Features • One of a Family of Devices with User Memories from 1-Kbit to 8-Kbits • 1-Kbit (128-byte) EEPROM User Memory ⎯ Four 256-bit (32-byte) Zones ⎯ Self-timed Write Cycle ⎯ Single Byte or 16-byte Page Write Mode ⎯ Programmable Access Rights for Each Zone • 2-Kbit Configuration Zone CryptoMemory® ⎯ 37-byte OTP Area for User-defined Codes ⎯ 160-byte Area for User-defined Keys and Passwords • High Security Features ⎯ 64-bit Mutual Authentication Protocol (Under License of ELVA) ⎯ Cryptographic Message Authentication Codes (MAC) AT88SC0104CA ⎯ Stream Encryption ⎯ Four Key Sets for Authentication and Encryption ⎯ Eight Sets of Two 24-bit Passwords ⎯ Anti-Tearing Function Summary ⎯ Voltage and Frequency Monitors • Smart Card Features ⎯ ISO 7816 Class B (3V) Operation ⎯ ISO 7816-3 Asynchronous T=0 Protocol (Gemplus® Patent) * ⎯ Multiple Zones, Key Sets and Passwords for Multi-application Use ⎯ Synchronous 2-wire Serial Interface for Faster Device Initialization * ⎯ Programmable 8-byte Answer-To-Reset Register ⎯ ISO 7816-2 Compliant Modules • Embedded Application Features ⎯ Low Voltage Supply: 2.7V – 3.6V ⎯ Secure Nonvolatile Storage for Sensitive System or User Information ⎯ 2-wire Serial Interface (TWI, 5V Compatible) ⎯ 1.0 MHz Compatibility for Fast Operation ⎯ Standard 8-lead Plastic Packages, Green compliant (exceeds RoHS) ⎯ Same Pin Configuration as AT24CXXX Serial EEPROM in SOIC and PDIP Packages • High Reliability ⎯ Endurance: 100,000 Cycles ⎯ Data Retention: 10 years ⎯ ESD Protection: 2,000V min * Note: Modules available with either T = 0 / 2-wire modes or 2-wire mode only. 5200ES–CRYPT–08/09 Table 1. Pin Assignments Pad Description ISO Module TWI Module “SOIC, PDIP” TSSOP Mini-MAP VCC Supply Voltage C1 C1 8 8 4 GND Ground C5 C5 4 1 5 SCL/CLK Serial Clock Input C3 C3 6 6 2 SDA/IO Serial Data Input/Output C7 C7 5 3 7 RST Reset Input C2 NC NC NC NC Figure 1. Pin Configuration 8-lead SOIC, PDIP ISO Smart Card Module VCC=C1 RST=C2 SCL/CLK=C3 NC=C4 C5=GND NC C6=NC NC C7=SDA/IO NC C8=NC GND VCC 8 7 6 5 NC SCL SDA 8-lead Ultra Thin Mini-MAP (MLP 2x3) 8-lead TSSOP GND 1 2 3 4 1 8 VCC NC 2 7 NC SDA 3 6 C LK NC 4 5 NC NC 8 SDA 7 NC 6 GND 5 1 2 3 4 NC CLK NC VCC Bottom View TWI Smart Card Module VCC=C1 C5=GND NC=C2 C6=NC SCL/CLK=C3 NC=C4 1. C7=SDA/IO C8=NC Description The AT88SC0104CA member of the CryptoMemory® family is a high-performance secure memory providing 1 Kbit of user memory with advanced security and cryptographic features built in. The user memory is divided into four 32-byte zones, each of which may be individually set with different security access rights or effectively combined together to provide space for 1 to 4 data files. The AT88SC0104CA features an enhanced command set that allows direct communication with microcontroller hardware 2-Wire interface thereby allowing for faster firmware development with reduced code space requirements. 2 AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 2. Smart Card Applications The AT88SC0104CA provides high security, low cost, and ease of implementation without the need for a microprocessor operating system. The embedded cryptographic engine provides for dynamic, symmetric-mutual authentication between the device and host, as well as performing stream encryption for all data and passwords exchanged between the device and host. Up to four unique key sets may be used for these operations. The AT88SC0104CA offers the ability to communicate with virtually any smart card reader using the asynchronous T = 0 protocol (Gemplus Patent) defined in ISO 7816-3. 3. Embedded Applications Through dynamic, symmetric-mutual authentication, data encryption, and the use of cryptographic Message Authentication Codes (MAC), the AT88SC0104CA provides a secure place for storage of sensitive information within a system. With its tamper detection circuits, this information remains safe even under attack. A 2-wire serial interface running at speeds up to 1.0 MHz provides fast and efficient communications with up to 15 individually addressable devices. The AT88SC0104CA is available in industry standard 8-lead packages with the same familiar pin configuration as AT24CXXX serial EEPROM devices. Does not apply to either the TSSOP or the Ultra Thin Mini-Map pinouts. Note: Figure 2. VCC GND SCL/CLK SDA/IO RST Block Diagram Power Management Authentication, Encryption and Certification Unit Synchronous Interface Data Transfer Asynchronous ISO Interface Password Verification Reset Block Answer to Reset Random Generator EEPROM 3 5200ES–CRYPT–08/09 4. Connection Diagram Figure 3. Connection Diagram 2.7v - 5.5v 2.7v - 3.6v Microprocessor CryptoMemory SDA SCL 5. Pin Descriptions 5.1. Supply Voltage (VCC) The VCC input is a 2.7V to 3.6V positive voltage supplied by the host. 5.2. Clock (SCL/CLK) When using the asynchronous T = 0 protocol, the CLK (SCL) input provides the device with a carrier frequency f. The nominal length of one bit emitted on I/O is defined as an “elementary time unit” (ETU) and is equal to 372/ f. When using the synchronous protocol, data clocking is done on the positive edge of the clock when writing to the device and on the negative edge of the clock when reading from the device. 5.3. Reset (RST) The AT88SC0104CA provides an ISO 7816-3 compliant asynchronous Answer-To-Reset (ATR) sequence. Upon activation of the reset sequence, the device outputs bytes contained in the 64-bit Answer-To-Reset register. An internal pull-up on the RST input pad allows the device to operate in synchronous mode without bonding RST. The AT88SC0104CA does not support an Answer-To-Reset sequence in the synchronous mode of operation. 5.4. Serial Data (SDA/IO) The SDA/IO pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wired with any number of other open-drain or open-collector devices. An external pull-up resistor should be connected between SDA/IO and VCC. The value of this resistor and the system capacitance loading the SDA/IO bus will determine the rise time of SDA/IO. This rise time will determine the maximum frequency during read operations. Low value pull-up resistors will allow higher frequency operations while drawing higher average power supply current. SDA/IO information applies to both asynchronous and synchronous protocols. 4 AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 6. *Absolute Maximum Ratings Operating Temperature.............................−40°C to +85°C *NOTICE: Storage Temperature ............................−65°C to + 150°C Voltage on Any Pin with Respect to Ground .......................− 0.7 to VCC +0.7V Maximum Operating Voltage.......................................4.0V DC Output Current ..................................................5.0 mA Table 2. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability. DC Characteristics Applicable over recommended operating range from VCC = +2.7 to 3.6V, TAC = -40°C to +85°C (unless otherwise noted) Symbol Parameter Test Conditions Min Typ Max Units VCC(1) Supply Voltage 3.6 V ICC Supply Current Async READ at 3.57MHz 5 mA ICC Supply Current Async WRITE at 3.57MHz 5 mA ICC Supply Current Synch READ at 1MHz 5 mA ICC Supply Current Synch WRITE at 1MHz 5 mA ISB Standby Current VIN = VCC or GND 100 μA VIL SDA/IO Input Low Voltage 0 VCC x 0.2 V VIL CLK Input Low Voltage 0 VCC x 0.2 V VIL RST Input Low Voltage 0 VCC x 0.2 V VIH(1) SDA/IO Input High Voltage VCC x 0.7 5.5 V VIH(1) 2.7 SCL/CLK Input High Voltage VCC x 0.7 5.5 V VIH RST Input High Voltage VCC x 0.7 5.5 V IIL SDA/IO Input Low Current 0 < VIL < VCC x 0.15 15 μA IIL SCL/CLK Input Low Current 0 < VIL < VCC x 0.15 15 μA IIL RST Input Low Current 0 < VIL < VCC x 0.15 50 μA IIH SDA/IO Input High Current VCC x 0.7 < VIH < VCC 20 μA IIH SCL/CLK Input High Current VCC x 0.7 < VIH < VCC 100 μA IIH RST Input High Current VCC x 0.7 < VIH < VCC 150 μA VOH SDA/IO Output High Voltage 20K ohm external pull-up VCC x 0.7 VCC V VOL SDA/IO Output Low Voltage IOL = 1mA 0 VCC x 0.15 V IOH SDA/IO Output High Current VOH 20 μA IOL SDA/IO Output Low Current VOL 10 mA (1) Note: 1. To prevent Latch Up Conditions from occurring during Power Up of the AT88SC0104CA, VCC must be turned on before applying VIH. For Powering Down, VIH must be removed before turning VCC off. 5 5200ES–CRYPT–08/09 Table 3. AC Characteristics Applicable over recommended operating range from VCC = +2.7 to 3.6V, TAC = -40°C to +85°C, CL = 30pF (unless otherwise noted) Symbol 6 Parameter Min Max Units fCLK Async Clock Frequency 1 4 MHz fCLK Synch Clock Frequency 0 1 MHz Clock Duty cycle 40 60 % tR “Rise Time - SDA/IO, RST” 1 μS tF “Fall Time - SDA/IO, RST” 1 μS tR Rise Time - SCL/CLK 9% x period μS tF Fall Time - SCL/CLK 9% x period μS tAA Clock Low to Data Out Valid 250 nS tHD.STA Start Hold Time 200 nS tSU.STA Start Set-up Time 200 nS tHD.DAT Data In Hold Time 10 nS tSU.DAT Data In Set-up Time 100 nS tSU.STO Stop Set-up Time 200 nS tDH Data Out Hold Time 20 nS tWR Write Cycle Time 5 mS AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 7. Device Operations for Synchronous Protocols 7.1. Clock and Data Transitions The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 6 on page 8). Data changes during SCL high periods will indicate a start or stop condition as defined below. 7.1.1. Start condition A high-to-low transition of SDA with SCL high defines a START condition which must precede all commands (see Figure 7 on page 8). 7.1.2. Stop condition A low-to-high transition of SDA with SCL high defines a STOP condition. After a read sequence, the STOP condition will place the EEPROM in a standby power mode (see Figure 7 on page 8). 7.1.3. ACKNOWLEDGE All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle (see Figure 8 on page 9). 7.2. Memory Reset After an interruption in communication due protocol errors, power loss or any reason, perform "Acknowledge Polling" to properly recover from the condition. Acknowledge polling consists of sending a start condition followed by a valid CryptoMemory command byte and determining if the device responded with an ACKNOWLEDGE. Figure 4. Bus Time for 2-Wire Serial Communications. SCL: Serial Clock, SDA: Serial Data I/O tHIGH tF tR tLOW SCL tSU.STA tLOW tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA tDH tBUF SDA OUT 7 5200ES–CRYPT–08/09 Figure 5. Write Cycle Timing. SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT ACK WORDn twr STOP CONDITION Note: Figure 6. (1) START CONDITION The Write Cycle time twr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. Data Validity SDA SCL DATA STABLE DATA STABLE DATA CHANGE ALLOWED Figure 7. START and STOP Definitions SDA SCL START 8 STOP AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA Figure 8. Output Acknowledge 1 SCL 8 9 DATA IN DATA OUT START ACKNOWLEDGE 9 5200ES–CRYPT–08/09 8. Device Architecture 8.1. User Zones The EEPROM user memory is divided into 4 zones of 256 bits each. Multiple zones allow for storage of different types of data or files in different zones. Access to user zones is permitted only after meeting proper security requirements. These security requirements are user definable in the configuration memory during device personalization. If the same security requirements are selected for multiple zones, then these zones may effectively be accessed as one larger zone. Figure 9. User Zones Zone $0 $1 $2 $3 $4 $5 $6 $7 $00 User 0 - 32 Bytes $18 $00 User 1 - 32 Bytes $18 $00 User 2 - 32 Bytes $18 $00 User 3 - 32 Bytes $18 9. Control Logic Access to the user zones occur only through the control logic built into the device. This logic is configurable through access registers, key registers and keys programmed into the configuration memory during device personalization. Also implemented in the control logic is a cryptographic engine for performing the various higher-level security functions of the device. 10 AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 10. Configuration Memory The configuration memory consists of 2048 bits of EEPROM memory used for storage of passwords, keys, codes, and also used for definition of security access rights for the user zones. Access rights to the configuration memory are defined in the control logic and are not alterable by the user after completion of personalization. Figure 10. Configuration Memory $0 $00 $08 $10 $18 $20 $28 $30 $38 $40 $48 $50 $58 $60 $68 $70 $78 $80 $88 $90 $98 $A0 $A8 $B0 $B8 $C0 $C8 $D0 $D8 $E0 $E8 $F0 $F8 10.1. $1 Fab Code DCR AR0 PR0 $2 $3 $4 $5 $6 $7 Answer To Reset MTZ Card Manufacturer Code Lot History Code Identification Number Nc AR1 PR1 AR2 PR2 AR3 PR3 Identifitcation Read Only Access Control Reserved Issuer Code PAC PAC PAC PAC PAC PAC PAC PAC For Authentication and Encryption use Cryptography For Authentication and Encryption use Secret Write 0 Write 1 Write 2 Write 3 Write 4 Write 5 Write 6 Write 7 PAC PAC PAC PAC PAC PAC PAC PAC Reserved Read 0 Read 1 Read 2 Read 3 Read 4 Read 5 Read 6 Read 7 Password Forbidden Security Fuses There are three fuses on the device that must be blown during the device personalization process. Each fuse locks certain portions of the configuration zone as OTP (One-Time Programmable) memory. Fuses are designed for the module manufacturer, card manufacturer and card issuer and should be blown in sequence, although all programming of the device and blowing of the fuses may be performed at one final step. 11 5200ES–CRYPT–08/09 11. Communication Security Modes Communications between the device and host operate in three basic modes. Standard mode is the default mode for the device after power-up. Authentication mode is activated by a successful authentication sequence. Encryption mode is activated by a successful encryption activation following a successful authentication. Communication Security Modes(1) Table 4. Mode Configuration Data User Data Passwords Data Integrity Check Standard Clear Clear Clear MDC(1) Authentication Clear Clear Encrypted MAC(1) Encryption Clear Encrypted Encrypted MAC(1) Note: 1. Configuration data include viewable areas of the Configuration Zone except the passwords: MDC: Modification Detection Code. MAC: Message Authentication Code. 12. Security Options 12.1. Anti-Tearing In the event of a power loss during a write cycle, the integrity of the device’s stored data is recoverable. This function is optional: the host may choose to activate the anti-tearing function, depending on application requirements. When antitearing is active, write commands take longer to execute, since more write cycles are required to complete them, and data is limited to a maximum of eight bytes for each write request. Data is written first into a buffer zone in EEPROM instead of the intended destination address, but with the same access conditions. The data is then written in the required location. If this second write cycle is interrupted due to a power loss, the device will automatically recover the data from the system buffer zone at the next power-up. Nonvolatile buffering of the data is done automatically by the device. During power-up in applications using Anti-Tearing, the host is required to perform ACK polling in the event that the device needs to carry out the data recovery process. 12.2. Write Lock If a user zone is configured in the write lock mode, the lowest address byte of an 8-byte page constitutes a write access byte for the bytes of that page. For example, the write lock byte at $080 controls the bytes from $081 to $087. Figure 11. Write Lock Example Address $0 $1 $2 $3 $4 $5 $6 $7 $080 11011001 xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx locked locked locked The Write-Lock byte itself may be locked by writing its least significant (rightmost) bit to “0”. Moreover, when write lock mode is activated, the write lock byte can only be programmed – that is, bits written to “0” cannot return to “1”. In the write lock configuration, write operations are limited to writing only one byte at a time. Attempts to write more than one byte will result in writing of just the first byte into the device. 12 AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 12.3. Password Verification Passwords may be used to protect READ and/or WRITE access of any user zone. When a valid password is presented, it is memorized and active until power is turned off, unless a new password is presented or RST becomes active. There are eight password sets that may be used to protect any user zone. Only one password is active at a time. Presenting the correct WRITE password also grants READ access privileges. 12.4. Authentication Protocol The access to a user zone may be protected by an authentication protocol. Any one of four keys may be selected to use with a user zone. Authentication success is memorized and active as long as the chip is powered, unless a new authentication is initialized or RST becomes active. If the new authentication request is not validated, the card loses its previous authentication which must be presented again to gain access. Only the latest request is memorized. Figure 12. Password and Authentication Operations Device (Card) Card Number Host (Reader) AUTHENTICATION VERIFY A COMPUTE Challenge B COMPUTE Challenge A Challenge A Challenge B VERIFY B READ ACCESS VERIFY RPW DATA Checksum (CS) VERIFY WPW VERIFY CS Read Password (RPW) VERIFY CS WRITE ACCESS Write Password (WPW) DATA CS Write DATA Note: Authentication and password verification may be attempted at any time and in any order. Exceeding corresponding authentication or password attempts trial limit renders subsequent authentication or password verification attempts futile. 13 5200ES–CRYPT–08/09 12.5. Cryptographic Message Authentication Codes AT88SC0104CA implements a data validity check function in the standard, authentication or encryption modes of operation. In the standard mode, data validity check is done through a Modification Detection Code (MDC), in which the host may read an MDC from the device in order to verify that the data sent was received correctly. In authentication and encryption modes, the data validity check becomes more powerful since it provides a bidirectional data integrity check and data origin authentication capability in the form of a Message Authentication Codes (MAC). Only the host/device that carried out a valid authentication is capable of computing a valid MAC. While operating in the authentication or encryption modes, the use of MAC is required. For an ingoing command, if the device calculates a MAC different from the MAC transmitted by the host, not only is the command abandoned but the security privilege is revoked. A new authentication and/or encryption activation will be required to reactivate the MAC. 12.6. Encryption The data exchanged between the device and the host during read, write and verify password commands may be encrypted to ensure data confidentiality. The issuer may choose to require encryption for a user zone by settings made in the configuration memory. Any one of four keys may be selected for use with a user zone. In this case, activation of the encryption mode is required in order to read/write data in the zone and only encrypted data will be transmitted. Even if not required, the host may still elect to activate encryption provided the proper keys are known. 12.7. Supervisor Mode Enabling this feature allows the holder of one specific password to gain full access to all eight password sets, including the ability to change passwords. 12.8. Modify Forbidden No write access is allowed in a user zone protected with this feature at any time. The user zone must be written during device personalization prior to blowing the security fuses. 12.9. Program Only For a user zones protected by this feature, data can only be programmed (bits change from a “1” to a “0”), but not erased (bits change from a “0” to a “1”). 14 AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 13. Protocol Selection The AT88SC0104CA supports two different communication protocols. Smartcard Applications: Smartcard applications use ISO 7816-B protocol in asynchronous T = 0 mode for compatibility and interoperability with industry standard smartcard readers. Embedded Applications: A 2-wire serial interface provides fast and efficient connectivity with other logic devices or microcontrollers. The power-up sequence determines establishes the communication protocol for use within that power cycle. Protocol selection is allowed only during power-up. 13.2. Synchronous 2-Wire Serial Interface The synchronous mode is the default mode after power up. This is due to the presence of an internal pull-up on RST. For embedded applications using CryptoMemory in standard plastic packages, this is the only available communication protocol. Power-up VCC, RST goes high also. After stable VCC, SCL(CLK) and SDA(I/O) may be driven. Once synchronous mode has been selected, it is not possible to switch to asynchronous mode without first powering off the device Figure 13. Synchronous 2-Wire Protocol Vcc I/O-SDA RST CLK-SCL Note: 1 2 3 4 5 Five clock pulses must be sent before the first command is issued. 15 5200ES–CRYPT–08/09 13.3. Asynchronous T = 0 Protocol This power-up sequence complies to ISO 7816-3 for a cold reset in smart card applications. VCC goes high; RST, I/O (SDA) and CLK (SCL) are low. Set I/O (SDA) in receive mode. Provide a clock signal to CLK (SCL). RST goes high after 400 clock cycles. The device will respond with a 64-bit ATR code, including historical bytes to indicate the memory density within the CryptoMemory family. Once asynchronous mode has been selected, it is not possible to switch to synchronous mode without first powering off the device. Figure 14. Asynchronous T = 0 Protocol (Gemplus Patent) Vcc I/O-SDA ATR RST CLK-SCL 14. Initial Device Programming Enabling the security features of CryptoMemory requires prior personalization. Personalization entails setting up of desired access rights by zones, passwords and key values, programming these values into the configuration memory with verification using simple WRITE and READ commands, and then blowing fuses to lock this information in place. Gaining access to the configuration memory requires successful presentation of a secure (or transport) code. The initial signature of the secure (transport) code for the AT88SC0104CA device is $DD 42 97. This is the same as the WRITE 7 password. The user may elect to change the signature of the secure code anytime after successful presentation. After writing and verifying data in the configuration memory, the security fuses MUST be blown to lock this information in the device. For additional information on personalizing CryptoMemory, please see the application notes Programming CryptoMemory for Embedded Applications and Initializing CryptoMemory for Smart Card Applications from the product page at www.atmel.com/products/securemem. 16 AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 15. Ordering Information Table 5. Ordering Information Voltage Range Temperature Range AT88SC0104CA-MJ AT88SC0104CA-MP AT88SC0104CA-MJTG AT88SC0104CA-MPTG Ordering Code M2 – J Module - ISO M2 – P Module - ISO M2 – J Module -TWI M2 – P Module -TWI 2.7V–3.6V Commercial (0°C to 70°C) AT88SC0104CA-PU AT88SC0104CA-SU AT88SC0104CA-TH AT88SC0104CA-Y6H-T 8P3 8S1 8A2 8Y6 2.7V–3.6V Green compliant (exceeds RoHS)/Industrial (−40°C to 85°C) AT88SC0104CA-WI 7 mil wafer 2.7V–3.6V Industrial (−40°C to 85°C) Table 6. Package Ordering Information Package Type(1) (2) Description M2 – J Module : ISO or TWI M2 ISO 7816 Smart Card Module M2 – P Module: ISO or TWI M2 ISO 7816 Smart Card Module with Atmel® Logo 8P3 8-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8A2 8-lead, 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8Y6 8-lead, 2.0 x 3.0mm Body, 0.50mm Pitch, Ultra Thin Mini-Map, Dual No Lead Package (DFN), (MLP 2x3) Note: 1. Formal drawings may be obtained from an Atmel sales office. 2. Both the J and P Module Packages are used for either ISO (T=0 / 2-wire mode) or TWI (2-wire mode only). 17 5200ES–CRYPT–08/09 16. Package Information Ordering Code: MJ or MJTG Module Size: M2 Dimension*: 12.6 x 11.4 [mm] Glob Top: Round – Æ 8.5 [mm] Thickness: 0.58 [mm] Pitch: 14.25 mm *Note: 18 Ordering Code: MP or MPTG Module Size: M2 Dimension*: 12.6 x 11.4 [mm] Glob Top: Square - 8.8 x 8.8 [mm] Thickness: 0.58 [mm] Pitch: 14.25 mm The module dimensions listed refer to the dimensions of the exposed metal contact area. The actual dimensions of the module after excise or punching from the carrier tape are generally 0.4 mm greater in both directions (i.e., a punched M2 module will yield 13.0 x 11.8 mm). AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 17. Ordering Code: SU 17.1. 8-lead SOIC C 1 E E1 N L Top View End View e COMMON DIMENSIONS (Unit of Measure = mm) b A A1 D SYMBOL MIN NOM MAX A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e Side View L NOTE 1.27 BSC 0.40 – 1.27 0˚ – 8˚ Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 3/17/05 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. REV. 8S1 C 19 5200ES–CRYPT–08/09 18. Ordering Code: PU 18.1. 8-lead PDIP E 1 E1 N Top View c eA End View D D1 COMMON DIMENSIONS (Unit of Measure = inches) e A2 A b2 b3 b 4 PLCS Side View L MIN SYMBOL NOM MAX NOTE 2 A − − 0.210 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 3 D1 0.005 − − 3 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 e 0.100 BSC eA 0.300 BSC L 0.115 0.130 4 0.150 Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). R 20 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) 2 01/09/02 DRAWING NO. REV. 8P3 B AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA 19. Ordering Code: TH 19.1. 8-lead TSSOP 3 2 1 Pin 1 indicator this corner E1 E L1 L N End View Top View SYMBOL A b D COMMON DIMENSIONS (Unit of Measure = mm) MIN 2.90 E e A2 D NOTE 3.00 3.10 2, 5 3, 5 E1 4.30 4.40 4.50 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 L 4 0.65 BSC 0.45 L1 Notes: MAX 6.40 BSC e Side View NOM 0.60 0.75 1.00 RE3 1. This drawing is for general information only. Refer to JEDEC D rawing MO-153, Variation AA, for proper dimension s, tolerances, datums, etc. 2. Dimension D does not include mold Flash, prot rusions or gate burrs. Mold Flash, prot rusions and gate burrs shall not exceed 0.15 mm (0.006 in) per sid e. 3. Dimension E1 does not include inter-lead Flash or prot rusions. Inter-lead Flash and prot rusions shall not exceed 0.25 mm (0.010 in) per sid e. 4. Dimension b does not include Dambar prot rusion. Allowable Dambar prot rusion shall be 0.08 mm total in excess of the b dimension at maxi mum mate rial condition . Dambar cannot be located on the l ower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm . 5. Dimension D and E1 to be dete rmined at Datum Plane H . TITLE Package Drawing Contact: [email protected] 8A2, 8-lead, 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) 10/29/08 GPC DRAWING NO. REV. TNR 8A2 C 21 5200ES–CRYPT–08/09 20. Ordering Code: Y6H-T 20.1. 8-lead Ultra Thin Mini-Map D2 A b (8X) E E2 Pin 1 Index Area Pin 1 ID L (8X) D A2 e (6X) A1 1.50 REF. A3 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground MIN NOM D 2.00 BSC E 3.00 BSC MAX D2 1.40 1.50 1.60 E2 - - 1.40 A - - 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 A3 L 0.20 REF 0.20 e b NOTE 0.30 0.40 0.50 BSC 0.20 0.25 0.30 2 11/21/08 TITLE Package Drawing Contact: [email protected] 22 GPC DRAWING NO. REV. 8Y6, 8-lead, 2.0x3.0 mm Body, 0.50 mm Pitch, UltraThin Mini-MAP, Dual No Lead Package YNZ (Sawn)(UDFN) 8Y6 E AT88SC0104CA 5200ES–CRYPT–08/09 AT88SC0104CA Appendix A. Revision History Doc. Rev. Date Comments 5200ES 08/2009 Minor edits and TWI module updates 5200DS 07/2009 Minor updates to package drawing information and ordering information. 5200CS 05/2009 Added Mini-MAP column to Table 1-1 and Mini-MAP pin-out drawing. 5200BS 02/2009 Connection Diagram inserted; DC Characteristics table updated. 5200AS 07/2008 Initial document release. 23 5200ES–CRYPT–08/09 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Product Contact Web Site Technical Support www.atmel.com/products/securemem [email protected] Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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