ATMEL AT97SC3203

Features
• Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main
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Specification Version 1.2
Compliant with TCG PC Client Specific TPM Interface Specification Version 1.2
Single Chip Turnkey Solution
Hardware Asymmetric Crypto Engine
2048 RSA Sign in 500 ms
AVR® RISC Microprocessor
33 MHz LPC (Low Pin Count) Bus for Easy PC Interface
Secure Hardware and Firmware Design
True Random Number Generator (RNG) – FIPS 140.2 compliant
Secure Real-time Clock Option
3.3V ±10% Supply Voltage
28-lead TSSOP Package or 40-lead QFN Package
0–70°C Temperature Range
Trusted
Platform
Module
Description
The AT97SC3203 Trusted Platform Module (TPM) is the latest offering from Atmel,
the world's leading choice for TPMs. Atmel, supplier of the world's first production
v1.1b TPM, the AT97SC3201, expands its success into v1.2 TPMs with the
AT97SC3203. Atmel continues to pace the development of TPM technology and
actively participates in the Trusted Computing Group (TCG) and contributes expertise
in the development of the TPM specifications. By utilizing Atmel TPMs, you can be
confident that you are implementing the most advanced TPMs available on the market
today and in the future.
The AT97SC3203 is a fully integrated security module designed to be integrated into
personal computers and other embedded systems. It implements version 1.2 of the
Trusted Computing Group specification for Trusted Platform Modules.
The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA
signature in 500 ms and a 1024-bit RSA signature in 100 ms. Performance of the
SHA-1 accelerator is L50 µs per 64-byte block. In most cases, TCG key generation
operations will be completed using a proprietary mechanism in less than 1 msec.
AT97SC3203
Summary
Advance
Information
The chip communicates with the PC through the LPC interface. The TPM supports
SIRQ (for interrupts) and CLKRUN to permit clock stopping for power savings in
mobile computers.
Rev. 5116AS-TPM–7/05
Note: This is a summary document. A complete document is
available under NDA. For more information, please contact your
local Atmel sales office.
1
Figure 1. AT97SC3203 Block Diagram
ROM
Program
EEPROM
Program
33 MHz
LPC
Interface
AVR®
8/16 Bit
CPU
SRAM
EEPROM
Data
GPIO6
GPIO
RNG
VBB
CRYPTO
Engine
RTC
32.768 kHz
Timer
Physical
Security
Circuitry
Figure 2. Atmel AT97SC3203 TPM Pin Configuration
40 pin QFN
6.0 mm x 6.0 mm
0.50 mm pitch
SB3V 5
GPIO6 6
NC 7
TestI 8
TestBI/BADD
9
3V 10
GND 11
VBAT 12
XtalI/32K in 13
XtalO 14
2
26 LAD0
25 GND
24 3V
23 LAD1
22 LFRAME#
21 LCLK
20 LAD2
19 3V
18 GND
17 LAD3
16 LRESET#
15 CLKRUN
NC
GND
SB3V
GPIO6
NC
TestI
TestBI/BADD
3V
GND
VBAT
40
39
38
37
36
35
34
33
32
31
27 SERIRQ
1
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
LAD0
GND
3V
LAD1
LFRAME#
LCLK
LAD2
3V
GND
LAD3
11
12
13
14
15
16
17
18
19
20
NC 3
GND 4
28 LPCPD#
NC
XTALI/32K in
XTALO
NC
NC
NC
NC
NC
CLKRUN#
LRESET#
NC 1
NC 2
NC
NC
NC
NC
NC
NC
NC
NC
LPCPD#
SERIRQ
28 pin TSSOP
9.6 mm, 0.65 mm pitch
6.1 mm plastic width
AT97SC3203
5116AS-TPM–7/05
AT97SC3203
Table 1. Pin Descriptions
Name
TSSOP Pin #
QFN Pin #
Type
Description
LAD[3:0]
17, 20, 23,
26
30, 27, 24,
21
Input or
Output
LPC Multiplexed Command, Address, Data: Internal pull-ups are
provided.
LFRAME#
22
26
Input
LPC frame: Indicates the start of an LPC cycle, or an abort.
LPCPD#
28
32
Input
Power Down: Indicates that the TPM should prepare for power to
be shut off on the LPC interface. If this pin is unused, it should be
tied to the 3V power supply pin through a resistor.
CLKRUN#
15
19
Input or
Output
PCI Clock Run: Active low output enabling the system LPC clock. If
this pin is unused, it should be tied to ground.
LCLK
21
25
Input
33MHz PCI clock provides timing for all transactions on the PCI
bus.
LRESET#
16
20
Input
PCI signal to reset all devices that reside on the PCI bus.
SERIRQ
27
31
Input or
Output
Serialized Interrupt Request Signal. If the SERIRQ function is
enabled, this pin should be connected to the CPU SERIRQ input,
and the line pulled to the 3V power supply pin through a resistor. If
this pin is unused, it should be tied to the 3V power supply pin
through a resistor.
SB3V
5
3
Input
Standby 3.3V Supply. If no separate standby power supply is
connected to this pin, the pin should be tied directly to the 3V
power supply pin.
3V
10, 19, 24
8, 23, 28
Input
Primary 3.3V DC power supply input rail supplied by the
motherboard. May be referred to as Vcc.
GND
4, 11, 18, 25
2, 9, 22, 29
Input
System ground.
NC
1
39
Output
No connect. This pin may be floated. If the XOR chain I/O test
mode is used, the pin should be tied to ground directly or through a
resistor. Reserved for the SMBus Data I/O function.
NC
2
40
Output
No connect. This pin may be floated. If the XOR chain I/O test
mode is used, the pin should be tied to ground directly or through a
resistor. Reserved for the SMBus Clock Input function.
1
Output
Vendor No Connect, as designated in the PC Client TIS
specification. This pin may be floated. If the XOR chain I/O test
mode is used, the pin should be tied to ground directly or through a
resistor.
General Purpose Input/Output. Internal Pull-up Resistor. This pin is
mapped to NV Index TPM_NV_INDEX_GPIO_00 and serves as
the GPIO-Express-00. Default TPM configuration: GPIO Input.
GPIO6 also serves as the XOR chain Output during I/O test mode.
VNC
3
GPIO6
6
4
Input or
Output
NC
7
5
Input
No Connect. This input pin has an internal pull-down resistor and
may be floated. If the XOR chain I/O test mode is used, the pin
should be tied to the 3V power supply directly or through a resistor.
TestI
8
6
Output
TPM manufacturing test input disabled. This pin may be floated. If
the XOR chain I/O test mode is used, the pin should be tied directly
to ground.
TestBI/BADD
9
7
Input
TestBI and BADD functions disabled. This pin should be tied
directly to ground.
3
5116AS-TPM–7/05
Table 1. Pin Descriptions (Continued)
Name
TSSOP Pin #
QFN Pin #
Type
Description
VBAT
12
10
Input
3.3V Battery Input. If no external battery is connected to this pin,
the pin should be tied directly to the 3V power supply pin.
XtalI/32K in
13
12
Input
32 kHz Crystal Oscillator Input or 32 kHz Clock Input. This pin
should be tied to ground if not used.
XtalO
14
13
Output
32 kHz Crystal Oscillator Output.
Absolute Maximum Ratings (Preliminary)
*NOTICE:
Operating Temperature..............................0°C to +70°C
Storage Temperature (without Bias)...........0°C to + 70°C
Voltage on I/O Pins..............................−0.1 to VCC +0.3V
Voltage on VCC with Respect to Ground.................6.0V
Maximum ESD Voltage..........................................2000V
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only
and functional operation of the device at these or
any other conditions beyond those indicated in
the operational sections of this specification may
cause temporary or permanent failure. Exposure
to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 2. DC Parameters (Preliminary)
VCC = 3.0 to 3.6V; Temperature = 0 to 70°C
Symbol
Parameter
Min
Nom
Max
Units
Vcc
Supply Voltage
3.0
3.3
3.6
V
Icc
Operating Current at fclk = 33 MHz
25
50
mA
IST
Static Current
5
10
mA
Vcc =3.6V; fxtal = 0 Hz;
active inputs
ISL
Sleep Current, Chip Idle
40
100
µA
VCC = 3.6V; fxtal = 0 Hz
IBB
Battery Current
2
4
µA
VCC = 0V; fxtal = 0 Hz
ILIO
Input Leakage
0.1
3
µA
Vin = VCC or GND
VIH
Input High Threshold
0.5 * Vcc
0.5 + Vcc
V
VIL
Input Low Threshold
-0.5
0.3 * Vcc
V
VOH
Output High Voltage
0.9 * Vcc
VOL
Output Low Voltage
IOLCR
Output Low Current, CLKRUN#
CI
Input Pin Capacitance
Notes:
4
0.98 * Vcc
0.1 * Vcc
7
6
Notes
V
At IOUT = –500 µA
V
V At IOUT = 1.5 mA
mA
At VOUT = .615 * VCC
pF
Note 1
1. These parameters guaranteed by design.
AT97SC3203
5116AS-TPM–7/05
AT97SC3203
Table 3. AC Parameters
Cl = 10pf.; VCC = 3.0 to 3.7V; Temperature = 0 to 70-C
Symbol
Parameter
Min
Nom
Max
Units
Notes
TVAL
CLK to Signal Valid Delay – LAD0-3
2
5
11
nS
Measured at Vtrise = 0.285 * VCC and Vtfal
= 0.615 * VCC. Measured from clk at Vtest =
0.4* VCC; Load = 200.
TON
Float to Active Delay
2
4
TOFF
Active to Float Delay
TSU
Input Setup Time to CLK
7
2
nS
TH
Input Hold Time from CLK
0
–500
nS
TRST
Reset Active Time After Power Stable
1
mS
Note 1
TRSTCLK
Reset Active After CLK Stable
100
mS
Note 1
TRSTOFF
Reset Active to Output Float Delay
40
nS
Note 1
TCLKIN
CLK Period
29.5
31
nS
Note 3
TCLKL
O
CLK Low Duration
13.4
18
nS
Note 2, Note 3
TCLKHI
CLK High Duration
13.4
18
nS
Note 2, Note 3
Notes:
nS
28
30
nS
1. These parameters guaranteed by design.
2. All parameters measured with respect to signal crossing Vtest = 0.4 * VCC unless otherwise noted.
3. The minimum parameter must never be violated under any circumstances unless Lreset# is asserted. If proper CLKRUN#
signaling is observed, the maximum specification can be violated.
Table 4. Ordering Information
Ordering Code(1)
Package
AT97SC3203-01AC
28A3 (TSSOP)
AT97SC3203-X1AC
28A3 (TSSOP)
AT97SC3203-01MC
40ML1 (QFN)
AT97SC3203-X1MC
Notes:
40ML1 (QFN)
Operation Range
Commercial (0° to 70° C)
(2)
Lead-free
Commercial (0° to 70° C)
Commercial (0° to 70° C)
Lead-free
(2)
Commercial (0° to 70° C)
1. Current as of publication date. Contact Atmel marketing for status update.
2. Also RoHS
5
5116AS-TPM–7/05
Package Drawing
28A3 – TSSOP
b
L
L1
E E1
e
End View
Top View
COMMON DIMENSIONS
(Unit of Measure = mm)
D
A
A2
SYMBOL
D
MIN
NOM
MAX
NOTE
9.60
9.70
9.80
2, 5
6.10
6.20
3, 5
E
E1
Side View
8.10 BSC
6.00
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
L
L1
Notes:
0.45
0.60
0.75
1.00 REF
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in)
per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
1/8/02
R
6
4
0.65 BSC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
28A3
REV.
A
AT97SC3203
5116AS-TPM–7/05
AT97SC3203
40ML1 – QFN
A
A1
D
N
A2
A3
1
Pin 1 Indicator
2
3
E
Top View
L
0
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
D2
SYMBOL
MIN
D
E2
MAX
6.00 BSC
1
D2
3.95
4.10
4.25
2
E2
3.95
4.10
4.25
b
3
N
e
PIN1 ID
Bottom View
A
-
0.85
0.90
A1
0.0
0.01
0.05
A2
-
0.65
0.70
A3
L
0.20 REF
0.30
e
b
NOTE
6.00 BSC
E
Notes:
NOM
0.40
0.50
0.50 BSC
0.18
0.23
0.30
2
1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3/9/04
R
TITLE
2325 Orchard Parkway
40ML1, 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded Quad
San Jose, CA 95131
Flat No Lead Package (MLF2)
DRAWING NO.
40ML1
REV.
A
7
5116AS-TPM–7/05
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5116AS-TPM–7/05