Features • Single-voltage Operation • • • • • • • • • – 5V Read – 5V Programming Fast Read Access Time – 70 ns Internal Erase/Program Control Sector Architecture – One 8K Word (16K Bytes) Boot Block with Programming Lockout – Two 4K Word (8K Bytes) Parameter Blocks – One 496K Word (992K Bytes) Main Memory Array Block Fast Sector Erase Time – 10 seconds Byte-by-byte or Word-by-word Programming – 10 µs Typical Hardware Data Protection Data Polling for End of Program Detection Low Power Dissipation – 50 mA Active Current – 100 µA CMOS Standby Current Typical 10,000 Write Cycles Description The AT49F008A(T) and AT49F8192A(T) are 5-volt, 8-megabit Flash memories organized as 1,048,576 words of 8 bits each or 512K words of 16 bits each. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the devices offer access times to 90 ns with power dissipation of just 275 mW. When deselected, the CMOS standby current is less than 100 µA. The device contains a user-enabled “boot block” protection feature. Two versions of the feature are available: the AT49F008A/8192A locates the boot block at lowest order addresses (“bottom boot”); the AT49F008AT/8192AT locates it at highest order addresses (“top boot”). 8-megabit (1M x 8/ 512K x 16) Flash Memory AT49F008A AT49F008AT AT49F8192A AT49F8192AT To allow for simple in-system reprogrammability, the AT49F008A(T)/8192A(T) does not require high-input voltages for programming. Reading data out of the device is similar to reading from an EPROM; it has standard CE, OE and WE inputs to avoid bus contention. Reprogramming the AT49F008A(T)/8192A(T) is performed by first erasing a block of data and then programming on a byte-by-byte or word-by-word basis. Pin Configurations Pin Name Function A0 - A18 Addresses CE Chip Enable OE Output Enable WE Write Enable RESET Reset RDY/BUSY Ready/Busy Output I/O0 - I/O14 Data Inputs/Outputs I/O15 (A-1) I/O15 (Data Input/Output, Word Mode) A-1 (LSB Address Input, Byte Mode) BYTE Selects Byte or Word Mode NC No Connect Rev. 1199G–FLASH–11/02 1 AT49F8192A(T) TSOP Top View Type 1 A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE RESET NC NC NC A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 AT49F8192A(T) SOIC (SOP) Top View NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE I/O0 I/O8 I/O1 I/O9 I/O2 I/O10 I/O3 I/O11 A16 BYTE GND I/O15 / A-1 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 VCC I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/O0 OE GND CE A0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RESET WE A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE GND I/O15 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 VCC AT49F008A(T) TSOP Top View Type 1 A16 A15 A14 A13 A12 A11 A9 A8 WE RESET NC RDY/BUSY A18 A7 A6 A5 A4 A3 A2 A1 Note: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A17 GND NC A-1 A10 I/O7 I/O6 I/O5 I/O4 VCC VCC NC I/O3 I/O2 I/O1 I/O0 OE GND CE A0 “•” denotes a white dot marked on the package. The device is erased by executing the Erase command sequence; the device internally controls the erase operation. The memory is divided into four blocks for erase operations. There are two 4K word parameter block sections: the boot block, and the main memory array block. The typical number of program and erase cycles is in excess of 10,000 cycles. The optional 8K word boot block section includes a reprogramming lockout feature to provide data integrity. This feature is enabled by a command sequence. Once the boot block programming lockout feature is enabled, the data in the boot block cannot be changed when input levels of 5.5 volts or less are used. The boot sector is designed to contain user secure code. For the AT49F8192A(T), the BYTE pin controls whether the device data I/O pins operate in the byte or word configuration. If the BYTE pin is set at a logic “1” or left open, the device is in word configuration, I/O0 - I/O15 are active and controlled by CE and OE. If the BYTE pin is set at logic “0”, the device is in byte configuration, and only data I/O pins I/O0 - I/O7 are active and controlled by CE and OE. The data I/O pins I/O8 - I/O14 are tristated and the I/O15 pin is used as an input for the LSB (A-1) address function. 2 AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) AT49F008A(T) Block Diagram AT49F008A VCC AT49F008AT DATA INPUTS/OUTPUTS I/O0 - I/O7 DATA INPUTS/OUTPUTS I/O0 - I/O7 INPUT/OUTPUT BUFFERS INPUT/OUTPUT BUFFERS PROGRAM DATA LATCHES PROGRAM DATA LATCHES GND OE WE CE RESET CONTROL LOGIC Y DECODER ADDRESS INPUTS X DECODER Y-GATING MAIN MEMORY (992K BYTES) PARAMETER BLOCK 2 8K BYTES PARAMETER BLOCK 1 8K BYTES BOOT BLOCK 16K BYTES AT49F8192A(T) Block Diagram 08000 07FFF 06000 05FFF 04000 03FFF 00000 AT49F8192A VCC GND OE WE CE RESET CONTROL LOGIC Y DECODER ADDRESS INPUTS X DECODER BOOT BLOCK 16K BYTES PARAMETER BLOCK 1 8K BYTES PARAMETER BLOCK 2 8K BYTES MAIN MEMORY (992K BYTES) FFFFF FC000 FBFFF FA000 F9FFF F8000 F7FFF 00000 AT49F8192AT DATA INPUTS/OUTPUTS I/O0 - I/O15 DATA INPUTS/OUTPUTS I/O0 - I/O15 INPUT/OUTPUT BUFFERS INPUT/OUTPUT BUFFERS PROGRAM DATA LATCHES PROGRAM DATA LATCHES Y-GATING Y-GATING MAIN MEMORY (496K WORDS) PARAMETER BLOCK 2 4K WORDS PARAMETER BLOCK 1 4K WORDS BOOT BLOCK 8K WORDS Device Operation Y-GATING FFFFF 7FFFF 04000 03FFF 03000 02FFF 02000 01FFF 00000 BOOT BLOCK 8K WORDS PARAMETER BLOCK 1 4K WORDS PARAMETER BLOCK 2 4K WORDS MAIN MEMORY (496K WORDS) 7FFFF 7E000 7DFFF 7D000 7CFFF 7C000 7BFFF 00000 READ: The AT49F008A(T)/8192A(T) is accessed like an EPROM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high-impedance state whenever CE or OE is high. This dual line control gives designers flexibility in preventing bus contention. COMMAND SEQUENCES: When the device is first powered on, it will be reset to the read or standby mode, depending upon the state of the control line inputs. In order to perform other device functions, a series of command sequences are entered into the device. The command sequences are shown in the Command Definitions table (I/O8 - I/O15 are don’t care inputs for the command codes). The command sequences are written by applying a low pulse on the WE or CE input with CE or WE low (respectively) and OE high. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. Standard microprocessor write timings are used. The address locations used in the command sequences are not affected by entering the command sequences. 3 1199G–FLASH–11/02 RESET: A RESET input pin is provided to ease some system applications. When RESET is at a logic high level, the device is in its standard operating mode. A low level on the RESET input halts the present device operation and puts the outputs of the device in a high-impedance state. When a high level is reasserted on the RESET pin, the device returns to the read or standby mode, depending upon the state of the control inputs. By applying a 12V ± 0.5V input signal to the RESET pin, the boot block array can be reprogrammed even if the boot block program lockout feature has been enabled (see Boot Block Programming Lockout Override section). ERASURE: Before a byte or word can be reprogrammed, it must be erased. The erased state of memory bits is a logic “1”. The entire device can be erased by using the Chip Erase command or individual sectors can be erased by using the Sector Erase command. CHIP ERASE: The entire device can be erased at one time by using the 6-byte chip erase software code. After the chip erase has been initiated, the device will internally time the erase operation so that no external clocks are required. The maximum time to erase the chip is tEC. If the boot block lockout has been enabled, the chip erase will not erase the data in the boot block; it will erase the main memory block and the parameter blocks only. After the chip erase, the device will return to the read or standby mode. SECTOR ERASE: As an alternative to a full chip erase, the device is organized into four sectors that can be individually erased. There are two 4K word parameter block sections, one boot block, and the main memory array block. The Sector Erase command is a six-bus cycle operation. The sector address is latched on the falling WE edge of the sixth cycle while the 30H data input command is latched at the rising edge of WE. The sector erase starts after the rising edge of WE of the sixth cycle. The erase operation is internally controlled; it will automatically time to completion. Whenever the main memory block is erased and reprogrammed, the two parameter blocks should be erased and reprogrammed before the main memory block is erased again. Whenever a parameter block is erased and reprogrammed, the other parameter block should be erased and reprogrammed before the first parameter block is erased again. Whenever the boot block is erased and reprogrammed, the main memory block and the parameter blocks should be erased and reprogrammed before the boot block is erased again. BYTE/WORD PROGRAMMING: Once a memory block is erased, it is programmed (to a logic “0”) on a byte-by-byte or word-by-word basis. Programming is accomplished via the internal device command register and is a four-bus cycle operation. The device will automatically generate the required internal program pulses. Any commands written to the chip during the embedded programming cycle will be ignored. If a hardware reset happens during programming, the data at the location being programmed will be corrupted. Please note that a data “0” cannot be programmed back to a “1”; only erase operations can convert “0”s to “1”s. Programming is completed after the specified tBP cycle time. The Data Polling feature may also be used to indicate the end of a program cycle. BOOT BLOCK PROGRAMMING LOCKOUT: The device has one designated block that has a programming lockout feature. This feature prevents programming of data in the designated block once the feature has been enabled. The size of the block is 8K words. This block, referred to as the boot block, can contain secure code that is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data in the rest of the device is updated. This feature does not have to be activated; the boot block’s usage as a write-protected region is optional to the user. The address range of the boot block is 00000H to 03FFFH for the AT49F008A; FC000H to FFFFFH for the AT49F008AT; 00000H to 01FFFH for the AT49F8192A; and 7E000H to 7FFFFH for the AT49F8192AT. 4 AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) Once the feature is enabled, the data in the boot block can no longer be erased or programmed when input levels of 5.5V or less are used. Data in the main memory block can still be changed through the regular programming method. To activate the lockout feature, a series of six program commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table. BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine if programming of the boot block section is locked out. When the device is in the software product identification mode (see Software Product Identification Entry and Exit sections), a read from the following address location will show if programming the boot block is locked out – 00002H for the AT49F008A and AT49F8192A; FC002H for the AT49F008AT; and 7E002H for the AT49F8192AT. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lockout feature has been enabled and the block cannot be programmed. The software product identification exit code should be used to return to standard operation. BOOT BLOCK PROGRAMMING LOCKOUT OVERRIDE: The user can override the boot block programming lockout by taking the RESET pin to 12 volts during the entire chip erase, sector erase or word programming operation. When the RESET pin is brought back to TTL levels, the boot block programming lockout feature is again active. PRODUCT IDENTIFICATION: The product identification mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external programmer to identify the correct programming algorithm for the Atmel product. For details, see “Operating Modes” (for hardware operation) or “Software Product Identification Entry/Exit” on page 13. The manufacturer and device codes are the same for both modes. DATA POLLING: The AT49F008A(T)/8192A(T) features Data Polling to indicate the end of a program cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. During a chip or sector erase operation, an attempt to read the device will give a “0” on I/O7. Once the program or erase cycle has completed, true data will be read from the device. Data Polling may begin at any time during the program cycle. TOGGLE BIT: In addition to Data Polling, the AT49F008A(T)/8192A(T) provides another method for determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle. READY/BUSY: For the AT49F008A(T), pin 12 is an open-drain Ready/Busy output pin, which provides another method of detecting the end of a program or erase operation. RDY/BUSY is actively pulled low during the internal program and erase cycles and it is released at the completion of the cycle. The open-drain connection allows for OR-tying of several devices to the same RDY/BUSY line. HARDWARE DATA PROTECTION: Hardware features protect against inadvertent programs to the AT49F008A(T)/8192A(T) in the following ways: (a) VCC sense: if VCC is below 3.8V (typical), the program function is inhibited. (b) VCC power-on delay: once VCC has reached the VCC sense level, the device will automatically time-out 10 ms (typical) before programming. (c) Program inhibit: holding any one of OE low, CE high or WE high inhibits program cycles. (d) Noise filter: pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a program cycle. 5 1199G–FLASH–11/02 Command Definition in Hex(1) Command Sequence 1st Bus Cycle Bus Cycles Addr Data Read 1 Addr DOUT Chip Erase 6 5555 AA 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle Data Addr Data Addr Data Addr Data Addr Data 2AAA 55 5555 80 5555 AA 2AAA 55 5555 10 2AAA 55 (4) SA 30 2AAA 55 5555 40 6 5555 AA 2AAA 55 5555 80 5555 AA Byte/Word Program 4 5555 AA 2AAA 55 5555 A0 Addr DIN Boot Block Lockout(2) 6 5555 AA 2AAA 55 5555 80 5555 AA Product ID Entry 3 5555 AA 2AAA 55 5555 90 (3) 3 5555 AA 2AAA 55 5555 F0 (3) 1 xxxx F0 Product ID Exit Notes: 6th Bus Cycle Addr Sector Erase Product ID Exit 5th Bus Cycle 1. The DATA FORMAT in each bus cycle is as follows: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex). The ADDRESS FORMAT in each bus cycle is as follows: A15 - A0 (Hex); A-1 and A15 - A18 (Don’t Care). 2. The boot sector has the address range 00000H to 03FFFH for the AT49F008A; FC000H to FFFFFH for the AT49F008AT; 00000H to 01FFFH for the AT49F8192A; and 7E000H to 7FFFFH for the AT49F8192AT. 3. Either one of the Product ID Exit commands can be used. 4. SA = sector addresses: (A0 - A18) For the AT49F008A/8192A SA = 01XXX for BOOT BLOCK SA = 02XXX for PARAMETER BLOCK 1 SA = 03XXX for PARAMETER BLOCK 2 SA = 7FXXX for MAIN MEMORY ARRAY For the AT49F008AT/8192AT SA = 7FXXX for BOOT BLOCK SA = 7DXXX for PARAMETER BLOCK 1 SA = 7CXXX for PARAMETER BLOCK 2 SA = 7BXXX for MAIN MEMORY ARRAY Absolute Maximum Ratings* Temperature under Bias ................................ -55°C to +125°C Storage Temperature ..................................... -65°C to +150°C All Input Voltages (including NC Pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground .............................-0.6V to VCC + 0.6V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage on RESET with Respect to Ground ...................................-0.6V to +13.5V 6 AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) DC and AC Operating Range AT49F008A/8192A(T)-70 AT49F008A/8192A(T)-90 N/A N/A -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% Com. Operating Temperature (Case) Ind. VCC Power Supply Operating Modes Mode CE OE WE RESET Ai I/O VIL VIL VIH VIH Ai DOUT VIL VIH VIL VIH Ai DIN VIH X(1) X VIH X High-Z Program Inhibit X X VIH VIH Program Inhibit X VIL X VIH Output Disable X VIH X VIH Reset X X X VIL Read Program/Erase (2) Standby/Program Inhibit High-Z X High-Z Product Identification Hardware VIL VIL Software(5) Notes: VIH VIH VIH A1 - A18 = VIL, A9 = VH(3) A0 = VIL Manufacturer Code(4) A1 - A18 = VIL, A9 = VH(3) A0 = VIH Device Code(4) A0 = VIL, A1 - A18 = VIL Manufacturer Code(4) A0 = VIH, A1 - A18 = VIL Device Code(4) 1. 2. 3. 4. X can be VIL or VIH. Refer to AC programming waveforms. VH = 12.0V ± 0.5V. Manufacturer Code: 001FH Device Code: 22H (AT49F008A); 00A0H (AT49F8192A); 21H (AT49F008AT); 00A3H (AT49F8192AT). 5. See details under “Software Product Identification Entry/Exit” on page 13. DC Characteristics Symbol Parameter Condition ILI Input Load Current ILO Min Max Units VIN = 0V to VCC 10.0 µA Output Leakage Current VI/O = 0V to VCC 10.0 µA ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC 100.0 µA ISB2 VCC Standby Current TTL CE = 2.0V to VCC 3.0 mA ICC(1) VCC Active Current f = 5 MHz; IOUT = 0 mA 50.0 mA VIL Input Low Voltage 0.8 V VIH Input High Voltage VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = -400 µA Note: 1. In the erase mode, ICC is 90 mA. 2.0 V 0.45 2.4 V V 7 1199G–FLASH–11/02 AC Read Characteristics AT49F008A/8192A(T)-70 Symbol Parameter Min Max tACC Address to Output Delay tCE(1) CE to Output Delay tOE(2) OE to Output Delay 0 35 tDF(3)(4) CE or OE to Output Float 0 25 tOH Output Hold from OE, CE or Address, whichever occurred first 0 tRO RESET to Output Delay AT49F008A/8192A(T)-90 Min Max Units 70 90 ns 70 90 ns 0 40 ns 0 25 ns 0 800 ns 800 ns AC Read Waveforms(1)(2)(3)(4) ADDRESS ADDRESS VALID CE t CE t OE OE t DF t t ACC RESET OUTPUT Notes: 8 OH t RO HIGH Z OUTPUT VALID 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. tDF is specified from OE or CE, whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) Input Test Waveforms and Measurement Level 3.0V 0.0V tR, tF < 5 ns Output Test Load 5.0V Pin Capacitance f = 1 MHz, T = 25°C(1) Typ Max Units CIN 4 6 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: Conditions 1. This parameter is characterized and is not 100% tested. 9 1199G–FLASH–11/02 AC Word Load Characteristics Symbol Parameter Min Max Units tAS, tOES Address, OE Setup Time 0 ns tAH Address Hold Time 50 ns tCS Chip Select Setup Time 0 ns tCH Chip Select Hold Time 0 ns tWP Write Pulse Width (WE or CE) 50 ns tDS Data Setup Time 50 ns tDH, tOEH Data, OE Hold Time 0 ns tWPH Write Pulse Width High 40 ns AC Byte/Word Load Waveforms WE Controlled CE Controlled 10 AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) Program Cycle Characteristics Symbol Parameter Min Typ Max Units tBP Byte/Word Programming Time 10 50 µs tAS Address Setup Time 0 ns tAH Address Hold Time 50 ns tDS Data Setup Time 50 ns tDH Data Hold Time 0 ns tWP Write Pulse Width 50 ns tWPH Write Pulse Width High 40 ns tEC Erase Cycle Time 5 seconds Program Cycle Waveforms PROGRAM CYCLE OE CE t WP t BP t WPH WE t AS A0-A18 t DH t AH 5555 5555 2AAA 5555 ADDRESS t DS 55 AA DATA A0 AA INPUT DATA Sector or Chip Erase Cycle Waveforms OE (1) CE t WP t WPH WE t AS A0-A18 t DH t AH 5555 5555 5555 2AAA Note 2 2AAA t EC t DS DATA AA BYTE/ WORD 0 Notes: 55 BYTE/ WORD 1 80 BYTE/ WORD 2 AA BYTE/ WORD 3 55 Note 3 BYTE/ WORD 4 BYTE/ WORD 5 1. OE must be high only when WE and CE are both low. 2. For chip erase, the address should be 5555. For sector erase, the address depends on what sector is to be erased. (See note 4 under Command Definitions.) 3. For chip erase, the data should be 10H, and for sector erase, the data should be 30H. 11 1199G–FLASH–11/02 Data Polling Characteristics(1) Symbol Parameter tDH Data Hold Time tOEH OE Hold Time Min Max OE to Output Delay tWR Write Recovery Time Units 10 ns 10 ns (2) tOE Notes: Typ ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in “AC Read Characteristics” on page 8. Data Polling Waveforms Toggle Bit Characteristics(1) Symbol Parameter tDH Data Hold Time 10 ns tOEH OE Hold Time 10 ns tOE OE to Output Delay(2) tOEHP OE High Pulse tWR Write Recovery Time Notes: Min Typ Max Units ns 150 ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in “AC Read Characteristics” on page 8. Toggle Bit Waveforms(1)(2)(3) Notes: 12 1. Toggling either OE or CE or both OE and CE will operate toggle bit. The tOEHP specification must be met by the toggling input(s). 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) Software Product Identification Entry(1) Boot Block Lockout Enable Algorithm(1) LOAD DATA AA TO ADDRESS 5555(7) LOAD DATA AA TO ADDRESS 5555(3) LOAD DATA 55 TO ADDRESS 2AAA(3) LOAD DATA 55 TO ADDRESS 2AAA(7) LOAD DATA 80 TO ADDRESS 5555(3) LOAD DATA 90 TO ADDRESS 5555(7) LOAD DATA AA TO ADDRESS 5555(3) ENTER PRODUCT IDENTIFICATION MODE(2)(3)(5) LOAD DATA 55 TO ADDRESS 2AAA(3) Software Product Identification Exit(1)(6) LOAD DATA AA TO ADDRESS 5555(7) LOAD DATA 55 TO ADDRESS 2AAA(7) OR LOAD DATA F0 TO ANY ADDRESS LOAD DATA 40 TO ADDRESS 5555(3) EXIT PRODUCT IDENTIFICATION MODE(4) LOAD DATA F0 TO ADDRESS 5555(7) PAUSE 1 second(2) Notes: 1. Data Format: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex). Address Format: A15 - A0 (Hex); A-1 and A15 - A18 (Don’t Care). 2. Boot Block Lockout feature enabled. EXIT PRODUCT IDENTIFICATION MODE(4) Notes: 1. Data Format: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex). Address Format: A15 - A0 (Hex); A-1 and A15 - A18 (Don’t Care). 2. A1 - A18 = VIL. Manufacturer Code is read for A0 = VIL. Device Code is read for A0 = VIH. 3. The device does not remain in identification mode if powered down. 4. The device returns to standard operation mode. 5. Manufacturer Code: 001FH Device Code: 22H (AT49F008A); 00A0H (AT49F8192A); 21H (AT49F008AT); 00A3H (AT49F8192AT) 6. Either one of the Product ID Exit commands can be used. 13 1199G–FLASH–11/02 AT49F008A Ordering Information tACC (ns) ICC (mA) Standby Active Ordering Code Package Operation Range 70 50 0.3 AT49F008A-70TI 40T Industrial (-40° to 85°C) 90 50 0.3 AT49F008A-90TI 40T Industrial (-40° to 85°C) Package Operation Range AT49F8192A(T) Ordering Information ICC (mA) tACC (ns) Active Standby 70 50 0.3 AT49F8192A-70TI 48T Industrial (-40° to 85°C) 70 50 0.3 AT49F8192AT-70TI 48T Industrial (-40° to 85°C) 90 50 0.3 AT49F8192A-90TI 48T Industrial (-40° to 85°C) 90 50 0.3 AT49F8192AT-90RI AT49F8192AT-90TI 44R 48T Industrial (-40° to 85°C) Ordering Code Package Type 44R 44-lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC) 40T 40-lead, Plastic Thin Small Outline Package (TSOP) 48T 48-lead, Plastic Thin Small Outline Package (TSOP) 14 AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) Packaging Information 44R – SOIC Dimensions in Millimeters and (Inches). Controlling dimension: Inches. 0.508(0.020) 0.356(0.014) 13.46(0.530) 13.21(0.520) 16.18(0.637) 15.82(0.623) PIN 1 1.27(0.050) BSC 28.32(1.115) 28.07(1.105) 2.67(0.105) 2.41(0.095) 0.33(0.130) 1.27(0.050) 0.250(0.010) 0.100(0.004) 0º ~ 8º 1.00(0.039) 0.60(0.024) 04/11/01 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 44R, 44-lead (0.525" Body) Plastic Gull Wing Small Outline (SOIC) DRAWING NO. REV. 44R A 15 1199G–FLASH–11/02 40T – TSOP PIN 1 0º ~ 8º c Pin 1 Identifier D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) A1 MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 19.80 20.00 20.20 D1 18.30 18.40 18.50 Note 2 E 9.90 10.00 10.10 Note 2 L 0.50 0.60 0.70 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-142, Variation CD. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e NOTE 0.50 BASIC 10/18/01 R 16 2325 Orchard Parkway San Jose, CA 95131 TITLE 40T, 40-lead (10 x 20 mm Package) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 40T B AT49F008A(T)/8192A(T) 1199G–FLASH–11/02 AT49F008A(T)/8192A(T) 48T – TSOP PIN 1 0º ~ 8º c Pin 1 Identifier D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) A1 MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 19.80 20.00 20.20 D1 18.30 18.40 18.50 Note 2 E 11.90 12.00 12.10 Note 2 L 0.50 0.60 0.70 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-142, Variation DD. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e NOTE 0.50 BASIC 10/18/01 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 48T, 48-lead (12 x 20 mm Package) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 48T B 17 1199G–FLASH–11/02 Atmel Headquarters Atmel Operations Corporate Headquarters Memory 2325 Orchard Parkway San Jose, CA 95131 USA TEL 1(408) 441-0311 FAX 1(408) 487-2600 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany TEL (49) 71-31-67-0 FAX (49) 71-31-67-2340 Microcontrollers Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France TEL (33) 2-40-18-18-18 FAX (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. 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The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems. ® ATMEL is the registered trademark of Atmel. Other terms and product names may be the trademark of others. Printed on recycled paper. 1199G–FLASH–11/02 /xM