)’s enhanced routing switch matrices increase usable gate count and the odds of successful pin-locked design
modifications.
The ATF1504ASV(L) has up to 68 bi-directional I/O pins and four dedicated input pins,
depending on the type of device package selected. Each dedicated pin can also serve
as a global control signal, register clock, register reset or output enable. Each of these
control signals can be selected for use individually within each macrocell.
Each of the 64 macrocells generates a buried feedback that goes to the global bus.
Each input and I/O pin also feeds into the global bus. The switch matrix in each logic
block then selects 40 individual signals from the global bus. Each macrocell also generates a foldback logic term that goes to a regional bus. Cascade logic between
macrocells in the ATF1504ASV(L) allows fast, efficient generation of complex logic functions. The ATF1504ASV(L) contains four such logic chains, each capable of creating
sum term logic with a fan-in of up to 40 product terms.
The ATF1504ASV(L) macrocell, shown in Figure 1, is flexible enough to support highlycomplex logic functions operating at high speed. The macrocell consists of five sections:
product terms and product term select multiplexer, OR/XOR/CASCADE logic, a flip-flop,
output select and enable, and logic array inputs.
4
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
Block Diagram
Unused product terms are automatically disabled by the compiler to decrease power
consumption. A security fuse, when programmed, protects the contents of the
ATF1504ASV(L). Two bytes (16 bits) of User Signature are accessible to the user for
purposes such as storing project name, part number, revision or date. The User Signature is accessible regardless of the state of the security fuse.
The ATF1504ASV(L) device is an in-system programmable (ISP) device. It uses the
industry-standard 4-pin JTAG interface (IEEE Std. 1149.1), and is fully-compliant with
JTAG’s Boundary-scan Description Language (BSDL). ISP allows the device to be programmed without removing it from the printed circuit board. In addition to simplifying the
manufacturing flow, ISP also allows design modifications to be made in the field via
software.
Product Terms and Select
Mux
Each ATF1504ASV(L) macrocell has five product terms. Each product term receives as
its inputs all signals from both the global bus and regional bus.
The product term select multiplexer (PTMUX) allocates the five product terms as
needed to the macrocell logic gates and control signals. The PTMUX programming is
determined by the design compiler, which selects the optimum macrocell configuration.
5
1409I–PLD–2/03
OR/XOR/CASCADE Logic
The ATF1504ASV(L)’s logic structure is designed to efficiently support all types of logic.
Within a single macrocell, all the product terms can be routed to the OR gate, creating a
5-input AND/OR sum term. With the addition of the CASIN from neighboring macrocells,
this can be expanded to as many as 40 product terms with little additional delay.
The macrocell’s XOR gate allows efficient implementation of compare and arithmetic
functions. One input to the XOR comes from the OR sum term. The other XOR input can
be a product term or a fixed high- or low-level. For combinatorial outputs, the fixed level
input allows polarity selection. For registered functions, the fixed levels allow DeMorgan
minimization of product terms. The XOR gate is also used to emulate T- and JK-type
flip-flops.
Flip-flop
The ATF1504ASV(L)’s flip-flop has very flexible data and control functions. The data
input can come from either the XOR gate, from a separate product term or directly from
the I/O pin. Selecting the separate product term allows creation of a buried registered
feedback within a combinatorial output macrocell. (This feature is automatically implemented by the fitter software). In addition to D, T, JK and SR operation, the flip-flop can
also be configured as a flow-through latch. In this mode, data passes through when the
clock is high and is latched when the clock is low.
The clock itself can either be one of the Global CLK Signal (GCK[0 : 2]) or an individual
product term. The flip-flop changes state on the clock’s rising edge. When the GCK signal is used as the clock, one of the macrocell product terms can be selected as a clock
enable. When the clock enable function is active and the enable signal (product term) is
low, all clock edges are ignored. The flip-flop’s asynchronous reset signal (AR) can be
either the Global Clear (GCLEAR), a product term, or always off. AR can also be a logic
OR of GCLEAR with a product term. The asynchronous preset (AP) can be a product
term or always off.
Extra Feedback
The ATF1504ASV(L) macrocell output can be selected as registered or combinatorial.
The extra buried feedback signal can be either combinatorial or a registered signal
regardless of whether the output is combinatorial or registered. (This enhancement
function is automatically implemented by the fitter software.) Feedback of a buried combinatorial output allows the creation of a second latch within a macrocell.
I/O Control
The output enable multiplexer (MOE) controls the output enable signal. Each I/O can be
individually configured as an input, output or for bi-directional operation. The output
enable for each macrocell can be selected from the true or compliment of the two output
enable pins, a subset of the I/O pins, or a subset of the I/O macrocells. This selection is
automatically done by the fitter software when the I/O is configured as an input, all macrocell resources are still available, including the buried feedback, expander and cascade
logic.
Global Bus/Switch Matrix
The global bus contains all input and I/O pin signals as well as the buried feedback signal from all 64 macrocells. The switch matrix in each logic block receives as its inputs all
signals from the global bus. Under software control, up to 40 of these signals can be
selected as inputs to the logic block.
Foldback Bus
Each macrocell also generates a foldback product term. This signal goes to the regional
bus and is available to four macrocells. The foldback is an inverse polarity of one of the
macrocell’s product terms. The four foldback terms in each region allow generation of
high fan-in sum terms (up to nine product terms) with little additional delay.
6
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
Figure 1. ATF1504ASV(L) Macrocell
Programmable Pin-keeper Option for Inputs and I/Os
The ATF1504ASV(L) offers the option of programming all input and I/O pins so that pin keeper circuits can be utilized.
When any pin is driven high or low and then subsequently left floating, it will stay at that previous high- or low-level. This circuitry prevents unused input and I/O lines from floating to intermediate voltage levels, which causes unnecessary power
consumption and system noise. The keeper circuits eliminate the need for external pull-up resistors and eliminate their DC
power consumption.
7
1409I–PLD–2/03
Input Diagram
I/O Diagram
Speed/Power
Management
The ATF1504ASV(L) has several built-in speed and power management features. The
ATF1504ASV(L) contains circuitry that automatically puts the device into a low power
standby mode when no logic transitions are occurring. This not only reduces power consumption during inactive periods, but also provides proportional power savings for most
applications running at system speeds below 5 MHz. This feature may be selected as a
device option.
To further reduce power, each ATF1504ASV(L) macrocell has a reduced-power bit feature. This feature allows individual macrocells to be configured for maximum power
savings. This feature may be selected as a design option.
All ATF1504ASV(L) also have an optional power-down mode. In this mode, current
drops to below 5 mA. When the power-down option is selected, either PD1 or PD2 pins
(or both) can be used to power down the part. The power-down option is selected in the
design source file. When enabled, the device goes into power down when either PD1 or
PD2 is high. In the power-down mode, all internal logic signals are latched and held, as
are any enabled outputs.
All pin transitions are ignored until the PD pin is brought low. When the power-down feature is enabled, the PD1 or PD2 pin cannot be used as a logic input or output. However,
the pin’s macrocell may still be used to generate buried foldback and cascade logic
signals.
8
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
All power-down AC characteristic parameters are computed from external input or I/O
pins, with reduced-power bit turned on. For macrocells in reduced-power mode
(reduced-power bit turned on), the reduced-power adder, tRPA, must be added to the AC
parameters, which include the data paths tLAD, tLAC, tIC, tACL, tACH and tSEXP.
The ATF1504ASV(L) macrocell also has an option whereby the power can be reduced
on a per macrocell basis. By enabling this power-down option, macrocells that are not
used in an application can be turned down, thereby reducing the overall power consumption of the device.
Each output also has individual slew rate control. This may be used to reduce system
noise by slowing down outputs that do not need to operate at maximum speed. Outputs
default to slow switching, and may be specified as fast switching in the design file.
Design Software
Support
ATF1504ASV(L) designs are supported by several industry standard third party tools.
Automated fitters allow logic synthesis using a variety of high-level description languages and formats.
Power-up Reset
The ATF1504ASV is designed with a power-up reset, a feature critical for state machine
initialization. At a point delayed slightly from VCC crossing VRST, all registers will be initialized, and the state of each output will depend on the polarity of its buffer. However,
due to the asynchronous nature of reset and uncertainty of how VCC actually rises in the
system, the following conditions are required:
1. The VCC rise must be monotonic,
2. After reset occurs, all input and feedback setup times must be met before driving
the clock pin high, and,
3. The clock must remain stable during TD.
The ATF1504ASV has two options for the hysteresis about the reset level, VRST, Small
and Large. To ensure a robust operating environment in applications where the device
is operated near 3.0V, Atmel recommends that during the fitting process users configure
the device with the Power-up Reset hysteresis set to Large. For conversions, Atmel
POF2JED users should include the flag “-power_reset” on the command line after “filename.POF”. To allow the registers to be properly reinitialized with the Large hysteresis
option selected, the following condition is added:
4. If VCC falls below 2.0V, it must shut off completely before the device is turned on
again.
When the Large hysteresis option is active, ICC is reduced by several hundred microamps as well.
Security Fuse Usage
A single fuse is provided to prevent unauthorized copying of the ATF1504ASV(L) fuse
patterns. Once programmed, fuse verify is inhibited. However, the 16-bit User Signature
remains accessible.
9
1409I–PLD–2/03
Programming
ATF1504ASV(L) devices are in-system programmable (ISP) devices utilizing the 4-pin
JTAG protocol. This capability eliminates package handling normally required for programming and facilitates rapid design iterations and field changes.
A t m el pr o v i d es IS P ha r dw a r e a n d s o ft w a r e t o a l l o w p r o g r a m m i n g of t h e
ATF1504ASV(L) via the PC. ISP is performed by using either a download cable, a comparable board tester or a simple microprocessor interface.
To facilitate ISP programming by the Automated Test Equipment (ATE) vendors. Serial
Vector Format (SVF) files can be created by Atmel provided software utilities.
ATF1504ASV(L) devices can also be programmed using standard third-party programmers. With third-party programmer the JTAG ISP port can be disabled thereby allowing
four additional I/O pins to be used for logic.
Contact your local Atmel representatives or Atmel PLD applications for details.
ISP Programming
Protection
The ATF1504ASV(L) has a special feature that locks the device and prevents the inputs
and I/O from driving if the programming process is interrupted for any reason. The
inputs and I/O default to high-Z state during such a condition. In addition the pin keeper
option preserves the former state during device programming, if this circuit were previously programmed on the device. This prevents disturbing the operation of other circuits
in the system while the ATF1504ASV(L) is being programmed via ISP.
All ATF1504ASV(L) devices are initially shipped in the erased state thereby making
them ready to use for ISP.
Note:
10
For more information refer to the “Designing for In-System Programmability with Atmel
CPLDs” application note.
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
DC and AC Operating Conditions
Commercial
Industrial
Operating Temperature (Ambient))
0°C - 70°C
-40°C - 85°C
VCC (3.3V) Power Supply
3.0V - 3.6V
3.0V - 3.6V
DC Characteristics
Symbol
Parameter
Condition
IIL
Input or I/O Low
Leakage Current
VIN = VCC
IIH
Input or I/O High
Leakage Current
IOZ
Tri-State Output
Off-State Current
Min
VO = VCC or GND
Typ
Max
Units
-2
-10
µA
2
10
-40
40
µA
Com.
60
mA
Ind.
75
mA
Com.
5
µA
Ind.
5
µA
Std Mode
ICC1
Power Supply Current,
Standby
VCC = Max
VIN = 0, VCC
“L” Mode
ICC2
Power Supply Current,
Power-down Mode
VCC = Max
VIN = 0, VCC
“PD” Mode
ICC3(2)
Reduced-power Mode
Supply Current, Standby
VCC = Max
VIN = 0, VCC
Std Power
VIL
Input Low Voltage
-0.3
0.8
V
VIH
Input High Voltage
1.7
VCCIO + 0.3
V
V
Output Low Voltage (TTL)
0.1
VOH
Notes:
40
Ind
55
mA
ma
VIN = VIH or VIL
VCCIO = Min, IOL = 8 mA
Com.
0.45
Ind.
0.45
VIN = VIH or VIL
VCC = Min, IOL = 0.1 mA
Com.
0.2
V
Ind.
0.2
V
VOL
Output Low Voltage (CMOS)
Com
5
Output High Voltage
- 3.3V (TTL)
VIN = VIH or VIL
VCCIO = Min, IOH = -2.0 mA
2.4
V
Output High Voltage
- 3.3V (CMOS)
VIN = VIH or VIL
VCCIO = Min, IOH = -0.1 mA
VCCIO - 0.2
V
1. Not more than one output at a time should be shorted. Duration of short circuit test should not exceed 30 sec.
2. When microcell reduced-power feature is enabled.
Pin Capacitance
Typ
CIN
CI/O
Note:
Max
Units
Conditions
8
pF
VIN = 0V; f = 1.0 MHz
8
pF
VOUT = 0V; f = 1.0 MHz
Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.
The OGI pin (high-voltage pin during programming) has a maximum capacitance of 12 pF.
11
1409I–PLD–2/03
Absolute Maximum Ratings*
Temperature Under Bias.................................. -40°C to +85°C
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Note:
Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V DC,
which may overshoot to 7.0V for pulses of less
than 20 ns.
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin with
Respect to Ground .........................................-2.0V to +7.0V(1)
Voltage on Input Pins
with Respect to Ground
During Programming.....................................-2.0V to +14.0V(1)
Programming Voltage with
Respect to Ground .......................................-2.0V to +14.0V(1)
1.
Timing Model
Internal Output
Enable Delay
tIOE
Global Control
Delay
tGLOB
Input
Delay
tIN
Switch
Matrix
tUIM
Logic Array
Delay
tLAD
Register Control
Delay
tLAC
tIC
tEN
Foldback Term
Delay
tSEXP
12
Cascade Logic
Delay
tPEXP
Fast Input
Delay
tFIN
Register
Delay
tSU
tH
tPRE
tCLR
tRD
tCOMB
tFSU
tFH
Output
Delay
tOD1
tOD2
tOD3
tXZ
tZX1
tZX2
tZX3
I/O
Delay
tIO
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
AC Characteristics
-15
Symbol
Parameter
tPD1
-20
Min
Max
Min
Max
Units
Input or Feedback to Non-Registered Output
3
15
20
ns
tPD2
I/O Input or Feedback to Non-Registered Feedback
3
12
16
ns
tSU
Global Clock Setup Time
11
13.5
ns
tH
Global Clock Hold Time
0
0
ns
tFSU
Global Clock Setup Time of Fast Input
3
3
ns
tFH
Global Clock Hold Time of Fast Input
1.0
2
MHz
tCOP
Global Clock to Output Delay
tCH
Global Clock High Time
5
6
ns
tCL
Global Clock Low Time
5
6
ns
tASU
Array Clock Setup Time
5
7
ns
tAH
Array Clock Hold Time
4
4
ns
tACOP
Array Clock Output Delay
tACH
Array Clock High Time
6
8
ns
tACL
Array Clock Low Time
6
8
ns
tCNT
Minimum Clock Global Period
fCNT
Maximum Internal Global Clock Frequency
tACNT
Minimum Array Clock Period
fACNT
Maximum Internal Array Clock Frequency
76.9
58.8
MHz
fMAX
Maximum Clock Frequency
100
83.3
MHz
tIN
Input Pad and Buffer Delay
2
2.5
ns
tIO
I/O Input Pad and Buffer Delay
2
2.5
ns
tFIN
Fast Input Delay
2
2
ns
tSEXP
Foldback Term Delay
8
10
ns
tPEXP
Cascade Logic Delay
1
1
ns
tLAD
Logic Array Delay
6
8
ns
tLAC
Logic Control Delay
3.5
4.5
ns
tIOE
Internal Output Enable Delay
3
3
ns
tOD1
Output Buffer and Pad Delay
(Slow slew rate = OFF; VCCIO = 5V; CL = 35 pF)
3
4
ns
tOD2
Output Buffer and Pad Delay
(Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF)
3
4
ns
tOD3
Output Buffer and Pad Delay
(Slow slew rate = ON; VCCIO = 5V or 3.3V; CL = 35 pF)
5
6
ns
tZX1
Output Buffer Enable Delay
(Slow slew rate = OFF; VCCIO = 5.0V; CL = 35 pF)
7
9
ns
9
12
15
18.5
13
76.9
17
66
13
ns
ns
ns
MHz
17
ns
13
1409I–PLD–2/03
AC Characteristics (Continued)
-15
Symbol
Parameter
Max
Units
tZX2
Output Buffer Enable Delay
(Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF)
7
9
ns
tZX3
Output Buffer Enable Delay
(Slow slew rate = ON; VCCIO = 5.0V/3.3V; CL = 35 pF)
10
11
ns
tXZ
Output Buffer Disable Delay (CL = 5 pF)
6
7
ns
tSU
Register Setup Time
5
6
ns
tH
Register Hold Time
4
5
ns
tFSU
Register Setup Time of Fast Input
2
2
ns
tFH
Register Hold Time of Fast Input
2
2
ns
tRD
Register Delay
2
2.5
ns
tCOMB
Combinatorial Delay
2
3
ns
tIC
Array Clock Delay
6
7
ns
tEN
Register Enable Time
6
7
ns
tGLOB
Global Control Delay
2
3
ns
tPRE
Register Preset Time
4
5
ns
tCLR
Register Clear Time
4
5
ns
tUIM
Switch Matrix Delay
2
2.5
ns
10
13
ns
tRPA
Notes:
Min
-20
(2)
Reduced-power Adder
Max
Min
1. See ordering information for valid part numbers.
2. The tRPA parameter must be added to the tLAD, tLAC,tTIC, tACL, and tSEXP parameters for macrocells running in the reducedpower mode.
3. See ordering information for valid part numbers.
Input Test Waveforms and Measurement Levels
tR, tF = 1.5 ns typical
Output AC Test Loads
3.0V
R1 = 703Ω
OUTPUT
PIN
R2 = 8060Ω
14
CL = 35 pF
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
Power-down Mode
The ATF1504ASV(L) includes an optional pin-controlled power-down feature. When this
mode is enabled, the PD pin acts as the power-down pin. When the PD pin is high, the
device supply current is reduced to less than 3 mA. During power down, all output data
and internal logic states are latched internally and held. Therefore, all registered and
combinatorial output data remain valid. Any outputs that were in a High-Z state at the
onset will remain at High-Z. During power down, all input signals except the power-down
pin are blocked. Input and I/O hold latches remain active to ensure that pins do not float
to indeterminate levels, further reducing system power. The power-down mode feature
is enabled in the logic design file or as a fitted or translated s/w option. Designs using
the power-down pin may not use the PD pin as a logic array input. However, all other PD
pin macrocell resources may still be used, including the buried feedback and foldback
product term array inputs.
Power Down AC Characteristics(1)(2)
-15
Symbol
Parameter
tIVDH
Valid I, I/O before PD High
15
20
ns
tGVDH
Valid OE(2) before PD High
15
20
ns
tCVDH
Valid Clock(2) before PD High
15
20
ns
tDHIX
I, I/O Don’t Care after PD High
(2)
Min
-20
Max
Min
Max
Units
25
30
ns
25
30
ns
tDHGX
OE
tDHCX
Clock(2) Don’t Care after PD High
25
30
ns
tDLIV
PD Low to Valid I, I/O
1
1
µs
tDLGV
PD Low to Valid OE (Pin or Term)
1
1
µs
tDLCV
PD Low to Valid Clock (Pin or Term)
1
1
µs
tDLOV
PD Low to Valid Output
1
1
µs
Notes:
Don’t Care after PD High
1. For slow slew outputs, add tSSO.
2. Pin or product term.
3. Includes tRPA for reduced-power bit enabled.
15
1409I–PLD–2/03
JTAG-BST/ISP
Overview
The JTAG boundary-scan testing is controlled by the Test Access Port (TAP) controller
in the ATF1504ASV(L). The boundary-scan technique involves the inclusion of a shiftregister stage (contained in a boundary-scan cell) adjacent to each component so that
signals at component boundaries can be controlled and observed using scan testing
principles. Each input pin and I/O pin has its own boundary-scan cell (BSC) in order to
support boundary-scan testing. The ATF1504ASV(L) does not currently include a Test
Reset (TRST) input pin because the TAP controller is automatically reset at power-up.
The five JTAG modes supported include: SAMPLE/PRELOAD, EXTEST, BYPASS,
IDCODE and HIGHZ. The ATF1504ASV(L)’s ISP can be fully described using JTAG’s
BSDL as described in IEEE Standard 1149.1b. This allows ATF1504ASV(L) programming to be described and implemented using any one of the third-party development
tools supporting this standard.
The ATF1504ASV(L) has the option of using four JTAG-standard I/O pins for boundaryscan testing (BST) and in-system programming (ISP) purposes. The ATF1504ASV(L) is
programmable through the four JTAG pins using the IEEE standard JTAG programming
protocol established by IEEE Standard 1149.1 using 5V TTL-level programming signals
from the ISP interface for in-system programming. The JTAG feature is a programmable
option. If JTAG (BST or ISP) is not needed, then the four JTAG control pins are available as I/O pins.
JTAG Boundary-scan
Cell (BSC) Testing
The ATF1504ASV(L) contains up to 68 I/O pins and four input pins, depending on the
device type and package type selected. Each input pin and I/O pin has its own boundary-scan cell (BSC) in order to support boundary-scan testing as described in detail by
IEEE Standard 1149.1. A typical BSC consists of three capture registers or scan registers and up to two update registers. There are two types of BSCs, one for input or I/O
pin, and one for the macrocells. The BSCs in the device are chained together through
the capture registers. Input to the capture register chain is fed in from the TDI pin while
the output is directed to the TDO pin. Capture registers are used to capture active
device data signals, to shift data in and out of the device and to load data into the update
registers. Control signals are generated internally by the JTAG TAP controller. The BSC
configuration for the input and I/O pins and macrocells are shown below.
BSC Configuration
for Input and I/O Pins
(Except JTAG TAP
Pins)
Note:
16
The ATF1504ASV(L) has pull-up option on TMS and TDI pins. This feature is selected as
a design option.
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
BSC Configuration for Macrocell
Pin BSC
TDO
0
1
Pin
DQ
Capture
DR
Clock
TDI
Shift
TDO
OEJ
0
0
1
D Q
D Q
1
OUTJ
0
0
Pin
1
D Q
D Q
Capture
DR
Update
DR
1
Mode
TDI
Shift
Clock
Macrocell BSC
17
1409I–PLD–2/03
ATF1504ASV Dedicated Pinouts
44-lead
TQFP
44-lead
J-lead
68-lead
J-lead
84-lead
J-lead
100-lead
PQFP
100-lead
TQFP
INPUT/OE2/GCLK2
40
2
2
2
92
90
INPUT/GCLR
39
1
1
1
91
89
INPUT/OE1
38
44
68
84
90
88
INPUT/GCLK1
37
43
67
83
89
87
I/O /GCLK3
35
41
65
81
87
85
5, 19
11, 25
17, 37
20, 46
14, 44
12, 42
I/O / TDI (JTAG)
1
7
12
14
6
4
I/O / TMS (JTAG)
7
13
19
23
17
15
I/O / TCK (JTAG)
26
32
50
62
64
62
I/O / TDO (JTAG)
32
38
57
71
75
73
GND
4, 16, 24, 36
10, 22, 30, 42
6, 16, 26, 34,
38, 48, 58, 66
7, 19, 32, 42,
47, 59, 72, 82
13, 28, 40, 45,
61, 76, 88, 97
11, 26, 38, 43,
59, 74, 86, 95
VCC
9, 17, 29, 41
3, 15, 23, 35
3, 11, 21, 31,
35, 43, 53, 63
3,13, 26, 38,
43, 53, 66, 78
5, 20, 36, 41,
53, 68, 84, 93
3, 18, 34, 39,
51, 66, 82, 91
1, 2, 5, 7, 22,
24, 27, 28, 49,
50, 53, 55, 70,
72, 77, 78
Dedicated Pin
I/O / PD (1,2)
N/C
–
–
–
–
1, 2, 7, 9,
24, 26, 29, 30,
51, 52, 55, 57,
72, 74, 79, 80
# of Signal Pins
36
36
52
68
68
68
# User I/O Pins
32
32
48
64
64
64
OE (1, 2)
Global OE pins
GCLR
Global Clear pin
GCLK (1, 2, 3)
Global Clock pins
PD (1, 2)
Power-down pins
TDI, TMS, TCK, TDO
JTAG pins used for boundary-scan testing or in-system programming
GND
Ground pins
VCC
VCC pins for the device
18
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
ATF1504ASV I/O Pinouts
44-lead 44-lead 68-lead 84-lead
PLCC
TQFP
PLCC
PLCC
100lead
PQFP
100lead
TQFP
44-lead 44-lead 68-lead 84-lead
PLCC
TQFP
PLCC
PLCC
100lead
PQFP
100lead
TQFP
MC
PLC
MC
PLC
1
A
12
6
18
22
16
14
33
C
24
18
36
44
42
40
2
A
-
-
-
21
15
13
34
C
-
-
-
45
43
41
3
A/
PD1
11
5
17
20
14
12
35
C/
PD2
25
19
37
46
44
42
4
A
9
3
15
18
12
10
36
C
26
20
39
48
46
44
5
A
8
2
14
17
11
9
37
C
27
21
40
49
47
45
6
A
-
-
13
16
10
8
38
C
-
-
41
50
48
46
7
A
-
-
-
15
8
6
39
C
-
-
-
51
49
47
8/
TDI
A
7
1
12
14
6
4
40
C
28
22
42
52
50
48
9
A
-
-
10
12
4
100
41
C
29
23
44
54
54
52
10
A
-
-
-
11
3
99
42
C
-
-
-
55
56
54
11
A
6
44
9
10
100
98
43
C
-
-
45
56
58
56
12
A
-
-
8
9
99
97
44
C
-
-
46
57
59
57
13
A
-
-
7
8
98
96
45
C
-
-
47
58
60
58
14
A
5
43
5
6
96
94
46
C
31
25
49
60
62
60
15
A
-
-
-
5
95
93
47
C
-
-
-
61
63
61
16
A
4
42
4
4
94
92
48/
TCK
C
32
26
50
62
64
62
17
B
21
15
33
41
39
37
49
D
33
27
51
63
65
63
18
B
-
-
-
40
38
36
50
D
-
-
-
64
66
64
19
B
20
14
32
39
37
35
51
D
34
28
52
65
67
65
20
B
19
13
30
37
35
33
52
D
36
30
54
67
69
67
21
B
18
12
29
36
34
32
53
D
37
31
55
68
70
68
22
B
-
-
28
35
33
31
54
D
-
-
56
69
71
69
23
B
-
-
-
34
32
30
55
D
-
-
-
70
73
71
D
38
32
57
71
75
73
59
73
77
75
24
B
17
11
27
33
31
29
56/
TDO
25
B
16
10
25
31
27
25
57
D
39
33
26
B
-
-
-
30
25
23
58
D
-
-
-
74
78
76
27
B
-
-
24
29
23
21
59
D
-
-
60
75
81
79
28
B
-
-
23
28
22
20
60
D
-
-
61
76
82
80
29
B
-
-
22
27
21
19
61
D
-
-
62
77
83
81
30
B
14
8
20
25
19
17
62
D
40
34
64
79
85
83
31
B
-
-
-
24
18
16
63
D
-
-
-
80
86
84
32/
TMS
B
13
7
19
23
17
15
64
D/
GCLK3
41
35
65
81
87
85
19
1409I–PLD–2/03
SUPPLY CURRENT VS. FREQUENCY
LOW-POWER ("L") VERSION
(TA = 25°C)
SUPPLY CURRENT VS. SUPPLY VOLTAGE
(TA = 25°C, F = 0)
100
100.0
75
80.0
STANDARD POWER
ICC (mA)
ICC (mA)
STANDARD POWER
50
REDUCED POWER MODE
60.0
40.0
REDUCED POWER
25
20.0
0
2.50
2.75
3.00
3.25
3.50
3.75
0.0
0.00
4.00
5.00
SUPPLY VOLTAGE (V)
800
10.00
15.00
20.00
FREQUENCY (MHz)
OUTPUT SOURCE CURRENT
VS. SUPPLY VOLTAGE
(VOH = 2.4V, TA = 25°C)
SUPPLY CURRENT VS. SUPPLY VOLTAGE
PIN-CONTROLLED POWER-DOWN MODE
(TA = 25°C, F = 0)
0
-2
700
-4
IOH (mA)
ICC (uA)
STANDARD & REDUCED POWER MODE
600
-6
-8
-10
-12
500
-14
400
2.50
2.75
3.00
3.25
3.50
3.75
-16
2.75
4.00
3.00
3.25
3.50
3.75
4.00
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
OUTPUT SOURCE CURRENT
VS. OUTPUT VOLTAGE
(VCC = 3.3V, TA = 25°C)
SUPPLY CURRENT VS. FREQUENCY
STANDARD POWER (TA = 25°C)
150.0
10
0
125.0
-10
ICC (mA)
75.0
IOH (mA)
STANDARD POWER
100.0
REDUCED POWER MODE
-20
-30
-40
-50
50.0
-60
25.0
-70
0.0
0.0
0.00
20.00
40.00
60.00
80.00
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
OUTPUT VOLTAGE (V)
100.00
FREQUENCY (MHz)
OUTPUT SINK CURRENT VS. SUPPLY VOLTAGE
(VOL = 0.5V, TA = 25°C)
SUPPLY CURRENT VS. SUPPLY VOLTAGE
LOW-POWER ("L") VERSION
(TA = 25°C, F = 0)
40
25
35
IOL (mA)
ICC (uA)
20
15
10
30
25
5
0
2.50
20
2.75
2.75
3.00
3.25
3.50
3.75
4.00
3.00
3.25
3.50
3.75
4.00
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
20
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
INPUT CURRENT VS. INPUT VOLTAGE
(VCC = 3.3V, TA = 25°C)
100
15
80
10
INPUT CURRENT (uA)
IOL (mA)
OUTPUT SINK CURRENT VS. OUTPUT VOLTAGE
(VCC = 3.3V, TA = 25°C)
60
40
20
0
5
0
-5
-10
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
2.5
3
3.5
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
INPUT CLAMP CURRENT VS. INPUT VOLTAGE
(VCC = 3.3V, TA = 25°C)
INPUT CURRENT (mA)
0
-20
-40
-60
-80
-100
-1
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
INPUT VOLTAGE (V)
21
1409I–PLD–2/03
ATF1504ASV(L) Ordering Information
tPD
(ns)
tCO1
(ns)
fMAX
(MHz)
15
8
15
Ordering Code
Package
Operation Range
100
ATF1504ASV-15 AC44
ATF1504ASV-15 JC44
ATF1504ASV-15 JC68
ATF1504ASV-15 JC84
ATF1504ASV-15 QC100
ATF1500ASV-15 AC100
44A
44J
68J
84J
100Q1
100A
Commercial
(0°C to 70°C)
8
100
ATF1504ASV-15 AI44
ATF1504ASV-15 JI44
ATF1504ASV-15 JI68
ATF1504ASV-15 JI84
ATF1504ASV-15 QI100
ATF1504ASV-15 AI100
44A
44J
68J
84J
100Q1
100A
Industrial
(-40°C to +85°C)
20
12
83.3
ATF1504ASVL-20 AC44
ATF1504ASVL-20 JC44
ATF1504ASVL-20 JC68
ATF1504ASVL-20 JC84
ATF1504ASVL-20 QC100
ATF1504ASVL-20 AC100
44A
44J
68J
84J
100Q1
100A
Commercial
(0°C to 70°C)
20
12
83.3
ATF1504ASVL-20 AI44
ATF1504ASVL-20 JI44
ATF1504ASVL-20 JI68
ATF1504ASVL-20 JI84
ATF1504ASVL-20 QI100
ATF1504ASVL-20 AI100
44A
44J
68J
84J
100Q1
100A
Industrial
(-40°C to +85°C)
Using “C” Product for Industrial
There is very little risk in using “C” devices for industrial applications because the VCC conditions for 3.3V products are the
same for commercial and industrial (there is only 15°C difference at the high end of the temperature range). To use commercial product for industrial temperature ranges, de-rate ICC by 15%.
22
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
Packaging Information
44A – TQFP
PIN 1
B
PIN 1 IDENTIFIER
E1
e
E
D1
D
C
0˚~7˚
A1
A2
A
L
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
SYMBOL
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
11.75
12.00
12.25
D1
9.90
10.00
10.10
E
11.75
12.00
12.25
E1
9.90
10.00
10.10
B
0.30
–
0.45
C
0.09
–
0.20
L
0.45
–
0.75
e
NOTE
Note 2
Note 2
0.80 TYP
10/5/2001
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
DRAWING NO.
REV.
44A
B
23
1409I–PLD–2/03
44J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
E1
D2/E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
17.399
–
17.653
D1
16.510
–
16.662
E
17.399
–
17.653
E1
16.510
–
16.662
D2/E2
14.986
–
16.002
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
24
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
44J
B
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
68J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
E1
D2/E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
25.019
–
25.273
D1
24.130
–
24.333
E
25.019
–
25.273
E1
24.130
–
24.333
D2/E2
22.606
–
23.622
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
68J, 68-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
68J
B
25
1409I–PLD–2/03
84J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
E1
D2/E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, Variation AF.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
30.099
–
30.353
D1
29.210
–
29.413
E
30.099
–
30.353
E1
29.210
–
29.413
D2/E2
27.686
–
28.702
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
26
2325 Orchard Parkway
San Jose, CA 95131
TITLE
84J, 84-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
84J
B
ATF1504ASV(L)
1409I–PLD–2/03
ATF1504ASV(L)
100Q1 – PQFP
Dimensions in Millimeters and (Inches)*
*Controlling dimensions: millimeters
JEDEC STANDARD MS-022, GC-1
17.45 (0.687)
16.95 (0.667)
PIN 1 ID
PIN 1
20.10 (0.791)
19.90 (0.783)
0.65 (0.0256) BSC
0.40 (0.016)
23.45 (0.923)
0.22 (0.009)
22.95 (0.904)
14.12 (0.556)
13.90 (0.547)
0.23 (0.009)
0.11 (0.004)
3.40 (0.134) MAX
0º~7º
1.03 (0.041)
0.73 (0.029)
0.50 (0.020)
0.25 (0.010)
04/11/2001
R
DRAWING NO.
TITLE
2325 Orchard Parkway
100Q1, 100-lead, 14 x 20 mm Body, 3.2 mm Footprint, 0.65 mm Pitch,
100Q1
San Jose, CA 95131
Plastic Quad Flat Package (PQFP)
REV.
A
27
1409I–PLD–2/03
100A – TQFP
PIN 1
B
PIN 1 IDENTIFIER
E1
e
E
D1
D
C
0˚~7˚
A1
A2
A
L
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-026, Variation AED.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.08 mm maximum.
SYMBOL
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
15.75
16.00
16.25
D1
13.90
14.00
14.10
E
15.75
16.00
16.25
E1
13.90
14.00
14.10
B
0.17
–
0.27
C
0.09
–
0.20
L
0.45
–
0.75
e
NOTE
Note 2
Note 2
0.50 TYP
10/5/2001
R
28
2325 Orchard Parkway
San Jose, CA 95131
TITLE
100A, 100-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness,
0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
DRAWING NO.
100A
REV.
C
ATF1504ASV(L)
1409I–PLD–2/03
Atmel Headquarters
Atmel Operations
Corporate Headquarters
Memory
2325 Orchard Parkway
San Jose, CA 95131
TEL 1(408) 441-0311
FAX 1(408) 487-2600
Europe
Atmel Sarl
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Case Postale 80
CH-1705 Fribourg
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FAX (852) 2722-1369
Japan
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Chuo-ku, Tokyo 104-0033
Japan
TEL (81) 3-3523-3551
FAX (81) 3-3523-7581
2325 Orchard Parkway
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TEL 1(408) 441-0311
FAX 1(408) 436-4314
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Theresienstrasse 2
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TEL (49) 71-31-67-0
FAX (49) 71-31-67-2340
Microcontrollers
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TEL 1(408) 441-0311
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TEL (33) 2-40-18-18-18
FAX (33) 2-40-18-19-60
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TEL 1(719) 576-3300
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TEL 1(719) 576-3300
FAX 1(719) 540-1759
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Maxwell Building
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TEL (44) 1355-803-000
FAX (44) 1355-242-743
e-mail
[email protected]
Web Site
http://www.atmel.com
© Atmel Corporation 2003.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical
components in life support devices or systems.
Atmel ® is the registered trademark of Atmel.
Other terms and product names may be the trademarks of others.
Printed on recycled paper.
1409I–PLD–2/03
xM