MCF5275 Reference Manual Errata

Freescale Semiconductor
Reference Manual Addendum
MCF5275RMAD
Rev. 2.2, 05/2007
MCF5275 Reference Manual Errata
by: Microcontroller Division
This errata document describes corrections to the
MCF5275 Reference Manual, order number
MCF5275RM. For convenience, the addenda items are
grouped by revision. Please check our website at
http://freescale.com/coldfire for the latest updates.
The current version available of the MCF5275 Reference
Manual is Revision 2.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
Table of Contents
1
2
3
4
Errata for Revision 2 ............................................2
Errata for Revision 1.1 .........................................8
Errata for Revision 1 ..........................................10
Revision History ................................................13
Errata for Revision 2
1
Errata for Revision 2
Table 1. MCF5275RM Rev 2 Errata
Location
Description
Table 1-1/Page 1-2
Change “CIM = Chip Configuration Module + Reset Controller Module” to “Chip
Configuration Module + Reset Controller Module”.
Figure 1-1/Page 1-3
Change instance of CIM to “CCM and Reset Controller”.
Section 1.3.1/Page 1-7
Change “Chip Integration Module (CIM)” to “Chip Configuration Module (CCM)”.
Move Reset sub-bullet (and its sub-bullets) up one level.
Table 3-1/Page 3-4
Remove last sentence in C bit field description.
Table 3-5/Page 3-8
Change PC’s Written with MOVEC entry to “No”.
Section 3.4/Page 3-9
Change last bullet to “Use of separate system stack pointers for user and supervisor
modes”
Section 3.5/Page 3-10
Change last sentence in fourth paragraph (step 2) to “The IACK cycle is mapped to special
locations within the interrupt controller's address space with the interrupt level encoded in
the address."
Figure 4-9/Page 4-14
Add minus sign to the exponent so that it is “–(i + 1 – N)”.
Table 5-3/Page 5-7
Change reset value of ACR0, ACR1 to “See Section” since some of the bits are undefined
after reset.
Figure 5-2/Page 5-7
Change CACR fields to R/W, since they may be read via the debug module.
Table 5-5/Page 5-10
For split instruction/data cache entry, swap text in parantheses in the description field.
Instruction cache uses the upper half of the arrays, while data cache uses the lower half.
Figure 5-3/Page 5-11
Change reset value of ACR: Bits 31-16, 14-13, 6-5, and 2 are undefined, and other bits are
cleared.
Change ACR fields to R/W, since they may be read via the debug module.
Section 5.2.1.2/Page 5-11 Change note to:
NOTE
Peripheral (IPSBAR) space should not be cached. The
combination of the CACR defaults and the two ACRn
registers must define the non-cacheable attribute for
this address space.
Figure 6-1/Page 6-2
Change RAMBAR fields to R/W, since they may be read via the debug module.
Section 11.2.1.1/Page 11-3 After the first paragraph add the following note:
NOTE
Accessing reserved IPSBAR memory space could
result in an unterminated bus cycle that causes the
core to hang. Only a hard reset will allow the core to
recover from this state. Therefore, all bus accesses to
IPSBAR space should fall within a module's memory
map space.
Table 12-9/Page 12-19
Change footnote from “...of the RCSC field in the CIM reset configuration register.” to “... of
the RCR[RCSC] field in the reset controller.”
MCF5275 Reference Manual Errata, Rev. 2.2
2
Freescale Semiconductor
Errata for Revision 2
Table 1. MCF5275RM Rev 2 Errata (continued)
Location
Table 13-1/Page 13-2
Description
Replace table with the one below to better illustrate the interrupt priority and level
assignments.
Interrupt
Level
ICR[IL]
Priority
ICR[IP]
Supported Interrupt
Sources
7
6
5
#8–63
4
7
— (Mid-point)
#7 (IRQ7)
3
2
1
#8–63
0
6
5
4
3
2
1
7–4
#8–63
— (Mid-point)
#6 (IRQ6)
3–0
#8–63
7–4
#8–63
— (Mid-point)
#5 (IRQ5)
3–0
#8–63
7–4
#8–63
— (Mid-point)
#4 (IRQ4)
3–0
#8–63
7–4
#8–63
— (Mid-point)
#3 (IRQ3)
3–0
#8–63
7–4
#8–63
— (Mid-point)
#2 (IRQ2)
3–0
#8–63
7–4
#8–63
— (Mid-point)
#1 (IRQ1)
3–0
#8–63
Table 13-2/Page 13-5
In footnote, remove mention of the SWIACK register, as it is not supported in the global
IACK space.
Table 13-3/Page 13-6
Added global IACK addresses for the L1IACK–L7IACK registers in the IPSBAR offset
column, 0xFE4–0xFFC.
Section 13.2.1.7/Page 13-16 Change last paragraph to: “In addition to the IACK registers within each interrupt controller,
there are global LnIACK registers. A read from one of the global LnIACK registers returns
the vector for the highest priority unmasked interrupt within a level for all interrupt
controllers. There is no global SWIACK register. However, reading the SWIACK register
from each interrupt controller returns the vector number of the highest priority unmasked
request within that controller.”
Figure 14-3/Page 14-4
Figure incorrectly shows that EPDDR is 16-bits wide. Change to an 8-bit register with each
EPDDn bit a one-bit field from bits 7–1 to match Table 15-4.
Figure 15-2/Page 15-5
Re-labeled the WS states in the timing diagram. The first should be IWS to indicate that the
length of this wait state is determined by CSCR[IWS]. The rest of the wait states should be
IWS/SWWS to indicate that either CSCR[IWS] or CSCR[SWWS] determine the length of
the wait state depending on the value of CSCR[AA].
MCF5275 Reference Manual Errata, Rev. 2.2
Freescale Semiconductor
3
Errata for Revision 2
Table 1. MCF5275RM Rev 2 Errata (continued)
Location
Description
Figure 15-3/Page 15-5
Re-labeled the WS states in the timing diagram. The first should be IWS to indicate that the
length of this wait state is determined by CSCR[IWS]. The rest of the wait states should be
IWS/SRWS to indicate that either CSCR[IWS] or CSCR[SRWS] determine the length of the
wait state depending on the value of CSCR[AA].
Change Write labels on the data signals to Read.
Table 17-8/Page 17-17
Change note in SDCR[DQS_OE] field description from
“Note: For 01 and 10 settings, some 32-bit DDR devices only have a single SD_DQS pin.
Enable one of the signals and disable the other. Then short both pins external to the device.”
to
“Note: Some 16-bit DDR devices only have a single SD_DQS pin. Therefore, use the 01 or
10 settings and short both pins external to the device.”
Section 17.5.3/Page 17-17 Add the following after the first two paragraphs:
NOTE
In DDR mode, the memory controller counts the delay
in DDR_CLKOUT × 2
DDR_CLKOUT—memory controller clock—is the speed of the SDRAM interface and is
equal to the internal bus clock.
DDR_CLKOUT × 2—double frequency of DDR_CLKOUT—DDR uses both edges of the
bus-frequency clock (DDR_CLKOUT) to read/write data.
Table 17-9/Page 17-18
Change SDCFG1[SRD2RW] field description equation from “SRD2RW = Burst Length/2”
to “SRD2RW = CASL + Burst Length/2 + 1” with a suggested value of 0x7.
Table 17-9/Page 17-19
Add the following examples to the ACT2RW and PRE2ACT field descriptions:
“EXAMPLE: If tRCD = 20ns and DDR_CLKOUT = 75 MHz
20ns / 13.3 ns = 1.5; round to 2; write 0x1.
Count value is in DDR_CLKOUT periods.”
Section 17.5.4/Page 17-19 Change “CLKOUT” in last sentence to “DDR_CLKOUT.”
Table 17-10/Page 17-19
Change BWT2RW equation from: BWT2RW = (BurstLength / 2 + tWR) to:
BWT2RW = (BurstLength / 2 + tWR / tDDR_CLKOUT)
Table 17-10/Page 17-20
Change BRD2WT field description from “Write 0xB for best performance. All values less
than 0xB are reserved.“ to “For DDR, suggested value = 0x7.”
Section 17.7/Page 17-23
Many corrections with the DDR SDRAM example:
Change example to two 16M x 16-bit DDR SDRAM operating at 75 MHz DDR_CLKOUT
frequency.
Update SDRAM example specifications to the following:
CAS latency: 2
Clock cycle time (tck): 7.5ns (min)
ACTV-to-read/write delay (tRCD): 15ns (min) 18ns (max)
Write recovery timer (tWR): 15ns
Precharge command to ACTV command (tRP): 15 ns (min) 18ns (max)
Auto refresh command period (tRFC): 72ns (min) 75ns (max)
Average periodic refresh interval (tREFI): 7.8 μs
Section 17.7.1/Page 17-25 Change SDMR0 setting from 0x03FC_0001 to 0x07FC_0001.
MCF5275 Reference Manual Errata, Rev. 2.2
4
Freescale Semiconductor
Errata for Revision 2
Table 1. MCF5275RM Rev 2 Errata (continued)
Location
Description
Section 17.7.2/Page 17-25 Change SDCFG1 from 0x2361_1630 to 0x7361_1530.
SRD2RW field using proper equation of CASL + bustlength/2 + 1 = 2 + 8/2 + 1 = 7
Change other equations to use a tDDR_CLKOUT of 13.3ns since the example uses a 75 MHz
frequency. However the only value this affects is REF2ACT which results in a setting of
5 instead of 6.
Section 17.7.3/Page 17-26 Change SDCFG2 from 0x2433_0000 to 0x4677_0000.
The burst length used in the equations should be 8 instead of 4.
The correct recommended value of BRD2WT is 0x7.
Table 17-17/Page 17-26
Change BWT2RW entry’s description to:
BWT2RW = BurstLength / 2 + tWR / tDDR_CLKOUT = 8/2 + 15/8.3 = 4 + 1.8 = 5.8,
rounded up to 6
Section 17.7.4/Page 17-27 Change SDCR from 0xC109_0002 to 0xC108_0002.
Change RCNT equation to use a tDDR_CLKOUT of 13.3ns since the example uses a 75 MHz
frequency. This changes the value from 9 to 8.
Section 17.7.6/Page 17-29 Change SDMR from 0x049D_0000 to 0x048D_0000.
Correct BLEN from 0x7 to 0x3.
Section 17.7.7/Page 17-30 Change SDCR from 0xC109_0002 to 0xC108_0002.
Change RCNT equation to use a tDDR_CLKOUT of 13.3ns since the example uses a 75 MHz
frequency. This changes the value from 9 to 8.
Section 17.8/Page 17-31
Change section number to Section 17.7.8.
Change SDCR from 0xC109_0004 to 0xC108_0004.
Change RCNT equation to use a tDDR_CLKOUT of 13.3ns since the example uses a 75 MHz
frequency. This changes the value from 9 to 8.
Section 17.8.1/Page 17-32 Change section number to Section 17.7.9.
Change SDMR from 0x009D_0000 to 0x008D_0000.
Correct BLEN from 0x7 to 0x3.
Section 17.8.2/Page 17-33 Change section number to Section 17.7.10.
Change SDCR from 0x510D_0C00 to 0x5108_0C00.
Change RCNT equation to use a tDDR_CLKOUT of 13.3ns since the example uses a 75 MHz
frequency. This changes the value from 9 to 8.
MCF5275 Reference Manual Errata, Rev. 2.2
Freescale Semiconductor
5
Errata for Revision 2
Table 1. MCF5275RM Rev 2 Errata (continued)
Location
Description
Section 17.8.3/Page 17-34 Change section number to Section 17.7.11.
Change code sequence to the following as a result of the above changes:
Basic Configuration and Initialization:
move.l
move.l
move.l
move.l
move.l
move.l
move.l
move.l
#0x00000000, d0
d0, SDBAR0
#0x03FC0001, d0
d0, SDMR0
#0x73611530, d0
d0, SDCFG1
#0x46770000, d0
d0, SDCFG2
Precharge Sequence and enable write to SDMR:
move.l
move.l
move.l
move.l
#0xC1080002, d0
d0, SDCR
#0x0, a0
#0xdeadbeef, (a0)
Write Extended Mode Register:
//Initialize SDCR, send PALL, enable SDMR
move.l
move.l
move.l
move.l
#0x40010000, d0
d0, SDMR
#0x0, a0
#0xdeadbeef, (a0)
Write Mode Register and Reset DLL:
//Write LEMR to enable DLL
move.l
move.l
move.l
move.l
#0x048D0000, d0
d0, SDMR
#0x0, a0
#0xdeadbeef, (a0)
Precharge Sequence:
//Write LMR and reset DLL
move.l
move.l
move.l
move.l
#0xC1080002, d0
d0, SDCR
#0x0, a0
#0xdeadbeef, (a0)
Refresh Sequence:
//Send PALL
move.l
move.l
move.l
move.l
move.l
move.l
move.l
move.l
#0xC1080004, d0
d0, SDCR
#0x0, a0
#0xdeadbeef, (a0)
#0xC1080004, d0
d0, SDCR
#0x0, a0
#0xdeadbeef, (a0)
Write Mode Register and Clear Reset DLL:
move.l
move.l
move.l
move.l
#0x008D0000, d0
d0, SDMR
#0x0, a0
#0xdeadbeef, (a0)
Enable Auto Refresh and Lock SDMR:
move.l
move.l
move.l
move.l
#0x51080C00, d0
d0, SDCR
#0x0, a0
#0xdeadbeef, (a0)
//Initialize SDBAR0
//Initialize SDMR0
//Initialize SDCFG1
//Initialize SDCFG2
//dummy write
//dummy write
//dummy write
//dummy write
//Send first REF command
//dummy write
//Send second REF command
//dummy write
//Write LMR and clear reset DLL
//dummy write
//Enable auto refresh and clear MODE_EN
//dummy write
Figure 18-1/Page 18-2
Remove this figure as it is incorrect for this device. The second figure on page 18-3 (with
DREQ3) is correct
Section 18.4/Page 18-13
Remove last sentence in this section starting with “BCRn decrements...” since SAA bit is
not supported.
Section 18.4.4.1/Page 18-16 Remove instances of eTPU in this section.
Change DREQ[32:0] to DREQ[3:0].
Remove third sentence in second paragraph.
Figure 18-9/Page 18-17
Change CLKIN to CLKOUT
Add overbars to TS, CS, and TA.
MCF5275 Reference Manual Errata, Rev. 2.2
6
Freescale Semiconductor
Errata for Revision 2
Table 1. MCF5275RM Rev 2 Errata (continued)
Location
Description
Section 18.4.4.1/Page 18-17 Remove all text and figures in this section starting with “Since bus timings...”
Table 19-1/Page 19-5
Correct MIB block counters end addresses to IPSBAR + 0x12FF and IPSBAR + 0x20FF
Table 19-3/Page 19-8
Add RMON_R_DROPn with an IPSBAR Offset of 0x1280 & 0x2080 and a description of
‘Count of frames not counted correctly’.
Section 19.3.6/Page 19-38 Add the following subsection entitled “Duplicate Frame Transmission”:
The FEC fetches transmit buffer descriptors (TxBDs) and the corresponding transmit data
continuously until the transmit FIFO is full. It does not determine whether the TxBD to be
fetched is already being processed internally (as a result of a wrap). As the FEC nears the
end of the transmission of one frame, it begins to DMA the data for the next frame. In order
to remain one BD ahead of the DMA, it also fetches the TxBD for the next frame. It is
possible that the FEC will fetch from memory a BD that has already been processed but not
yet written back (that is, it is read a second time with the R bit still set). In this case, the data
is fetched and transmitted again.
Using at least three TxBDs fixes this problem for large frames, but not for small frames. To
ensure correct operation for either large or small frames, one of the following must be true:
• The FEC software driver ensures that there is always at least one TxBD with the ready
bit cleared.
• Every frame uses more than one TxBD and every TxBD but the last is written back
immediately after the data is fetched.
• The FEC software driver ensures a minimum frame size, n. The minimum number of
TxBDs is then (Tx FIFO Size ÷ (n + 4)) rounded up to the nearest integer (though the
result cannot be less than three). The default Tx FIFO size is 192 bytes; this size is
programmable.
Figure 29-8/Page 29-7
Move SKMR[CTRM,DKP] bit fieldsfrom 11–7 to 12–8.
Table 29-2/Page 29-8
Correct bit locations for CTRM and DKP fields:
31–13 Reserved
12–9 CTRM
8
DKP
7–5
Reserved
Table 31-13/Page 31-13
Add the following note to the PBR[Address] field description:
Note: PBR[0] should always be loaded with a 0.
Table 31-21/Page 31-36
Change CSR’s initial state to 0x0090_0000.
MCF5275 Reference Manual Errata, Rev. 2.2
Freescale Semiconductor
7
Errata for Revision 1.1
2
Errata for Revision 1.1
Table 2. MCF5275RM Rev 1.1 Errata
Location
Description
Table 2-1/Page 2-5
FEC0_RXER and FEC1_RXER direction should be input, FEC0_TXEN and FEC1_TXEN
direction should be output.
Table 2-1/Page 2-6
The GPIO signal name for the U1RTS entry should be swapped with U1CTS. The same is
true for U0RTS and U0CTS as well. Here are the correct assignments:
U1CTS : PUARTL5
U1RTS : PUARTL4
U0CTS : PUARTL1
U0RTS : PUARTL0
Table 2-8/Page 2-12
FECn_RXER direction should be input.
Table 7-3/Page 7-7
Footnote should read: “In 1:1 mode for the MCF5275, fsys = 2 × fref_1:1”
Table 9-8/Page 9-8
Default output pad drive strength should be partial instead of full.
Table 9-8/Page 9-9
Footnote #2: Changed which pins do not affect reset configuration: “The D[31:26, 23:22,
18:17, 15:0] pins do not affect reset configuration.”
Table 12-1/Page 12-6
FEC0_RXER and FEC1_RXER direction should be input, FEC0_TXEN and FEC1_TXEN
direction should be output.
Table 12-1/Page 12-7
The GPIO signal name for the U1RTS entry should be swapped with U1CTS. The same is
true for U0RTS and U0CTS as well. Here are the correct assignments:
U1CTS : PUARTL5
U1RTS : PUARTL4
U0CTS : PUARTL1
U0RTS : PUARTL0
Table 12-15/Page 12-27
In bits 3–0 of the PAR_FECI2C register the settings for assigning the I2C_SDA and
I2C_SCL pins to be UART2 transmit and receive functions are incorrect. Replace with
the following bit settings table:
Figure 12-45/Page 12-28
PAR_SDA
PAR_SCL
00
GPIO
GPIO
01
U2RXD
U2TXD
10
GPIO
GPIO
11
I2C_SDA
I2C_SCL
Combine bits 5–4 and bits 1–0 and rename the two fields to PAR_U1CTL and PAR_U0CTL
respectively. Pinmuxing for the CTS/RTS signals cannot be controlled independently.
MCF5275 Reference Manual Errata, Rev. 2.2
8
Freescale Semiconductor
Errata for Revision 1.1
Table 2. MCF5275RM Rev 1.1 Errata (continued)
Location
Description
Table 12-16/Page 12-29
For bits 5–4 and 1–0, CTS and RTS pinmuxing for UART0 and UART1 cannot be controlled
independently.
To enable the GPIO on U0CTS and U0RTS pins, PAR_UART[1:0] should be set to ‘00’; to
enable primary function on these pins PAR_UART[1:0] should be set to '11’.
Similarly, to enable GPIO on U1CTS and U1RTS, PAR_UART[5:4] should be set to ‘00’; to
enable primary function on these pins PAR_UART[5:4] should be set to ‘11’.
Combinations of ‘01’ and ‘01’ are not valid.
Therefore, the following table rows for bits 5–4 and 1–0 should be used:
Bits
5–4
Bits
1–0
Field
Description
PAR_U1CTL U1CTS and U1RTS pin assignment. These two bits configure the U1CTS and U1RTS
pins for primary function or GPIO.
00 U1CTS and U1RTS pins configured for GPIO
01 Reserved
10 Reserved
11 U1CTS and U1RTS pins configured for UART1 control functions.
Field
Description
PAR_U0CTL U0CTS and U0RTS pin assignment. These two bits configure the U0CTS and U0RTS
pins for primary function or GPIO.
00 U0CTS and U0RTS pins configured for GPIO
01 Reserved
10 Reserved
11 U0CTS and U0RTS pins configured for UART0 control functions.
Section 13.2.1.6/Page 13-12 Include the text
It is the responsibility of the software to program the ICRnx registers with unique and
non-overlapping level and priority definitions. Failure to program the ICRnx registers in
this manner can result in undefined behavior. If a specific interrupt request is completely
unused, the ICRnx value can remain in its reset (and disabled) state.
in section description and as a note in Figure 13.9.
Throughout Chapter 15
Replace instances of D[19:18] with D[20:19].
Figure 21-1/Page 21-2
Change value in divide by box to 4096 instead of 8192.
Figure 26-17/Page 26-18
Remove 16-bit divider blocks from both timer inputs, as it is not available when using an
external clock source.
Section 26.4.1.2.2/Page
26-19
Change equation to: Baudrate = fextc/(16 or 1), since the 16-bit divider is not available when
using an external clock source.
Table 30-7/Page 30-15
Replace entries with “Bytes 5-7 + Parity” with “Bytes 5-8” to reduce confusion. The parity is
included in the last bit of each byte, not the 8th byte.
MCF5275 Reference Manual Errata, Rev. 2.2
Freescale Semiconductor
9
Errata for Revision 1
3
Errata for Revision 1
Table 3. MCF5275RM Rev 1 Errata
Location
Description
Throughout
Remove overbar from DACKn signals, as they are not asserted low.
Throughout
Fix discrepancies regarding core and internal bus frequencies. Max core frequency is
166 MHz and max internal bus frequency is 83 MHz.
Throughout
Replace RSTI with RESET and RSTO with RSTOUT.
Figure 2-1/Page 2-2
Remove VSTBY signal from figure.
Table 2-1/Page 2-3
Change RCON pin location for the 196 MAPBGA device from N11 to M6.
Change USB_CLK pin location for the 196 MAPBGA device from G12 to F12.
Change FEC0_TXCLK pin location for the 256 MAPBGA device from C1 to C3.
Table 2-15/Page 2-18
Added entry in table for PSTCLK output signal. “PSTCLK indicates when the development
system should sample PST and DDATA values.”
Figure 3-7/Page 3-18
The reset value of D1[DCSIZ] is 0x0 and the reset value of D1[RAM1SIZ] is 0x8. Table 3-11
is correct.
Table 6-1/Page 6-3
In SPV bit field description, fix cross-reference to Section “Memory Base Address Register
(RAMBAR)”. It should be Section 11.2.1.2 instead of 8.4.2.
Section 7.1.3.5/Page 7-6
The PLL cannot be stopped when the device enters stop mode. Remove paragraphs 3-6
and add in their place “During stop mode, the PLL continues to run. The external
CLKOUT signal may be enabled or disabled when the device enters stop mode,
depending on the LPCR[STPMD] bit settings. The external CLKOUT output pin may be
disabled to lower power consumption via the SYNCR[DISCLK] bit. The external
CLKOUT pin function is enabled by default at reset.”
Table 7-5/Page 7-9
The first equation in footnote #1 in the MFD bit description field is incorrect. It should be:
“fsys = fref × 2(MFD + 2)/2RFD” instead of fsys/2.
Table 7-5/Page 7-9
The second equation in footnote #1 in the MFD bit description field is incorrect. It should be:
“fref × 2(MFD + 2) ≤ 166MHz” instead 83MHz
Section 7.4.3/Page 7-15
First paragraph, the default core frequency is one and a half times the reference frequency
after reset instead of two times the reference frequency. An MFD = 0b001 is 6x not 2x.
Table 7-11/Page 7-30
Delete 4th and 5th rows on this page, as the PLL cannot be disabled in stop mode.
Table 8-4/Page 8-4
The description of bits 2-0 is missing from the LPCR Field Description table. These should
be included with the following description: “Reserved, should be cleared.”
Section 8.3.2.3/Page 8-6
Corrected second paragraph since the core watchdog cannot reset the device. Second
paragraph should read “When enabled, the core watchdog can bring the device out of
low-power mode via a core watchdog interrupt. This system setup must meet the
conditions specified in Section 8.3.1, “Low-Power Modes” for the core watchdog interrupt
to bring the part out of low-power mode.
Section 8.3.2.16/Page 8-10 The PLL cannot be stopped when the device enters stop mode. Remove paragraphs 2-5
and add in their place “During stop mode, the PLL continues to run. The external
CLKOUT signal may be enabled or disabled when the device enters stop mode,
depending on the LPCR[STPMD] bit settings.”
Table 9-1/Page 9-2
Section 9.2.3/Page 9-2
Reset config override signals should be D[25:24, 21:19, 16] instead of D[26:24, 21, 19:16].
Section title should be “D[25:24, 21:19, 16]...” instead of “D[26:24, 21, 19:16]...”
MCF5275 Reference Manual Errata, Rev. 2.2
10
Freescale Semiconductor
Errata for Revision 1
Table 3. MCF5275RM Rev 1 Errata (continued)
Location
Description
Figure 9-2/Page 9-4
Change the CCR[LOAD] bit to reserved, as it is not functional on the device.
Change reset value to 0x0028.
Table 9-4/page 9-4
Remove the CCR[LOAD] bit.
Figure 9-3/Page 9-5
Unreserved RCON register bits should be read only.
Table 9-7/Page 9-8
Reset config override signals should be D[25:24, 21:19, 16] instead of D[26:24, 21, 19:16].
Table 9-8/Page 9-8
Chip mode heading should be D16 only, since D26 & D17 have no affect on the selected
chip mode. Master mode (default) is selected by asserting D16. Deasserting D16 during
RCON assertion at reset places the device in a reserved mode.
Table 9-8/Page 9-8
Remove “RCON[2]=0” in boot device default configuration field.
Table 9-8/Page 9-9
“Chip select configuration“ entry for setting D[25:24]=11, should read “PADDR[7:5] =
CS[6:4]” instead of “PADDR[7:6] = CS[6:4]”
Table 9-8/Page 9-9
Remove “RCON[7:6]=10” from clock mode default configuration field. Footnote added:
“There is no default configuration for clock mode selection. The actual values for the
CLKMOD pins must always be driven during reset. Once out of reset, the CLKMOD pins
have no effect on the clock mode selection.”
Table 9-8/Page 9-9
Footnote #2: Changed which pins do not affect reset configuration: “The D[31:26, 23:22,
20:17] pins do not affect reset configuration.”
Section 9.4.2/Page 9-9
Table 9-9/Page 9-9
Table 13-13/Page 13-15
Figure 14-9/Page 14-16
Section 15.2.1/Page 15-1
Table 15-6/Page 15-8
The MODE field is in the RCON register instead of the CCR.
Remove MODE[2] and MODE[1] columns since the MODE field is only one bit wide and
also D26 and D17 have no affect on chip configuration mode selection.
The interrupt source assignment for the USB sources in incorrect. They should be as
follows:
Source
Module
Flag
Source
Description
43
USB
USB
USB Interrupt
writing a ’1’ to the appropriate bit in
USB_INTR
44
EP0
Endpoint 0
writing a ’1’ to the appropriate bit in
USB_EP0_INTR
45
EP1
Endpoint 1
writing a ’1’ to the appropriate bit in
USB_EP1_INTR
46
EP2
Endpoint 2
writing a ’1’ to the appropriate bit in
USB_EP2_INTR
47
EP3
Endpoint 3
writing a ’1’ to the appropriate bit in
USB_EP3_INTR
Flag Clearing Mechanism
DACKn is only asserted for a single clock cycle. All other signals (TS, CS, TA, R/W, and
A[23:0] are subsequently moved one cycle sooner.
An overbar should be placed over the CS[7:0] in the section heading.
The last sentence should read: “Port size for CS0 is configured by the logic levels of
D[20:19] when RSTOUT negates and RCON is asserted.”
In the CSMRn[BAM] bit description, the first example BAM bit setting is incorrect. Change
from 0x0008 to 0x0001.
MCF5275 Reference Manual Errata, Rev. 2.2
Freescale Semiconductor
11
Errata for Revision 1
Table 3. MCF5275RM Rev 1 Errata (continued)
Location
Description
Table 17-8/Page 17-17
In the RCNT field description, the last line of the example should be:
RCNT = floor(5 × 83/64) - 1 =0x04
Correct CLKOUT value and move closing parenthesis.
Table 17-9/Page 17-18
PRE2ACT bit field description; tDDRCLKOUT is incorrect. Should be 1/83 MHz.
Section 17.7/Page 17-23
Change “75MHz DDR_CLKOUT frequency” to “83MHz DDR_CLKOUT frequency (12ns
period)”.
Throughout Section 17.7
Correct tDDR_CLKOUT in all equations; should be 12ns instead of 8.3ns. This affects the table
entries as well as the actual values calculated for the registers.
Table 17-20/Page 17-29
Correct BLEN entry. Burst length can only be 8, BLEN = 111.
Table 17-23/Page 17-32
Correct BLEN entry. Burst length can only be 8, BLEN = 111.
Chapter 19
Figure 19-24/Page 19-28
The maximum buffer size of the FEC is 2032 bytes. Replace all instances of 2047 with 2032.
R_BUF_SIZE is at bit position 10:4 in the EMRBR register. Therefore the maximum
setting is $7F0 which equals 2032.
Change the EMRBRn register addresses to “IPSBAR + 0x1188 (FEC0) & IPSBAR +
0x1988 (FEC1)” instead of “IPSBAR + 0x11B8 (FEC0) & IPSBAR + 0x19B8 (FEC1)”.
Figure 20-6/Page 20-9
DADR field is only 10 bits wide (USB_DAR[9:0]) not 11 bits. Correct figure and
corresponding bit description table.
Table 24-3/Page 24-6
The MODE16 bit field description should read: “Selects the increment mode for the timer.
MODE16 = 1 is intended to exercise the upper bits of the 32-bit timer in diagnostic software
without requiring the timer to count through its entire dynamic range. When set, the
counter’s upper 16 bits mirror its lower 16 bits. All 32 bits of the counter are still compared
to the reference value.”
Section 24.3.2/Page 24-11 Correct example for 83 MHz.
Section 28.4.1/Page 28-15 Swap steps 4 & 5 and change “...(without padding) in bits” to “...(without padding) in bytes”.
Section 28.4.2.1/Page 28-16 Swap steps 4 & 5.
Section 28.4.2.2/Page 28-16 Swap steps 4 & 5.
Section 28.4.2.3/Page 28-17 Swap steps 8 & 9.
Section 28.4.3/Page 28-18 Swap steps 8 & 9.
Section 28.4.4/Page 28-18 Swap steps 6 & 7.
Section 28.4.5/Page 28-18 Swap steps 7 & 8.
Figure 30-8/Page 30-7
Change SKMR[CTRM] bit field to straddle bits 11–8.
Table 30-2/Page 30-8
Change the first 4 SKMR bit fields bit numbers to 31–12, 11–8, 7, & 6–5.
Section 30.3.1/Page 30-19 Remove last sentence of section, as this refers to internal logic only.
Section 30.4.1/Page 30-20 Swap steps 9 & 10.
Section 30.4.2/Page 30-20 Swap steps 9 & 10.
Swap steps 23 & 24.
Table 32-1/Page 32-2
Change CLKOUT to PSTCLK.
Figure 32-2/Page 32-2
Change CLKOUT to PSTCLK.
Figure 32-41/Page 32-48
Change pin 24 from CLKOUT to PSTCLK.
MCF5275 Reference Manual Errata, Rev. 2.2
12
Freescale Semiconductor
Revision History
4
Revision History
Table 4 provides a revision history for this document.
Table 4. Revision History Table
Rev. Number
Substantive Changes
Date of Release
1.0
• Initial release.
11/2004
1.1
• Added D1 reset value errata.
• Added FEC max buffer size errata.
01/2005
1.2
• Added FEC EMRBRn address errata.
03/2005
1.3
•
•
•
•
•
•
04/2005
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Added core and internal bus frequency errata.
Added RSTI/RSTO errata.
Added VSTBY errata.
Added multiple PSTCLK errata.
Added SPV bit field cross-reference errata.
Added multiple errata regarding the PLL unable to be stopped during stop
mode.
Added MFD bit field errata.
Added Section 7.4.3 default core frequency errata.
Added CCR[LOAD] bit errata.
Added core watchdog reset errata.
Added chip select configuration entry errata.
Added USB interrupt source number errata.
Added CSMRn[BAM] example errata.
Added RCNT field description equation errata.
Added tDDR_CLKOUT errata.
Added BLEN errata.
Added USB_DAR[DADR] bit field length errata.
Added DMA Timer MODE16 bit errata.
Added DMA Timer example errata.
Added MDHA & SKHA application examples errata.
Added the SKMR[CTRM] bit field errata.
The below errata were added for MCF5275RM Revision 1.1
1.4
• Added D[19:18]->D[20:19] errata.
• Corrected previous errata with Table 9-8, Footnote #2
07/2005
1.5
•
•
•
•
•
08/2005
1.6
• Added GPIO signal names for the UART control signals errata.
• Added PAR_FECI2C’s I2C_SDA and I2C_SCL bit setting error.
11/2005
1.7
• Added PAR_UART register errata for the UART0 and UART1 control signals.
12/2005
1.8
• Added ICRnx note regarding unique and non-overlapping level and priority
definitions.
• Added watchdog timer divide-by value errata.
07/2006
Added ERXER and ETXER direction errata in Chapter 2 and 12.
Added default output pad drive strength
Added Table 7-3 footnote errata.
Added SKHA parity errata.
Added UART external clock source, 16-bit divider errata.
MCF5275 Reference Manual Errata, Rev. 2.2
Freescale Semiconductor
13
Revision History
Table 4. Revision History Table (continued)
Rev. Number
Substantive Changes
Date of Release
The below errata were added for MCF5275RM Revision 2
2.1
•
•
•
•
•
Added RMON_R_DROP counter errata.
Added SDCR[DQS_OE] note errata.
Added SDCFG1 section notes.
Added SDCFG1[SRD2RW] description errata.
Added DDR example errata.
11/2006
2.2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Added various core, EMAC, cache, SRAM and debug chapter errata.
Added CLKIN to CLKOUT errata.
Added FEC MIB counter memory map errata.
Added “Duplicate Frame Transmission” section to FEC chapter.
Added secondary wait state timing diagram errata.
Added SKMR[CTRM,DKP] errata.
Added CIM/CCM errata.
Added EPDDR figure errata.
Added DMA figure overbars errata.
Added DMA figure errata.
Added SDRAM’s BWT2RW equation errata.
Added DMA external request and acknowledge operation section errata.
Added DMA SAA bit errata.
Added interrupt level/priority table.
Added IPSBAR note in SCM chapter.
Added global IACK space errata.
05/2007
MCF5275 Reference Manual Errata, Rev. 2.2
14
Freescale Semiconductor
THIS PAGE INTENTIONALLY LEFT BLANK
MCF5275 Reference Manual Errata, Rev. 2.2
Freescale Semiconductor
15
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MCF5275RMAD
Rev. 2.2
05/2007