June, 2010 Freescales Redistributed Chip Packaging (RCP) Ready for Production FTF-ENT-F0812 Navjot Chhabra RCP Operations Manager TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Introduction As Dan Hutcheson, CEO of VLSI Research Inc. recently wrote, “Not far away in Tempe, at Freescale’s Packaging Systems Laboratory, an even more revolutionary packaging technology has been developed. Freescale calls it RCP for Redistributed Chip Package. I think they should rename it to Revolutionary Chip Package because what I’ve seen has led me to believe it will upend the entire way electronics are made in the future.” Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 2 Objective ► Understand and apply the RCP package technology toward the following attributes: • • • • • • • Package size Package performance Multi-die in package solutions Integrated stacked packages 3D Integrated packaging System in package Convergence of 3D IC and RCP technology Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 3 Agenda ► Redistributed Chip Packaging (RCP) overview ► RCP roadmap ► Reliability and technology certification ► Development activities underway ► Providing solutions to customers ► Summary Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 4 Three Key Benefits of RCP 3G-UMTS Radio 13x13mm 9x9mm MBGA RCP 280-I/O • • • • ►Miniaturization On average - 30% area reduction Eliminates wirebonds & substrate Maintain same ball pitch or smaller 30% thinner than standard BGA ►Integration ►Elimination 30x30mm 45x90mm 86 Embedded peripheral components 36 SMT peripheral components 122 total peripheral components Does not include PA or power FETS 3-4 layer PCB required for HIF Multiple die - any device technology 440• peripheral components Die PCB PLUS peripherals in package 10 •layer • PoP any packaging technology • SMT components top ~75%onreduction • Replace motherboard - PCB in area ~70% peripheral components eliminated! (animated slide) Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 5 RCP Industry Thrust ►System in package – Addresses a potentially large need in the market and is being recognized as the next industry thrust • Heterogeneous integration • System miniaturization • System performance • System cost • High speed in package computing • System flexibility (Chip sourcing, integration) • Block testability • Path to integrating with 3D IC Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 6 Complexity Freescale Packaging Technology Landscape RCP Stacked Die TSV 3D Packaging RCP SiP RCP Single Die Wire bond BGAs TBGA PQFN PoP RF Module-HDI Flip Chip BGA MPC8370 QAC0703 TEPBGA II QFP QFN Integration Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 7 Convergence of 3D IC with RCP Integrated Systems 3D IC TSV. Stacked memory 3D ICTSV. Differentiated die 3D IC TSV. Integrated with RCP Stacked die * 3D IC face-to-face PoP RCP Stacked multi-die modules (2-5 layers). RCP (1LM – 6 LM, 3x3 to 40x40mm pkg.) * RCP Integrated Systems (Sensors, MEMS, Analog, Digital, Image, Memory, RF, optical) RCP Die to Die Integrated Package RCP Multi-die/Modules Substrate Based Module Fan out 1LM small pkg. (≤ 8x8) Highly integrated, performance app’s. (3D + RCP Systems) -Courtesy of 3D Plus WL-CSP Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. * 8 TM Freescale’s Redistributed Chip Package ►Cost competitive, high productivity, large area batch process Eliminates package substrate Eliminates gold wire bonds / C4 bumps ►High performance package Reduced electrical parasitics Higher frequency response ►Ultra Low-k Compatible (<90 nm MLM) Compliant with advance Si technology ►Pb-free, Halogen free, ROHS compliant ►Single chip, multiple chip and embedded component capability 300 mm round panel ►3D IC Enabling with System Integration roadmap 9 x 9 mm packages 258 IO, 0.5 mm pitch 716 packages/panel 2 layer build-up ►Certified to JEDEC/FSL Commercial and Industrial Level Reliability Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 9 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 10 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 11 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 12 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 13 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Animated Build-up Process Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 14 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Rotate 180 Degrees Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 15 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 16 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 17 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 18 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 19 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 20 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 21 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 22 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 23 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 24 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 25 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 26 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 27 RCP Process Mold frame Pre-tested die Carrier Die place onto carrier tape face down prior to encapsulation. Panel encapsulation Tape Carrier Mold frame removed, panel separated from carrier, ready to de-tape Cu interconnect ►Process steps • Die placed face down on tape mounted carrier • Non-compression encapsulant applied over die • Low temperature cure of encapsulant and de-tape • Panel buildup with dielectric and Cu redistribution • Panel bumped after final dielectric layer applied Solder bump Cu via Encapsulant Die Panel cross-section after build up process and bump applied Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Animated Build-up Process TM 28 RCP Build-Up Process Metal 1 layer Metal 2 layer BGA Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 29 Attributes of the RCP Technology ►Multiple • redistribution layers Allows for higher routing complexities, greater I/O ►Package • 1ML 2ML Shrink Improved via/line/spacing over HDI substrate 3ML ►Performance • ►Die • shrink Design for RCP ►Decrease • 4ML Low contact resistance via structure (Rvia<25mOhm) in iterative design cycle RCP build up pizza mask ►Integration • • • • Multi-Die SiP 3D Double sided build up Stacked Integrated passives LTE2 13x13mm Pad Compatible with BGA version RCP-LTE2 9x9mm-I.275BB Single die version I/O = 280 30 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 30 RCP and HDI Design Rule Comparison FC-HDI Substrate Std/Prem Label Feature RCP Std/Min A Via hole diameter 75um/65um* 200um/80um B Via pad diameter 100um/95um 350um/150um C Line width* 25um/25um** 50um/45um D Line to line space 25um/25um 50um/45um E Line to via pad space 25um/25um 50um/45um F Via pad to via pad space 25um/25um 50um/45um G Via pad to package edge space -/300um 250um/150um H Line to package edge space -/300um 250um/150um *Current released rules (12MPK10001G-ENG01) 70um min. Expect to revise min via size in a next release pending additional reliability data received, from 70um to 65um (after built: 65um top with 60um bottom). For actual “built” bias dimension, see RCP standard notes). **Widen line width to as much as possible for low line resistance nets. Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 31 Die Design for RCP Potential Die Pad Configurations Potential for Die Shrink •Design for RCP allows full array die I/O •Die size can be reduced, fewer power and ground connections Die Pad Design Rules Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 32 RCP Thermal Improvements RCP With Exposed Die and Attached Heat Spreader Thermal Performance Package Type Junction-to-air Thermal Resistance, Rja (°C/W) Natural Convection Forced Convection at 1 m/s (200 ft/min) RCP, 4 layers, Die Size: 8.5 x 9.9 mm, no lid on die backside 21.4 14.5 FC-PBGA, 6-layer HDI Die Size: 7 x 9 mm, no lid on die backside 24.2 20.4 FC-CBGA, 6 layers Die Size: 6.8 x 7.9 mm, no lid on die backside 14.0 11.0 RCP with 0.5 mm thick 25x25 mm Cu lid on die/encapsulant backside 15.8 10.2 RCP with 1.0 mm thick 25x25 mm Cu lid on die/encapsulant backside 15.5 10.1 RCP with 1.0 mm thick 25x25 mm Cu lid on die/encapsulant backside, along with a plate-fin heatsink 5.6 2.33 360 I/O, 25x25 mm, 1.27 mm pitch on a 4-layer PCB •Exposed Si Backside •Attach of heat spreader •Improved thermal performance Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 33 RCP Test Vehicles & Assembled Products TV1 TV2 TV3 PowerQuicc-3 PTV-C65 3G Baseband Network Processor PA Test Vehicle 2G Baseband i.300 RiP RF Test Vehicle XTR Power Management i.275 RiP Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 19 34 TM 9mm x 9mm 0.5mm P 12mm x 12mm 0.4mm P Certification Vehicles 6mm x 6mm 0.5mm P 12mm x 12mm 0.4mm P Vertical probe 125um pad pitch Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 35 RCP Reliability – M2 Technology Certification 300mm Test Item Pre-con: Customer-F* Pre-con: Customer-B** Pre-con: MSL3/260ºC Temp Cycle (-55 to 125ºC) w/Customer-F* Pre-con Temp Cycle (-55 to 125ºC) w/Customer-B** Pre-con Temp Cycle (-55 to 125ºC) w/MSL3/260ºC Pre-con HTOL 125ºC HTB 150ºC THB 85ºC/85% w/Customer-F* Pre-con THB 85ºC/85% w/Customer-B** Pre-con THB 85ºC/85% w/MSL3/260ºC Pre-con PCT 121ºC/100%RH 29.7psia w/Customer-F* Pre-con PCT 121ºC/100%RH 29.7psia w/Customer-B** Pre-con Board Level SJR Temp Cycle (-55 to 125ºC) w/Customer-F* Pre-con JEDEC Drop Test 30 Drops, 1500G JEDEC/FSL JEDEC/FSL Customer Extended Commercial Industrial Requirement Stress NA NA Pass NA NA Pass Pass Pass Pass NA NA NA NA Pass 400cyc Pass 504hrs Pass 504hrs NA Pass 700cyc Pass 1008hrs Pass 1008hrs NA Pass 100cyc Pass 100cyc NA NA NA Pass 504hrs NA Pass 1008hrs NA NA NA M2 Tech Cert Achieved using Spirytus-S (6x6mm, 105 I/O, 2ML 0.5mm pitch) Pass 1000cyc Pass 1008hrs Pass 1008hrs Pass 1008hrs Pass 1008hrs NA JEDEC and customer specific reliability requirements met Pass 96hrs Pass 96hrs NA NA Pass 480cyc Pass Pass NA * F Precon consists of 3 cycles of moisture load (30ºC/70%RH for 96hrs) and reflow at 260ºC ** B Precon consists of 2 cycles of moisture load (30ºC/70%RH for 96hrs) and reflow at 260ºC Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 36 RCP Reliability – LTE2 300mm RCP – LTE2 Demonstrated Reliability (9x9mm, 2ML, 258 I/O, 0.5mm pitch) Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 37 A Few Applications Targeted for RCP Package 1 Package 2 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 38 Robust RCP 2D Dimensional Packages – Building a Foundation for 3D Multi-Die, Embedded Passives, Integrated Structures Multiple Redistribution Layers Fan-Out Packaging Module with two die and 8 embedded passives 1ML U1 2ML 4ML U2 Inductors in Build-up M1 M2 M3 M4 39 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Inductor Coils with Shielding Structure for Isolation TM 39 RCP 3D Building Blocks – Multi Layer Fan-Out Packages Stacked Chip-to-Chip Die/Package B Die A RCP multi-die layer PCB -Courtesy of 3D Plus RCP Module with Sensor Stacked Fan-Out with side metal interconnect Multiple Laminated Package Layers Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 10 die, multilayer package built for Medtronic (Pacemaker application) TM 40 RCP 3D Building Blocks – Through Package Via-Double Sided Buildup Package A Die 1 Die 2 Package A Package B Package C Die 1 Package B Die 2 Package D Package A Embedded in Base Package Through Package Vias Base Package Assembled on Top Stacked TSV SMD Single die Back-toBack Die 2D Fan-out Common Power/Ground E-Plane DoubleSided Build up Blind Via Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. Through Vias TM 41 New RCP Potential Wirebond to RCP ►Allows system integration of mixed technologies: • MEMS • WB Die GCell Single die Backto-Back Die E-Plane ►Wirebond on Cu RCP pad possible over: • Die Region • EGP • Encapsulation Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 42 RCP on Interposer Requiring ≥ 0.8mm BGA Pitch ► ► ► Devised as low cost alternative to low-mid range FC packages Combines smaller RCP packaged device stacked on low cost substrate to accommodate 1mm and larger pitch Key Attributes of Concept • • Allows for smaller RCP package size Low cost Interposer substrate provided by vendor Footed HS Underfill RCP Interposer 8156 die mapped into a 0.4mm RCP Package (17mm x17mm) Interposer routing out to 43 1.0mm (29mm x 29mm) Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM Summary: Borrow Architecture from Nature – Adapt it for RCP Retina Light input Parallel Vertical Imager/Processor Stack Electrical output To optic nerve (output) To main computer Smart processing Ganglion cells (multi-pixel processing) BOX Bipolar cells Amacrine cells Horizontal cells Cones (day/color) Rods (night vision) Metal3 Metal2 Metal1 InGaAs BOX Imager layer BOX Visible IR ►RCP provides a diverse set of solutions for heterogeneous integration. ►Interest in mounting within the industry to utilize this capability for integrated, compact systems 44 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM Proposed Model Outside of Nepes framework Freescale Development Activities Internal Freescale Non JDA related opportunities (ex Sensors) JDA Activity with Nepes Multi-Die 3D Integrated Packages High I/O, High performance packages Integrated Sensors Prototyping Freescale NPI’s Freescale initiated external customer support External Freescale System level or package level opportunity (i.e. Medical, Robotics, Imaging, Smart Card, etc.) Tempe RCP Development and Prototyping Lab Prototyping Nepes initiated non-Freescale product support Nepes Manufacturing Site External Freescale Test hardware development Develop Freescale integrated system level package solution using Freescale resources (design, modeling, package development, manufacturing) Use established opportunities to integrate Freescale IP/ Chips as well as build a comprehensive solution Nepes Manufacturing Site Partner Manufacturing Site Freescale Manufacturing Site Technology Development Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 45 Foundry Technology Offerings Across Markets Automotive Industrial Consumer Wireless Handsets Networking Infrastructure CMOS Technology (Low Power, RF CMOS, SOI, NVM and Cores) 180nm, 130nm and 90nm Silicon Germanium RF BiCMOS 0.35um and 0.18um SmartMOS (BCD Smart Power Technology 0.35um, 0.25um and 0.13um (voltage tiers up to 105v) MEMs, Backend and Post Process Modules (Cu Ind, Power Cu and Bump) 150mm and 200mm Wafer Services RCP – Advanced Redistributed 3-D Packaging Technology Multi Die, Multi Technology Systems in a Package Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. TM 46 TM