Features • High-performance, Low-power 8/16-bit AVR XMEGA Microcontroller • Non-Volatile Program and Data Memories – – – – • • • • • 64K - 384K Bytes of In-System Self-Programmable Flash 4K - 8K Bytes Boot Section with Independent Lock Bits 2 KB - 4 KB EEPROM 4 KB - 32 KB Internal SRAM External Bus Interface for up to 16M bytes SRAM External Bus Interface for up to 128M bit SDRAM Peripheral Features – Four-channel DMA Controller with support for external requests – Eight-channel Event System – Eight 16-bit Timer/Counters Four Timer/Counters with 4 Output Compare or Input Capture channels Four Timer/Counters with 2 Output Compare or Input Capture channels High-Resolution Extension on all Timer/Counters Advanced Waveform Extension on two Timer/Counters – Eight USARTs IrDA modulation/demodulation for one USART – Four Two-Wire Interfaces with dual address match (I2C and SMBus compatible) – Four SPI (Serial Peripheral Interface) peripherals – AES and DES Crypto Engine – 16-bit Real Time Counter with separate Oscillator – Two Eight-channel, 12-bit, 2 Msps Analog to Digital Converters – Two Two-channel, 12-bit, 1 Msps Digital to Analog Converters – Four Analog Comparators with Window compare function – External Interrupts on all General Purpose I/O pins – Programmable Watchdog Timer with Separate On-chip Ultra Low Power Oscillator Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal and External Clock Options with PLL and Prescaler – Programmable Multi-level Interrupt Controller – Sleep Modes: Idle, Power-down, Standby, Power-save, Extended Standby – Advanced Programming, Test and Debugging Interfaces JTAG (IEEE 1149.1 Compliant) Interface for programming, test and debugging PDI (Program and Debug Interface) for programming and debugging I/O and Packages – 78 Programmable I/O Lines – 100 - lead TQFP – 100 - ball CBGA – 100 - ball VFBGA Operating Voltage – 1.6 – 3.6V Speed performance – 0 – 12 MHz @ 1.6 – 3.6V – 0 – 32 MHz @ 2.7 – 3.6V 8/16-bit XMEGA A1 Microcontroller ATxmega384A1 ATxmega256A1 ATxmega192A1 ATxmega128A1 ATxmega64A1 Preliminary Typical Applications • • • • • Industrial control Factory automation Building control Board control White Goods • • • • • Climate control ZigBee Motor control Networking Optical • • • • • Hand-held battery applications Power tools HVAC Metering Medical Applications 8067I–AVR–04/09 XMEGA A1 ‘ 1. Ordering Information Ordering Code Flash (B) E2 SRAM Speed (MHz) Power Supply ATxmega384A1-AU 384K + 8K 4 KB 32 KB 32 1.6 - 3.6V ATxmega256A1-AU 256K + 8K 4 KB 16 KB 32 1.6 - 3.6V ATxmega192A1-AU 192K + 8K 2 KB 16 KB 32 1.6 - 3.6V ATxmega128A1-AU 128K + 8K 2 KB 8 KB 32 1.6 - 3.6V ATxmega64A1-AU 64K + 4K 2 KB 4 KB 32 1.6 - 3.6V ATxmega384A1-CU 384K + 8K 4 KB 32 KB 32 1.6 - 3.6V ATxmega256A1-CU 256K + 8K 4 KB 16 KB 32 1.6 - 3.6V ATxmega192A1-CU 192K + 8K 2 KB 16 KB 32 1.6 - 3.6V ATxmega128A1-CU 128K + 8K 2 KB 8 KB 32 1.6 - 3.6V ATxmega64A1-CU 64K + 4K 2 KB 4 KB 32 1.6 - 3.6V ATxmega128A1-C7U 128K + 8K 2 KB 8 KB 32 1.6 - 3.6V ATxmega64A1-C7U 64K + 4K 2 KB 4 KB 32 1.6 - 3.6V Notes: 1. 2. 3. Package(1)(2)(3) Temp 100A -40°C - 85°C 100C1 100C2 This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. For packaging information, see “Packaging information” on page 61. Package Type 100A 100-lead, 14 x 14 x 1.0 mm, 0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 100C1 100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.88 mm, Chip Ball Grid Array (CBGA) 100C2 100-ball, 7 x 7 x 1.0 mm Body, Ball Pitch 0.65 mm, Very Thin Fine-Pitch Ball Grid Array (VFBGA) 2 8067I–AVR–04/09 XMEGA A1 2. Pinout/Block Diagram Block diagram and pinout PA5 PA4 PA3 PA2 PA1 PA0 AVCC GND PR1 PR0 RESET/PDI PDI PQ3 PQ2 PQ1 PQ0 GND VCC PK7 PK6 PK5 PK4 PK3 PK2 PK1 Figure 2-1. 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 INDEX CORNER Port Q Port R DATA BU S OSC/CLK Contro l DAC A AC A0 Power Contro l AC A1 BOD VREF POR TEMP RTC OCD FLASH CPU ADC B Reset Contro l DAC B RAM DMA AC B0 Port K External Bus Interface Port A ADC A Port B E 2 PROM Interrupt Controlle r Watchdog AC B1 Event System ctrl Port J Port H DATA BU S Port C Port D Port E SPI TWI T/C0:1 USART0:1 SPI TWI T/C0:1 USART0:1 SPI TWI T/C0:1 USART0/1 SPI TWI T/C0:1 EVENT ROUTING NETWORK USART0:1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Port F 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PK0 VCC GND PJ7 PJ6 PJ5 PJ4 PJ3 PJ2 PJ1 PJ0 VCC GND PH7 PH6 PH5 PH4 PH3 PH2 PH1 PH0 VCC GND PF7 PF6 PD1 PD2 PD3 PD4 PD5 PD6 PD7 GND VCC PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 GND VCC PF0 PF1 PF2 PF3 PF4 PF5 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 PA6 PA7 GND AVCC PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 GND VCC PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 GND VCC PD0 Note: For full details on pinout and pin functions refer to “Pinout and Pin Functions” on page 49. 3 8067I–AVR–04/09 XMEGA A1 Figure 2-2. CBGA-pinout Top view 1 2 3 4 5 6 Bottom view 7 8 9 10 10 9 8 7 6 5 4 3 2 1 A A B B C C D D E E F F G G H H J J K K Table 2-1. CBGA-pinout 1 2 3 4 5 6 7 8 9 10 A PK0 VCC GND PJ3 VCC GND PH1 GND VCC PF7 B PK3 PK2 PK1 PJ4 PH7 PH4 PH2 PH0 PF6 PF5 C VCC PK5 PK4 PJ5 PJ0 PH5 PH3 PF2 PF3 VCC D GND PK6 PK7 PJ6 PJ1 PH6 PF0 PF1 PF4 GND E PQ0 PQ1 PQ2 PJ7 PJ2 PE7 PE6 PE5 PE4 PE3 PR1 PR0 RESET/ PDI_CLK PDI_DATA PQ3 PC2 PE2 PE1 PE0 VCC G GND PA1 PA4 PB3 PB4 PC1 PC6 PD7 PD6 GND H AVCC PA2 PA5 PB2 PB5 PC0 PC5 PD5 PD4 PD3 J PA0 PA3 PB0 PB1 PB6 PC3 PC4 PC7 PD2 PD1 K PA6 PA7 GND AVCC PB7 VCC GND VCC GND PD0 F 4 8067I–AVR–04/09 XMEGA A1 3. Overview The XMEGA™ A1 is a family of low power, high performance and peripheral rich CMOS 8/16-bit microcontrollers based on the AVR ® enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the XMEGA A1 achieves throughputs approaching 1 Million Instructions Per Second (MIPS) per MHz allowing the system designer to optimize power consumption versus processing speed. The AVR CPU combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times faster than conventional single-accumulator or CISC based microcontrollers. The XMEGA A1 devices provides the following features: In-System Programmable Flash with Read-While-Write capabilities, Internal EEPROM and SRAM, four-channel DMA Controller, eight-channel Event System, Programmable Multi-level Interrupt Controller, 78 general purpose I/O lines, 16-bit Real Time Counter (RTC), eight flexible 16-bit Timer/Counters with compare modes and PWM, eight USARTs, four Two Wire Serial Interfaces (TWIs), four Serial Peripheral Interfaces (SPIs), AES and DES crypto engine, two 8-channel, 12-bit ADCs with optional differential input with programmable gain, two 2-channel, 12-bit DACs, four analog comparators with window mode, programmable Watchdog Timer with seperate Internal Oscillator, accurate internal oscillators with PLL and prescaler and programmable Brown-Out Detection. The Program and Debug Interface (PDI), a fast 2-pin interface for programming and debugging, is available. The devices also have an IEEE std. 1149.1 compliant JTAG test interface, and this can also be used for On-chip Debug and programming. The XMEGA A1 devices have five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, DMA Controller, Event System, Interrupt Controller and all peripherals to continue functioning. The Power-down mode saves the SRAM and register contents but stops the oscillators, disabling all other functions until the next TWI or pin-change interrupt, or Reset. In Power-save mode, the asynchronous Real Time Counter continues to run, allowing the application to maintain a timer base while the rest of the device is sleeping. In Standby mode, the Crystal/Resonator Oscillator is kept running while the rest of the device is sleeping. This allows very fast start-up from external crystal combined with low power consumption. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. To further reduce power consumption, the peripheral clock to each individual peripheral can optionally be stopped in Active mode and Idle sleep mode. The device is manufactured using Atmel's high-density nonvolatile memory technology. The program Flash memory can be reprogrammed in-system through the PDI or JTAG. A Bootloader running in the device can use any interface to download the application program to the Flash memory. The Bootloader software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8/16-bit RISC CPU with In-System Self-Programmable Flash, the Atmel XMEGA A1 is a powerful microcontroller family that provides a highly flexible and cost effective solution for many embedded applications. The XMEGA A1 devices are supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits. 5 8067I–AVR–04/09 XMEGA A1 3.1 Block Diagram Figure 3-1. XMEGA A1 Block Diagram PR[0..1] XTAL1 PQ[0..3] TOSC1 TOSC2 PORT R (2) PORT Q (4) XTAL2 Oscillator Circuits/ Clock Generation EVENT ROUTING NETWORK Real Time Counter Watchdog Timer DATA BUS DACA PA[0..7] Watchdog Oscillator PORT A (8) Event System Controller SRAM ACA DMA Controller ADCA VCC Power Supervision POR/BOD & RESET Oscillator Control GND Sleep Controller RESET/ PDI_CLK PDI AREFA BUS Controller VCC/10 PDI_DATA Prog/Debug Controller JTAG Int. Ref. Tempref DES PORT B OCD AREFB CPU Interrupt Controller AES ADCB ACB PORT K (8) PK[0..7] PORT J (8) PJ[0..7] PORT H (8) PH[0..7] NVM Controller PB[0..7]/ JTAG EBI PORT B (8) Flash EEPROM DACB IRCOM DATA BUS PC[0..7] PORT D (8) PD[0..7] PE[0..7] SPIF TWIF TCF0:1 USARTF0:1 SPIE PORT E (8) TWIE TCE0:1 USARTE0:1 TWID SPID USARTD0:1 TCD0:1 SPIC PORT C (8) TWIC USARTC0:1 TCC0:1 EVENT ROUTING NETWORK PORT F (8) PF[0..7] 6 8067I–AVR–04/09 XMEGA A1 4. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. 4.1 Recommended reading • XMEGA A Manual • XMEGA A Application Notes This device data sheet only contains part specific information and a short description of each peripheral and module. The XMEGA A Manual describes the modules and peripherals in depth. The XMEGA A application notes contain example code and show applied use of the modules and peripherals. The XMEGA A Manual and Application Notes are available from http://www.atmel.com/avr. 5. Disclaimer For devices that are not available yet, typical values contained in this datasheet are based on simulations and characterization of other AVR XMEGA microcontrollers manufactured on the same process technology. Min. and Max values will be available after the device is characterized. 7 8067I–AVR–04/09 XMEGA A1 6. AVR CPU 6.1 Features • 8/16-bit high performance AVR RISC Architecture • • • • • • • 6.2 – 138 instructions – Hardware multiplier 32x8-bit registers directly connected to the ALU Stack in SRAM Stack Pointer accessible in I/O memory space Direct addressing of up to 16M Bytes of program and data memory True 16/24-bit access to 16/24-bit I/O registers Support for 8-, 16- and 32-bit Arithmetic Configuration Change Protection of system critical features Overview The XMEGA A1 uses the 8/16-bit AVR CPU. The main function of the CPU is program execution. The CPU must therefore be able to access memories, perform calculations and control peripherals. Interrupt handling is described in a separate section. Figure 6-1 on page 8 shows the CPU block diagram. Figure 6-1. CPU block diagram DATA BUS Flash Program Memory Program Counter OCD Instruction Register STATUS/ CONTROL Instruction Decode 32 x 8 General Purpose Registers ALU Multiplier/ DES DATA BUS Peripheral Module 1 Peripheral Module 2 SRAM EEPROM PMIC The AVR uses a Harvard architecture - with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipeline. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This 8 8067I–AVR–04/09 XMEGA A1 concept enables instructions to be executed in every clock cycle. The program memory is InSystem Self-Programmable Flash memory. 6.3 Register File The fast-access Register File contains 32 x 8-bit general purpose working registers with single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU cycle, the operation is performed on two Register File operands, and the result is stored back in the Register File. Six of the 32 registers can be used as three 16-bit address register pointers for data space addressing - enabling efficient address calculations. One of these address pointers can also be used as an address pointer for look up tables in Flash program memory. 6.4 ALU - Arithmetic Logic Unit The high performance Arithmetic Logic Unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. After an arithmetic or logic operation, the Status Register is updated to reflect information about the result of the operation. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Both 8- and 16-bit arithmetic is supported, and the instruction set allows for efficient implementation of 32-bit aritmetic. The ALU also provides a powerful multiplier supporting both signed and unsigned multiplication and fractional format. 6.5 Program Flow When the device is powered on, the CPU starts to execute instructions from the lowest address in the Flash Program Memory ‘0’. The Program Counter (PC) addresses the next instruction to be fetched. After a reset, the PC is set to location ‘0’. Program flow is provided by conditional and unconditional jump and call instructions, capable of addressing the whole address space directly. Most AVR instructions use a 16-bit word format, while a limited number uses a 32-bit format. During interrupts and subroutine calls, the return address PC is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. After reset the Stack Pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR CPU. 9 8067I–AVR–04/09 XMEGA A1 7. Memories 7.1 Features • Flash Program Memory – One linear address space – In-System Programmable – Self-Programming and Bootloader support – Application Section for application code – Application Table Section for application code or data storage – Boot Section for application code or bootloader code – Separate lock bits and protection for all sections – Built in fast CRC check of a selectable flash program memory section • Data Memory – One linear address space – Single cycle access from CPU – SRAM – EEPROM Byte and page accessible Optional memory mapping for direct load and store – I/O Memory Configuration and Status registers for all peripherals and modules 16 bit-accessible General Purpose Register for global variables or flags – External Memory support SRAM SDRAM Memory mapped external hardware – Bus arbitration Safe and deterministic handling of CPU and DMA Controller priority – Separate buses for SRAM, EEPROM, I/O Memory and External Memory access Simultaneous bus access for CPU and DMA Controller • Production Signature Row Memory for factory programmed data Device ID for each microcontroller device type Serial number for each device Oscillator calibration bytes ADC, DAC and temperature sensor calibration data • User Signature Row One flash page in size Can be read and written from software Content is kept after chip erase 7.2 Overview The AVR architecture has two main memory spaces, the Program Memory and the Data Memory. In addition, the XMEGA A1 features an EEPROM Memory for non-volatile data storage. All three memory spaces are linear and require no paging. The available memory size configurations are shown in “Ordering Information” on page 2. In addition each device has a Flash memory signature row for calibration data, device identification, serial number etc. Non-volatile memory spaces can be locked for further write or read/write operations. This prevents unrestricted access to the application software. 10 8067I–AVR–04/09 XMEGA A1 7.3 In-System Programmable Flash Program Memory The XMEGA A1 devices contain On-chip In-System Programmable Flash memory for program storage, see Figure 7-1 on page 11. Since all AVR instructions are 16- or 32-bits wide, each Flash address location is 16 bits. The Program Flash memory space is divided into Application and Boot sections. Both sections have dedicated Lock Bits for setting restrictions on write or read/write operations. The Store Program Memory (SPM) instruction must reside in the Boot Section when used to write to the Flash memory. A third section inside the Application section is referred to as the Application Table section which has separate Lock bits for storage of write or read/write protection. The Application Table section can be used for storing non-volatile data or application software. Figure 7-1. Flash Program Memory (Hexadecimal address) Word Address 0 Application Section (Bytes) (384K/256K/192K/128K/64K) ... 2EFFF / 1EFFF / 16FFF / EFFF / 77FF 2F000 / 1F000 / 17000 / F000 / 7800 2FFFF / 1FFFF / 17FFF / FFFF / 7FFF 30000 / 20000 / 18000 / 10000 / 8000 30FFF / 20FFF / 18FFF / 10FFF / 87FF Application Table Section (Bytes) (8K/8K/8K/8K/4K) Boot Section (Bytes) (8K/8K/8K/8K/4K) The Application Table Section and Boot Section can also be used for general application software. 7.4 Data Memory The Data Memory consists of the I/O Memory, EEPROM and SRAM memories, all within one linear address space, see Figure 7-2 on page 11. To simplify development, the memory map for all devices in the family is identical and with empty, reserved memory space for smaller devices. Figure 7-2. Data Memory Map (Hexadecimal address) Byte Address 0 FFF 1000 17FF ATxmega192A1 I/O Registers (4 KB) EEPROM (2 KB) RESERVED Byte Address 0 FFF 1000 17FF ATxmega128A1 I/O Registers (4 KB) EEPROM (2 KB) RESERVED Byte Address 0 FFF 1000 17FF ATxmega64A1 I/O Registers (4 KB) EEPROM (2 KB) RESERVED 11 8067I–AVR–04/09 XMEGA A1 Figure 7-2. Data Memory Map (Hexadecimal address) 2000 5FFF 6000 FFFFFF Internal SRAM (16 KB) External Memory (0 to 16 MB) 2000 3FFF 4000 Internal SRAM (8 KB) FFFFFF External Memory (0 to 16 MB) Byte Address ATxmega384A1 0 FFF 2000 2FFF 3000 FFFFFF Byte Address 0 I/O Registers (4 KB) FFF 1000 1FFF 9FFF 10000 FFFFFF 7.4.1 External Memory (0 to 16 MB) ATxmega256A1 I/O Registers (4 KB) 1000 EEPROM (4 KB) 2000 Internal SRAM (4 KB) EEPROM (4 KB) 1FFF Internal SRAM (32 KB) External Memory (0 to 16 MB) 2000 5FFF 6000 FFFFFF Internal SRAM (16 KB) External Memory (0 to 16 MB) I/O Memory All peripherals and modules are addressable through I/O memory locations in the data memory space. All I/O memory locations can be accessed by the Load (LD/LDS/LDD) and Store (ST/STS/STD) instructions, transferring data between the 32 general purpose registers in the CPU and the I/O Memory. The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F directly. I/O registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. The value of single bits can be checked by using the SBIS and SBIC instructions on these registers. The I/O memory address for all peripherals and modules in XMEGA A1 is shown in the “Peripheral Module Address Map” on page 55. 7.4.2 SRAM Data Memory The XMEGA A1 devices has internal SRAM memory for data storage. 7.4.3 EEPROM Data Memory The XMEGA A1 devices have internal EEPROM memory for non-volatile data storage. It is addressable either in a separate data space or it can be memory mapped into the normal data memory space. The EEPROM memory supports both byte and page access. 12 8067I–AVR–04/09 XMEGA A1 7.4.4 EBI - External Bus Interface • Supports SRAM up to • • • • – 512K Bytes using 2-port EBI – 16M Bytes using 3-port EBI Supports SDRAM up to – 128M bit using 3-port EBI Four software configurable Chip Selects Software configurable Wait State insertion Clocked from the Peripheral 2x Clock at up to two times the CPU clock speed The External Bus Interface (EBI) is the interface for connecting external peripheral and memory to the data memory space. The XMEGA A1 has 3 ports that can be used for the EBI. It can interface external SRAM, SDRAM, and/or peripherals such as LCD displays and other memory mapped devices. The address space, and the number of pins used, for the external memory is selectable from 256 bytes (8-bit) and up to 16M bytes (24-bit). Various multiplexing modes for address and data lines can be selected for optimal use of pins when more or less pins is available for the EBI. Each of the four chip selects has seperate configuration, and can be configured for SRAM, SRAM Low Pin Count (LPC) or SDRAM. The data memory address space associated for each chip select is decided by a configurable base address and address size for each chip celect. For SDRAM both 4-bit SDRAM is supported, and SDRAM configurations such as CAS Latency and Refresh rate is configurable in software. The EBI is clocked from the Peripheral 2x Clock, running up to two times faster than the CPU and supporting speeds of up to 64 MHz. 13 8067I–AVR–04/09 XMEGA A1 7.5 Production Signature Row The Production Signature Row is a separate memory section for factory programmed data. It contains calibration data for functions such as oscillators and analog modules. The production signature row also contains a device ID that identify each microcontroller device type, and a serial number that is unique for each manufactured device. The device ID for the available XMEGA A1 devices is shown in Table 7-1 on page 14. The serial number consist of the production LOT number, wafer number, and wafer coordinates for the device. The production signature row can not be written or erased, but it can be read from both application software and external programming. Table 7-1. Device ID bytes for XMEGA A1 devices. Device 7.6 Device ID bytes Byte 2 Byte 1 Byte 0 ATxmega64A1 4E 96 1E ATxmega128A1 4C 97 1E ATxmega192A1 4E 97 1E ATxmega256A1 46 98 1E ATxmega384A1 TBD TBD TBD User Signature Row The User Signature Row is a separate memory section that is fully accessible (read and write) from application software and external programming. The user signature row is one flash page in size, and is meant for static user parameter storage, such as calibration data, custom serial numbers or identification numbers, random number seeds etc. This section is not erased by Chip Erase commands that erase the Flash, and requires a dedicated erase command. This ensures parameter storage during multiple program/erase session and on-chip debug sessions. 14 8067I–AVR–04/09 XMEGA A1 7.7 Flash and EEPROM Page Size The Flash Program Memory and EEPROM data memory is organized in pages. The pages are word accessible for the Flash and byte accessible for the EEPROM. Table 7-2 on page 15 shows the Flash Program Memory organization. Flash write and erase operations are performed on one page at a time, while reading the Flash is done one byte at a time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) gives the page number and the least significant address bits (FWORD) gives the word in the page. Table 7-2. Devices Number of words and Pages in the Flash. Flash Page Size Size (Bytes) (words) FWORD ATxmega64A1 64K + 4K 128 Z[7:1] ATxmega128A1 128K + 8K 256 Z[8:1] ATxmega192A1 192K + 8K 256 ATxmega256A1 256K + 8K 256 ATxmega384A1 384K + 8K 256 FPAGE Application Boot Size (Bytes) No of Pages Size (Bytes) No of Pages Z[16:8] 64K 256 4K 16 Z[17:9] 128K 256 8K 16 Z[8:1] Z[18:9] 192K 384 8K 16 Z[8:1] Z[18:9] 256K 512 8K 16 Z[8:1] Z[19:9] 384K 768 8K 16 Table 7-3 on page 15 shows EEPROM memory organization for the XMEGA A1 devices. EEPROM write and erase operations can be performed one page or one byte at a time, while reading the EEPROM is done one byte at a time. For EEPROM access the NVM Address Register (ADDR[m:n]) is used for addressing. The most significant bits in the address (E2PAGE) gives the page number and the least significant address bits (E2BYTE) gives the byte in the page. Table 7-3. Devices Number of Bytes and Pages in the EEPROM. EEPROM Page Size E2BYTE E2PAGE No of Pages Size (Bytes) ATxmega64A1 2 KB 32 ADDR[4:0] ADDR[10:5] 64 ATxmega128A1 2 KB 32 ADDR[4:0] ADDR[10:5] 64 ATxmega192A1 2 KB 32 ADDR[4:0] ADDR[10:5] 64 ATxmega256A1 4 KB 32 ADDR[4:0] ADDR[11:5] 128 ATxmega384A1 4 KB 32 ADDR[4:0] ADDR[11:5] 128 15 8067I–AVR–04/09 XMEGA A1 8. DMAC - Direct Memory Access Controller 8.1 Features • Allows High-speed data transfer • • • • • 8.2 – From memory to peripheral – From memory to memory – From peripheral to memory – From peripheral to peripheral 4 Channels From 1 byte and up to 16M bytes transfers in a single transaction Multiple addressing modes for source and destination address – Increment – Decrement – Static 1, 2, 4, or 8 byte Burst Transfers Programmable priority between channels Overview The XMEGA A1 has a Direct Memory Access (DMA) Controller to move data between memories and peripherals in the data space. The DMA controller uses the same data bus as the CPU to transfer data. It has 4 channels that can be configured independently. Each DMA channel can perform data transfers in blocks of configurable size from 1 to 64K bytes. A repeat counter can be used to repeat each block transfer for single transactions up to 16M bytes. Each DMA channel can be configured to access the source and destination memory address with incrementing, decrementing or static addressing. The addressing is independent for source and destination address. When the transaction is complete the original source and destination address can automatically be reloaded to be ready for the next transaction. The DMAC can access all the peripherals through their I/O memory registers, and the DMA may be used for automatic transfer of data to/from communication modules, as well as automatic data retrieval from ADC conversions, data transfer to DAC conversions, or data transfer to or from port pins. A wide range of transfer triggers is available from the peripherals, Event System and software. Each DMA channel has different transfer triggers. To allow for continuous transfers, two channels can be interlinked so that the second takes over the transfer when the first is finished and vice versa. The DMA controller can read from memory mapped EEPROM, but it cannot write to the EEPROM or access the Flash. 16 8067I–AVR–04/09 XMEGA A1 9. Event System 9.1 Features • • • • • • • • 9.2 Inter-peripheral communication and signalling with minimum latency CPU and DMA independent operation 8 Event Channels allows for up to 8 signals to be routed at the same time Events can be generated by – Timer/Counters (TCxn) – Real Time Counter (RTC) – Analog to Digital Converters (ADCx) – Analog Comparators (ACx) – Ports (PORTx) – System Clock (ClkSYS) – Software (CPU) Events can be used by – Timer/Counters (TCxn) – Analog to Digital Converters (ADCx) – Digital to Analog Converters (DACx) – Ports (PORTx) – DMA Controller (DMAC) – IR Communication Module (IRCOM) The same event can be used by multiple peripherals for synchronized timing Advanced Features – Manual Event Generation from software (CPU) – Quadrature Decoding – Digital Filtering Functions in Active and Idle mode Overview The Event System is a set of features for inter-peripheral communication. It enables the possibility for a change of state in one peripheral to automatically trigger actions in one or more peripherals. These changes in a peripheral that will trigger actions in other peripherals are configurable by software. It is a simple, but powerful system as it allows for autonomous control of peripherals without any use of interrupts, CPU or DMA resources. The indication of a change in a peripheral is referred to as an event, and is usually the same as the interrupt conditions for that peripheral. Events are passed between peripherals using a dedicated routing network called the Event Routing Network. Figure 9-1 on page 18 shows a basic block diagram of the Event System with the Event Routing Network and the peripherals to which it is connected. This highly flexible system can be used for simple routing of signals, pin functions or for sequencing of events. The maximum latency is two CPU clock cycles from when an event is generated in one peripheral, until the actions are triggered in one or more other peripherals. The Event System is functional in both Active and Idle modes. 17 8067I–AVR–04/09 XMEGA A1 Figure 9-1. Event system block diagram. PORTx ClkSYS CPU ADCx RTC Event Routing Network DACx IRCOM ACx T/Cxn DMAC The Event Routing Network can directly connect together ADCs, DACs, Analog Comparators (ACx), I/O ports (PORTx), the Real-time Counter (RTC), Timer/Counters (T/C) and the IR Communication Module (IRCOM). Events can also be generated from software (CPU). All events from all peripherals are always routed into the Event Routing Network. This consist of eight multiplexers where each can be configured in software to select which event to be routed into that event channel. All eight event channels are connected to the peripherals that can use events, and each of these peripherals can be configured to use events from one or more event channels to automatically trigger a software selectable action. 18 8067I–AVR–04/09 XMEGA A1 10. System Clock and Clock options 10.1 Features • Fast start-up time • Safe run-time clock switching • Internal Oscillators: • • • • • • 10.2 – 32 MHz run-time calibrated RC oscillator – 2 MHz run-time calibrated RC oscillator – 32.768 kHz calibrated RC oscillator – 32 kHz Ultra Low Power (ULP) oscillator with 1 kHz ouput External clock options – 0.4 - 16 MHz Crystal Oscillator – 32 kHz Crystal Oscillator – External clock PLL with internal and external clock options with 1 to 31x multiplication Clock Prescalers with 1 to 2048x division Fast peripheral clock running at 2 and 4 times the CPU clock speed Automatic Run-Time Calibration of internal oscillators Crystal Oscillator failure detection Overview XMEGA A1 has an advanced clock system, supporting a large number of clock sources. It incorporates both integrated oscillators, external crystal oscillators and resonators. A high frequency Phase Locked Loop (PLL) and clock prescalers can be controlled from software to generate a wide range of clock frequencies from the clock source input. It is possible to switch between clock sources from software during run-time. After reset the device will always start up running from the 2 Mhz internal oscillator. A calibration feature is available, and can be used for automatic run-time calibration of the internal 2 MHz and 32 MHz oscillators. This reduce frequency drift over voltage and temperature. A Crystal Oscillator Failure Monitor can be enabled to issue a Non-Maskable Interrupt and switch to internal oscillator if the external oscillator fails. Figure 10-1 on page 20 shows the principal clock system in XMEGA A1. 19 8067I–AVR–04/09 XMEGA A1 Figure 10-1. Clock system overview clkULP 32 kHz ULP Internal Oscillator clkRTC 32.768 kHz Calibrated Internal Oscillator RTC PERIPHERALS ADC 2 MHz Run-Time Calibrated Internal Oscillator 32 MHz Run-time Calibrated Internal Oscillator WDT/BOD DAC CLOCK CONTROL clkPER UNIT with PLL and Prescaler PORTS ... DMA INTERRUPT 32.768 KHz Crystal Oscillator EVSYS RAM 0.4 - 16 MHz Crystal Oscillator CPU clkCPU NVM MEMORY External Clock Input FLASH EEPROM Each clock source is briefly described in the following sub-sections. 10.3 10.3.1 Clock Options 32 kHz Ultra Low Power Internal Oscillator The 32 kHz Ultra Low Power (ULP) Internal Oscillator is a very low power consumption clock source. It is used for the Watchdog Timer, Brown-Out Detection and as an asynchronous clock source for the Real Time Counter. This oscillator cannot be used as the system clock source, and it cannot be directly controlled from software. 10.3.2 32.768 kHz Calibrated Internal Oscillator The 32.768 kHz Calibrated Internal Oscillator is a high accuracy clock source that can be used as the system clock source or as an asynchronous clock source for the Real Time Counter. It is calibrated during production to provide a default frequency which is close to its nominal frequency. 20 8067I–AVR–04/09 XMEGA A1 10.3.3 32.768 kHz Crystal Oscillator The 32.768 kHz Crystal Oscillator is a low power driver for an external watch crystal. It can be used as system clock source or as asynchronous clock source for the Real Time Counter. 10.3.4 0.4 - 16 MHz Crystal Oscillator The 0.4 - 16 MHz Crystal Oscillator is a driver intended for driving both external resonators and crystals ranging from 400 kHz to 16 MHz. 10.3.5 2 MHz Run-time Calibrated Internal Oscillator The 2 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during productionn to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 10.3.6 32 MHz Run-time Calibrated Internal Oscillator The 32 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 10.3.7 External Clock input The external clock input gives the possibility to connect a clock from an external source. 10.3.8 PLL with Multiplication factor 1 - 31x The PLL provides the possibility of multiplying a frequency by any number from 1 to 31. In combination with the prescalers, this gives a wide range of output frequencies from all clock sources. 21 8067I–AVR–04/09 XMEGA A1 11. Power Management and Sleep Modes 11.1 Features • 5 sleep modes – Idle – Power-down – Power-save – Standby – Extended standby • Power Reduction registers to disable clocks to unused peripherals 11.2 Overview The XMEGA A1 provides various sleep modes tailored to reduce power consumption to a minimum. All sleep modes are available and can be entered from Active mode. In Active mode the CPU is executing application code. The application code decides when and what sleep mode to enter. Interrupts from enabled peripherals and all enabled reset sources can restore the microcontroller from sleep to Active mode. In addition, Power Reduction registers provide a method to stop the clock to individual peripherals from software. When this is done, the current state of the peripheral is frozen and there is no power consumption from that peripheral. This reduces the power consumption in Active mode and Idle sleep mode. 11.3 Sleep Modes 11.3.1 Idle Mode In Idle mode the CPU and Non-Volatile Memory are stopped, but all peripherals including the Interrupt Controller, Event System and DMA Controller are kept running. Interrupt requests from all enabled interrupts will wake the device. 11.3.2 Power-down Mode In Power-down mode all system clock sources, and the asynchronous Real Time Counter (RTC) clock source, are stopped. This allows operation of asynchronous modules only. The only interrupts that can wake up the MCU are the Two Wire Interface address match interrupts, and asynchronous port interrupts, e.g pin change. 11.3.3 Power-save Mode Power-save mode is identical to Power-down, with one exception: If the RTC is enabled, it will keep running during sleep and the device can also wake up from RTC interrupts. 11.3.4 Standby Mode Standby mode is identical to Power-down with the exception that all enabled system clock sources are kept running, while the CPU, Peripheral and RTC clocks are stopped. This reduces the wake-up time when external crystals or resonators are used. 11.3.5 Extended Standby Mode Extended Standby mode is identical to Power-save mode with the exception that all enabled system clock sources are kept running while the CPU and Peripheral clocks are stopped. This reduces the wake-up time when external crystals or resonators are used. 22 8067I–AVR–04/09 XMEGA A1 12. System Control and Reset 12.1 Features • Multiple reset sources for safe operation and device reset – Power-On Reset – External Reset – Watchdog Reset The Watchdog Timer runs from separate, dedicated oscillator – Brown-Out Reset Accurate, programmable Brown-Out levels – JTAG Reset – PDI reset – Software reset • Asynchronous reset – No running clock in the device is required for reset • Reset status register 12.2 Resetting the AVR During reset, all I/O registers are set to their initial values. The SRAM content is not reset. Application execution starts from the Reset Vector. The instruction placed at the Reset Vector should be an Absolute Jump (JMP) instruction to the reset handling routine. By default the Reset Vector address is the lowest Flash program memory address, ‘0’, but it is possible to move the Reset Vector to the first address in the Boot Section. The I/O ports of the AVR are immediately tri-stated when a reset source goes active. The reset functionality is asynchronous, so no running clock is required to reset the device. After the device is reset, the reset source can be determined by the application by reading the Reset Status Register. 12.3 12.3.1 Reset Sources Power-On Reset The MCU is reset when the supply voltage VCC is below the Power-on Reset threshold voltage. 12.3.2 External Reset The MCU is reset when a low level is present on the RESET pin. 12.3.3 Watchdog Reset The MCU is reset when the Watchdog Timer period expires and the Watchdog Reset is enabled. The Watchdog Timer runs from a dedicated oscillator independent of the System Clock. For more details see “WDT - Watchdog Timer” on page 24. 12.3.4 Brown-Out Reset The MCU is reset when the supply voltage VCC is below the Brown-Out Reset threshold voltage and the Brown-out Detector is enabled. The Brown-out threshold voltage is programmable. 23 8067I–AVR–04/09 XMEGA A1 12.3.5 JTAG reset The MCU is reset as long as there is a logic one in the Reset Register in one of the scan chains of the JTAG system. Refer to IEEE 1149.1 (JTAG) Boundary-scan for details. 12.3.6 PDI reset The MCU can be reset through the Program and Debug Interface (PDI). 12.3.7 Software reset The MCU can be reset by the CPU writing to a special I/O register through a timed sequence. 12.4 12.4.1 WDT - Watchdog Timer Features • 11 selectable timeout periods, from 8 ms to 8s. • Two operation modes – Standard mode – Window mode • Runs from the 1 kHz output of the 32 kHz Ultra Low Power oscillator • Configuration lock to prevent unwanted changes 12.4.2 Overview The XMEGA A1 has a Watchdog Timer (WDT). The WDT will run continuously when turned on and if the Watchdog Timer is not reset within a software configurable time-out period, the microcontroller will be reset. The Watchdog Reset (WDR) instruction must be run by software to reset the WDT, and prevent microcontroller reset. The WDT has a Window mode. In this mode the WDR instruction must be run within a specified period called a window. Application software can set the minimum and maximum limits for this window. If the WDR instruction is not executed inside the window limits, the microcontroller will be reset. A protection mechanism using a timed write sequence is implemented in order to prevent unwanted enabling, disabling or change of WDT settings. For maximum safety, the WDT also has an Always-on mode. This mode is enabled by programming a fuse. In Always-on mode, application software can not disable the WDT. 24 8067I–AVR–04/09 XMEGA A1 13. PMIC - Programmable Multi-level Interrupt Controller 13.1 Features • Separate interrupt vector for each interrupt • Short, predictable interrupt response time • Programmable Multi-level Interrupt Controller – 3 programmable interrupt levels – Selectable priority scheme within low level interrupts (round-robin or fixed) – Non-Maskable Interrupts (NMI) • Interrupt vectors can be moved to the start of the Boot Section 13.2 Overview XMEGA A1 has a Programmable Multi-level Interrupt Controller (PMIC). All peripherals can define three different priority levels for interrupts; high, medium or low. Medium level interrupts may interrupt low level interrupt service routines. High level interrupts may interrupt both lowand medium level interrupt service routines. Low level interrupts have an optional round robin scheme to make sure all interrupts are serviced within a certain amount of time. The built in oscillator failure detection mechanism can issue a Non-Maskable Interrupt (NMI). 13.3 Interrupt vectors When an interrupt is serviced, the program counter will jump to the interrupt vector address. The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in each peripheral. The base addresses for the XMEGA A1 devices are shown in Table 13-1. Offset addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA A manual. For peripherals or modules that have only one interrupt, the interrupt vector is shown in Table 13-1. The program address is the word address. Table 13-1. Reset and Interrupt Vectors Program Address (Base Address) Source 0x000 RESET 0x002 OSCF_INT_vect Crystal Oscillator Failure Interrupt vector (NMI) 0x004 PORTC_INT_base Port C Interrupt base 0x008 PORTR_INT_base Port R Interrupt base 0x00C DMA_INT_base DMA Controller Interrupt base 0x014 RTC_INT_base Real Time Counter Interrupt base 0x018 TWIC_INT_base Two-Wire Interface on Port C Interrupt base 0x01C TCC0_INT_base Timer/Counter 0 on port C Interrupt base 0x028 TCC1_INT_base Timer/Counter 1 on port C Interrupt base 0x030 SPIC_INT_vect SPI on port C Interrupt vector 0x032 USARTC0_INT_base USART 0 on port C Interrupt base 0x038 USARTC1_INT_base USART 1 on port C Interrupt base 0x03E AES_INT_vect AES Interrupt vector Interrupt Description 25 8067I–AVR–04/09 XMEGA A1 Table 13-1. Reset and Interrupt Vectors (Continued) Program Address (Base Address) Source Interrupt Description 0x040 NVM_INT_base Non-Volatile Memory Interrupt base 0x044 PORTB_INT_base Port B Interrupt base 0x048 ACB_INT_base Analog Comparator on Port B Interrupt base 0x04E ADCB_INT_base Analog to Digital Converter on Port B Interrupt base 0x056 PORTE_INT_base Port E Interrupt base 0x05A TWIE_INT_base Two-Wire Interface on Port E Interrupt base 0x05E TCE0_INT_base Timer/Counter 0 on port E Interrupt base 0x06A TCE1_INT_base Timer/Counter 1 on port E Interrupt base 0x072 SPIE_INT_vect SPI on port E Interrupt vector 0x074 USARTE0_INT_base USART 0 on port E Interrupt base 0x07A USARTE1_INT_base USART 1 on port E Interrupt base 0x080 PORTD_INT_base Port D Interrupt base 0x084 PORTA_INT_base Port A Interrupt base 0x088 ACA_INT_base Analog Comparator on Port A Interrupt base 0x08E ADCA_INT_base Analog to Digital Converter on Port A Interrupt base 0x096 TWID_INT_base Two-Wire Interface on Port D Interrupt base 0x09A TCD0_INT_base Timer/Counter 0 on port D Interrupt base 0x0A6 TCD1_INT_base Timer/Counter 1 on port D Interrupt base 0x0AE SPID_INT_vector SPI on port D Interrupt vector 0x0B0 USARTD0_INT_base USART 0 on port D Interrupt base 0x0B6 USARTD1_INT_base USART 1 on port D Interrupt base 0x0BC PORTQ_INT_base Port Q INT base 0x0C0 PORTH_INT_base Port H INT base 0x0C4 PORTJ_INT_base Port J INT base 0x0C8 PORTK_INT_base Port K INT base 0x0D0 PORTF_INT_base Port F INT base 0x0D4 TWIF_INT_base Two-Wire Interface on Port F INT base 0x0D8 TCF0_INT_base Timer/Counter 0 on port F Interrupt base 0x0E4 TCF1_INT_base Timer/Counter 1 on port F Interrupt base 0x0EC SPIF_INT_vector SPI ion port F Interrupt base 0x0EE USARTF0_INT_base USART 0 on port F Interrupt base 0x0F4 USARTF1_INT_base USART 1 on port F Interrupt base 26 8067I–AVR–04/09 XMEGA A1 14. I/O Ports 14.1 Features • Selectable input and output configuration for each pin individually • Flexible pin configuration through dedicated Pin Configuration Register • Synchronous and/or asynchronous input sensing with port interrupts and events • • • • • • • • • • 14.2 – Sense both edges – Sense rising edges – Sense falling edges – Sense low level Asynchronous wake-up from all input sensing configurations Two port interrupts with flexible pin masking Highly configurable output driver and pull settings: – Totem-pole – Pull-up/-down – Wired-AND – Wired-OR – Bus-keeper – Inverted I/O Optional Slew rate control Configuration of multiple pins in a single operation Read-Modify-Write (RMW) support Toggle/clear/set registers for Output and Direction registers Clock output on port pin Event Channel 7 output on port pin Mapping of port registers (virtual ports) into bit accessible I/O memory space Overview The XMEGA A1 devices have flexible General Purpose I/O Ports. A port consists of up to 8 pins, ranging from pin 0 to pin 7. The ports implement several functions, including synchronous/asynchronous input sensing, pin change interrupts and configurable output settings. All functions are individual per pin, but several pins may be configured in a single operation. 14.3 I/O configuration All port pins (Pn) have programmable output configuration. In addition, all port pins have an inverted I/O function. For an input, this means inverting the signal between the port pin and the pin register. For an output, this means inverting the output signal between the port register and the port pin. The inverted I/O function can be used also when the pin is used for alternate functions. The port pins also have configurable slew rate limitation to reduce electromagnetic emission. 27 8067I–AVR–04/09 XMEGA A1 14.3.1 Push-pull Figure 14-1. I/O configuration - Totem-pole DIRn OUTn Pn INn 14.3.2 Pull-down Figure 14-2. I/O configuration - Totem-pole with pull-down (on input) DIRn OUTn Pn INn 14.3.3 Pull-up Figure 14-3. I/O configuration - Totem-pole with pull-up (on input) DIRn OUTn Pn INn 14.3.4 Bus-keeper The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’. 28 8067I–AVR–04/09 XMEGA A1 Figure 14-4. I/O configuration - Totem-pole with bus-keeper DIRn OUTn Pn INn 14.3.5 Others Figure 14-5. Output configuration - Wired-OR with optional pull-down OUTn Pn INn Figure 14-6. I/O configuration - Wired-AND with optional pull-up INn Pn OUTn 29 8067I–AVR–04/09 XMEGA A1 14.4 Input sensing • • • • Sense both edges Sense rising edges Sense falling edges Sense low level Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is shown in Figure 14-7 on page 30. Figure 14-7. Input sensing system overview Asynchronous sensing EDGE DETECT Interrupt Control IREQ Synchronous sensing Pn Synchronizer INn D Q D Q INVERTED I/O R EDGE DETECT Event R When a pin is configured with inverted I/O the pin value is inverted before the input sensing. 14.5 Port Interrupt Each ports have two interrupts with seperate priority and interrupt vector. All pins on the port can be individually selected as source for each of the interrupts. The interrupts are then triggered according to the input sense configuration for each pin configured as source for the interrupt. 14.6 Alternate Port Functions In addition to the input/output functions on all port pins, most pins have alternate functions. This means that other modules or peripherals connected to the port can use the port pins for their functions, such as communication or pulse-width modulation. “Pinout and Pin Functions” on page 49 shows which modules on peripherals that enables alternate functions on a pin, and what alternate functions that is available on a pin. 30 8067I–AVR–04/09 XMEGA A1 15. T/C - 16-bit Timer/Counter 15.1 Features • Eight 16-bit Timer/Counters • • • • • • • • • • • • 15.2 – Four Timer/Counters of type 0 – Four Timer/Counters of type 1 Four Compare or Capture (CC) Channels in Timer/Counter 0 Two Compare or Capture (CC) Channels in Timer/Counter 1 Double Buffered Timer Period Setting Double Buffered Compare or Capture Channels Waveform Generation: – Single Slope Pulse Width Modulation – Dual Slope Pulse Width Modulation – Frequency Generation Input Capture: – Input Capture with Noise Cancelling – Frequency capture – Pulse width capture – 32-bit input capture Event Counter with Direction Control Timer Overflow and Timer Error Interrupts and Events One Compare Match or Capture Interrupt and Event per CC Channel Supports DMA Operation Hi-Resolution Extension (Hi-Res) Advanced Waveform Extension (AWEX) Overview XMEGA A1 has eight Timer/Counters, four Timer/Counter 0 and four Timer/Counter 1. The difference between them is that Timer/Counter 0 has four Compare/Capture channels, while Timer/Counter 1 has two Compare/Capture channels. The Timer/Counters (T/C) are 16-bit and can count any clock, event or external input in the microcontroller. A programmable prescaler is available to get a useful T/C resolution. Updates of Timer and Compare registers are double buffered to ensure glitch free operation. Single slope PWM, dual slope PWM and frequency generation waveforms can be generated using the Compare Channels. Through the Event System, any input pin or event in the microcontroller can be used to trigger input capture, hence no dedicated pins is required for this. The input capture has a noise canceller to avoid incorrect capture of the T/C, and can be used to do frequency and pulse width measurements. A wide range of interrupt or event sources are available, including T/C Overflow, Compare match and Capture for each Compare/Capture channel in the T/C. PORTC, PORTD, PORTE and PORTF each has one Timer/Counter 0 and one Timer/Counter1. Notation of these Timer/Counters are TCC0 (Time/Counter C0), TCC1, TCD0, TCD1, TCE0, TCE1, TCF0, and TCF1, respectively. 31 8067I–AVR–04/09 XMEGA A1 Figure 15-1. Overview of a Timer/Counter and closely related peripherals Timer/Counter Base Counter Timer Period Counter Prescaler Control Logic clkPER Event System clkPER4 Buffer Capture Control Waveform Generation DTI Dead-Time Insertion Pattern Generation Fault Protection PORT Comparator AWeX Hi-Res Compare/Capture Channel D Compare/Capture Channel C Compare/Capture Channel B Compare/Capture Channel A The Hi-Resolution Extension can be enabled to increase the waveform generation resolution by 2 bits (4x). This is available for all Timer/Counters. See “Hi-Res - High Resolution Extension” on page 34 for more details. The Advanced Waveform Extension can be enabled to provide extra and more advanced features for the Timer/Counter. This are only available for Timer/Counter 0. See “AWEX - Advanced Waveform Extension” on page 33 for more details. 32 8067I–AVR–04/09 XMEGA A1 16. AWEX - Advanced Waveform Extension 16.1 Features • • • • • • • • 16.2 Output with complementary output from each Capture channel Four Dead Time Insertion (DTI) Units, one for each Capture channel 8-bit DTI Resolution Separate High and Low Side Dead-Time Setting Double Buffered Dead-Time Event Controlled Fault Protection Single Channel Multiple Output Operation (for BLDC motor control) Double Buffered Pattern Generation Overview The Advanced Waveform Extension (AWEX) provides extra features to the Timer/Counter in Waveform Generation (WG) modes. The AWEX enables easy and safe implementation of for example, advanced motor control (AC, BLDC, SR, and Stepper) and power control applications. Any WG output from a Timer/Counter 0 is split into a complimentary pair of outputs when any AWEX feature is enabled. These output pairs go through a Dead-Time Insertion (DTI) unit that enables generation of the non-inverted Low Side (LS) and inverted High Side (HS) of the WG output with dead time insertion between LS and HS switching. The DTI output will override the normal port value according to the port override setting. Optionally the final output can be inverted by using the invert I/O setting for the port pin. The Pattern Generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition, the waveform generator output from Compare Channel A can be distributed to, and override all port pins. When the Pattern Generator unit is enabled, the DTI unit is bypassed. The Fault Protection unit is connected to the Event System. This enables any event to trigger a fault condition that will disable the AWEX output. Several event channels can be used to trigger fault on several different conditions. The AWEX is available for TCC0 and TCE0. The notation of these peripherals are AWEXC and AWEXE. 33 8067I–AVR–04/09 XMEGA A1 17. Hi-Res - High Resolution Extension 17.1 Features • Increases Waveform Generator resolution by 2-bits (4x) • Supports Frequency, single- and dual-slope PWM operation • Supports the AWEX when this is enabled and used for the same Timer/Counter 17.2 Overview The Hi-Resolution (Hi-Res) Extension is able to increase the resolution of the waveform generation output by a factor of 4. When enabled for a Timer/Counter, the Fast Peripheral clock running at four times the CPU clock speed will be as input to the Timer/Counter. The High Resolution Extension can also be used when an AWEX is enabled and used with a Timer/Counter. XMEGA A1 devices have four Hi-Res Extensions that each can be enabled for each Timer/Counters pair on PORTC, PORTD, PORTE and PORTF. The notation of these peripherals are HIRESC, HIRESD, HIRESE and HIRESF, respectively. 34 8067I–AVR–04/09 XMEGA A1 18. RTC - 16-bit Real-Time Counter 18.1 Features • • • • • • 18.2 16-bit Timer Flexible Tick resolution ranging from 1 Hz to 32.768 kHz One Compare register One Period register Clear timer on Overflow or Compare Match Overflow or Compare Match event and interrupt generation Overview The XMEGA A1 includes a 16-bit Real-time Counter (RTC). The RTC can be clocked from an accurate 32.768 kHz Crystal Oscillator, the 32.768 kHz Calibrated Internal Oscillator, or from the 32 kHz Ultra Low Power Internal Oscillator. The RTC includes both a Period and a Compare register. For details, see Figure 18-1. A wide range of Resolution and Time-out periods can be configured using the RTC. With a maximum resolution of 30.5 µs, time-out periods range up to 2000 seconds. With a resolution of 1 second, the maximum time-out period is over 18 hours (65536 seconds). Figure 18-1. Real Time Counter overview Period 32 kHz = 10-bit prescaler 1 kHz Overflow Counter = Compare Match Compare 35 8067I–AVR–04/09 XMEGA A1 19. TWI - Two-Wire Interface 19.1 Features • • • • • • • • • • • • 19.2 Four Identical TWI peripherals Simple yet Powerful and Flexible Communication Interface Both Master and Slave Operation Supported Device can Operate as Transmitter or Receiver 7-bit Address Space Allows up to 128 Different Slave Addresses Multi-master Arbitration Support Up to 400 kHz Data Transfer Speed Slew-rate Limited Output Drivers Noise Suppression Circuitry Rejects Spikes on Bus Lines Fully Programmable Slave Address with General Call Support Address Recognition Causes Wake-up when in Sleep Mode I2C and System Management Bus (SMBus) compatible Overview The Two-Wire Interface (TWI) is a bi-directional wired-AND bus with only two lines, the clock (SCL) line and the data (SDA) line. The protocol makes it possible to interconnect up to 128 individually addressable devices. Since it is a multi-master bus, one or more devices capable of taking control of the bus can be connected. The only external hardware needed to implement the bus is a single pull-up resistor for each of the TWI bus lines. Mechanisms for resolving bus contention are inherent in the TWI protocol. PORTC, PORTD, PORTE, and PORTF each has one TWI. Notation of these peripherals are TWIC, TWID, TWIE, and TWIF, respectively. 36 8067I–AVR–04/09 XMEGA A1 20. SPI - Serial Peripheral Interface 20.1 Features • • • • • • • • • 20.2 Four Identical SPI peripherals Full-duplex, Three-wire Synchronous Data Transfer Master or Slave Operation LSB First or MSB First Data Transfer Seven Programmable Bit Rates End of Transmission Interrupt Flag Write Collision Flag Protection Wake-up from Idle Mode Double Speed (CK/2) Master SPI Mode Overview The Serial Peripheral Interface (SPI) allows high-speed full-duplex, synchronous data transfer between different devices. Devices can communicate using a master-slave scheme, and data is transferred both to and from the devices simultaneously. PORTC, PORTD, PORTE, and PORTF each has one SPI. Notation of these peripherals are SPIC, SPID, SPIE, and SPIF, respectively. 37 8067I–AVR–04/09 XMEGA A1 21. USART 21.1 Features • • • • • • • • • • • • • • • 21.2 Eight Identical USART peripherals Full Duplex Operation (Independent Serial Receive and Transmit Registers) Asynchronous or Synchronous Operation Master or Slave Clocked Synchronous Operation High-resolution Arithmetic Baud Rate Generator Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits Odd or Even Parity Generation and Parity Check Supported by Hardware Data OverRun Detection Framing Error Detection Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete Multi-processor Communication Mode Double Speed Asynchronous Communication Mode Master SPI mode for SPI communication IrDA support through the IRCOM module Overview The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a highly flexible serial communication module. The USART supports full duplex communication, and both asynchronous and clocked synchronous operation. The USART can also be set in Master SPI mode to be used for SPI communication. Communication is frame based, and the frame format can be customized to support a wide range of standards. The USART is buffered in both direction, enabling continued data transmission without any delay between frames. There are separate interrupt vectors for receive and transmit complete, enabling fully interrupt driven communication. Frame error and buffer overflow are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can also be enabled. One USART can use the IRCOM module to support IrDA 1.4 physical compliant pulse modulation and demodulation for baud rates up to 115.2 kbps. PORTC, PORTD, PORTE, and PORTF each has two USARTs. Notation of these peripherals are USARTC0, USARTC1, USARTD0, USARTD1, USARTE0, USARTE1, USARTF0, USARTF1, respectively. 38 8067I–AVR–04/09 XMEGA A1 22. IRCOM - IR Communication Module 22.1 Features • Pulse modulation/demodulation for infrared communication • Compatible to IrDA 1.4 physical for baud rates up to 115.2 kbps • Selectable pulse modulation scheme – 3/16 of baud rate period – Fixed pulse period, 8-bit programmable – Pulse modulation disabled • Built in filtering • Can be connected to and used by one USART at a time 22.2 Overview XMEGA contains an Infrared Communication Module (IRCOM) for IrDA communication with baud rates up to 115.2 kbps. This supports three modulation schemes: 3/16 of baud rate period, fixed programmable pulse time based on the Peripheral Clock speed, or pulse modulation disabled. There is one IRCOM available which can be connected to any USART to enable infrared pulse coding/decoding for that USART. 39 8067I–AVR–04/09 XMEGA A1 23. Crypto Engine 23.1 Features • Data Encryption Standard (DES) CPU instruction • Advanced Encryption Standard (AES) Crypto module • DES Instruction – Encryption and Decryption – Single-cycle DES instruction – Encryption/Decryption in 16 clock cycles per 8-byte block • AES Crypto Module – Encryption and Decryption – Support 128-bit keys – Support XOR data load mode to the State memory for Cipher Block Chaining – Encryption/Decryption in 375 clock cycles per 16-byte block 23.2 Overview The Advanced Encryption Standard (AES) and Data Encryption Standard (DES) are two commonly used encryption standards. These are supported through an AES peripheral module and a DES CPU instruction. All communication interfaces and the CPU can optionally use AES and DES encrypted communication and data storage. DES is supported by a DES instruction in the AVR XMEGA CPU. The 8-byte key and 8-byte data blocks must be loaded into the Register file, and then DES must be executed 16 times to encrypt/decrypt the data block. The AES Crypto Module encrypts and decrypts 128-bit data blocks with the use of a 128-bit key. The key and data must be loaded into the key and state memory in the module before encryption/decryption is started. It takes 375 peripheral clock cycles before the encryption/decryption is done and decrypted/encrypted data can be read out, and an optional interrupt can be generated. The AES Crypto Module also has DMA support with transfer triggers when encryption/decryption is done and optional auto-start of encryption/decryption when the state memory is fully loaded. 40 8067I–AVR–04/09 XMEGA A1 24. ADC - 12-bit Analog to Digital Converter 24.1 Features • • • • • • • • • • • • • 24.2 Two ADCs with 12-bit resolution 2 Msps sample rate for each ADC Signed and Unsigned conversions 4 result registers with individual input channel control for each ADC 8 single ended inputs for each ADC 8x4 differential inputs for each ADC 4 internal inputs: – Integrated Temperature Sensor – DAC Output – VCC voltage divided by 10 – Bandgap voltage Software selectable gain of 2, 4, 8, 16, 32 or 64 Software selectable resolution of 8- or 12-bit. Internal or External Reference selection Event triggered conversion for accurate timing DMA transfer of conversion results Interrupt/Event on compare result Overview XMEGA A1 devices have two Analog to Digital Converters (ADC), see Figure 24-1 on page 42. The two ADC modules can be operated simultaneously, individually or synchronized. The ADC converts analog voltages to digital values. The ADC has 12-bit resolution and is capable of converting up to 2 million samples per second. The input selection is flexible, and both single-ended and differential measurements can be done. For differential measurements an optional gain stage is available to increase the dynamic range. In addition several internal signal inputs are available. The ADC can provide both signed and unsigned results. This is a pipeline ADC. A pipeline ADC consists of several consecutive stages, where each stage convert one part of the result. The pipeline design enables high sample rate at low clock speeds, and remove limitations on samples speed versus propagation delay. This also means that a new analog voltage can be sampled and a new ADC measurement started while other ADC measurements are ongoing. ADC measurements can either be started by application software or an incoming event from another peripheral in the device. Four different result registers with individual input selection (MUX selection) are provided to make it easier for the application to keep track of the data. Each result register and MUX selection pair is referred to as an ADC Channel. It is possible to use DMA to move ADC results directly to memory or peripherals when conversions are done. Both internal and external analog reference voltages can be used. An accurate internal 1.0V reference is available. An integrated temperature sensor is available and the output from this can be measured with the ADC. The output from the DAC, VCC/10 and the Bandgap voltage can also be measured by the ADC. 41 8067I–AVR–04/09 XMEGA A1 Figure 24-1. ADC overview Channel A MUX selection Channel D MUX selection Configuration Reference selection Channel A Register Pin inputs Channel B Register ADC Pin inputs Internal inputs Channel B MUX selection Channel C MUX selection Event Trigger Channel C Register 1-64 X Channel D Register Each ADC has four MUX selection registers with a corresponding result register. This means that four channels can be sampled within 1.5 µs without any intervention by the application other than starting the conversion. The results will be available in the result registers. The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 3.5 µs for 12-bit to 2.5 µs for 8-bit result. ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when the result is represented as a signed integer (signed 16-bit number). PORTA and PORTB each has one ADC. Notation of these peripherals are ADCA and ADCB, respectively. 42 8067I–AVR–04/09 XMEGA A1 25. DAC - 12-bit Digital to Analog Converter 25.1 Features • • • • • • • • 25.2 Two DACs with 12-bit resolution Up to 1 Msps conversion rate for each DAC Flexible conversion range Multiple trigger sources 1 continuous output or 2 Sample and Hold (S/H) outputs for each DAC Built-in offset and gain calibration High drive capabilities Low Power Mode Overview The XMEGA A1 devices features two 12-bit, 1 Msps DACs with built-in offset and gain calibration, see Figure 25-1 on page 43. A DAC converts a digital value into an analog signal. The DAC may use an internal 1.1 voltage as the upper limit for conversion, but it is also possible to use the supply voltage or any applied voltage in-between. The external reference input is shared with the ADC reference input. Figure 25-1. DAC overview Configuration Reference selection Channel A Register Channel A DAC Channel B Channel B Register Event Trigger Each DAC has one continuous output with high drive capabilities for both resistive and capacitive loads. It is also possible to split the continuous time channel into two Sample and Hold (S/H) channels, each with separate data conversion registers. A DAC conversion may be started from the application software by writing the data conversion registers. The DAC can also be configured to do conversions triggered by the Event System to have regular timing, independent of the application software. DMA may be used for transferring data from memory locations to DAC data registers. The DAC has a built-in calibration system to reduce offset and gain error when loading with a calibration value from software. PORTA and PORTB each has one DAC. Notation of these peripherals are DACA and DACB. respectively. 43 8067I–AVR–04/09 XMEGA A1 26. AC - Analog Comparator 26.1 Features • Four Analog Comparators • Selectable Power vs. Speed • Selectable hysteresis – 0, 20 mV, 50 mV • Analog Comparator output available on pin • Flexible Input Selection – All pins on the port – Output from the DAC – Bandgap reference voltage. – Voltage scaler that can perform a 64-level scaling of the internal VCC voltage. • Interrupt and event generation on – Rising edge – Falling edge – Toggle • Window function interrupt and event generation on – Signal above window – Signal inside window – Signal below window 26.2 Overview XMEGA A1 features four Analog Comparators (AC). An Analog Comparator compares two voltages, and the output indicates which input is largest. The Analog Comparator may be configured to give interrupt requests and/or events upon several different combinations of input change. Both hysteresis and propagation delays may be adjusted in order to find the optimal operation for each application. A wide range of input selection is available, both external pins and several internal signals can be used. The Analog Comparators are always grouped in pairs (AC0 and AC1) on each analog port. They have identical behavior but separate control registers. Optionally, the state of the comparator is directly available on a pin. PORTA and PORTB each has one AC pair. Notations are ACA and ACB, respectively. 44 8067I–AVR–04/09 XMEGA A1 Figure 26-1. Analog comparator overview Pin inputs Internal inputs + Pin 0 output AC0 Pin inputs - Internal inputs VCC scaled Interrupt sensitivity control Pin inputs Interrupts Events Internal inputs + AC1 Pin inputs Internal inputs - VCC scaled 45 8067I–AVR–04/09 XMEGA A1 26.3 Input Selection The Analog comparators have a very flexible input selection and the two comparators grouped in a pair may be used to realize a window function. One pair of analog comparators is shown in Figure 26-1 on page 45. • Input selection from pin – Pin 0, 1, 2, 3, 4, 5, 6 selectable to positive input of analog comparator – Pin 0, 1, 3, 5, 7 selectable to negative input of analog comparator • Internal signals available on positive analog comparator inputs – Output from 12-bit DAC • Internal signals available on negative analog comparator inputs – 64-level scaler of the VCC, available on negative analog comparator input – Bandgap voltage reference – Output from 12-bit DAC 26.4 Window Function The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in Figure 26-2. Figure 26-2. Analog comparator window function + AC0 Upper limit of window Interrupt sensitivity control Input signal Interrupts Events + AC1 Lower limit of window - 46 8067I–AVR–04/09 XMEGA A1 27. OCD - On-chip Debug 27.1 Features • Complete Program Flow Control – Go, Stop, Reset, Step into, Step over, Step out, Run-to-Cursor Debugging on C and high-level language source code level Debugging on Assembler and disassembler level 1 dedicated program address or source level breakpoint for AVR Studio / debugger 4 Hardware Breakpoints Unlimited Number of User Program Breakpoints Unlimited Number of User Data Breakpoints, with break on: – Data location read, write or both read and write – Data location content equal or not equal to a value – Data location content is greater or less than a value – Data location content is within or outside a range – Bits of a data location are equal or not equal to a value • Non-Intrusive Operation – No hardware or software resources in the device are used • High Speed Operation – No limitation on debug/programming clock frequency versus system clock frequency • • • • • • 27.2 Overview The XMEGA A1 has a powerful On-Chip Debug (OCD) system that - in combination with Atmel’s development tools - provides all the necessary functions to debug an application. It has support for program and data breakpoints, and can debug an application from C and high level language source code level, as well as assembler and disassembler level. It has full Non-Intrusive Operation and no hardware or software resources in the device are used. The ODC system is accessed through an external debugging tool which connects to the JTAG or PDI physical interfaces. Refer to “PDI - Program and Debug Interface” on page 48. 47 8067I–AVR–04/09 XMEGA A1 28. PDI - Program and Debug Interface 28.1 Features • • • • • 28.2 PDI - Program and Debug Interface (Atmel proprietary 2-pin interface) JTAG Interface (IEEE std. 1149.1 compliant) Boundary-scan capabilities according to the IEEE Std. 1149.1 (JTAG) Access to the OCD system Programming of Flash, EEPROM, Fuses and Lock Bits Overview The programming and debug facilities are accessed through the JTAG and PDI physical interfaces. The PDI physical interface uses one dedicated pin together with the Reset pin, and no general purpose pins are used. JTAG uses four general purpose pins on PORTB. The PDI is an Atmel proprietary protocol for communication between the microcontroller and Atmel’s or third party development tools. 28.3 JTAG interface The JTAG physical layer handles the basic low-level serial communication over four I/O lines named TMS, TCK, TDI, and TDO. It complies to the IEEE Std. 1149.1 for test access port and boundary scan. 48 8067I–AVR–04/09 XMEGA A1 29. Pinout and Pin Functions The pinout of XMEGA A1 is shown in “Pinout/Block Diagram” on page 3. In addition to general I/O functionality, each pin may have several functions. This will depend on which peripheral is enabled and connected to the actual pin. Only one of the alternate pin functions can be used at time. 29.1 Alternate Pin Function Description The tables below shows the notation for all pin functions available and describes its function. 29.1.1 29.1.2 29.1.3 29.1.4 Operation/Power Supply VCC Digital supply voltage AVCC Analog supply voltage GND Ground Port Interrupt functions SYNC Port pin with full synchronous and limited asynchronous interrupt function ASYNC Port pin with full synchronous and full asynchronous interrupt function Analog functions ACn Analog Comparator input pin n AC0OUT Analog Comparator 0 Output ADCn Analog to Digital Converter input pin n DACn Digital to Analog Converter output pin n AREF Analog Reference input pin An Address line n Dn Data line n CSn Chip Select n ALEn Address Latch Enable pin n (SRAM) RE Read Enable (SRAM) WE External Data Memory Write (SRAM /SDRAM) BAn Bank Address (SDRAM) CAS Column Access Strobe (SDRAM) CKE SDRAM Clock Enable (SDRAM) CLK SDRAM Clock (SDRAM) DQM Data Mask Signal/Output Enable (SDRAM) RAS Row Access Strobe (SDRAM) EBI functions 49 8067I–AVR–04/09 XMEGA A1 29.1.5 29.1.6 29.1.7 29.1.8 Timer/Counter and AWEX functions OCnx Output Compare Channel x for Timer/Counter n OCxn Inverted Output Compare Channel x for Timer/Counter n Communication functions SCL Serial Clock for TWI SDA Serial Data for TWI SCLIN Serial Clock In for TWI when external driver interface is enabled SCLOUT Serial Clock Out for TWI when external driver interface is enabled SDAIN Serial Data In for TWI when external driver interface is enabled SDAOUT Serial Data Out for TWI when external driver interface is enabled XCKn Transfer Clock for USART n RXDn Receiver Data for USART n TXDn Transmitter Data for USART n SS Slave Select for SPI MOSI Master Out Slave In for SPI MISO Master In Slave Out for SPI SCK Serial Clock for SPI Oscillators, Clock and Event TOSCn Timer Oscillator pin n XTALn Input/Output for inverting Oscillator pin n CLKOUT Peripheral Clock Output EVOUT Event Channel 0 Output Debug/System functions RESET Reset pin PDI_CLK Program and Debug Interface Clock pin PDI_DATA Program and Debug Interface Data pin TCK JTAG Test Clock TDI JTAG Test Data In TDO JTAG Test Data Out TMS JTAG Test Mode Select 50 8067I–AVR–04/09 XMEGA A1 29.2 Alternate Pin Functions The tables below show the primary/default function for each pin on a port in the first column, the pin number in the second column, and then all alternate pin functions in the remaining columns. The head row shows what peripheral that enable and use the alternate pin functions. Table 29-1. PORT A PIN # Port A - Alternate functions INTERRUPT ADCA POS ADCA NEG ADCA GAINPOS SYNC ADC0 ADC0 ADC0 ADCA GAINNEG ACA POS ACA NEG AC0 AC0 AC1 GND 93 AVCC 94 PA0 95 PA1 96 SYNC ADC1 ADC1 ADC1 AC1 PA2 97 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 PA3 98 SYNC ADC3 ADC3 PA4 99 SYNC ADC4 PA5 100 SYNC PA6 1 SYNC PA7 2 SYNC ADC7 Table 29-2. PORT B PIN # ADC3 ADC4 AC4 ADC5 ADC5 ADC5 AC5 ADC6 ADC6 ADC6 AC6 ADC7 ADC7 DACA REFA AREF DAC0 AC3 ADC4 ACA OUT AC3 DAC1 AC5 AC7 AC0OUT Port B - Alternate functions INTERRUPT ADCB POS ADCB NEG ADCB GAINPOS SYNC ADC0 ADC0 ADCB GAINNEG ACB POS ACB NEG ADC0 AC0 AC0 AC1 GND 3 AVCC 4 PB0 5 PB1 6 SYNC ADC1 ADC1 ADC1 AC1 PB2 7 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 PB3 8 SYNC ADC3 ADC3 ADC3 PB4 9 SYNC ADC4 PB5 10 SYNC ADC5 ADC5 ADC5 AC5 PB6 11 SYNC ADC6 ADC6 ADC6 AC6 PB7 12 SYNC ADC7 ADC7 ADC7 ADC4 AC3 ADC4 ACB OUT DACB REFB JTAG AREF DAC0 AC3 DAC1 AC4 TMS AC5 TDI TCK AC7 AC0OUT TDO 51 8067I–AVR–04/09 XMEGA A1 Table 29-3. PORT C PIN # Port C - Alternate functions INTERRUPT TCC0 AWEXC 15 SYNC OC0A OC0A 16 SYNC OC0B OC0A XCK0 PC2 17 SYNC/ASYNC OC0C OC0B RXD0 PC3 18 SYNC OC0D PC4 19 SYNC PC5 20 PC6 21 PC7 22 GND 13 VCC 14 PC0 PC1 Table 29-4. PORT D PIN # TCC1 USARTC0 USARTC1 OC0B EVENTOUT TXD0 OC0C OC1A SS SYNC OC0C OC1B XCK1 MOSI SYNC OC0D RXD1 MISO SYNC OC0D TXD1 SCK CLKOUT EVOUT Port D - Alternate functions INTERRUPT TCD0 SYNC OC0A TCD1 USARTD0 USARTD1 SPID VCC 24 PD0 25 PD1 26 SYNC OC0B XCK0 PD2 27 SYNC/ASYNC OC0C RXD0 PD3 28 SYNC OC0D TXD0 PD4 29 SYNC OC1A PD5 30 SYNC OC1B XCK1 MOSI PD6 31 SYNC RXD1 MISO PD7 32 SYNC TXD1 SCK PIN # CLOCKOUT SCL 23 PORT E TWIC SDA GND Table 29-5. SPIC TWID CLOCKOUT EVENTOUT CLKOUT EVOUT SDA SCL SS Port E - Alternate functions INTERRUPT TCE0 AWEXE TCE1 USARTE0 GND 33 VCC 34 PE0 35 SYNC OC0A OC0A PE1 36 SYNC OC0B OC0A XCK0 PE2 37 SYNC/ASYNC OC0C OC0B RXD0 PE3 38 SYNC OC0D PE4 39 SYNC OC0C OC1A PE5 40 SYNC OC0C OC1B PE6 41 SYNC PE7 42 SYNC USARTE1 SPIE TWIE CLOCKOUT EVENTOUT CLKOUT EVOUT SDA OC0B SCL TXD0 SS XCK1 MOSI OC0D RXD1 MISO OC0D TXD1 SCK 52 8067I–AVR–04/09 XMEGA A1 Table 29-6. PORT F PIN # Port F - Alternate functions INTERRUPT TCF0 SYNC OC0A TCF1 USARTF0 USARTF1 SPIF GND 43 VCC 44 PF0 45 PF1 46 SYNC OC0B XCK0 PF2 47 SYNC/ASYNC OC0C RXD0 PF3 48 SYNC OC0D TXD0 PF4 49 SYNC OC1A PF5 50 SYNC OC1B XCK1 MOSI PF6 51 SYNC RXD1 MISO PF7 52 SYNC TXD1 SCK Table 29-7. PORT H PIN # TWIF SDA SCL SS Port H - Alternate functions INTERRUPT SDRAM 3P SRAM ALE1 SRAM ALE12 LPC3 ALE1 LPC2 ALE1 LPC2 ALE12 SYNC WE WE WE WE WE WE 56 SYNC CAS RE RE RE RE RE 57 SYNC/ASYNC RAS ALE1 ALE1 ALE1 ALE1 ALE1 58 SYNC DQM 59 SYNC BA0 CS0/A16 CS0 CS0/A16 CS0 CS0/A16 PH5 60 SYNC BA1 CS1/A17 CS1 CS1/A17 CS1 CS1/A17 PH6 61 SYNC CKE CS2/A18 CS2 CS2/A18 CS2 CS2/A18 PH7 62 SYNC CLK CS3/A19 CS3 CS3/A19 CS3 CS3/A19 GND 53 VCC 54 PH0 55 PH1 PH2 PH3 PH4 Table 29-8. PORT J PIN # ALE2 ALE2 Port J - Alternate functions INTERRUPT SDRAM 3P SRAM ALE1 SRAM ALE12 LPC3 ALE1 LPC2 ALE1 LPC2 ALE12 GND 63 VCC 64 PJ0 65 SYNC D0 D0 D0 D0/A0 D0/A0 D0/A0/A8 PJ1 66 SYNC D1 D1 D1 D1/A1 D1/A1 D1/A1/A9 PJ2 67 SYNC/ASYNC D2 D2 D2 D2/A2 D2/A2 D2/A2/A10 PJ3 68 SYNC D3 D3 D3 D3/A3 D3/A3 D3/A3/A11 PJ4 69 SYNC A8 D4 D4 D4/A4 D4/A4 D4/A4/A12 PJ5 70 SYNC A9 D5 D5 D5/A5 D5/A5 D5/A5/A13 PJ6 71 SYNC A10 D6 D6 D6/A6 D6/A6 D6/A6/A14 PJ7 72 SYNC A11 D7 D7 D7/A7 D7/A7 D7/A7/A15 53 8067I–AVR–04/09 XMEGA A1 Table 29-9. PORT K PIN # Port K - Alternate functions INTERRUPT SDRAM 3P SRAM ALE1 SRAM ALE2 LPC3 ALE1 SYNC A0 A0/A8 A0/A8/A16 A8 GND 73 VCC 74 PK0 75 PK1 76 SYNC A1 A1/A9 A1/A9/A17 A9 PK2 77 SYNC/ASYNC A2 A2/A10 A2/A10/A18 A10 PK3 78 SYNC A3 A3/A11 A3/A11/A19 A11 PK4 79 SYNC A4 A4/A12 A4/A12/A20 A12 PK5 80 SYNC A5 A5/A13 A5/A13/A21 A13 PK6 81 SYNC A6 A6/A14 A6/A14/A22 A14 PK7 82 SYNC A7 A7/A15 A7/A15/A23 A15 Table 29-10. Port Q - Alternate functions PORT Q PIN # INTERRUPT TOSC SYNC TOSC1 86 SYNC TOSC2 87 SYNC/ASYNC 88 SYNC VCC 83 GND 84 PQ0 85 PQ1 PQ2 PQ3 Table 29-11. Port R- Alternate functions PORT R PIN # INTERRUPT PDI XTAL PDI 89 PDI_DATA RESET 90 PDI_CLOCK PRO 91 SYNC XTAL2 PR1 92 SYNC XTAL1 54 8067I–AVR–04/09 XMEGA A1 30. Peripheral Module Address Map The address maps show the base address for each peripheral and module in XMEGA A1. For complete register description and summary for each peripheral module, refer to the XMEGA A Manual. Base Address 0x0000 0x0010 0x0014 0x0018 0x001C 0x0030 0x0040 0x0048 0x0050 0x0060 0x0068 0x0070 0x0078 0x0080 0x0090 0x00A0 0x00B0 0x00C0 0x0100 0x0180 0x01C0 0x0200 0x0240 0x0300 0x0320 0x0380 0x0390 0x0400 0x0440 0x0480 0x0490 0x04A0 0x04B0 0x0600 0x0620 0x0640 0x0660 0x0680 0x06A0 0x06E0 0x0700 0x0720 0x07C0 0x07E0 0x0800 0x0840 0x0880 0x0890 0x08A0 0x08B0 0x08C0 0x08F8 0x0900 0x0940 0x0990 0x09A0 0x09B0 0x09C0 0x0A00 Name Description GPIO VPORT0 VPORT1 VPORT2 VPORT3 CPU CLK SLEEP OSC DFLLRC32M DFLLRC2M PR RST WDT MCU PMIC PORTCFG AES DMA EVSYS NVM ADCA ADCB DACA DACB ACA ACB RTC EBI TWIC TWID TWIE TWIF PORTA PORTB PORTC PORTD PORTE PORTF PORTH PORTJ PORTK PORTQ PORTR TCC0 TCC1 AWEXC HIRESC USARTC0 USARTC1 SPIC IRCOM TCD0 TCD1 HIRESD USARTD0 USARTD1 SPID TCE0 General Purpose IO Registers Virtual Port 0 Virtual Port 1 Virtual Port 2 Virtual Port 3 CPU Clock Control Sleep Controller Oscillator Control DFLL for the 32 MHz Internal RC Oscillator DFLL for the 2 MHz RC Oscillator Power Reduction Reset Controller Watch-Dog Timer MCU Control Programmable Multilevel Interrupt Controller Port Configuration AES Module DMA Controller Event System Non Volatile Memory (NVM) Controller Analog to Digital Converter on port A Analog to Digital Converter on port B Digital to Analog Converter on port A Digital to Analog Converter on port B Analog Comparator pair on port A Analog Comparator pair on port B Real Time Counter External Bus Interface Two Wire Interface on port C Two Wire Interface on port D Two Wire Interface on port E Two Wire Interface on port F Port A Port B Port C Port D Port E Port F Port H Port J Port K Port Q Port R Timer/Counter 0 on port C Timer/Counter 1 on port C Advanced Waveform Extension on port C High Resolution Extension on port C USART 0 on port C USART 1 on port C Serial Peripheral Interface on port C Infrared Communication Module Timer/Counter 0 on port D Timer/Counter 1 on port D High Resolution Extension on port D USART 0 on port D USART 1 on port D Serial Peripheral Interface on port D Timer/Counter 0 on port E 55 8067I–AVR–04/09 XMEGA A1 Base Address 0x0A40 0x0A80 0x0A90 0x0AA0 0x0AB0 0x0AC0 0x0B00 0x0B40 0x0B90 0x0BA0 0x0BB0 0x0BC0 Name Description TCE1 AWEXE HIRESE USARTE0 USARTE1 SPIE TCF0 TCF1 HIRESF USARTF0 USARTF1 SPIF Timer/Counter 1 on port E Advanced Waveform Extension on port E High Resolution Extension on port E USART 0 on port E USART 1 on port E Serial Peripheral Interface on port E Timer/Counter 0 on port F Timer/Counter 1 on port F High Resolution Extension on port F USART 0 on port F USART 1 on port F Serial Peripheral Interface on port F 56 8067I–AVR–04/09 XMEGA A1 31. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks Arithmetic and Logic Instructions ADD Rd, Rr Add without Carry Rd ← Rd + Rr Z,C,N,V,S,H 1 ADC Rd, Rr Add with Carry Rd ← Rd + Rr + C Z,C,N,V,S,H 1 ADIW Rd, K Add Immediate to Word Rd ← Rd + 1:Rd + K Z,C,N,V,S 2 SUB Rd, Rr Subtract without Carry Rd ← Rd - Rr Z,C,N,V,S,H 1 SUBI Rd, K Subtract Immediate Rd ← Rd - K Z,C,N,V,S,H 1 SBC Rd, Rr Subtract with Carry Rd ← Rd - Rr - C Z,C,N,V,S,H 1 SBCI Rd, K Subtract Immediate with Carry Rd ← Rd - K - C Z,C,N,V,S,H 1 SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd ← Rd + 1:Rd - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Rd ← Rd • Rr Z,N,V,S 1 ANDI Rd, K Logical AND with Immediate Rd ← Rd • K Z,N,V,S 1 OR Rd, Rr Logical OR Rd ← Rd v Rr Z,N,V,S 1 ORI Rd, K Logical OR with Immediate Rd ← Rd v K Z,N,V,S 1 EOR Rd, Rr Exclusive OR Rd ← Rd ⊕ Rr Z,N,V,S 1 COM Rd One’s Complement Rd ← $FF - Rd Z,C,N,V,S 1 NEG Rd Two’s Complement Rd ← $00 - Rd Z,C,N,V,S,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V,S 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • ($FFh - K) Z,N,V,S 1 INC Rd Increment Rd ← Rd + 1 Z,N,V,S 1 DEC Rd Decrement Rd ← Rd - 1 Z,N,V,S 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V,S 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V,S 1 SER Rd Set Register Rd ← $FF None 1 MUL Rd,Rr Multiply Unsigned R1:R0 ← Rd x Rr (UU) Z,C 2 MULS Rd,Rr Multiply Signed R1:R0 ← Rd x Rr (SS) Z,C 2 MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr (SU) Z,C 2 FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 ← Rd x Rr<<1 (UU) Z,C 2 FMULS Rd,Rr Fractional Multiply Signed R1:R0 ← Rd x Rr<<1 (SS) Z,C 2 FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 ← Rd x Rr<<1 (SU) Z,C 2 DES K Data Encryption if (H = 0) then R15:R0 else if (H = 1) then R15:R0 ← ← Encrypt(R15:R0, K) Decrypt(R15:R0, K) PC ← PC + k + 1 None 2 1/2 Branch Instructions RJMP k Relative Jump IJMP Indirect Jump to (Z) PC(15:0) PC(21:16) ← ← Z, 0 None 2 EIJMP Extended Indirect Jump to (Z) PC(15:0) PC(21:16) ← ← Z, EIND None 2 JMP k Jump PC ← k None 3 RCALL k Relative Call Subroutine PC ← PC + k + 1 None 2 / 3(1) ICALL Indirect Call to (Z) PC(15:0) PC(21:16) ← ← Z, 0 None 2 / 3(1) EICALL Extended Indirect Call to (Z) PC(15:0) PC(21:16) ← ← Z, EIND None 3(1) 57 8067I–AVR–04/09 XMEGA A1 Mnemonics Operands Description CALL k call Subroutine PC ← RET Subroutine Return PC RETI Interrupt Return CPSE Rd,Rr Compare, Skip if Equal CP Rd,Rr Compare CPC Rd,Rr Compare with Carry CPI Rd,K Compare with Immediate Operation Flags #Clocks k None 3 / 4(1) ← STACK None 4 / 5(1) PC ← STACK I 4 / 5(1) if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 Rd - Rr Z,C,N,V,S,H 1 Rd - Rr - C Z,C,N,V,S,H 1 Rd - K Z,C,N,V,S,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC ← PC + 2 or 3 None 1/2/3 SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC ← PC + 2 or 3 None 2/3/4 SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC ← PC + 2 or 3 None 2/3/4 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC ← PC + k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC ← PC + k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if (I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if (I = 0) then PC ← PC + k + 1 None 1/2 MOV Rd, Rr Copy Register Rd ← Rr None 1 MOVW Rd, Rr Copy Register Pair Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LDS Rd, k Load Direct from data space Rd ← (k) None 2(1)(2) LD Rd, X Load Indirect Rd ← (X) None 1(1)(2) LD Rd, X+ Load Indirect and Post-Increment Rd X ← ← (X) X+1 None 1(1)(2) LD Rd, -X Load Indirect and Pre-Decrement X ← X - 1, Rd ← (X) ← ← X-1 (X) None 2(1)(2) LD Rd, Y Load Indirect Rd ← (Y) ← (Y) None 1(1)(2) LD Rd, Y+ Load Indirect and Post-Increment Rd Y ← ← (Y) Y+1 None 1(1)(2) Data Transfer Instructions 58 8067I–AVR–04/09 XMEGA A1 Mnemonics Operands Description Flags #Clocks LD Rd, -Y Load Indirect and Pre-Decrement Y Rd ← ← Y-1 (Y) None 2(1)(2) LDD Rd, Y+q Load Indirect with Displacement Rd ← (Y + q) None 2(1)(2) LD Rd, Z Load Indirect Rd ← (Z) None 1(1)(2) LD Rd, Z+ Load Indirect and Post-Increment Rd Z ← ← (Z), Z+1 None 1(1)(2) LD Rd, -Z Load Indirect and Pre-Decrement Z Rd ← ← Z - 1, (Z) None 2(1)(2) LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2(1)(2) STS k, Rr Store Direct to Data Space (k) ← Rd None 2(1) ST X, Rr Store Indirect (X) ← Rr None 1(1) ST X+, Rr Store Indirect and Post-Increment (X) X ← ← Rr, X+1 None 1(1) ST -X, Rr Store Indirect and Pre-Decrement X (X) ← ← X - 1, Rr None 2(1) ST Y, Rr Store Indirect (Y) ← Rr None 1(1) ST Y+, Rr Store Indirect and Post-Increment (Y) Y ← ← Rr, Y+1 None 1(1) ST -Y, Rr Store Indirect and Pre-Decrement Y (Y) ← ← Y - 1, Rr None 2(1) STD Y+q, Rr Store Indirect with Displacement (Y + q) ← Rr None 2(1) ST Z, Rr Store Indirect (Z) ← Rr None 1(1) ST Z+, Rr Store Indirect and Post-Increment (Z) Z ← ← Rr Z+1 None 1(1) ST -Z, Rr Store Indirect and Pre-Decrement Z ← Z-1 None 2(1) STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2(1) Load Program Memory R0 ← (Z) None 3 LPM Operation LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Increment Rd Z ← ← (Z), Z+1 None 3 Extended Load Program Memory R0 ← (RAMPZ:Z) None 3 ELPM ELPM Rd, Z Extended Load Program Memory Rd ← (RAMPZ:Z) None 3 ELPM Rd, Z+ Extended Load Program Memory and PostIncrement Rd Z ← ← (RAMPZ:Z), Z+1 None 3 Store Program Memory (RAMPZ:Z) ← R1:R0 None - (RAMPZ:Z) Z ← ← R1:R0, Z+2 None - Rd ← I/O(A) None 1 I/O(A) ← Rr None 1 STACK ← Rr None 1(1) Rd ← STACK None 2(1) Rd(n+1) Rd(0) C ← ← ← Rd(n), 0, Rd(7) Z,C,N,V,H 1 Rd(n) Rd(7) C ← ← ← Rd(n+1), 0, Rd(0) Z,C,N,V 1 SPM SPM Z+ Store Program Memory and Post-Increment by 2 IN Rd, A In From I/O Location OUT A, Rr Out To I/O Location PUSH Rr Push Register on Stack POP Rd Pop Register from Stack Bit and Bit-test Instructions LSL Rd Logical Shift Left LSR Rd Logical Shift Right 59 8067I–AVR–04/09 XMEGA A1 Mnemonics Operands Description ROL Rd Rotate Left Through Carry ROR Rd ASR Rd Operation Flags #Clocks Rd(0) Rd(n+1) C ← ← ← C, Rd(n), Rd(7) Z,C,N,V,H 1 Rotate Right Through Carry Rd(7) Rd(n) C ← ← ← C, Rd(n+1), Rd(0) Z,C,N,V 1 Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0) ↔ Rd(7..4) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 SBI A, b Set Bit in I/O Register I/O(A, b) ← 1 None 1 CBI A, b Clear Bit in I/O Register I/O(A, b) ← 0 None 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C 1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N 1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z 1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I 1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S 1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Two’s Complement Overflow V ← 1 V 1 CLV Clear Two’s Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T 1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H 1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 MCU Control Instructions BREAK Break NOP No Operation SLEEP Sleep WDR Watchdog Reset Notes: (See specific descr. for BREAK) None 1 None 1 (see specific descr. for Sleep) None 1 (see specific descr. for WDR) None 1 1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface. 2. One extra cycle must be added when accessing Internal SRAM. 60 8067I–AVR–04/09 XMEGA A1 32. Packaging information 32.1 100A PIN 1 B PIN 1 IDENTIFIER E1 e E D1 D C 0˚~7˚ A1 A2 A L COMMON DIMENSIONS (Unit of Measure = mm) Notes: 1. This package conforms to JEDEC reference MS-026, Variation AED. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.08 mm maximum. SYMBOL MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 B 0.17 – 0.27 C 0.09 – 0.20 L 0.45 – 0.75 e NOTE Note 2 Note 2 0.50 TYP 10/5/2001 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 100A, 100-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. 100A REV. C 61 8067I–AVR–04/09 XMEGA A1 32.2 100C1 0.12 Z E Marked A1 Identifier SIDE VIEW D A TOP VIEW A1 Øb e A1 Corner 0.90 TYP 10 9 8 7 6 5 4 3 2 1 A 0.90 TYP B C D COMMON DIMENSIONS (Unit of Measure = mm) E D1 F e SYMBOL MIN NOM MAX H A 1.10 – 1.20 I A1 0.30 0.35 0.40 D 8.90 9.00 9.10 E 8.90 9.00 9.10 D1 7.10 7.20 7.30 G J E1 BOTTOM VIEW E1 7.10 7.20 7.30 Øb 0.35 0.40 0.45 e NOTE 0.80 TYP 5/25/06 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 100C1, 100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.80 mm Chip Array BGA Package (CBGA) DRAWING NO. 100C1 REV. A 62 8067I–AVR–04/09 XMEGA A1 32.3 100C2 E A1 BALL ID 0.10 D A1 TOP VIEW A A2 E1 SIDE VIEW 100 - Ø0.35 ± 0.05 J I H G e COMMON DIMENSIONS (Unit of Measure = mm) F D1 E SYMBOL MIN MAX D A – – 1.00 C A1 0.20 – – B A2 0.65 – – D 6.90 7.00 7.10 A D1 1 2 3 4 5 6 7 8 9 b e BOTTOM VIEW NOTE 5.85 BSC 10 E A1 BALL CORNER NOM 6.90 7.00 E1 b 7.10 5.85 BSC 0.30 0.35 e 0.40 0.65 BSC 12/23/08 Package Drawing Contact: [email protected] TITLE 100C2, 100-ball (10 x 10 Array), 0.65 mm Pitch, 7.0 x 7.0 x 1.0 mm, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GPC CIF DRAWING NO. 100C2 REV. A 63 8067I–AVR–04/09 XMEGA A1 33. Electrical Characteristics 33.1 Absolute Maximum Ratings* Operating Temperature.................................. -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin with respect to Ground..-0.5V to VCC+0.5V Maximum Operating Voltage ............................................ 3.6V DC Current per I/O Pin ............................................... 20.0 mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Current VCC and GND Pins................................ 200.0 mA 33.2 DC Characteristics Table 33-1. Symbol Current Consumption Parameter Condition TBD VCC = 3.0V TBD VCC = 1.8V 365 VCC = 3.0V 790 VCC = 1.8V 690 VCC = 3.0V 1400 VCC = 1.8V 710 VCC = 3.0V 1.45 32 MHz, Ext. Clk VCC = 3.0V 18.35 32 MHz, Ext. Clk, T= 85°C VCC = 3.0V 18.4 VCC = 1.8V TBD VCC = 3.0V TBD VCC = 1.8V 135 VCC = 3.0V 255 VCC = 1.8V 270 VCC = 3.0V 510 VCC = 1.8V 275 VCC = 3.0V 520 32 MHz, Ext. Clk VCC = 3.0V 8.15 32 MHz, Ext. Clk, T= 85°C VCC = 3.0V 8.25 1 MHz, Ext. Clk 2 MHz, Ext. Clk 2 MHz, Ext. Clk, T = 85°C ICC Power Supply Current(1) 32 kHz, Ext. Clk 1 MHz, Ext. Clk Idle Typ. VCC = 1.8V 32 kHz, Ext. Clk Active Min. 2 MHz, Ext. Clk 2 MHz, Ext. Clk, T = 85°C Max. Units µA mA µA mA 64 8067I–AVR–04/09 XMEGA A1 Table 33-1. Symbol Current Consumption (Continued) Parameter Condition Typ. All Functions Disabled VCC = 3.0V 0.1 All Functions Disabled, T = 85°C VCC = 3.0V 2 VCC = 1.8V 1.1 VCC = 3.0V 1.2 ULP, WDT, Sampled BOD, T=85°C VCC = 3.0V TBD RTC 1.024 kHz from Low Power 32.768 kHz TOSC VCC = 1.8V 0.55 VCC = 3.0V 0.65 RTC from Low Power 32.768 kHz TOSC VCC = 1.8V 0.55 VCC = 3.0V 1.15 VCC = 3.0V TBD Power-down mode ULP, WDT, Sampled BOD ICC Min. Power-save mode Reset Current Consumption Max. Units µA Module current consumption(2) RC32M 395 RC2M 120 RC2M w/DFLL Internal 32.768 kHz oscillator as DFLL source RC32K 30 EXT CLK PLL TBD Multiplication factor = 10x External Clock Source Fail Monitor ICC 155 195 TBD Watchdog normal mode 1 BOD Continuous mode 120 BOD Sampled mode 1 Internal 1.00 V ref 85 Temperature reference 80 RTC with int. 32 kHz RC as source No prescaling 30 RTC with ULP as source No prescaling 1 RTC with 1 kHz TOSC as source No prescaling TBD ADC 250 ksps in free running mode, internal 1.00V ref. DAC Normal Mode Single channel, Internal 1.00V reference TBD DAC Low-Power Mode Single channel, Internal 1.00V reference TBD DAC S/H Internal 1.00V reference, Refresh 16CLK 2.3 DAC Low-Power Mode S/H Internal 1.00V reference, Refresh 16CLK TBD µA 3.6 mA 65 8067I–AVR–04/09 XMEGA A1 Table 33-1. Symbol ICC Current Consumption (Continued) Parameter Condition Min. Typ. AC High-speed 220 AC Low-power 110 USART Rx and Tx enabled, 9600 BAUD 7.5 DMA 1 MBps data rate 180 Timer/Counter Prescaler DIV1 18 Units µA AES Note: Max. 195 1. All Power Reduction Registers set. T = 25°C if not specified. 2. All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC = 3.0V, ClkSYS = 1 MHz External clock with no prescaling, T = 25°C. 33.3 Speed Table 33-2. Symbol ClkSYS Speed Parameter Condition System clock frequency Min Typ Max VCC = 1.6V 0 12 VCC = 1.8V 0 12 VCC = 2.7V 0 32 VCC = 3.6V 0 32 Units MHz The maximum System clock frequency of the XMEGA A1 devices is depending on VCC. As shown in Figure 33-1 on page 66 the Frequency vs. V C C curve is linear between 1.8V < VCC < 2.7V. Figure 33-1. Operating Frequency vs. Vcc MHz 32 Safe Operating Area 12 1.6 1.8 2.7 3.6 V 66 8067I–AVR–04/09 XMEGA A1 33.4 ADC Characteristics Table 33-3. ADC Characteristics Symbol Parameter Condition RES Resolution Programmable: 8/12 INL Integral Non-Linearity 500 ksps DNL Differential Non-Linearity 500 ksps ADCclk Min Typ Max Units 8 12 12 Bits < ±1 ±1 < ±10 mV Offset Error ±2 mV ADC Clock frequency Max is 1/4 of Peripheral Clock Conversion time (propagation delay) (RES+2)/2+GAIN RES = 8 or 12, GAIN = 0 or 1 Sampling Time 1/2 ADCclk cycle 5 7 2000 kHz 2000 ksps 8 ADCclk cycles 0.25 uS Conversion range 0 VREF V Reference voltage 1.0 Vcc-0.6V V Input bandwidth INT1V LSB Gain Error Conversion rate VREF LSB kHz Internal 1.00V reference 1.00 V INTVCC Internal VCC/1.6 VCC/1.6 V SCALEDVCC Scaled internal VCC/10 input VCC/10 V Reference input resistance > 10 MΩ RAREF Start-up time Internal input sampling speed Table 33-4. Symbol µs Parameter Condition 1 to 64 gain Noise level at input Min Typ Max < ±1 Offset error Units % < ±1 VREF = Int 1.00V 0.12 VREF = Ext 2 V 0.06 mV 64x gain Conversion rate Rs ksps ADC Gain Stage Characteristics Gain error Vrms 100 Temp. sensor, VCC/10, Bandgap 1000 Input impedance All channels, full speed Start-up time ADC conversion rate ksps Ω cycle 67 8067I–AVR–04/09 XMEGA A1 33.5 DAC Characteristics Table 33-5. Symbol DAC Characteristics Parameter Condition Min Typ Max Units Single channel mode VREF = Ext. ref INL Integral Non-Linearity DNL Differential Non-Linearity VCC = 1.6-3.6V VCC = 1.6-3.6V 5 VREF= AVCC LSB VREF = Ext. ref 0.6 VREF= AVCC 0.6 <±1 Conversion rate Fclk AREF External reference voltage 1.1 Reference input impedance 1000 ksps AVCC-0.6 V >10 MΩ DC output impedance Max output voltage Rload=100kΩ AVCC*0.98 Min output voltage Rload=100kΩ 0.01 Offset factory calibration accuracy Continues mode, VCC=3.0V, VREF = Int 1.00V, T=85°C TBD Gain factory calibration accuracy 33.6 kΩ V LSB TBD Analog Comparator Characteristics Table 33-6. Symbol Analog Comparator Characteristics Parameter Condition Input Offset Voltage VCC = 1.6-3.6V < ±5 mV Input Leakage Current VCC = 1.6-3.6V < 1000 pA Vhys1 Hysteresis, No VCC = 1.6-3.6V 0 mV Vhys2 Hysteresis, Small VCC = 1.6-3.6V mode = HS 25 Vhys3 Hysteresis, Large VCC = 1.6-3.6V mode = HS 50 70 Propagation delay VCC = 3.0V, T= 85°C mode = HS tdelay VCC = 1.6-3.6V mode = LP 140 Voff Ilk 33.7 Min Typ Max Units mV ns Bandgap Voltage Characteristics Table 33-7. Symbol Bandgap Voltage Characteristics Parameter Condition Min Typ As reference for ADC or DAC TBD As input to AC or ADC TBD Max Bandgap µs Bandgap voltage Internal 1.00V reference Units 1.10 TA = -40°C °, VCC = 3.0V V 0.995 1.00 1.05 68 8067I–AVR–04/09 XMEGA A1 33.8 Brownout Detection Characteristics Brownout Detection Characteristics(1) Table 33-8. Symbol Parameter Condition Min Typ BOD level 0 falling Vcc 1.6 BOD level 1 falling Vcc 1.9 BOD level 2 falling Vcc 2.1 BOD level 3 falling Vcc 2.4 BOD level 4 falling Vcc 2.6 BOD level 5 falling Vcc 2.9 BOD level 6 falling Vcc 3.2 BOD level 7 falling Vcc 3.4 Max Units V Hysteresis BOD level 0-5 Note: 1. BOD is calibrated on BOD level 0 at 85°C. 33.9 PAD Characteristics Table 33-9. Symbol Parameter Input High Voltage VIL Input Low Voltage VOH % PAD Characteristics VIH VOL 2 Output Low Voltage GPIO Output High Voltage GPIO Condition Min Typ Max VCC = 2.4 - 3.6V VCC+0.5 VCC = 1.6 - 2.4V VCC+0.5 VCC = 2.4 - 3.6V -0.5 VCC = 1.6 - 2.4V -0.5 IOL = 15 mA, VCC = 3.3V 0.45 IOL = 10 mA, VCC = 2.7V 0.3 IOL = 5 mA, VCC = 1.8V 0.2 IOH = -8 mA, VCC = 3.3V 3.0 IOH = -6 mA, VCC = 2.7V 2.2 IOH = -2 mA, VCC = 1.8V 1.6 V IIL Input Leakage Current I/O pin <0.001 1 IIH Input Leakage Current I/O pin <0.001 1 RP I/O pin Pull/Buss keeper Resistor T= -40°C to 85°C 20 Reset pin Pull-up Resistor T= -40°C to 85°C 20 Slew Rate No load TBD Slew Rate w/slew rate limitation No load TBD Input hysteresis VCC = 1.6 V - 3.6 V, T= -40°C to 85°C 0.5 RRST Units µA kΩ ns mV 69 8067I–AVR–04/09 XMEGA A1 33.10 POR Characteristics Table 33-10. Power-on Reset Characteristics Symbol Parameter Condition Min Typ Max Units Power-on slope range TBD V/ms Minimum pulse width TBD µs VPOT- POR threshold voltage falling Vcc 1 VPOT+ POR threshold voltage rising Vcc 1.4 V 33.11 Reset Characteristics Table 33-11. Reset Characteristics Symbol Parameter Condition Min Minimum reset pulse width Reset threshold voltage Typ Max 90 VCC = 2.7 - 3.6V 0.45*VCC VCC = 1.6 - 2.7V 0.42*VCC Units ns V 33.12 Oscillator Characteristics Table 33-12. Internal 2 MHz Oscillator Characteristics Symbol Parameter Condition Accuracy T = 85°C, VCC = 3V, After production calibration DFLL Calibration step size T = 25°C, VCC = 3V Min Typ -1 Max Units 1 % 0.175 Table 33-13. Internal 32 MHz Oscillator Characteristics Symbol Parameter Condition Accuracy T = 85°C, VCC = 3V, After production calibration DFLL Calibration step size T = 25°C, VCC = 3V Min Typ -1 Max Units 1 % 0.2 70 8067I–AVR–04/09 XMEGA A1 34. Typical Characteristics 34.1 Active Supply Current Figure 34-1. Active Supply Current vs. Frequency fSYS = 1 - 32 MHz, T = 25°C 25 3.3V 20 Icc [mA] 3.0V 2.7V 15 10 2.2V 5 1.8V 0 0 4 8 12 16 20 24 28 32 Frequency [MHz] Figure 34-2. Active Supply Current vs. VCC fSYS = 1.0 MHz 1200 85°C -40°C 25°C 1000 Icc [uA] 800 600 400 200 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] 71 8067I–AVR–04/09 XMEGA A1 34.2 Idle Supply Current Figure 34-3. Idle Supply Current vs. Frequency fSYS = 1 - 32 MHz, T = 25°C , 10 3.3V 9 8 3.0V 7 2.7V Icc [mA] 6 5 4 3 2.2V 2 1.8V 1 0 0 4 8 12 16 20 24 28 32 Frequency [MHz] Figure 34-4. Active Supply Current vs. VCC fSYS = 1.0 MHz 400 85°C 25°C -40°C 350 300 Icc [uA] 250 200 150 100 50 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] 72 8067I–AVR–04/09 XMEGA A1 34.3 Power-down Supply Current Figure 34-5. Power-down Supply Current vs. Temperature 2.5 3.3V 3.0V 2.7V 2.2V 1.8V 2 Icc [uA] 1.5 1 0.5 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 34.4 Power-save Supply Current Figure 34-6. Power-save Supply Current vs. Temperature Sampled BOD, WDT, RTC from ULP enabled 3.5 3.3V 2.7V 3 2.2V 1.8V Icc [uA] 2.5 2 1.5 1 0.5 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 73 8067I–AVR–04/09 XMEGA A1 34.5 Pin Pull-up Figure 34-7. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 1.8V 100 Ireset [uA] 80 60 -40 °C 40 85 °C 25 °C 20 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 vreset [V] Figure 34-8. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 3.0V 180 160 140 Ireset [uA] 120 100 80 60 -40 °C 85 °C 40 25 °C 20 0 0 0.5 1 1.5 2 2.5 vreset [V] 74 8067I–AVR–04/09 XMEGA A1 Figure 34-9. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 3.3V 180 160 140 Ireset [uA] 120 100 80 -40 °C 85 °C 60 40 20 25 °C 0 0 0.5 1 1.5 2 2.5 3 vreset [V] 34.6 Pin Thresholds and Hysteresis Figure 34-10. I/O Pin Input Threshold Voltage vs. VCC VIH - I/O Pin Read as “1” 2.5 -40 °C 25 °C 85 °C Vthreshold [V] 2 1.5 1 0.5 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] 75 8067I–AVR–04/09 XMEGA A1 Figure 34-11. I/O Pin Input Threshold Voltage vs. VCC VIL - I/O Pin Read as “0” 1.8 85 °C 25 °C -40 °C 1.6 1.4 Vthreshold [V] 1.2 1 0.8 0.6 0.4 0.2 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Figure 34-12. I/O Pin Input Hysteresis vs. VCC. 0.8 Vthreshold [V] 0.6 85 °C 25 °C -40 °C 0.4 0.2 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] 76 8067I–AVR–04/09 XMEGA A1 Figure 34-13. Reset Input Threshold Voltage vs. VCC VIH - I/O Pin Read as “1” 1.8 -40 °C 25 °C 85 °C 1.6 1.4 Vthreshold [V] 1.2 1 0.8 0.6 0.4 0.2 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Figure 34-14. Reset Input Threshold Voltage vs. VCC VIL - I/O Pin Read as “0” 1.8 -40 °C 25 °C 85 °C 1.6 1.4 Vthreshold [V] 1.2 1 0.8 0.6 0.4 0.2 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] 77 8067I–AVR–04/09 XMEGA A1 34.7 Bod Thresholds Figure 34-15. BOD Thresholds vs. Temperature BOD Level = 1.6V 1.638 1.632 Rising Vcc VBOT [V] 1.626 1.62 1.614 Falling Vcc 1.608 1.602 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 40 50 60 70 80 90 Temperature [°C] Figure 34-16. BOD Thresholds vs. Temperature BOD Level = 2.9V 3.01 Rising Vcc 2.995 VBOT [V] 2.98 2.965 2.95 2.935 Falling Vcc 2.92 2.905 -40 -30 -20 -10 0 10 20 30 Temperature [°C] 78 8067I–AVR–04/09 XMEGA A1 34.8 Bandgap Figure 34-17. Internal 1.00V Reference vs. Temperature. 1.004 1.0035 1.003 VREF [V] 1.0025 1.002 1.0015 1.001 1.0005 1 3.0V 1.8V 0.9995 0.999 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 34.9 Analog Comparator Figure 34-18. Analog Comparator Hysteresis vs. VCC High-speed, Small hysteresis 30 Hysteresis [mV] 25 25°C 20 15 10 5 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] 79 8067I–AVR–04/09 XMEGA A1 Figure 34-19. Analog Comparator Hysteresis vs. VCC, High-speed Large hysteresis 60 50 Hysteresis [mV] 25°C 40 30 20 10 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Figure 34-20. Analog Comparator Propagation Delay vs. VCC High-speed 120 Propagation Delay [ns] 100 80 60 25°C 40 20 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] 80 8067I–AVR–04/09 XMEGA A1 34.10 Internal Oscillator Speed Figure 34-21. Internal 32.768 kHz Oscillator Frequency vs. Temperature 1.024 kHz output p 1.03 1.025 1.8 V 1.02 3.0 V f [kHz] 1.015 1.01 1.005 1 0.995 0.99 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 T [°C] Figure 34-22. Ultra Low-Power (ULP) Oscillator Frequency vs. Temperature 1 kHz output p 0.93 0.92 f1kHz output [kHz] 0.91 0.9 3.0 V 0.89 1.8 V 0.88 0.87 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 T [°C] 81 8067I–AVR–04/09 XMEGA A1 Figure 34-23. Internal 2 MHz Oscillator CalA Calibration Step Size T = -40 to 85°C, VCC = 3V 0.006 Step size: f [MHz] 0.005 0.004 0.003 0.002 0.001 0 0 20 40 60 80 100 120 140 60 70 CALA [LSB] Figure 34-24. Internal 2 MHz Oscillator CalB Calibration Step Size T = -40 to 85°C, VCC = 3V 0.04 0.035 Step size: f [MHz] 0.03 0.025 0.02 0.015 0.01 0.005 0 0 10 20 30 40 50 CALB [LSB] 82 8067I–AVR–04/09 XMEGA A1 Figure 34-25. Internal 32 MHz Oscillator CalA Calibration Step Size T = -40 to 85°C, VCC = 3V 0.09 0.08 Step size: f [MHz] 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 0 20 40 60 80 100 120 140 60 70 CALA Figure 34-26. Internal 32 MHz Oscillator CalB Calibration Step Size T = -40 to 85°C, VCC = 3V 0.7 0.6 Step size: f [MHz] 0.5 0.4 0.3 0.2 0.1 0 0 10 20 30 40 50 CALB 83 8067I–AVR–04/09 XMEGA A1 35. Errata 35.1 ATxmega128A1 rev. H • • • • • • • • • • • • • • • • Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously DAC is nonlinear and inaccurate when reference is above 2.4V or VCC - 0.6V ADC gain stage output range is limited to 2.4V The ADC has up to ±2 LSB inaccuracy TWI, a general address call will match independent of the R/W-bit value TWI, the minimum I2C SCL low time could be violated in Master Read mode TWI, the address-mask features is missing Setting HIRES PR bit makes PWM output unavailable BOD will be enabled after any reset Propagation delay analog Comparator increasing to 2 ms at -40°C Sampled BOD in Active mode will cause noise when bandgap is used as reference Default setting for SDRAM refresh period too low Flash Power Reduction Mode can not be enabled when entering sleep mode JTAG enable does not override Analog Comparator B output Bandgap measurement with the ADC is non-functional when VCC is below 2.7V DAC refresh may be blocked in S/H mode 1. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously If the bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input for the another AC, the first comparator will be affected for up to 1 us and could potentially give a wrong comparison result. Problem fix/Workaround If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling any of them. 2. DAC is nonlinear and inaccurate when reference is above 2.4V or Vcc-0.6V Using the DAC with a reference voltage above 2.4V or Vcc-0.6Vgive inaccurate output when converting codes that give below 0.75V output: – ±10 LSB for continuous mode – ±20 LSB for Sample and Hold mode Problem fix/Workaround None, avoid using a voltage reference above 2.4V or Vcc-0.6V 3. ADC gain stage output range is limited to 2.4 V The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give correct output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of : – 1x gain: 2.4 V – 2x gain: 1.2 V – 4x gain: 0.6 V 84 8067I–AVR–04/09 XMEGA A1 – 8x gain: 300 mV – 16x gain: 150 mV – 32x gain: 75 mV – 64x gain: 38 mV Problem fix/Workaround Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep ADC voltage reference below 2.4 V. 4. The ADC has up to ±2 LSB inaccuracy The ADC will have up to ±2 LSB inaccuracy, visible as a saw-tooth pattern on the input voltage/ output value transfer function of the ADC. The inaccuracy increases with increasing voltage reference reaching ±2 LSB with 3V reference. Problem fix/Workaround None, the actual ADC resolution will be reduced with up to ±2 LSB. 5. TWI, a general address call will match independent of the R/W-bit value. When the TWI is in Slave mode and a general address call is issued on the bus, the TWI Slave will get an address match regardless of the R/W-bit (ADDR[0] bit) value in the Slave Address Register. Problem fix/Workaround Use software to check the R/W-bit on general call address match. 6. TWI, the minimum I2C SCL low time could be violated in Master Read mode When the TWI is in Master Read mode and issuing a Repeated Start on the bus, this will immediately release the SCL line even if one complete SCL low period has not passed. This means that the minimum SCL low time in the I2C specification could be violated. Problem fix/Workaround If this causes a potential problem in the application, software must ensure that the Repeated Start is never issued before one SCL low time has passed. 7. TWI, the address-mask features is missing The address-mask functionality is missing, so the TWI cannot perform address match on more than one address. Problem fix/Workaround If the TWI must respond to multiple addresses, enable Promiscuous Mode for the TWI to respond to all address and implementing the address-mask function in software 8. Setting HIRES PR bit makes PWM output unavailable Setting the HIRES Power Reduction (PR) bit for PORTx will make any Frequency or PWM output for the corresponding Timer/Counters (TCx0 and TCx1) unavailable on the pin even if the Hi-Res is not used. Problem fix/Workaround Do not write the HIRES PR bit on PORTx when frequency or PWM output from TCx0/1 is used. 85 8067I–AVR–04/09 XMEGA A1 9. BOD will be enabled after any reset If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the programmed BOD level even if the BOD is disabled. Problem fix/Workaround Do not set the BOD level higher than VCC even if the BOD is not used. 10. Propagation delay analog Comparator increasing to 2 ms at -40 °C When the analog comparator is used at temperatures reaching down to -40 °C, the propagation delay will increase to ~2 ms. Problem fix/Workaround None 11. Sampled BOD in Active mode will cause noise when bandgap is used as reference Using the BOD in sampled mode when the device is running in Active or Idle mode will add noise on the bandgap reference for ADC and DAC. Problem fix/Workaround If the bandgap is used as reference for either the ADC or the DAC, the BOD must not be set in sampled mode. 12. Default setting for SDRAM refresh period too low If the SDRAM refresh period is set to a value less then 0x20, the SDRAM content may be corrupted when accessing through On-Chip Debug sessions. Problem fix/Workaround The SDRAM refresh period (REFRESHH/L) should not be set to a value less then 0x20. 13. Flash Power Reduction Mode can not be enabled when entering sleep mode If Flash Power Reduction Mode is enabled when entering Power-save or Extended Standby sleep mode, the device will only wake up on every fourth wake-up request. If Flash Power Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with up to 16 CPU clock cycles. Problem fix/Workaround Disable Flash Power Reduction mode before entering sleep mode. 14. JTAG enable does not override Analog Comparator B output When JTAG is enabled this will not override the Anlog Comparator B (ACB)ouput, AC0OUT on pin 7 if this is enabled. Problem fix/Workaround AC0OUT for ACB should not be enabled when JTAG is used. Use only analog comparator output for ACA when JTAG is used, or use the PDI as debug interface. 15. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V The ADC cannot be used to do bandgap measurements when VCC is below 2.7V. 86 8067I–AVR–04/09 XMEGA A1 Problem fix/Workaround If internal voltages must be measured when VCC is below 2.7V, measure the internal 1.00V reference instead of the bandgap. 16. DAC refresh may be blocked in S/H mode If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is done at maximum rate (i.e. the DAC is always busy doing conversion for this channel), this will block refresh signals to the second channel. Problem fix/Workarund When using the DAC in S/H mode, ensure that none of the channels is running at maximum conversion rate, or ensure that the conversion rate of both channels is high enough to not require refresh. 35.2 ATxmega128A1 rev. G • • • • • • • • • • • • • • • • • • Bootloader Section in Flash is non-functional Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously DAC is nonlinear and inaccurate when reference is above 2.4V ADC gain stage output range is limited to 2.4 V The ADC has up to ±2 LSB inaccuracy TWI, a general address call will match independent of the R/W-bit value TWI, the minimum I2C SCL low time could be violated in Master Read mode Setting HIRES PR bit makes PWM output unavailable EEPROM erase and write does not work with all System Clock sources BOD will be enabled after any reset Propagation delay analog Comparator increasing to 2 ms at -40°C Sampled BOD in Active mode will cause noise when bandgap is used as reference Default setting for SDRAM refresh period too low Flash Power Reduction Mode can not be enabled when entering sleep mode Enabling Analog Comparator B output will cause JTAG failure JTAG enable does not override Analog Comparator B output Bandgap measurement with the ADC is non-functional when VCC is below 2.7V DAC refresh may be blocked in S/H mode 1. Bootloader Section in Flash is non-functional The Bootloader Section is non-functional, and bootloader or application code cannot reside in this part of the Flash. Problem fix/Workaround None, do not use the Bootloader Section. 2. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously If the Bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input for the another AC, the first comparator will be affected for up to 1 us and could potentially give a wrong comparison result. Problem fix/Workaround If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling any of them. 87 8067I–AVR–04/09 XMEGA A1 3. DAC is nonlinear and inaccurate when reference is above 2.4V Using the DAC with a reference voltage above 2.4V give inaccurate output when converting codes that give below 0.75V output: – ±20 LSB for continuous mode – ±200 LSB for Sample and Hold mode Problem fix/Workaround None, avoid using a voltage reference above 2.4V. 4. ADC gain stage output range is limited to 2.4 V The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give correct output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of: – 1x gain: 2.4 V – 2x gain: 1.2 V – 4x gain: 0.6 V – 8x gain: 300 mV – 16x gain: 150 mV – 32x gain: 75 mV – 64x gain: 38 mV Problem fix/Workaround Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep ADC voltage reference below 2.4 V. 5. The ADC has up to ±2 LSB inaccuracy The ADC will have up to ±2 LSB inaccuracy, visible as a saw-tooth pattern on the input voltage/ output value transfer function of the ADC. The inaccuracy increases with increasing voltage reference reaching ±2 LSB with 3V reference. Problem fix/Workaround None, the actual ADC resolution will be reduced with up to ±2 LSB. 6. TWI, a general address call will match independent of the R/W-bit value When the TWI is in Slave mode and a general address call is issued on the bus, the TWI Slave will get an address match regardless of the R/W-bit (ADDR[0] bit) value in the Slave Address Register. Problem fix/Workaround Use software to check the R/W-bit on general call address match. 7. TWI, the minimum I2C SCL low time could be violated in Master Read mode When the TWI is in Master Read mode and issuing a Repeated Start on the bus, this will immediately release the SCL line even if one complete SCL low period has not passed. This means that the minimum SCL low time in the I2C specification could be violated. 88 8067I–AVR–04/09 XMEGA A1 Problem fix/Workaround If this causes a potential problem in the application, software must ensure that the Repeated Start is never issued before one SCL low time has passed. 8. Setting HIRES PR bit makes PWM output unavailable Setting the HIRES Power Reduction (PR) bit for PORTx will make any Frequency or PWM output for the corresponding Timer/Counters (TCx0 and TCx1) unavailable on the pin. Problem fix/Workaround Do not write the HIRES PR bit on PORTx when frequency or PWM output from TCx0/1 is used. 9. EEPROM erase and write does not work with all System Clock sources When doing EEPROM erase or Write operations with other clock sources than the 2 MHz RCOSC, Flash will be read wrongly for one or two clock cycles at the end of the EEPROM operation. Problem fix/Workaround Alt 1: Use the internal 2 MHz RCOSC when doing erase or write operations on EEPROM. Alt 2: Ensure to be in sleep mode while completing erase or write on EEPROM. After starting erase or write operations on EEPROM, other interrupts should be disabled and the device put to sleep. 10. BOD will be enabled after any reset If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the programmed BOD level even if the BOD is disabled. Problem fix/Workaround Do not set the BOD level higher than VCC even if the BOD is not used. 11. Propagation delay analog Comparator increasing to 2 ms at -40 °C When the analog comparator is used at temperatures reaching down to -40 °C, the propagation delay will increase to ~2 ms. Problem fix/Workaround None 12. Sampled BOD in Active mode will cause noise when bandgap is used as reference Using the BOD in sampled mode when the device is running in Active or Idle mode will add noise on the bandgap reference for ADC and DAC. Problem fix/Workaround If the bandgap is used as reference for either the ADC or the DAC, the BOD must not be set in sampled mode. 13. Default setting for SDRAM refresh period too low If the SDRAM refresh period is set to a value less then 0x20, the SDRAM content may be corrupted when accessing through On-Chip Debug sessions. Problem fix/Workaround The SDRAM refresh period (REFRESHH/L) should not be set to a value less then 0x20. 89 8067I–AVR–04/09 XMEGA A1 14. Flash Power Reduction Mode can not be enabled when entering sleep mode If Flash Power Reduction Mode is enabled when entering Power-save or Extended Standby sleep mode, the device will only wake up on every fourth wake-up request. If Flash Power Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with up to 16 CPU clock cycles. Problem fix/Workaround Disable Flash Power Reduction mode before entering sleep mode. 15. JTAG enable does not override Analog Comparator B output When JTAG is enabled this will not override the Anlog Comparator B (ACB)ouput, AC0OUT on pin 7 if this is enabled. Problem fix/Workaround AC0OUT for ACB should not be enabled when JTAG is used. Use only analog comparator output for ACA when JTAG is used, or use the PDI as debug interface. 16. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V The ADC cannot be used to do bandgap measurements when VCC is below 2.7V. Problem fix/Workaround If internal voltages must be measured when VCC is below 2.7V, measure the internal 1.00V reference instead of the bandgap. 17. DAC refresh may be blocked in S/H mode If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is done at maximum rate (i.e. the DAC is always busy doing conversion for this channel), this will block refresh signals to the second channel. Problem fix/Workarund When using the DAC in S/H mode, ensure that none of the channels is running at maximum conversion rate, or ensure that the conversion rate of both channels is high enough to not require refresh. 90 8067I–AVR–04/09 XMEGA A1 36. Datasheet Revision History 36.1 36.2 36.3 36.4 8067I – 04/09 1. Updated “Ordering Information” on page 2. 2. Updated “PAD Characteristics” on page 69. 1. Editorial updates. 2. Updated “Overview” on page 48. 3. Updated Table 29-9 on page 54. 4. Updated “Peripheral Module Address Map” on page 55. IRCOM has address map: 0x08F8. 5. Updated “Electrical Characteristics” on page 64. 6. Updated “PAD Characteristics” on page 69. 7. Updated “Typical Characteristics” on page 71. 1. Updated “Block Diagram” on page 6. 2. Updated feature list in “Memories” on page 10. 3. Updated “PDI - Program and Debug Interface” on page 48. 4. Updated “Peripheral Module Address Map” on page 55. IRCOM has address 0x8F0. 5. Added “Electrical Characteristics” on page 64. 6. Added “Typical Characteristics” on page 71. 7. Added “ATxmega128A1 rev. H” on page 84. 8. Updated “ATxmega128A1 rev. G” on page 87. 1. Updated “Features” on page 1 2. Updated “Ordering Information” on page 2 3. Updated Figure 7-1 on page 11 and Figure 7-2 on page 11. 4. Updated Table 7-2 on page 15. 5. Updated “Features” on page 41 and “Overview” on page 41. 6. Removed “Interrupt Vector Summary” section from datasheet. 8067H – 04/09 8067G – 11/08 8067F – 09/08 91 8067I–AVR–04/09 XMEGA A1 36.5 36.6 36.7 36.8 8067E – 08/08 1. Changed Figure 2-1’s title to “Block diagram and pinout” on page 3. 2. Updated Figure 2-2 on page 4. 3. Updated Table 29-2 on page 51 and Table 29-3 on page 52. 1. Updated “Ordering Information” on page 2. 2. Updated “Peripheral Module Address Map” on page 55. 3. Inserted “Interrupt Vector Summary” on page 56. 1. Updated the Front page and “Features” on page 1. 2. Updated the “DC Characteristics” on page 64. 3. Updated Figure 3-1 on page 6. 4. Added “Flash and EEPROM Page Size” on page 15. 5. Updated Table 33-4 on page 67 with new data: Gain Error, Offset Error and Signal -to-Noise Ratio (SNR). 6. Updated Errata “ATxmega128A1 rev. G” on page 87. 1. Updated “Pinout/Block Diagram” on page 3 and “Pinout and Pin Functions” on page 49. 2. Added XMEGA A1 Block Diagram, Figure 3-1 on page 6. 3. Updated “Overview” on page 5 included the XMEGA A1 explanation text on page 6. 4. Updated AVR CPU “Features” on page 8. 5. Updated Event System block diagram, Figure 9-1 on page 18. 6. Updated “PMIC - Programmable Multi-level Interrupt Controller” on page 25. 7. Updated “AC - Analog Comparator” on page 44. 8. Updated “Alternate Pin Function Description” on page 49. 9. Updated “Alternate Pin Functions” on page 51. 10. Updated “Typical Characteristics” on page 71. 11. Updated “Ordering Information” on page 2. 12. Updated “Overview” on page 5. 8067D – 07/08 8067C – 06/08 8067B – 05/08 92 8067I–AVR–04/09 XMEGA A1 36.9 13. Updated Figure 6-1 on page 8. 14. Inserted a new Figure 15-1 on page 32. 15. Updated Speed grades in “Speed” on page 66. 16. Added a new ATxmega384A1 device in “Features” on page 1, updated “Ordering Information” on page 2 and “Memories” on page 10. 17. Replaced the Figure 3-1 on page 6 by a new XMEGA A1 detailed block diagram. 18. Inserted Errata “ATxmega128A1 rev. G” on page 87. 1. Initial revision. 8067A – 02/08 93 8067I–AVR–04/09 XMEGA A1 Table of Contents Features ..................................................................................................... 1 Typical Applications ................................................................................ 1 1 Ordering Information ............................................................................... 2 2 Pinout/Block Diagram .............................................................................. 3 3 Overview ................................................................................................... 5 3.1 4 Block Diagram ...................................................................................................6 Resources ................................................................................................. 7 4.1 Recommended reading .....................................................................................7 5 Disclaimer ................................................................................................. 7 6 AVR CPU ................................................................................................... 8 7 8 9 6.1 Features ............................................................................................................8 6.2 Overview ............................................................................................................8 6.3 Register File ......................................................................................................9 6.4 ALU - Arithmetic Logic Unit ...............................................................................9 6.5 Program Flow ....................................................................................................9 Memories ................................................................................................ 10 7.1 Features ..........................................................................................................10 7.2 Overview ..........................................................................................................10 7.3 In-System Programmable Flash Program Memory .........................................11 7.4 Data Memory ...................................................................................................11 7.5 Production Signature Row ...............................................................................14 7.6 User Signature Row ........................................................................................14 7.7 Flash and EEPROM Page Size .......................................................................15 DMAC - Direct Memory Access Controller .......................................... 16 8.1 Features ..........................................................................................................16 8.2 Overview ..........................................................................................................16 Event System .......................................................................................... 17 9.1 Features ..........................................................................................................17 9.2 Overview ..........................................................................................................17 10 System Clock and Clock options ......................................................... 19 10.1 Features ..........................................................................................................19 i 8067I–AVR–04/09 XMEGA A1 10.2 Overview ..........................................................................................................19 10.3 Clock Options ..................................................................................................20 11 Power Management and Sleep Modes ................................................. 22 11.1 Features ..........................................................................................................22 11.2 Overview ..........................................................................................................22 11.3 Sleep Modes ....................................................................................................22 12 System Control and Reset .................................................................... 23 12.1 Features ..........................................................................................................23 12.2 Resetting the AVR ...........................................................................................23 12.3 Reset Sources .................................................................................................23 12.4 WDT - Watchdog Timer ...................................................................................24 13 PMIC - Programmable Multi-level Interrupt Controller ....................... 25 13.1 Features ..........................................................................................................25 13.2 Overview ..........................................................................................................25 13.3 Interrupt vectors ...............................................................................................25 14 I/O Ports .................................................................................................. 27 14.1 Features ..........................................................................................................27 14.2 Overview ..........................................................................................................27 14.3 I/O configuration ..............................................................................................27 14.4 Input sensing ...................................................................................................30 14.5 Port Interrupt ....................................................................................................30 14.6 Alternate Port Functions ..................................................................................30 15 T/C - 16-bit Timer/Counter ..................................................................... 31 15.1 Features ..........................................................................................................31 15.2 Overview ..........................................................................................................31 16 AWEX - Advanced Waveform Extension ............................................. 33 16.1 Features ..........................................................................................................33 16.2 Overview ..........................................................................................................33 17 Hi-Res - High Resolution Extension ..................................................... 34 17.1 Features ..........................................................................................................34 17.2 Overview ..........................................................................................................34 18 RTC - 16-bit Real-Time Counter ............................................................ 35 18.1 Features ..........................................................................................................35 ii 8067I–AVR–04/09 XMEGA A1 18.2 Overview ..........................................................................................................35 19 TWI - Two-Wire Interface ....................................................................... 36 19.1 Features ..........................................................................................................36 19.2 Overview ..........................................................................................................36 20 SPI - Serial Peripheral Interface ............................................................ 37 20.1 Features ..........................................................................................................37 20.2 Overview ..........................................................................................................37 21 USART ..................................................................................................... 38 21.1 Features ..........................................................................................................38 21.2 Overview ..........................................................................................................38 22 IRCOM - IR Communication Module ..................................................... 39 22.1 Features ..........................................................................................................39 22.2 Overview ..........................................................................................................39 23 Crypto Engine ......................................................................................... 40 23.1 Features ..........................................................................................................40 23.2 Overview ..........................................................................................................40 24 ADC - 12-bit Analog to Digital Converter ............................................. 41 24.1 Features ..........................................................................................................41 24.2 Overview ..........................................................................................................41 25 DAC - 12-bit Digital to Analog Converter ............................................. 43 25.1 Features ..........................................................................................................43 25.2 Overview ..........................................................................................................43 26 AC - Analog Comparator ....................................................................... 44 26.1 Features ..........................................................................................................44 26.2 Overview ..........................................................................................................44 26.3 Input Selection .................................................................................................46 26.4 Window Function .............................................................................................46 27 OCD - On-chip Debug ............................................................................ 47 27.1 Features ..........................................................................................................47 27.2 Overview ..........................................................................................................47 28 PDI - Program and Debug Interface ...................................................... 48 28.1 Features ..........................................................................................................48 28.2 Overview ..........................................................................................................48 iii 8067I–AVR–04/09 XMEGA A1 28.3 JTAG interface .................................................................................................48 29 Pinout and Pin Functions ...................................................................... 49 29.1 Alternate Pin Function Description ..................................................................49 29.2 Alternate Pin Functions ...................................................................................51 30 Peripheral Module Address Map .......................................................... 55 31 Instruction Set Summary ....................................................................... 57 32 Packaging information .......................................................................... 61 32.1 100A ................................................................................................................61 32.2 100C1 ..............................................................................................................62 32.3 100C2 ..............................................................................................................63 33 Electrical Characteristics ...................................................................... 64 33.1 Absolute Maximum Ratings* ...........................................................................64 33.2 DC Characteristics ..........................................................................................64 33.3 Speed ..............................................................................................................66 33.4 ADC Characteristics ........................................................................................67 33.5 DAC Characteristics ........................................................................................68 33.6 Analog Comparator Characteristics .................................................................68 33.7 Bandgap Voltage Characteristics ....................................................................68 33.8 Brownout Detection Characteristics ................................................................69 33.9 PAD Characteristics ........................................................................................69 33.10 POR Characteristics ........................................................................................70 33.11 Reset Characteristics ......................................................................................70 33.12 Oscillator Characteristics .................................................................................70 34 Typical Characteristics .......................................................................... 71 34.1 Active Supply Current ......................................................................................71 34.2 Idle Supply Current ..........................................................................................72 34.3 Power-down Supply Current ............................................................................73 34.4 Power-save Supply Current .............................................................................73 34.5 Pin Pull-up .......................................................................................................74 34.6 Pin Thresholds and Hysteresis ........................................................................75 34.7 Bod Thresholds ...............................................................................................78 34.8 Bandgap ..........................................................................................................79 34.9 Analog Comparator .........................................................................................79 34.10 Internal Oscillator Speed .................................................................................81 iv 8067I–AVR–04/09 XMEGA A1 35 Errata ....................................................................................................... 84 35.1 ATxmega128A1 rev. H ....................................................................................84 35.2 ATxmega128A1 rev. G ....................................................................................87 36 Datasheet Revision History ................................................................... 91 36.1 8067I – 04/09 ...................................................................................................91 36.2 8067H – 04/09 .................................................................................................91 36.3 8067G – 11/08 .................................................................................................91 36.4 8067F – 09/08 .................................................................................................91 36.5 8067E – 08/08 .................................................................................................92 36.6 8067D – 07/08 .................................................................................................92 36.7 8067C – 06/08 .................................................................................................92 36.8 8067B – 05/08 .................................................................................................92 36.9 8067A – 02/08 .................................................................................................93 Table of Contents....................................................................................... i v 8067I–AVR–04/09 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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