PCA9515A I2C-bus repeater Rev. 5 — 23 March 2012 Product data sheet 1. General description The PCA9515A is a CMOS integrated circuit intended for application in I2C-bus and SMBus systems. While retaining all the operating modes and features of the I2C-bus system, it permits extension of the I2C-bus by buffering both the data (SDA) and the clock (SCL) lines, thus enabling two buses of 400 pF. The I2C-bus capacitance limit of 400 pF restricts the number of devices and bus length. Using the PCA9515A enables the system designer to isolate two halves of a bus, thus more devices or longer length can be accommodated. It can also be used to run two buses, one at 5 V and the other at 3.3 V or a 400 kHz and 100 kHz bus, where the 100 kHz bus is isolated when 400 kHz operation of the other is required. Two or more PCA9515As cannot be put in series. The PCA9515A design does not allow this configuration. Since there is no direction pin, slightly different ‘legal’ low voltage levels are used to avoid lock-up conditions between the input and the output. A ‘regular LOW’ applied at the input of a PCA9515A will be propagated as a ‘buffered LOW’ with a slightly higher value. When this ‘buffered LOW’ is applied to another PCA9515A, PCA9516A or PCA9518/A in series, the second PCA9515A, PCA9516A or PCA9518/A will not recognize it as a ‘regular LOW’ and will not propagate it as a ‘buffered LOW’ again. The PCA9510/A, PCA9511/A, PCA9512/A, PCA9513/A, PCA9514/A cannot be used in series with the PCA9515A, PCA9516A or PCA9518/A, but can be used in series with themselves since they use shifting instead of static offsets to avoid lock-up conditions. The output pull-down of each internal buffer is set for approximately 0.5 V, while the input threshold of each internal buffer is set about 0.07 V lower, when the output is internally driven LOW. This prevents a lock-up condition from occurring. 2. Features and benefits 2-channel, bidirectional buffer I2C-bus and SMBus compatible Active HIGH repeater enable input Open-drain input/outputs Lock-up free operation Supports arbitration and clock stretching across the repeater Accommodates Standard-mode and Fast-mode I2C-bus devices and multiple masters Powered-off high-impedance I2C-bus pins Operating supply voltage range of 2.3 V to 3.6 V 5.5 V tolerant I2C-bus and enable pins PCA9515A NXP Semiconductors I2C-bus repeater 0 Hz to 400 kHz clock frequency (the maximum system operating frequency may be less than 400 kHz because of the delays added by the repeater) ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101 Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA Packages offered: SO8, TSSOP8 (MSOP8), HWSON8 3. Ordering information Table 1. Ordering information Tamb = 40 C to +85 C. Type number Topside mark Package Name Description Version PCA9515AD PA9515A SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 PCA9515ADP 9515A TSSOP8[1] plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 PCA9515ATP 15A HWSON8 plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 3 0.8 mm SOT1069-2 [1] Also known as MSOP8. 4. Functional diagram VCC PCA9515A SDA0 SDA1 SCL0 SCL1 pull-up resistor EN 002aad738 GND Fig 1. PCA9515A Product data sheet Functional diagram of PCA9515A All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 2 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 5. Pinning information 5.1 Pinning n.c. 1 8 VCC SCL0 2 7 SCL1 SDA0 3 6 SDA1 GND 4 5 EN PCA9515AD n.c. 1 8 VCC SCL0 2 7 SCL1 SDA0 3 6 SDA1 GND 4 5 EN PCA9515ADP 002aad737 002aad736 Fig 2. Pin configuration for SO8 Fig 3. Pin configuration for TSSOP8 (MSOP8) PCA9515ATP terminal 1 index area SDA0 1 8 SCL0 GND 2 7 n.c. EN 3 6 VCC SDA1 4 5 SCL1 002aag783 Transparent top view Fig 4. Pin configuration for HWSON8 5.2 Pin description Table 2. Symbol Pin SO8, TSSOP8 HWSON8 n.c. 1 7 not connected SCL0 2 8 serial clock bus 0; open-drain 5 V tolerant I/O SDA0 3 1 Product data sheet Description serial data bus 0; open-drain 5 V tolerant I/O supply ground (0 V) GND 4 2[1] EN 5 3 active HIGH repeater enable input (internal pull-up with 100 k) SDA1 6 4 serial data bus 1; open-drain 5 V tolerant I/O SCL1 7 5 serial clock bus 1; open-drain 5 V tolerant I/O VCC 8 6 supply voltage [1] PCA9515A Pin description HWSON8 package die supply ground is connected to both GND pin and exposed center pad. GND pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper head conduction through the board, thermal vias need to be incorporated in the printed-circuit board in the thermal pad region. All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 3 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 6. Functional description Refer to Figure 1 “Functional diagram of PCA9515A”. The PCA9515A integrated circuit contains two identical buffer circuits which enable I2C-bus and similar bus systems to be extended without degradation of system performance. The PCA9515A contains two bidirectional, open-drain buffers specifically designed to support the standard LOW-level contention arbitration of the I2C-bus. Except during arbitration or clock stretching, the PCA9515A acts like a pair of non-inverting, open-drain buffers, one for SDA and one for SCL. 6.1 Enable The EN pin is active HIGH with an internal pull-up and allows the user to select when the repeater is active. This can be used to isolate a badly behaved slave on power-up until after the system power-up reset. It should never change state during an I2C-bus operation because disabling during a bus operation will hang the bus and enabling part way through a bus cycle could confuse the I2C-bus parts being enabled. The enable pin should only change state when the global bus and the repeater port are in an idle state to prevent system failures. 6.2 I2C-bus systems As with the standard I2C-bus system, pull-up resistors are required to provide the logic HIGH levels on the buffered bus (standard open-collector configuration of the I2C-bus). The size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. This part designed to work with Standard-mode and Fast-mode I2C-bus devices in addition to SMBus devices. Standard-mode I2C-bus devices only specify 3 mA output drive; this limits the termination current to 3 mA in a generic I2C-bus system where Standard-mode devices and multiple masters are possible. Under certain conditions higher termination currents can be used. Please see Application Note AN255, I2C/SMBus Repeaters, Hubs and Expanders for additional information on sizing resistors and precautions when using more than one PCA9515A/PCA9516A in a system or using the PCA9515A/PCA9516A in conjunction with the P82B96. PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 4 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 7. Application design-in information A typical application is shown in Figure 5. In this example, the system master is running on a 3.3 V I2C-bus while the slave is connected to a 5 V bus. Both buses run at 100 kHz unless the slave bus is isolated and then the master bus can run at 400 kHz. Master devices can be placed on either bus. 3.3 V 5V 10 kΩ 10 kΩ 10 kΩ 10 kΩ VCC SDA SDA0 SDA1 SDA SCL SCL0 SCL1 SCL BUS MASTER 400 kHz PCA9515A EN bus 0 Fig 5. SLAVE 100 kHz bus 1 002aad739 Typical application The PCA9515A is 5 V tolerant, so it does not require any additional circuitry to translate between the different bus voltages. When one side of the PCA9515A is pulled LOW by a device on the I2C-bus, a CMOS hysteresis type input detects the falling edge and causes the internal driver on the other side to turn on, thus causing the other side to also go LOW. The side driven LOW by the PCA9515A will typically be at VOL = 0.5 V. In order to illustrate what would be seen in a typical application, refer to Figure 6 and Figure 7. If the bus master in Figure 5 were to write to the slave through the PCA9515A, we would see the waveform shown in Figure 6 on bus 0. This looks like a normal I2C-bus transmission until the falling edge of the eighth clock pulse. At that point, the master releases the data line (SDA) while the slave pulls it LOW through the PCA9515A. Because the VOL of the PCA9515A is typically round 0.5 V, a step in the SDA will be seen. After the master has transmitted the ninth clock pulse, the slave releases the data line. On the bus 1 side of the PCA9515A, the clock and data lines would have a positive offset from ground equal to the VOL of the PCA9515A. After the eighth clock pulse the data line will be pulled to the VOL of the slave device, which is very close to ground in this example. It is important to note that any arbitration or clock stretching events on bus 1 require that the VOL of the PCA9515A (see VOLVILc in Section 9 “Static characteristics”) to be recognized by the PCA9515A and then transmitted to bus 0. PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 5 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 9th clock pulse SCL VOL of PCA9515A SDA VOL of master Fig 6. 002aad740 Bus 0 waveform 9th clock pulse SCL SDA VOL of PCA9515A VOL of slave Fig 7. 002aad741 Bus 1 waveform 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages with respect to pin GND. Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.5 +7 V VI2C-bus I2C-bus voltage SCL or SDA 0.5 +7 V II/O input/output current DC; any pin - 50 mA Ptot total power dissipation - 100 mW Tstg storage temperature 55 +125 C Tamb ambient temperature 40 +85 C PCA9515A Product data sheet operating in free air All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 6 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 9. Static characteristics Table 4. Static characteristics (VCC = 3.0 V to 3.6 V) VCC = 3.0 V to 3.6 V[1]; GND = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ[2] Max Unit 3.0 - 3.6 V Supplies VCC supply voltage ICCH HIGH-level supply current both channels HIGH; VCC = 3.6 V; SDAn = SCLn = VCC - 0.8 5 mA ICCL LOW-level supply current both channels LOW; VCC = 3.6 V; one SDA and one SCL = GND; other SDA and SCL open - 1.7 5 mA ICCLc contention LOW-level supply current VCC = 3.6 V; SDAn = SCLn = GND - 1.6 5 mA Input SCLn; input/output SDAn VIH HIGH-level input voltage 0.7VCC - 5.5 V VIL LOW-level input voltage [3] 0.5 - +0.3VCC V VILc contention LOW-level input voltage [3] 0.5 - +0.4 V VIK input clamping voltage II = 18 mA - - 1.2 V ILI input leakage current VI = 3.6 V 1 - +1 A IIL LOW-level input current SDAn, SCLn; VI = 0.2 V - - 5 A VOL LOW-level output voltage IOL = 20 A or 6 mA 0.47 0.52 0.6 V VOLVILc difference between LOW-level output guaranteed by design and LOW-level input voltage contention - - 70 mV Ci input capacitance - 6 7 pF VI = 3 V or 0 V Enable VIL LOW-level input voltage 0.5 - +0.8 V VIH HIGH-level input voltage 2.0 - 5.5 V IIL(EN) LOW-level input current on pin EN - 10 30 A ILI input leakage current 1 - +1 A Ci input capacitance - 6 7 pF VI = 0.2 V VI = 3.0 V or 0 V [1] For operation between published voltage ranges (Table 4 for VCC = 3.0 V to 3.6 V; Table 5 for VCC = 2.3 V to 2.7 V), refer to worst-case parameter in both ranges. [2] Typical value taken at VCC = 3.3 V and Tamb = 25 C. [3] VIL specification is for the first LOW level seen by the SDAn/SCLn lines. VILc is for the second and subsequent LOW levels seen by the SDAn/SCLn lines. PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 7 of 20 PCA9515A NXP Semiconductors I2C-bus repeater Table 5. Static characteristics (VCC = 2.3 V to 2.7 V) VCC = 2.3 V to 2.7 V[1]; GND = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ[2] Max Unit 2.3 - 2.7 V Supplies VCC supply voltage ICCH HIGH-level supply current both channels HIGH; VCC = 2.7 V; SDAn = SCLn = VCC - 0.8 5 mA ICCL LOW-level supply current both channels LOW; VCC = 2.7 V; one SDA and one SCL = GND; other SDA and SCL open - 1.6 5 mA ICCLc contention LOW-level supply current VCC = 2.7 V; SDAn = SCLn = GND - 1.6 5 mA Input SCLn; input/output SDAn VIH HIGH-level input voltage 0.7VCC - 5.5 V LOW-level input voltage [3] 0.5 - +0.3VCC V VILc contention LOW-level input voltage [3] 0.5 - +0.4 V VIK input clamping voltage II = 18 mA - - 1.2 V ILI input leakage current VI = 2.7 V 1 - +1 A IIL LOW-level input current SDAn, SCLn; VI = 0.2 V - - 10 A VOL LOW-level output voltage IOL = 20 A or 6 mA 0.47 0.52 0.6 V VOLVILc difference between LOW-level output guaranteed by design and LOW-level input voltage contention - - 70 mV Ci input capacitance - 6 7 pF VIL VI = 3 V or 0 V Enable VIL LOW-level input voltage 0.5 - +0.8 V VIH HIGH-level input voltage 2.0 - 5.5 V IIL(EN) LOW-level input current on pin EN VI = 0.2 V - 10 30 A ILI input leakage current 1 - +1 A Ci input capacitance VI = 3.0 V or 0 V - 6 7 pF [1] For operation between published voltage ranges (Table 4 for VCC = 3.0 V to 3.6 V; Table 5 for VCC = 2.3 V to 2.7 V), refer to worst-case parameter in both ranges. [2] Typical value taken at VCC = 2.5 V and Tamb = 25 C. [3] VIL specification is for the first LOW level seen by the SDAn/SCLn lines. VILc is for the second and subsequent LOW levels seen by the SDAn/SCLn lines. PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 8 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 10. Dynamic characteristics Table 6. Dynamic characteristics (VCC = 2.3 V to 2.7 V) VCC = 2.3 V to 2.7 V; GND = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions tPHL HIGH to LOW propagation delay Figure 8 tPLH LOW to HIGH propagation delay Figure 8 tTHL HIGH to LOW output transition time Figure 8 Min [2] [2] Typ[1] Max Unit 45 82 130 ns 33 113 190 ns - 57 - ns - 148 - ns tTLH LOW to HIGH output transition time Figure 8 tsu set-up time EN HIGH before START condition 100 - - ns th hold time EN HIGH after STOP condition 130 - - ns [1] Typical values taken at VCC = 2.5 V and Tamb = 25 C. [2] Different load resistance and capacitance will alter the RC time constant, thereby changing the propagation delay and transition times. Table 7. Dynamic characteristics (VCC = 3.0 V to 3.6 V) VCC = 3.0 V to 3.6 V; GND = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit tPHL HIGH to LOW propagation delay Figure 8 45 68 120 ns 33 102 180 ns - 58 - ns tPLH LOW to HIGH propagation delay Figure 8 tTHL HIGH to LOW output transition time Figure 8 [2] [2] tTLH LOW to HIGH output transition time Figure 8 - 147 - ns tsu set-up time EN HIGH before START condition 100 - - ns th hold time EN HIGH after STOP condition 100 - - ns [1] Typical values taken at VCC = 3.3 V and Tamb = 25 C. [2] Different load resistance and capacitance will alter the RC time constant, thereby changing the propagation delay and transition times. 10.1 AC waveforms 3.3 V input 1.5 V 1.5 V tPHL tPLH 80 % output 1.5 V 20 % 1.5 V 20 % tTHL 0.1 V 80 % tTLH 3.3 V VOL 002aad478 Fig 8. PCA9515A Product data sheet Propagation delay and transition times All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 9 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 11. Test information VCC VCC RL PULSE GENERATOR VI VO DUT CL RT 002aad479 RL = load resistor; 1.35 k CL = load capacitance includes jig and probe capacitance; 50 pF RT = termination resistance should be equal to Zo of pulse generators Fig 9. PCA9515A Product data sheet Test circuit for open-drain outputs All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 10 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 12. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 10. Package outline SOT96-1 (SO8) PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 11 of 20 PCA9515A NXP Semiconductors I2C-bus repeater TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm D E SOT505-1 A X c y HE v M A Z 5 8 A2 pin 1 index (A3) A1 A θ Lp L 1 4 detail X e w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.94 0.7 0.4 0.1 0.1 0.1 0.70 0.35 6° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18 SOT505-1 Fig 11. Package outline SOT505-1 (TSSOP8) PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 12 of 20 PCA9515A NXP Semiconductors I2C-bus repeater HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.8 mm SOT1069-2 X A B D A2 A E A1 A3 terminal 1 index area detail X e1 terminal 1 index area e 1 4 C C A B C v w b y y1 C L K E2 8 5 D2 0 1 Dimensions Unit mm 2 mm scale A(1) A1 A2 max 0.80 0.05 0.65 nom 0.75 0.02 0.55 min 0.70 0.00 0.45 A3 b D(1) D2 E(1) E2 e e1 0.2 0.30 0.25 0.18 2.1 2.0 1.9 1.6 1.5 1.4 3.1 3.0 2.9 1.6 1.5 1.4 0.5 1.5 K L 0.40 0.45 0.35 0.40 0.30 0.35 v 0.1 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1069-2 --- MO-229 --- sot1069-2_po European projection Issue date 09-10-22 09-11-18 Fig 12. Package outline SOT1069-2 (HWSON8) PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 13 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 13.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 14 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 13) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 < 2.5 235 220 2.5 220 220 Table 9. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 13. PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 15 of 20 PCA9515A NXP Semiconductors I2C-bus repeater maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations Table 10. Acronym PCA9515A Product data sheet Abbreviations Description CDM Charged-Device Model CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model I/O Input/Output I2C-bus Inter-Integrated Circuit bus SMBus System Management Bus All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 16 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9515A v.5 20120323 Product data sheet - PCA9515A v.4 Modifications: • Section 2 “Features and benefits”: – 12th bullet item: deleted phrase “200 V MM per JESD22-A115” – 14th bullet item: added “HWSON8” package • • • • Table 1 “Ordering information”: added Type number PCA9515ATP (HWSON8 package) Section 5.1 “Pinning”: added (new) Figure 4 “Pin configuration for HWSON8” Table 2 “Pin description”: added column for HWSON8 pinning Table 3 “Limiting values”: – Symbol/Parameter “Vbus, voltage on I2C-bus, SCL or SDA” changed to “VI2C-bus, I2C-bus voltage” with “SCL or SDA” in Conditions column – Symbol/Parameter “I, DC current” changed to “II/O, input/output current” • Table 4 “Static characteristics (VCC = 3.0 V to 3.6 V)”, Table note [1]: added phrase “(Table 4 for VCC = 3.0 V to 3.6 V; Table 5 for VCC = 2.3 V to 2.7 V)” • Table 5 “Static characteristics (VCC = 2.3 V to 2.7 V)”, Table note [1]: added phrase “(Table 4 for VCC = 3.0 V to 3.6 V; Table 5 for VCC = 2.3 V to 2.7 V)” • Section 12 “Package outline”: added (new) Figure 12 “Package outline SOT1069-2 (HWSON8)” PCA9515A v.4 20080411 Product data sheet - PCA9515A v.3 PCA9515A v.3 (9397 750 14098) 20040929 Product data sheet - PCA9515A v.2 PCA9515A v.2 (9397 750 13709) 20040709 Product data sheet - PCA9515A v.1 PCA9515A v.1 (9397 98 13237) 20040617 Objective data sheet - - PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 17 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCA9515A Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 18 of 20 PCA9515A NXP Semiconductors I2C-bus repeater Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCA9515A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 19 of 20 PCA9515A NXP Semiconductors I2C-bus repeater 18. Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.2 7 8 9 10 10.1 11 12 13 13.1 13.2 13.3 13.4 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 I2C-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 4 Application design-in information . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering of SMD packages . . . . . . . . . . . . . . 14 Introduction to soldering . . . . . . . . . . . . . . . . . 14 Wave and reflow soldering . . . . . . . . . . . . . . . 14 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 23 March 2012 Document identifier: PCA9515A