Features • High Performance, Low Power AVR® 8-Bit Microcontroller • Advanced RISC Architecture • • • • • • • • – 120 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation Non-volatile Program and Data Memories – 2/4/8K Byte of In-System Programmable Program Memory Flash (ATtiny25/45/85) • Endurance: 10,000 Write/Erase Cycles – 128/256/512 Bytes In-System Programmable EEPROM (ATtiny25/45/85) • Endurance: 100,000 Write/Erase Cycles – 128/256/512 Bytes Internal SRAM (ATtiny25/45/85) – Programming Lock for Self-Programming Flash Program and EEPROM Data Security Peripheral Features – 8-bit Timer/Counter with Prescaler and Two PWM Channels – 8-bit High Speed Timer/Counter with Separate Prescaler • 2 High Frequency PWM Outputs with Separate Output Compare Registers • Programmable Dead Time Generator – USI – Universal Serial Interface with Start Condition Detector – 10-bit ADC • 4 Single Ended Channels • 2 Differential ADC Channel Pairs with Programmable Gain (1x, 20x) • Temperature Measurement – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator Special Microcontroller Features – debugWIRE On-chip Debug System – In-System Programmable via SPI Port – External and Internal Interrupt Sources – Low Power Idle, ADC Noise Reduction, and Power-down Modes – Enhanced Power-on Reset Circuit – Programmable Brown-out Detection Circuit – Internal Calibrated Oscillator I/O and Packages – Six Programmable I/O Lines – 8-pin PDIP, 8-pin SOIC and 20-pad QFN/MLF Operating Voltage – 1.8 - 5.5V for ATtiny25/45/85V – 2.7 - 5.5V for ATtiny25/45/85 Speed Grade – ATtiny25/45/85V: 0 - 4 MHz @ 1.8 - 5.5V, 0 - 10 MHz @ 2.7 - 5.5V – ATtiny25/45/85: 0 - 10 MHz @ 2.7 - 5.5V, 0 - 20 MHz @ 4.5 - 5.5V Industrial Temperature Range Low Power Consumption – Active Mode: • 1 MHz, 1.8V: 300 μA – Power-down Mode: • 0.1μA at 1.8V 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash ATtiny25/V * ATtiny45/V ATtiny85/V * * Preliminary Summary 2586KS–AVR–01/08 1. Pin Configurations Figure 1-1. Pinout ATtiny25/45/85 PDIP/SOIC (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/XTAL1/CLKI/OC1B/ADC3) PB3 (PCINT4/XTAL2/CLKO/OC1B/ADC2) PB4 GND 1 2 3 4 8 7 6 5 VCC PB2 (SCK/USCK/SCL/ADC1/T0/INT0/PCINT2) PB1 (MISO/DO/AIN1/OC0B/OC1A/PCINT1) PB0 (MOSI/DI/SDA/AIN0/OC0A/OC1A/AREF/PCINT0) 15 14 13 12 11 6 7 8 9 10 1 2 3 4 5 VCC PB2 (SCK/USCK/SCL/ADC1/T0/INT0/PCINT2) DNC PB1 (MISO/DO/AIN1/OC0B/OC1A/PCINT1) PB0 (MOSI/DI/SDA/AIN0/OC0A/OC1A/AREF/PCINT0) DNC DNC GND DNC DNC (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/XTAL1/CLKI/OC1B/ADC3) PB3 DNC DNC (PCINT4/XTAL2/CLKO/OC1B/ADC2) PB4 20 19 18 17 16 DNC DNC DNC DNC DNC QFN/MLF NOTE: Bottom pad should be soldered to ground. DNC: Do Not Connect 1.1 1.1.1 Pin Descriptions VCC Supply voltage. 1.1.2 GND Ground. 1.1.3 Port B (PB5..PB0) Port B is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B also serves the functions of various special features of the ATtiny25/45/85 as listed in “Alternate Functions of Port B” on page 61. On ATtiny25, the programmable I/O ports PB3 and PB4 (pins 2 and 3) are exchanged in ATtiny15 Compatibility Mode for supporting the backward compatibility with ATtiny15. 2 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 1.1.4 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 21-4 on page 170. Shorter pulses are not guaranteed to generate a reset. The reset pin can also be used as a (weak) I/O pin. 3 2586KS–AVR–01/08 2. Overview The ATtiny25/45/85 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny25/45/85 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram 8-BIT DATABUS CALIBRATED INTERNAL OSCILLATOR PROGRAM COUNTER STACK POINTER PROGRAM FLASH SRAM WATCHDOG TIMER TIMING AND CONTROL VCC MCU CONTROL REGISTER MCU STATUS REGISTER GND INSTRUCTION REGISTER INSTRUCTION DECODER CONTROL LINES GENERAL PURPOSE REGISTERS TIMER/ COUNTER0 X Y Z TIMER/ COUNTER1 ALU UNIVERSAL SERIAL INTERFACE STATUS REGISTER INTERRUPT UNIT PROGRAMMING LOGIC DATA EEPROM DATA REGISTER PORT B DATA DIR. REG.PORT B OSCILLATORS ADC / ANALOG COMPARATOR PORT B DRIVERS RESET PB0-PB5 The AVR core combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent 4 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATtiny25/45/85 provides the following features: 2/4/8K byte of In-System Programmable Flash, 128/256/512 bytes EEPROM, 128/256/256 bytes SRAM, 6 general purpose I/O lines, 32 general purpose working registers, one 8-bit Timer/Counter with compare modes, one 8-bit high speed Timer/Counter, Universal Serial Interface, Internal and External Interrupts, a 4-channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, and three software selectable power saving modes. Idle mode stops the CPU while allowing the SRAM, Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. Power-down mode saves the register contents, disabling all chip functions until the next Interrupt or Hardware Reset. ADC Noise Reduction mode stops the CPU and all I/O modules except ADC, to minimize switching noise during ADC conversions. The device is manufactured using Atmel’s high density non-volatile memory technology. The On-chip ISP Flash allows the Program memory to be re-programmed In-System through an SPI serial interface, by a conventional non-volatile memory programmer or by an On-chip boot code running on the AVR core. The ATtiny25/45/85 AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators and Evaluation kits. 5 2586KS–AVR–01/08 3. About 3.1 Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. For I/O Registers located in the extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI” instructions must be replaced with instructions that allow access to extended I/O. Typically, this means “LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”. Note that not all AVR devices include an extended I/O map. 3.3 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 6 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 4. Register Summary Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x3F SREG Name I T H S V N Z C Page page 8 0x3E SPH – – – – – – SP9 SP8 page 11 0x3D SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 page 11 0x3C Reserved 0x3B GIMSK – INT0 PCIE – – – – – page 53 0x3A GIFR – INTF0 PCIF – – – – – page 53 0x39 TIMSK – OCIE1A OCIE1B OCIE0A OCIE0B TOIE1 TOIE0 – page 84/page 106 0x38 TIFR – OCF1A OCF1B OCF0A OCF0B TOV1 TOV0 – page 84 0x37 SPMCSR – – RSIG CTPB RFLB PGWRT PGERS SPMEN page 149 0x36 Reserved 0x35 MCUCR BODS PUD SE SM1 SM0 BODSE ISC01 ISC00 page 38,page 52, page 66, 0x34 MCUSR – – – – WDRF BORF EXTRF PORF page 47, 0x33 TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 page 82 0x32 TCNT0 0x31 OSCCAL 0x30 TCCR1 – – Timer/Counter0 page 83 Oscillator Calibration Register CTC1 PWM1A COM1A1 COM1A0 CS13 page 32 CS12 CS11 CS10 page 92, page 103 0x2F TCNT1 Timer/Counter1 page 94, page 105 0x2E OCR1A Timer/Counter1 Output Compare Register A page 94, page 105 0x2D OCR1C Timer/Counter1 Output Compare Register C 0x2C GTCCR 0x2B OCR1B 0x2A TCCR0A 0x29 OCR0A TSM PWM1B COM1B1 COM0A1 COM0A0 COM0B1 COM1B0 FOC1B FOC1A PSR1 PSR0 WGM01 WGM00 Timer/Counter1 Output Compare Register B COM0B0 page 95 – Timer/Counter0 – Output Compare Register A 0x28 OCR0B 0x27 PLLCSR LSM 0x26 CLKPR CLKPCE – 0x25 DT1A DT1AH3 DT1AH2 DT1BH3 DT1BH2 - - – page 80 page 83 Timer/Counter0 – Output Compare Register B – page 95, page 106 page 80, page 93, page page 84 – – PCKE PLLE PLOCK page 97, page 107 – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 page 33 DT1AH1 DT1AH0 DT1AL3 DT1AL2 DT1AL1 DT1AL0 page 110 DT1BH1 DT1BH0 DT1BL3 DT1BL2 DT1BL1 DT1BL0 page 110 - - - - DTPS11 DTPS10 page 109 WDE WDP2 WDP1 WDP0 page 47 PRTIM1 PRTIM0 PRUSI PRADC page 37 EEAR8 page 20 0x24 DT1B 0x23 DTPS1 0x22 DWDR 0x21 WDTCR 0x20 PRR 0x1F EEARH 0x1E EEARL 0x1D EEDR 0x1C EECR 0x1B Reserved – 0x1A Reserved – 0x19 Reserved 0x18 PORTB – – PORTB5 0x17 DDRB – – 0x16 PINB – 0x15 PCMSK 0x14 DIDR0 0x13 GPIOR2 General Purpose I/O Register 2 page 10 0x12 GPIOR1 General Purpose I/O Register 1 page 10 0x11 GPIOR0 General Purpose I/O Register 0 page 10 0x10 USIBR USI Buffer Register page 118 DWDR[7:0] WDIF WDIE WDP3 WDCE – EEAR7 EEAR6 EEAR5 EEAR4 page 144 EEAR3 EEAR2 EEAR1 EEAR0 page 20 EERIE EEMPE EEPE EERE page 21 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 page 66 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 page 66 – PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 page 66 – – PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 page 54 – – ADC0D ADC2D ADC3D ADC1D AIN1D AIN0D page 125, page 142 EEPROM Data Register – – EEPM1 EEPM0 page 20 – 0x0F USIDR 0x0E USISR USISIF USIOIF USIPF USIDC USI Data Register USICNT3 USICNT2 USICNT1 USICNT0 page 118 page 119 0x0D USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC page 120 0x0C Reserved – 0x0B Reserved – 0x0A Reserved – 0x09 Reserved 0x08 ACSR 0x07 – ACD ACBG ACO ACI ACIE – ACIS1 ACIS0 page 124 ADMUX REFS1 REFS0 ADLAR REFS2 MUX3 MUX2 MUX1 MUX0 page 138 0x06 ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 page 140 0x05 ADCH ADC Data Register High Byte 0x04 ADCL ADC Data Register Low Byte 0x03 ADCSRB 0x02 Reserved – 0x01 Reserved – 0x00 Reserved – BIN ACME IPR – – page 141 page 141 ADTS2 ADTS1 ADTS0 page 124, page 141 7 2586KS–AVR–01/08 Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 8 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 5. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 2 BRANCH INSTRUCTIONS RJMP k IJMP RCALL k Relative Jump PC ← PC + k + 1 None Indirect Jump to (Z) PC ← Z None 2 Relative Subroutine Call PC ← PC + k + 1 None 3 3 ICALL Indirect Call to (Z) PC ← Z None RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 1/2/3 1 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1 9 2586KS–AVR–01/08 Mnemonics Operands Description Operation Flags #Clocks ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C←1 C 1 CLC Clear Carry C←0 C 1 SEN Set Negative Flag N←1 N 1 CLN Clear Negative Flag N←0 N 1 SEZ Set Zero Flag Z←1 Z 1 CLZ Clear Zero Flag Z←0 Z 1 SEI Global Interrupt Enable I←1 I 1 CLI Global Interrupt Disable I←0 I 1 SES Set Signed Test Flag S←1 S 1 CLS Clear Signed Test Flag S←0 S 1 SEV Set Twos Complement Overflow. V←1 V 1 CLV Clear Twos Complement Overflow V←0 V 1 SET Set T in SREG T←1 T 1 CLT Clear T in SREG T←0 T 1 SEH CLH Set Half Carry Flag in SREG Clear Half Carry Flag in SREG H←1 H←0 H H 1 Rd ← Rr Rd+1:Rd ← Rr+1:Rr None 1 None 1 1 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers MOVW Rd, Rr Copy Register Word LDI Rd, K Load Immediate Rd ← K None LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 Load Program Memory R0 ← (Z) None 3 LPM LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 Store Program Memory (z) ← R1:R0 None IN Rd, P In Port Rd ← P None OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 SPM 1 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR BREAK Watchdog Reset Break (see specific descr. for WDR/Timer) For On-chip Debug Only None None 1 N/A 10 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 6. Ordering Information 6.1 ATtiny25 Speed (MHz)(3) 10 20 Notes: Power Supply Ordering Code(2) Package(1) 1.8 - 5.5V ATtiny25V-10PU ATtiny25V-10SU ATtiny25V-10SSU ATtiny25V-10MU 8P3 8S2 S8S1 20M1 Industrial (-40°C to 85°C) 2.7 - 5.5V ATtiny25-20PU ATtiny25-20SU ATtiny25-20SSU ATtiny25-20MU 8P3 8S2 S8S1 20M1 Industrial (-40°C to 85°C) Operational Range 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC,see Figure 21.3 on page 168 Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S2 8-lead, 0.200" Wide, Plastic Gull-Wing Small Outline (EIAJ SOIC) S8S1 8-lead, 0.150" Wide, Plastic Gull-Wing Small Outline (JEDEC SOIC) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 11 2586KS–AVR–01/08 6.2 ATtiny45 Speed (MHz)(3) 10 20 Notes: Power Supply Ordering Code(2) Package(1) 1.8 - 5.5V ATtiny45V-10PU ATtiny45V-10SU ATtiny45V-10MU 8P3 8S2 20M1 Industrial (-40°C to 85°C) 2.7 - 5.5V ATtiny45-20PU ATtiny45-20SU ATtiny45-20MU 8P3 8S2 20M1 Industrial (-40°C to 85°C) Operational Range 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC,see Figure 21.3 on page 168 Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S2 8-lead, 0.200" Wide, Plastic Gull-Wing Small Outline (EIAJ SOIC) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 12 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 6.3 ATtiny85 Speed (MHz)(3) 10 20 Notes: Power Supply Ordering Code(2) Package(1) 1.8 - 5.5V ATtiny85V-10PU ATtiny85V-10SU ATtiny85V-10MU 8P3 8S2 20M1 Industrial (-40°C to 85°C) 2.7 - 5.5V ATtiny85-20PU ATtiny85-20SU ATtiny85-20MU 8P3 8S2 20M1 Industrial (-40°C to 85°C) Operational Range 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC,see Figure 21.3 on page 168 Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S2 8-lead, 0.200" Wide, Plastic Gull-Wing Small Outline (EIAJ SOIC) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 13 2586KS–AVR–01/08 7. Packaging Information 7.1 8P3 E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A SYMBOL MIN NOM A b2 b3 b 4 PLCS Side View L 0.210 NOTE 2 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 D1 0.005 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 0.100 BSC eA 0.300 BSC 0.115 3 3 e L Notes: MAX 0.130 4 0.150 2 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 R 14 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. REV. 8P3 B ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 7.2 8S2 C 1 E E1 L N θ TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A SYMBOL A1 D SIDE VIEW NOM MAX NOTE A 1.70 2.16 A1 0.05 0.25 b 0.35 0.48 5 C 0.15 0.35 5 D 5.13 5.35 E1 5.18 5.40 E 7.70 8.26 L 0.51 0.85 θ 0° 8° e Notes: 1. 2. 3. 4. 5. MIN 1.27 BSC 2, 3 4 This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. Mismatch of the upper and lower dies and resin burrs are not included. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded. Determines the true geometric position. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm. 4/7/06 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8S2, 8-lead, 0.209" Body, Plastic Small Outline Package (EIAJ) DRAWING NO. 8S2 REV. D 15 2586KS–AVR–01/08 7.3 S8S1 3 2 1 H N Top View e B A D COMMON DIMENSIONS (Unit of Measure = mm) Side View A2 C L SYMBOL MIN NOM MAX A – – 1.75 B – – 0.51 C – – 0.25 D – – 5.00 E – – 4.00 e E End View NOTE 1.27 BSC H – – 6.20 L – – 1.27 Note: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc. 10/10/01 R 16 2325 Orchard Parkway San Jose, CA 95131 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. REV. 8S1 A ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 7.4 20M1 D 1 Pin 1 ID 2 SIDE VIEW E 3 TOP VIEW A2 D2 A1 A 0.08 1 2 Pin #1 Notch (0.20 R) 3 COMMON DIMENSIONS (Unit of Measure = mm) E2 b L e BOTTOM VIEW SYMBOL MIN NOM MAX A 0.70 0.75 0.80 A1 – 0.01 0.05 A2 b 0.18 D D2 E2 L 0.23 0.30 4.00 BSC 2.45 2.60 2.75 4.00 BSC 2.45 e Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5. NOTE 0.20 REF E Note: C 2.60 2.75 0.50 BSC 0.35 0.40 0.55 10/27/04 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF) DRAWING NO. 20M1 REV. A 17 2586KS–AVR–01/08 8. Errata 8.1 Errata ATtiny25 The revision letter in this section refers to the revision of the ATtiny25 device. 8.1.1 Rev D and E No known errata. 8.1.2 Rev B and C • EEPROM read may fail at low supply voltage / low clock frequency 1. EEPROM read may fail at low supply voltage / low clock frequency Trying to read EEPROM at low clock frequencies and/or low supply voltage may result in invalid data. Problem Fix/Workaround Do not use the EEPROM when clock frequency is below 1 MHz and supply voltage is below 2V. If operating frequency can not be raised above 1 MHz then supply voltage should be more than 3V. Similarly, if supply voltage can not be raised above 2V then operating frequency should be more than 2 MHz. This feature is known to be temperature dependent but it has not been characterised. Guidelines are given for room temperature, only. 8.1.3 Rev A Not sampled. 18 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 8.2 Errata ATtiny45 The revision letter in this section refers to the revision of the ATtiny45 device. 8.2.1 Rev F and G No known errata 8.2.2 Rev D and E • EEPROM read may fail at low supply voltage / low clock frequency 1. EEPROM read may fail at low supply voltage / low clock frequency Trying to read EEPROM at low clock frequencies and/or low supply voltage may result in invalid data. Problem Fix/Workaround Do not use the EEPROM when clock frequency is below 1 MHz and supply voltage is below 2V. If operating frequency can not be raised above 1 MHz then supply voltage should be more than 3V. Similarly, if supply voltage can not be raised above 2V then operating frequency should be more than 2 MHz. This feature is known to be temperature dependent but it has not been characterised. Guidelines are given for room temperature, only. 8.2.3 Rev B and C • • • • PLL not locking EEPROM read from application code does not work in Lock Bit Mode 3 EEPROM read may fail at low supply voltage / low clock frequency Timer Counter 1 PWM output generation on OC1B- XOC1B does not work correctly 1. PLL not locking When at frequencies below 6.0 MHz, the PLL will not lock Problem fix / Workaround When using the PLL, run at 6.0 MHz or higher. 2. EEPROM read from application code does not work in Lock Bit Mode 3 When the Memory Lock Bits LB2 and LB1 are programmed to mode 3, EEPROM read does not work from the application code. Problem Fix/Work around Do not set Lock Bit Protection Mode 3 when the application code needs to read from EEPROM. 3. EEPROM read may fail at low supply voltage / low clock frequency Trying to read EEPROM at low clock frequencies and/or low supply voltage may result in invalid data. Problem Fix/Workaround Do not use the EEPROM when clock frequency is below 1 MHz and supply voltage is below 2V. If operating frequency can not be raised above 1 MHz then supply voltage should be 19 2586KS–AVR–01/08 more than 3V. Similarly, if supply voltage can not be raised above 2V then operating frequency should be more than 2 MHz. This feature is known to be temperature dependent but it has not been characterised. Guidelines are given for room temperature, only. 4. Timer Counter 1 PWM output generation on OC1B – XOC1B does not work correctly Timer Counter1 PWM output OC1B-XOC1B does not work correctly. Only in the case when the control bits, COM1B1 and COM1B0 are in the same mode as COM1A1 and COM1A0, respectively, the OC1B-XOC1B output works correctly. Problem Fix/Work around The only workaround is to use same control setting on COM1A(1:0) and COM1B(1:0) control bits, see table 14-4 in the data sheet. The problem has been fixed for Tiny45 rev D. 8.2.4 Rev A • • • • • Too high power down power consumption DebugWIRE looses communication when single stepping into interrupts PLL not locking EEPROM read from application code does not work in Lock Bit Mode 3 EEPROM read may fail at low supply voltage / low clock frequency 1. Too high power down power consumption Three situations will lead to a too high power down power consumption. These are: – An external clock is selected by fuses, but the I/O PORT is still enabled as an output. – The EEPROM is read before entering power down. – VCC is 4.5 volts or higher. Problem fix / Workaround – When using external clock, avoid setting the clock pin as Output. – Do not read the EEPROM if power down power consumption is important. – Use VCC lower than 4.5 Volts. 2. DebugWIRE looses communication when single stepping into interrupts When receiving an interrupt during single stepping, debugwire will loose communication. Problem fix / Workaround – When singlestepping, disable interrupts. – When debugging interrupts, use breakpoints within the interrupt routine, and run into the interrupt. 3. PLL not locking When at frequencies below 6.0 MHz, the PLL will not lock Problem fix / Workaround When using the PLL, run at 6.0 MHz or higher. 4. EEPROM read from application code does not work in Lock Bit Mode 3 20 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 When the Memory Lock Bits LB2 and LB1 are programmed to mode 3, EEPROM read does not work from the application code. Problem Fix/Work around Do not set Lock Bit Protection Mode 3 when the application code needs to read from EEPROM. 5. EEPROM read may fail at low supply voltage / low clock frequency Trying to read EEPROM at low clock frequencies and/or low supply voltage may result in invalid data. Problem Fix/Workaround Do not use the EEPROM when clock frequency is below 1 MHz and supply voltage is below 2V. If operating frequency can not be raised above 1 MHz then supply voltage should be more than 3V. Similarly, if supply voltage can not be raised above 2V then operating frequency should be more than 2 MHz. This feature is known to be temperature dependent but it has not been characterised. Guidelines are given for room temperature, only. 21 2586KS–AVR–01/08 8.3 Errata ATtiny85 The revision letter in this section refers to the revision of the ATtiny85 device. 8.3.1 Rev B and C No known errata. 8.3.2 Rev A • EEPROM read may fail at low supply voltage / low clock frequency 1. EEPROM read may fail at low supply voltage / low clock frequency Trying to read EEPROM at low clock frequencies and/or low supply voltage may result in invalid data. Problem Fix/Workaround Do not use the EEPROM when clock frequency is below 1 MHz and supply voltage is below 2V. If operating frequency can not be raised above 1 MHz then supply voltage should be more than 3V. Similarly, if supply voltage can not be raised above 2V then operating frequency should be more than 2 MHz. This feature is known to be temperature dependent but it has not been characterised. Guidelines are given for room temperature, only. 22 ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 9. Datasheet Revision History 9.1 Rev. 2586K-01/08 1. Updated Document Template. 2. Added Sections: – “Data Retention” on page 6 – “Low Level Interrupt” on page 51 – “Device Signature Imprint Table” on page 153 3. Updated Sections: – “Internal PLL for Fast Peripheral Clock Generation - clkPCK” on page 24 – “System Clock and Clock Options” on page 23 – “Internal PLL in ATtiny15 Compatibility Mode” on page 24 – “Sleep Modes” on page 35 – “Software BOD Disable” on page 36 – “External Interrupts” on page 51 – “Timer/Counter1 in PWM Mode” on page 101 – “USI – Universal Serial Interface” on page 111 – “Temperature Measurement” on page 137 – “Reading Lock, Fuse and Signature Data from Software” on page 147 – “Program And Data Memory Lock Bits” on page 151 – “Fuse Bytes” on page 152 – “Signature Bytes” on page 154 – “Calibration Bytes” on page 154 – “System and Reset Characteristics” on page 170 4. Added Figures: – “Reset Pin Output Voltage vs. Sink Current (VCC = 3V)” on page 188 – “Reset Pin Output Voltage vs. Sink Current (VCC = 5V)” on page 189 – “Reset Pin Output Voltage vs. Source Current (VCC = 3V)” on page 189 – “Reset Pin Output Voltage vs. Source Current (VCC = 5V)” on page 190 5. Updated Figure: – “Reset Logic” on page 41 6. Updated Tables: – “Start-up Times for Internal Calibrated RC Oscillator Clock” on page 28 – “Start-up Times for Internal Calibrated RC Oscillator Clock (in ATtiny15 Mode)” on page 28 – “Start-up Times for the 128 kHz Internal Oscillator” on page 29 – “Compare Mode Select in PWM Mode” on page 89 – “Compare Mode Select in PWM Mode” on page 101 – “DC Characteristics. TA = -40°C to 85°C (1)” on page 166 – “Calibration Accuracy of Internal RC Oscillator” on page 169 – “ADC Characteristics – Preliminary” on page 172 23 2586KS–AVR–01/08 7. Updated Code Example in Section: – “Write” on page 17 8. Updated Bit Descriptions in: – “MCUCR – MCU Control Register” on page 38 – “Bits 7:6 – COM0A1:0: Compare Match Output A Mode” on page 80 – “Bits 5:4 – COM0B1:0: Compare Match Output B Mode” on page 80 – “Bits 2:0 – ADTS2:0: ADC Auto Trigger Source” on page 142 – “SPMCSR – Store Program Memory Control and Status Register” on page 149. 9. Updated description of feature “EEPROM read may fail at low supply voltage / low clock frequency” in Sections: – “Errata ATtiny25” on page 18 – “Errata ATtiny45” on page 19 – “Errata ATtiny85” on page 22 10. Updated Package Description in Sections: – “ATtiny25” on page 11 – “ATtiny45” on page 12 – “ATtiny85” on page 13 11. Updated Package Drawing: – “S8S1” on page 16 12. Updated Order Codes for: – “ATtiny25” on page 11 9.2 Rev. 2586J-12/06 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 24 Updated “Low Power Consumption” on page 1. Updated description of instruction length in “Architectural Overview” , starting on page 7. Updated Flash size in “In-System Re-programmable Flash Program Memory” on page 15. Updated cross-references in sections “Atomic Byte Programming” , “Erase” and “Write” , starting on page 17. Updated “Atomic Byte Programming” on page 17. Updated “Internal PLL for Fast Peripheral Clock Generation - clkPCK” on page 24. Replaced single clocking system figure with two: Figure 6-2 and Figure 6-3 on page 24. Updated Table 6-1 on page 25, Table 6-12 on page 30 and Table 6-6 on page 28. Updated “Calibrated Internal Oscillator” on page 27. Updated Table 6-5 on page 27. Updated “OSCCAL – Oscillator Calibration Register” on page 32. Updated “CLKPR – Clock Prescale Register” on page 33. Updated “Power-down Mode” on page 36. Updated “Bit 0” in “PRR – Power Reduction Register” on page 39. Added footnote to Table 8-3 on page 49. Updated Table 10-5 on page 65. Deleted “Bits 7, 2” in “MCUCR – MCU Control Register” on page 66. ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 9.3 Updated and moved section “Timer/Counter0 Prescaler and Clock Sources”, now located on page 68. Updated “Timer/Counter1 Initialization for Asynchronous Mode” on page 89. Updated bit description in “PLLCSR – PLL Control and Status Register” on page 97 and “PLLCSR – PLL Control and Status Register” on page 107. Added recommended maximum frequency in“Prescaling and Conversion Timing” on page 129. Updated Figure 17-8 on page 133 . Updated “Temperature Measurement” on page 137. Updated Table 17-3 on page 138. Updated bit R/W descriptions in: “TIMSK – Timer/Counter Interrupt Mask Register” on page 84, “TIFR – Timer/Counter Interrupt Flag Register” on page 84, “TIMSK – Timer/Counter Interrupt Mask Register” on page 95, “TIFR – Timer/Counter Interrupt Flag Register” on page 96, “PLLCSR – PLL Control and Status Register” on page 97, “TIMSK – Timer/Counter Interrupt Mask Register” on page 106, “TIFR – Timer/Counter Interrupt Flag Register” on page 106, “PLLCSR – PLL Control and Status Register” on page 107 and “DIDR0 – Digital Input Disable Register 0” on page 142. Added limitation to “Limitations of debugWIRE” on page 144. Updated “DC Characteristics” on page 166. Updated Table 21-7 on page 171. Updated Figure 21-6 on page 175. Updated Table 21-11 on page 175. Updated Table 22-1 on page 181. Updated Table 22-2 on page 181. Updated Table 22-30, Table 22-31 and Table 22-32, starting on page 192. Updated Table 22-33, Table 22-34 and Table 22-35, starting on page 193. Updated Table 22-37 on page 195. Updated Table 22-44, Table 22-45, Table 22-46 and Table 22-47, starting on page 199. Rev. 2586I-09/06 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. All Characterization data moved to “Electrical Characteristics” on page 166. All Register Descriptions are gathered up in seperate sections in the end of each chapter. Updated Table 11-3 on page 81, Table 11-5 on page 82, Table 11-6 on page 83 and Table 20-4 on page 152. Updated “Calibrated Internal Oscillator” on page 27. Updated Note in Table 7-1 on page 35. Updated “System Control and Reset” on page 41. Updated Register Description in “I/O Ports” on page 55. Updated Features in “USI – Universal Serial Interface” on page 111. Updated Code Example in “SPI Master Operation Example” on page 113 and “SPI Slave Operation Example” on page 114. Updated “Analog Comparator Multiplexed Input” on page 123. 25 2586KS–AVR–01/08 11. 12. 13. 9.4 Rev. 2586H-06/06 1. 2. 3. 9.5 Updated Features in “Analog to Digital Converter” on page 126. Updated Operation in “Analog to Digital Converter” on page 126. Updated Table 17-2 on page 138. Updated Table 17-3 on page 138. Updated “Errata” on page 18. Rev. 2586D-02/06 1. 2. 3. 4. 5. 6. 26 Updated “Digital Input Enable and Sleep Modes” on page 59. Updated Table 20-16 on page 163. Updated “Ordering Information” on page 11. Rev. 2586E-03/06 1. 2. 3. 4. 5. 9.8 Updated “Internal PLL for Fast Peripheral Clock Generation - clkPCK” on page 24. Updated “Default Clock Source” on page 31. Updated “Low-Frequency Crystal Oscillator” on page 29. Updated “Calibrated Internal Oscillator” on page 27. Updated “Clock Output Buffer” on page 32. Updated “Power Management and Sleep Modes” on page 35. Added “Software BOD Disable” on page 36. Updated Figure 16-1 on page 123. Updated “Bit 6 – ACBG: Analog Comparator Bandgap Select” on page 124. Added note for Table 17-2 on page 129. Updated “Register Summary” on page 7. Rev. 2586F-04/06 1. 2. 3. 9.7 Updated “Calibrated Internal Oscillator” on page 27. Updated Table 6.5.1 on page 32. Added Table 21-2 on page 169. Rev. 2586G-05/06 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 9.6 Updated Figure 17-1 on page 127. Updated “Signature Bytes” on page 154. Updated “Electrical Characteristics” on page 166. Updated Table 6-12 on page 30, Table 6-10 on page 29, Table 6-3 on page 26, Table 6-9 on page 29, Table 6-5 on page 27, Table 9-1 on page 50,Table 17-4 on page 139, Table 20-16 on page 163, Table 21-8 on page 172. Updated “Timer/Counter1 in PWM Mode” on page 89. Updated text “Bit 2 - TOV1: Timer/Counter1 Overflow Flag” on page 96. Updated values in “DC Characteristics” on page 166. Updated “Register Summary” on page 7. Updated “Ordering Information” on page 11. ATtiny25/45/85 2586KS–AVR–01/08 ATtiny25/45/85 7. 8. 9. 9.9 Rev. 2586C-06/05 1. 2. 3. 4. 5. 6. 9.10 Updated “Features” on page 1. Updated Figure 1-1 on page 2. Updated Code Examples on page 18 and page 19. Moved “Temperature Measurement” to Section 17.12 page 137. Updated “Register Summary” on page 7. Updated “Ordering Information” on page 11. Rev. 2586B-05/05 1. 2. 3. 4. 5. 6. 7. 8. 9. 9.11 Updated Rev B and C in “Errata ATtiny45” on page 19. All references to power-save mode are removed. Updated Register Adresses. CLKI added, instances of EEMWE/EEWE renamed EEMPE/EEPE, removed some TBD. Removed “Preliminary Description” from “Temperature Measurement” on page 137. Updated “Features” on page 1. Updated Figure 1-1 on page 2 and Figure 8-1 on page 41. Updated Table 7-2 on page 39, Table 10-4 on page 65, Table 10-5 on page 65 Updated “Serial Programming Instruction set” on page 157. Updated SPH register in “Instruction Set Summary” on page 9. Updated “DC Characteristics” on page 166. Updated “Ordering Information” on page 11. Updated “Errata” on page 18. Rev. 2586A-02/05 Initial revision. 27 2586KS–AVR–01/08 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2008 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, AVR ® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 2586KS–AVR–01/08