AT27C400 Features • • • • • • • • • • • Fast Read Access Time - 70 ns Word-wide or Byte-wide Configurable 4 Megabit Flash and Mask ROM Compatible Low Power CMOS Operation – 100 µA Maximum Standby – 50 mA Maximum Active at 5 MHz Wide Selection of JEDEC Standard Packages – 40-Lead 600 mil PDIP – 40-Lead SOIC (SOP) – 48-Lead TSOP (12 mm x 20 mm) 5V ± 10% Power Supply High Reliability CMOS Technology – 2,000V ESD Protection – 200 mA Latchup Immunity Rapid™Programming Algorithm - 50 µs/word (typical) CMOS and TTL Compatible Inputs and Outputs Integrated Product Identification Code Commercial and Industrial Temperature Ranges 4-Megabit (256K x 16 or 512K x 8) OTP EPROM Description The AT27C400 is a low-power, high-performance 4,194,304-bit one-time programmable read only memory (OTP EPROM) organized as either 256K by 16 or 512K by 8 bits. It requires a single 5V power supply in normal read mode operation. Any word can be accessed in less than 70 ns, eliminating the need for speed-reducing WAIT states. The by-16 organization makes this part ideal for high-performance 16- and 32bit microprocessor systems. PDIP Top View SOIC (SOP) AT27C400 Preliminary Pin Configurations Pin Name Function A0 - A17 Addresses O0 - O15 Outputs O15/A-1 Output/Address BYTE/VPP Byte Mode/ Program Supply CE Chip Enable OE Output Enable NC No Connect Note: Both GND pins must be connected. A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND 015/A-1 O7 O14 O6 O13 O5 O12 O4 VCC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND 015/A-1 O7 O14 O6 O13 O5 O12 O4 VCC TSOP Type 1 A15 A14 A13 A12 A11 A10 A9 A8 NC NC NC NC NC NC NC NC A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE/VPP GND 015/A-1 I/O7 O14 O6 O13 O5 O12 O4 VCC O11 O3 O10 O2 O9 O1 O8 O0 OE GND CE A0 0844A-A–7/97 1 Description (Continued) System Considerations The AT27C400 can be organized as either word-wide or byte-wide. The organization is selected via the BYTE/VPP pin. When BYTE/VPP is asserted high (VIH), the word-wide organization is selected and the O15/A-1 pin is used for O15 data output. When BYTE/VPP is asserted low (VIL), the byte-wide organization is selected and the O15/A-1 pin is used for the address pin A-1. When the AT27C400 is logically regarded as x16 (word-wide), but read in the bytewide mode, then with A-1 = VIL the lower 8 bits of the 16-bit word are selected and with A-1 = VIH the upper 8 bits of the 16-bit word are selected. In read mode, the AT27C400 typically consumes 15 mA. Standby mode supply current is typically less than 10 µA. The AT27C400 is available in industry standard JEDEC-approved one-time programmable (OTP) PDIP, SOIC (SOP), and TSOP packages. The device features two-line control (CE, OE) to eliminate bus contention in high-speed systems. With high density 256K word or 512K byte storage capability, the AT27C400 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. Atmel’s AT27C400 has additional features that ensure high quality and efficient production use. The Rapid™ Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 50 µs/word. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages. Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the VCC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. 2 AT27C400 AT27C400 Block Diagram Absolute Maximum Ratings* Temperature Under Bias ......................-55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Minimum voltage is -0.6V dc which undershoot to 2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V dc which may overshoot to +7.0V for pulses of less than 20 ns. Storage Temperature............................-65°C to +150°C Voltage on Any Pin with Respect to Ground ..............................-2.0V to +7.0V (1) Voltage on A9 with Respect to Ground ...........................-2.0V to +14.0V (1) 1. VPP Supply Voltage with Respect to Ground ............................-2.0V to +14.0V (1) Integrated UV Erase Dose...................7258 W •sec/cm2 Operating Modes Outputs Mode/Pin CE Read Word-wide Read Byte-wide Upper Read Byte-wide Lower Output Disable Standby Rapid Program(2) PGM Verify PGM Inhibit VIL VIL VIL X (1) OE BYTE/VPP O0 - O7 O8 - O14 O15/A-1 (1) VIH DOUT DOUT DOUT VIL (1) X VIL DOUT High Z VIH VIL X(1) VIL DOUT High Z VIL VIH (1) VIL VIH X VIL X VIH (1) Ai X X X (1) (5) X X VIH Ai VPP DIN VIL Ai VPP DOUT VPP High Z VIH Identificatio n Code VIH (1) X (3) Product Identification(4) Notes: VIL High Z VIL A9 = VH A0 = VIH or VIL A1 - A17 = VIL High Z 1. X can be VIL or VIH. 2. Refer to the programming characteristics tables in this data sheet. 3. VH = 12.0 ± 0.5V. 4. Two identifier words may be selected. All inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled low (VIL) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word. 5. Standby VCC current (ISB) is specified with VPP = VCC. VCC > VPP will cause a slight increase in ISB. 3 DC and AC Operating Conditions for Read Operation AT27C400 Operating Temperature (Case) -70 -90 -12 -15 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% Com. Ind. VCC Power Supply DC and Operating Characteristics for Read Operation Symbol Parameter Condition ILI Input Load Current ILO IPP1 (2) Max Units VIN = 0V to VCC ±1 µA Output Leakage Current VOUT = 0V to VCC ±5 µA VPP(1) Read/Standby VPP = VCC 10 µA ISB1 (CMOS) CE = VCC ± 0.3V 100 µA ISB2 (TTL) CE = 2.0 to VCC + 0.5V 1 mA f = 5 MHz, IOUT = 0 mA, CE = VIL 40 mA Current VCC(1) Standby Current ISB VCC Active Current Min VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1 mA 0.4 V VOH Output High Voltage IOH = -400 µA Notes: 2.4 V 1. VCC must be applied simultaneously or beofre VPP, and removed simultaneously or after VPP. 2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP. AC Characteristics for Read Operation AT27C400 -70 4 Min Max Units tACC(2) Address to Output Delay CE = OE = VIL 70 90 120 150 ns tCE(2) CE to Output Delay OE = VIL 70 tOE(2)(3) 90 120 150 ns OE to Output Delay CE = VIL 30 35 40 50 ns tDF(4)(5) OE or CE High to Output Float, whichever occurred first 20 20 30 35 ns tOH(4) Output Hold from Address, CE or OE, whichever occurred first tST BYTE High to Output Valid 70 90 120 150 ns tSTD BYTE Low to Output Transition 40 40 50 60 ns 5 2, 3, 4, 5. See the AC Waveforms for Read Operation diagram. Min Max 5 Min -15 Parameter AT27C400 Max -12 Symbol Notes: Condition -90 Max 5 Min 5 ns = Advance Information AT27C400 Byte-Wide Read Mode AC Waveforms Note: BYTE/VPP = VIL Word-Wide Read Mode AC Waveforms Note: BYTE/VPP = VIH BYTE Transition AC Waveforms Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified. 2. OE maybe delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE maybe delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. 5 Input Test Waveforms and Measurement Levels Output Test Load tR, tF < 20 ns (10% to 90%) Note: CL = 100 pF including jig capacitance. Pin Capacitance (f = 1 MHz T = 25°C)(1) Typ Max Units Conditions CIN 4 10 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 6 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. AT27C400 AT27C400 Programming Waveforms(1) Notes: 1. The Input Timing Reference is 0.8V for V IL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but mist be accomodated by the programmer. 3. When programming the AT27C400, a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage transients. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Symbol Parameter Test Conditions ILI Input Load Current VIN = VIL, VIH VIL Input Low Level VIH Input High Level VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = -400 µA ICC2 VCC Supply Current (Program and Verify) IPP2 VPP Supply Current VID A9 Product Identification Voltage Min Max Units ±10 µA -0.6 0.8 V 2.0 VCC + V 0.5 0.4 2.4 CE = VIL 11.5 V V 50 mA 30 mA 12.5 V 7 AC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Test Conditions(1) Symbol Parameter Min Max Units tAS Address Setup Time 2 µs tOES OE Setup Time 2 µs tDS Data Setup Time 2 µs tAH Address Hold Time 0 µs tDH Data Hold Time 2 µs tDFP OE High to Output Float Delay(2) tVPS VPP Setup Time tVCS VCC Setup Time Width(3) tPW CE Program Pulse tOE Data Valid from OE tPRT BYTE/VPP Pulse Rise Time During Programming Notes: Input Rise and Fall Times (10% to 90%) 20ns Input Pulse Levels 0.45V to 2.4V Input Timing Reference Level 0.8V to 2.0V Output Timing Reference Level 0.8V to 2.0V 0 130 ns 2 µs 2 µs 47.5 52.5 µs 150 ns 50 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Ouput Float is defined as the point where data is no longer driven — see timing diagram. 3. Program Pulse width tolerance is 50 µsec ± 5%. ns Atmel’s 27C400 Integrated Product Identification Code Pins A0 Codes 8 O15 O14 O13 O12 O11 O10 O9 O8 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data Manufacturer 0 0 0 0 1 1 1 1 0 1E1E Device Type 1 1 1 1 1 0 1 0 0 F4F4 AT27C400 AT27C400 Rapid Programming Algorithm A 50 µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and BYTE/VPP is raised to 13.0V. Each address is first programmed with one 50 µs CE pulse without verification. Then a verification/ reprogramming loop is executed for each address. In the event a word fails to pass verification, up to 10 successive 50 µs pulses are applied with a verification after each pulse. If the word fails to verify after 10 pulses have been applied, the part is considered failed. After the word verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All words are read again and compared with the original data to determine if the device passes or fails. 9 Ordering Information ICC (mA) tACC (ns) Active Standby Ordering Code Package 70 40 0.1 AT27C400-70PC AT27C400-70RC AT27C400-70TC 40P6 40R 48T Commercial (0°C to 70°C) 40 0.1 AT27C400-70PI AT27C400-70RI AT27C400-70TI 40P6 40R 48T Industrial (-40°C to 85°C) 40 0.1 AT27C400-90PC AT27C400-90RC AT27C400-90TC 40P6 40R 48T Commercial (0°C to 70°C) 40 0.1 AT27C400-90PI AT27C400-90RI AT27C400-90TI 40P6 40R 48T Industrial (-40°C to 85°C) 40 0.1 AT27C400-12PC AT27C400-12RC AT27C400-12TC 40P6 40R 48T Commercial (0°C to 70°C) 40 0.1 AT27C400-12PI AT27C400-12RI AT27C400-12TI 40P6 40R 48T Industrial (-40°C to 85°C) 40 0.1 AT27C400-15PC AT27C400-15RC AT27C400-15TC 40P6 40R 48T Commercial (0°C to 70°C) 40 0.1 AT27C400-15PI AT27C400-15RI AT27C400-15TI 40P6 40R 48T Industrial (-40°C to 85°C) 90 120 150 Operation Range = Advance Information Package Type 40P6 40-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 40R 40-Lead, 0.450" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 48T 48-Lead, Plastic Thin Small Outline Package (TSOP) 12 x 20 mm 10 AT27C400