Features • High-performance, Low-power AVR 8/16-bit XMEGA Microcontroller • Non-volatile Program and Data Memories • • • • • – 256 KB of In-System Self-Programmable Flash – 8 KB Boot Code Section with Independent Lock Bits – 4 KB EEPROM – 16 KB Internal SRAM Peripheral Features – Four-channel DMA Controller with support for external requests – Eight-channel Event System – Seven 16-bit Timer/Counters Four Timer/Counters with 4 Output Compare or Input Capture channels Three Timer/Counters with 2 Output Compare or Input Capture channels High-Resolution Extension on all Timer/Counters Advanced Waveform Extension on one Timer/Counter – Six USARTs IrDA modulation/demodulation for one USART – Two Two-Wire Interfaces with dual address match (I2C and SMBus compatible) – Two SPI (Serial Peripheral Interface) peripherals – AES and DES Crypto Engine – 32-bit Real Time Counter with separate Oscillator and Battery Backup System – Two Eight-channel, 12-bit, 2 Msps Analog to Digital Converters – One Two-channel, 12-bit, 1 Msps Digital to Analog Converters – Four Analog Comparators with Window compare function – External Interrupts on all General Purpose I/O pins – Programmable Watchdog Timer with Separate On-chip Ultra Low Power Oscillator Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal and External Clock Options with PLL – Programmable Multi-level Interrupt Controller – Sleep Modes: Idle, Power-down, Standby, Power-save, Extended Standby – Advanced Programming, Test and Debugging Interfaces JTAG (IEEE 1149.1 Compliant) Interface for test, debug and programming PDI (Program and Debug Interface) for programming and debugging I/O and Packages – 49 Programmable I/O Lines – 64-lead TQFP – 64-pad QFN/MLF Operating Voltage – 1.6 – 3.6V Speed performance – 0 – 12 MHz @ 1.6 – 3.6V – 0 – 32 MHz @ 2.7 – 3.6V 8/16-bit XMEGA A3B Microcontroller ATxmega256A3B Preliminary Typical Applications • • • • • Industrial control Factory automation Building control Board control White Goods • • • • • Climate control ZigBee Motor control Networking Optical • • • • • Hand-held battery applications Power tools HVAC Metering Medical Applications 8116B–AVR–12/08 XMEGA A3B 1. Ordering Information Flash E2 SRAM Speed (MHz) Power Supply Package(1)(2)(3) ATxmega256A3B-AU 256 KB + 8 KB 4 KB 16 KB 32 1.6 - 3.6V 64A ATxmega256A3B-MU 256 KB + 8 KB 4 KB 16 KB 32 1.6 - 3.6V 64M2 Ordering Code Notes: Temp -40°C - 85°C 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For packaging information, see ”Packaging information” on page 60. Package Type 64A 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 64M2 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, 7.65 mm Exposed Pad, Micro Lead Frame Package (MLF) 2. Pinout/Block Diagram Block diagram and pinout. PA2 PA1 PA0 AVCC GND PR1 PR0 RESET/PDI_CLK PDI_DATA PF7 PF6 VCC GND VBAT PF4 PF3 Figure 2-1. 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 INDEXCORNER Port R DATA BU S Port A ADC A Bat t Backup OSC/CLK Contro l BOD VREF POR TEMP RTC OCD AC A0 Power Contro l AC A1 FLASH CPU ADC B Port B Reset Contro l DAC B RAM DMA AC B0 E2PROM Interrupt Controlle r Watchdog AC B1 Event System ctrl DATA BU S Port C Port D Port E USART0 T/C0 TWI USART0 T/C0:1 USART0:1 SPI T/C0:1 SPI TWI USART0:1 EVENTROUTING N ETWORK T/C0:1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Port F 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PF2 PF1 PF0 VCC GND TOSC1 TOSC2 PE5 PE4 PE3 PE2 PE1 PE0 VCC GND PD7 PC1 PC2 PC3 PC4 PC5 PC6 PC7 GND VCC PD0 PD1 PD2 PD3 PD4 PD5 PD6 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 GND VCC PC0 Note: for full details on pinout and pin functions refer to ”Pinout and Pin Functions” on page 50. 2 8116B–AVR–12/08 XMEGA A3B 3. Overview The XMEGA™A3V is a family of low power, high performance and peripheral rich CMOS 8/16-bit microcontrollers based on the AVR ® enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the XMEGA A3B achieves throughputs approaching 1 Million Instructions Per Second (MIPS) per MHz allowing the system designer to optimize power consumption versus processing speed. The AVR CPU combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times faster than conventional single-accumulator or CISC based microcontrollers. The XMEGA A3B devices provides the following features: In-System Programmable Flash with Read-While-Write capabilities, Internal EEPROM and SRAM, four-channel DMA Controller, eight-channel Event System, Programmable Multi-level Interrupt Controller, 49 general purpose I/O lines, 32-bit Real Time Counter (RTC) with Battery Backup System, seven flexible 16-bit Timer/Counters with compare modes and PWM, six USARTs, two Two Wire Serial Interfaces (TWIs), two Serial Peripheral Interfaces (SPIs), AES and DES crypto engine, two 8-channel, 12bit ADCs with optional differential input with programmable gain, one 2-channel 12-bit DAC, four analog comparators with window mode, programmable Watchdog Timer with separate Internal Oscillator, accurate internal oscillators with PLL and prescaler and programmable Brown-Out Detection. The Program and Debug Interface (PDI), a fast 2-pin interface for programming and debugging, is available. The devices also have an IEEE std. 1149.1 compliant JTAG test interface, and this can also be used for On-chip Debug and programming. The XMEGA A3B devices have five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, DMA Controller, Event System, Interrupt Controller and all peripherals to continue functioning. The Power-down mode saves the SRAM and register contents but stops the oscillators, disabling all other functions until the next TWI or pin-change interrupt, or Reset. In Power-save mode, the asynchronous Real Time Counter continues to run, allowing the application to maintain a timer base while the rest of the device is sleeping. In Standby mode, the Crystal/Resonator Oscillator is kept running while the rest of the device is sleeping. This allows very fast start-up from external crystal combined with low power consumption. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. To further reduce power consumption, the peripheral clock to each individual peripheral can optionally be stopped in Active mode and Idle sleep mode. The device is manufactured using Atmel's high-density nonvolatile memory technology. The program Flash memory can be reprogrammed in-system through the PDI or JTAG. A Bootloader running in the device can use any interface to download the application program to the Flash memory. The Bootloader software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8/16-bit RISC CPU with In-System Self-Programmable Flash, the Atmel XMEGA A3B is a powerful microcontroller family that provides a highly flexible and cost effective solution for many embedded applications. 3 8116B–AVR–12/08 XMEGA A3B The XMEGA A3B devices are supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits. 3.1 Block Diagram Figure 3-1. XMEGA A3B Block Diagram PR[0..1] XTAL1 PORT R (2) XTAL2 Oscillator Circuits/ Clock Generation Watchdog Oscillator Watchdog Timer DATA BUS PA[0..7] PORT A (8) Event System Controller Oscillator Control ACA VCC Power Supervision POR/BOD & RESET GND SRAM DMA Controller ADCA Sleep Controller RESET/ PDI_CLK PDI PDI_DATA AREFA BUS Controller VCC/10 Prog/Debug Controller JTAG Int. Ref. Tempref DES PORT B OCD AREFB CPU Interrupt Controller AES ADCB NVM Controller PB[0..7]/ JTAG USARTF0 PORT B (8) TCF0 Flash EEPROM PORT F (7) ACB PF[0..4,6..7] DACB IRCOM DATA BUS PORT C (8) PORT D (8) PC[0..7] PD[0..7] TWIE TCE0:1 USARTE0 SPID USARTD0:1 TCD0:1 SPIC TWIC TCC0:1 USARTC0:1 EVENT ROUTING NETWORK Real Time Counter Battery Backup Controller 32.768 kHz XOSC VBAT Power Supervision PORT E (6) VBAT TOSC1 PE[0..5] TOSC2 4 8116B–AVR–12/08 XMEGA A3B 4. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. 4.1 Recommended reading • XMEGA A Manual • XMEGA A Application Notes This device data sheet only contains part specific information and a short description of each peripheral and module. The XMEGA A Manual describes the modules and peripherals in depth. The XMEGA A application notes contain example code and show applied use of the modules and peripherals. The XMEGA A Manual and Application Notes are available from http://www.atmel.com/avr. 5. Disclaimer For devices that are not available yet, typical values contained in this datasheet are based on simulations and characterization of other AVR XMEGA microcontrollers manufactured on the same process technology. Min. and Max values will be available after the device is characterized. 5 8116B–AVR–12/08 XMEGA A3B 6. AVR CPU 6.1 Features • 8/16-bit high performance AVR RISC Architecture • • • • • • • 6.2 – 138 instructions – Hardware multiplier 32x8-bit registers directly connected to the ALU Stack in SRAM Stack Pointer accessible in I/O memory space Direct addressing of up to 16M Bytes of program and data memory True 16/24-bit access to 16/24-bit I/O registers Support for 8-, 16- and 32-bit Arithmetic Configuration Change Protection of system critical features Overview The XMEGA A3B uses the 8/16-bit AVR CPU. The main function of the CPU is program execution. The CPU must therefore be able to access memories, perform calculations and control peripherals. Interrupt handling is described in a separate section. Figure 6-1 on page 6 shows the CPU block diagram. Figure 6-1. CPU block diagram DATA BUS Flash Program Memory Program Counter OCD Instruction Register STATUS/ CONTROL Instruction Decode 32 x 8 General Purpose Registers ALU Multiplier/ DES DATA BUS Peripheral Module 1 Peripheral Module 2 SRAM EEPROM PMIC The AVR uses a Harvard architecture - with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipeline. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This 6 8116B–AVR–12/08 XMEGA A3B concept enables instructions to be executed in every clock cycle. The program memory is InSystem Self-Programmable Flash memory. 6.3 Register File The fast-access Register File contains 32 x 8-bit general purpose working registers with single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU cycle, the operation is performed on two Register File operands, and the result is stored back in the Register File. Six of the 32 registers can be used as three 16-bit address register pointers for data space addressing - enabling efficient address calculations. One of these address pointers can also be used as an address pointer for look up tables in Flash program memory. 6.4 ALU - Arithmetic Logic Unit The high performance Arithmetic Logic Unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. After an arithmetic or logic operation, the Status Register is updated to reflect information about the result of the operation. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Both 8- and 16-bit arithmetic is supported, and the instruction set allows for easy implementation of 32-bit arithmetic. The ALU also provides a powerful multiplier supporting both signed and unsigned multiplication and fractional format. 6.5 Program Flow When the device is powered on, the CPU starts to execute instructions from the lowest address in the Flash Program Memory ‘0’. The Program Counter (PC) addresses the next instruction to be fetched. After a reset, the PC is set to location ‘0’. Program flow is provided by conditional and unconditional jump and call instructions, capable of addressing the whole address space directly. Most AVR instructions use a 16-bit word format, while a limited number uses a 32-bit format. During interrupts and subroutine calls, the return address PC is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. After reset the Stack Pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR CPU. 7 8116B–AVR–12/08 XMEGA A3B 7. Memories 7.1 Features • Flash Program Memory – One linear address space – In-System Programmable – Self-Programming and Bootloader support – Application Section for application code – Application Table Section for application code or data storage – Boot Section for application code or bootloader code – Separate lock bits and protection for all sections – Built in fast CRC check of a selectable flash program memory section • Data Memory – One linear address space – Single cycle access from CPU – SRAM – EEPROM Byte and page accessible Optional memory mapping for direct load and store – I/O Memory Configuration and Status registers for all peripherals and modules 16 bit-accessible General Purpose Register for global variables or flags – Bus arbitration Safe and deterministic handling of CPU and DMA Controller priority – Separate buses for SRAM, EEPROM, I/O Memory and External Memory access Simultaneous bus access for CPU and DMA Controller • Production Signature Row Memory for factory programmed data Device ID for each microcontroller device type Serial number for each device Oscillator calibration bytes ADC, DAC and temperature sensor calibration data • User Signature Row One flash page in size Can be read and written from software Content is kept after chip erase 7.2 Overview The AVR architecture has two main memory spaces, the Program Memory and the Data Memory. In addition, the XMEGA A3B features an EEPROM Memory for non-volatile data storage. All three memory spaces are linear and require no paging. The available memory size configurations are shown in ”Ordering Information” on page 2. In addition each device has a Flash memory signature row for calibration data, device identification, serial number etc. Non-volatile memory spaces can be locked for further write or read/write operations. This prevents unrestricted access to the application software. 8 8116B–AVR–12/08 XMEGA A3B 7.3 In-System Programmable Flash Program Memory The XMEGA A3B devices contain On-chip In-System Programmable Flash memory for program storage, see Figure 7-1 on page 9. Since all AVR instructions are 16- or 32-bits wide, each Flash address location is 16 bits. The Program Flash memory space is divided into Application and Boot sections. Both sections have dedicated Lock Bits for setting restrictions on write or read/write operations. The Store Program Memory (SPM) instruction must reside in the Boot Section when used to write to the Flash memory. A third section inside the Application section is referred to as the Application Table section which has separate Lock bits for storage of write or read/write protection. The Application Table section can be used for storing non-volatile data or application software. Figure 7-1. Flash Program Memory (Hexadecimal address) Word Address 0 Application Section (256 KB) ... 1EFFF 1F000 1FFFF 20000 20FFF Application Table Section (8 KB) Boot Section (8 KB) The Application Table Section and Boot Section can also be used for general application software. 7.4 Data Memory The Data Memory consists of the I/O Memory, EEPROM and SRAM memories, all within one linear address space, see Figure 7-2 on page 9. To simplify development, the memory map for all devices in the family is identical and with empty, reserved memory space for smaller devices. Figure 7-2. Data Memory Map (Hexadecimal address) Byte Address 0 FFF ATxmega256A3B I/O Registers (4 KB) 9 8116B–AVR–12/08 XMEGA A3B Figure 7-2. Data Memory Map (Hexadecimal address) 1000 EEPROM (4 KB) 1FFF 2000 5FFF 7.4.1 Internal SRAM (16 KB) I/O Memory All peripherals and modules are addressable through I/O memory locations in the data memory space. All I/O memory locations can be accessed by the Load (LD/LDS/LDD) and Store (ST/STS/STD) instructions, transferring data between the 32 general purpose registers in the CPU and the I/O Memory. The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F directly. I/O registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. The value of single bits can be checked by using the SBIS and SBIC instructions on these registers. The I/O memory address for all peripherals and modules in XMEGA A3B is shown in the ”Peripheral Module Address Map” on page 55. 7.4.2 SRAM Data Memory The XMEGA A3B devices have internal SRAM memory for data storage. 7.4.3 EEPROM Data Memory The XMEGA A3B devices have internal EEPROM memory for non-volatile data storage. It is addressable either in a separate data space or it can be memory mapped into the normal data memory space. The EEPROM memory supports both byte and page access. 10 8116B–AVR–12/08 XMEGA A3B 7.5 Production Signature Row The Production Signature Row is a separate memory section for factory programmed data. It contains calibration data for functions such as oscillators and analog modules. The production signature row also contains a device ID that identify each microcontroller device type, and a serial number that is unique for each manufactured device. The device ID for the available XMEGA A3 devices is shown in Table 7-1 on page 12. The serial number consist of the production LOT number, wafer number, and wafer coordinates for the device. 11 8116B–AVR–12/08 XMEGA A3B 7.6 Production Signature Row The Production Signature Row is a separate memory section for factory programmed data. It contains calibration data for functions such as oscillators and analog modules. The production signature row also contains a device ID that identify each microcontroller device type, and a serial number that is unique for each manufactured device. The device ID for the available XMEGA A3 devices is shown in Table 7-1 on page 12. The serial number consist of the production LOT number, wafer number, and wafer coordinates for the device. The production signature row can not be written or erased, but it can be read from both application software and external programming. Table 7-1. .Device ID bytes for XMEGA A3B device. Device ATxmega256A3B 7.7 Device ID bytes Byte 2 Byte 1 Byte 0 43 98 1E User Signature Row The User Signature Row is a separate memory section that is fully accessible (read and write) from application software and external programming. The user signature row is one flash page in size, and is meant for static user parameter storage, such as calibration data, custom serial numbers or identification numbers, random number seeds etc. This section is not erased by Chip Erase commands that erase the Flash, and requires a dedicated erase command. This ensures parameter storage during multiple program/erase session and on-chip debug sessions. 12 8116B–AVR–12/08 XMEGA A3B 7.8 Flash and EEPROM Page Size The Flash Program Memory and EEPROM data memory are organized in pages. The pages are word accessible for the Flash and byte accessible for the EEPROM. Table 7-2 on page 13 shows the Flash Program Memory organization. Flash write and erase operations are performed on one page at the time, while reading the Flash is done one byte at the time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) give the page number and the least significant address bits (FWORD) give the word in the page. Table 7-2. Devices Flash Size Number of words and Pages in the Flash. Page Size FWORD FPAGE Application (words) ATxmega256A3B 256 KB + 8 KB 256 Z[8:1] Z[18:9] Boot Size No of Pages Size No of Pages 256 KB 512 8 KB 16 Table 7-3 on page 13 shows EEPROM memory organization for the XMEGA A3B devices. EEPROM write and erase operations can be performed one page or one byte at the time, while reading the EEPROM is done one byte at the time. For EEPROM access the NVM Address Register (ADDR[m:n]) is used for addressing. The most significant bits in the address (E2PAGE) give the page number and the least significant address bits (E2BYTE) give the byte in the page. Table 7-3. Devices ATxmega256A3B Number of Bytes and Pages in the EEPROM. EEPROM Page Size Size (Bytes) 4 KB 32 E2BYTE E2PAGE No of Pages ADDR[4:0] ADDR[11:5] 128 13 8116B–AVR–12/08 XMEGA A3B 8. DMAC - Direct Memory Access Controller 8.1 Features • Allows High-speed data transfer • • • • • 8.2 – From memory to peripheral – From memory to memory – From peripheral to memory – From peripheral to peripheral 4 Channels From 1 byte and up to 16M bytes transfers in a single transaction Multiple addressing modes for source and destination address – Increment – Decrement – Static 1, 2, 4, or 8 byte Burst Transfers Programmable priority between channels Overview The XMEGA A3B has a Direct Memory Access (DMA) Controller to move data between memories and peripherals in the data space. The DMA controller uses the same data bus as the CPU to transfer data. It has 4 channels that can be configured independently. Each DMA channel can perform data transfers in blocks of configurable size from 1 to 64K bytes. A repeat counter can be used to repeat each block transfer for single transactions up to 16M bytes. Each DMA channel can be configured to access the source and destination memory address with incrementing, decrementing or static addressing. The addressing is independent for source and destination address. When the transaction is complete the original source and destination address can automatically be reloaded to be ready for the next transaction. The DMAC can access all the peripherals through their I/O memory registers, and the DMA may be used for automatic transfer of data to/from communication modules, as well as automatic data retrieval from ADC conversions, data transfer to DAC conversions, or data transfer to or from port pins. A wide range of transfer triggers are available from the peripherals, Event System and software. Each DMA channel has different transfer triggers. To allow for continuous transfers, two channels can be interlinked so that the second takes over the transfer when the first is finished and vice versa. The DMA controller can read from memory mapped EEPROM, but it cannot write to the EEPROM or access the Flash. 14 8116B–AVR–12/08 XMEGA A3B 9. Event System 9.1 Features • • • • • • • • 9.2 Inter-peripheral communication and signalling with minimum latency CPU and DMA independent operation 8 Event Channels allows for up to 8 signals to be routed at the same time Events can be generated by – Timer/Counters (TCxn) – Real Time Counter (RTC) – Analog to Digital Converters (ADCx) – Analog Comparators (ACx) – Ports (PORTx) – System Clock (ClkSYS) – Software (CPU) Events can be used by – Timer/Counters (TCxn) – Analog to Digital Converters (ADCx) – Digital to Analog Converters (DACx) – Ports (PORTx) – DMA Controller (DMAC) – IR Communication Module (IRCOM) The same event can be used by multiple peripherals for synchronized timing Advanced Features – Manual Event Generation from software (CPU) – Quadrature Decoding – Digital Filtering Functions in Active and Idle mode Overview The Event System is a set of features for inter-peripheral communication. It enables the possibility for a change of state in one peripheral to automatically trigger actions in one or more peripherals. What changes in a peripheral that will trigger actions in other peripherals are configurable by software. It is a simple, but powerful system as it allows for autonomous control of peripherals without any use of interrupts, CPU or DMA resources. The indication of a change in a peripheral is referred to as an event, and is usually the same as the interrupt conditions for that peripheral. Events are passed between peripherals using a dedicated routing network called the Event Routing Network. Figure 9-1 on page 16 shows a basic block diagram of the Event System with the Event Routing Network and the peripherals to which it is connected. This highly flexible system can be used for simple routing of signals, pin functions or for sequencing of events. The maximum latency is two CPU clock cycles from when an event is generated in one peripheral, until the actions are triggered in one or more other peripherals. The Event System is functional in both Active and Idle modes. 15 8116B–AVR–12/08 XMEGA A3B Figure 9-1. Event system block diagram. PORTx ClkSYS CPU ADCx RTC Event Routing Network DACx IRCOM ACx T/Cxn DMAC The Event Routing Network can directly connect together ADCs, DACs, Analog Comparators (ACx), I/O ports (PORTx), the Real-time Counter (RTC), Timer/Counters (T/C) and the IR Communication Module (IRCOM). Events can also be generated from software (CPU). All events from all peripherals are always routed into the Event Routing Network. This consist of eight multiplexers where each can be configured in software to select which event to be routed into that event channel. All eight event channels are connected to the peripherals that can use events, and each of these peripherals can be configured to use events from one or more event channels to automatically trigger a software selectable action. 16 8116B–AVR–12/08 XMEGA A3B 10. System Clock and Clock options 10.1 Features • Fast start-up time • Safe run-time clock switching • Internal Oscillators: • • • • • • 10.2 – 32 MHz run-time calibrated RC oscillator – 2 MHz run-time calibrated RC oscillator – 32.768 kHz calibrated RC oscillator – 32 kHz Ultra Low Power (ULP) oscillator External clock options – 0.4 - 16 MHz Crystal Oscillator – 32 kHz Crystal Oscillator – External clock PLL with internal and external clock options with 2 to 31x multiplication Clock Prescalers with 2 to 2048x division Fast peripheral clock running at 2 and 4 times the CPU clock speed Automatic Run-Time Calibration of internal oscillators Crystal Oscillator failure detection Overview XMEGA A3B has an advanced clock system, supporting a large number of clock sources. It incorporates both integrated oscillators, external crystal oscillators and resonators. A high frequency Phase Locked Loop (PLL) and clock prescalers can be controlled from software to generate a wide range of clock frequencies from the clock source input. It is possible to switch between clock sources from software during run-time. After reset the device will always start up running from the 2 Mhz internal oscillator. A calibration feature is available, and can be used for automatic run-time calibration of the internal 2 MHz and 32 MHz oscillators. This reduce frequency drift over voltage and temperature. A Crystal Oscillator Failure Monitor can be enabled to issue a Non-Maskable Interrupt and switch to internal oscillator if the external oscillator fails. Figure 10-1 on page 18 shows the principal clock system in XMEGA A3B. 17 8116B–AVR–12/08 XMEGA A3B Figure 10-1. Clock system overview clkULP WDT/BOD 32 kHz ULP Internal Oscillator clkRTC RTC 32.768 kHz Calibrated Internal Oscillator PERIPHERALS ADC 2 MHz Run-Time Calibrated Internal Oscillator 32 MHz Run-time Calibrated Internal Oscillator DAC CLOCK CONTROL clkPER UNIT with PLL and Prescaler PORTS ... DMA INTERRUPT 32.768 KHz Crystal Oscillator EVSYS RAM 0.4 - 16 MHz Crystal Oscillator CPU clkCPU NVM MEMORY External Clock Input FLASH EEPROM Each clock source is briefly described in the following sub-sections. 10.3 10.3.1 Clock Options 32 kHz Ultra Low Power Internal Oscillator The 32 kHz Ultra Low Power (ULP) Internal Oscillator is a very low power consumption clock source. It is used for the Watchdog Timer, Brown-Out Detection and as an asynchronous clock source for the Real Time Counter. This oscillator cannot be used as the system clock source, and it cannot be directly controlled from software. 10.3.2 32.768 kHz Calibrated Internal Oscillator The 32.768 kHz Calibrated Internal Oscillator is a high accuracy clock source that can be used as the system clock source or as an asynchronous clock source for the Real Time Counter. It is calibrated during production to provide a default frequency which is close to its nominal frequency. 18 8116B–AVR–12/08 XMEGA A3B 10.3.3 32.768 kHz Crystal Oscillator The 32.768 kHz Crystal Oscillator is a low power driver for an external watch crystal. It can be used as system clock source or as asynchronous clock source for the Real Time Counter. 10.3.4 0.4 - 16 MHz Crystal Oscillator The 0.4 - 16 MHz Crystal Oscillator is a driver intended for driving both external resonators and crystals ranging from 400 kHz to 16 MHz. 10.3.5 2 MHz Run-time Calibrated Internal Oscillator The 2 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 10.3.6 32 MHz Run-time Calibrated Internal Oscillator The 32 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 10.3.7 External Clock input The external clock input gives the possibility to connect a clock from an external source. 10.3.8 PLL with Multiplication factor 2 - 31x The PLL provides the possibility of multiplying a frequency by any number from 2 to 31. In combination with the prescalers, this gives a wide range of output frequencies from all clock sources. 19 8116B–AVR–12/08 XMEGA A3B 11. Power Management and Sleep Modes 11.1 Features • 5 sleep modes – Idle – Power-down – Power-save – Standby – Extended standby • Power Reduction registers to disable clocks to unused peripherals 11.2 Overview The XMEGA A3B provides various sleep modes tailored to reduce power consumption to a minimum. All sleep modes are available and can be entered from Active mode. In Active mode the CPU is executing application code. The application code decides when and what sleep mode to enter. Interrupts from enabled peripherals and all enabled reset sources can restore the microcontroller from sleep to Active mode. In addition, Power Reduction registers provide a method to stop the clock to individual peripherals from software. When this is done, the current state of the peripheral is frozen and there is no power consumption from that peripheral. This reduces the power consumption in Active mode and Idle sleep mode. 11.3 Sleep Modes 11.3.1 Idle Mode In Idle mode the CPU and Non-Volatile Memory are stopped, but all peripherals including the Interrupt Controller, Event System and DMA Controller are kept running. Interrupt requests from all enabled interrupts will wake the device. 11.3.2 Power-down Mode In Power-down mode all system clock sources, and the asynchronous Real Time Counter (RTC) clock source, are stopped. This allows operation of asynchronous modules only. The only interrupts that can wake up the MCU are the Two Wire Interface address match interrupts, and asynchronous port interrupts, e.g pin change. 11.3.3 Power-save Mode Power-save mode is identical to Power-down, with one exception: If the RTC is enabled, it will keep running during sleep and the device can also wake up from RTC interrupts. 11.3.4 Standby Mode Standby mode is identical to Power-down with the exception that all enabled system clock sources are kept running, while the CPU, Peripheral and RTC clocks are stopped. This reduces the wake-up time when external crystals or resonators are used. 20 8116B–AVR–12/08 XMEGA A3B 11.3.5 Extended Standby Mode Extended Standby mode is identical to Power-save mode with the exception that all enabled system clock sources are kept running while the CPU and Peripheral clocks are stopped. This reduces the wake-up time when external crystals or resonators are used. 21 8116B–AVR–12/08 XMEGA A3B 12. System Control and Reset 12.1 Features • Multiple reset sources for safe operation and device reset – Power-On Reset – External Reset – Watchdog Reset The Watchdog Timer runs from separate, dedicated oscillator – Brown-Out Reset Accurate, programmable Brown-Out levels – JTAG Reset – PDI reset – Software reset • Asynchronous reset – No running clock in the device is required for reset • Reset status register 12.2 Resetting the AVR During reset, all I/O registers are set to their initial values. The SRAM content is not reset. Application execution starts from the Reset Vector. The instruction placed at the Reset Vector should be an Absolute Jump (JMP) instruction to the reset handling routine. By default the Reset Vector address is the lowest Flash program memory address, ‘0’, but it is possible to move the Reset Vector to the first address in the Boot Section. The I/O ports of the AVR are immediately tri-stated when a reset source goes active. The reset functionality is asynchronous, so no running clock is required to reset the device. After the device is reset, the reset source can be determined by the application by reading the Reset Status Register. 12.3 12.3.1 Reset Sources Power-On Reset The MCU is reset when the supply voltage VCC is below the Power-on Reset threshold voltage. 12.3.2 External Reset The MCU is reset when a low level is present on the RESET pin. 12.3.3 Watchdog Reset The MCU is reset when the Watchdog Timer period expires and the Watchdog Reset is enabled. The Watchdog Timer runs from a dedicated oscillator independent of the System Clock. For more details see ”WDT - Watchdog Timer” on page 23. 12.3.4 Brown-Out Reset The MCU is reset when the supply voltage VCC is below the Brown-Out Reset threshold voltage and the Brown-out Detector is enabled. The Brown-out threshold voltage is programmable. 22 8116B–AVR–12/08 XMEGA A3B 12.3.5 JTAG reset The MCU is reset as long as there is a logic one in the Reset Register in one of the scan chains of the JTAG system. Refer to IEEE 1149.1 (JTAG) Boundary-scan for details. 12.3.6 PDI reset The MCU can be reset through the Program and Debug Interface (PDI). 12.3.7 Software reset The MCU can be reset by the CPU writing to a special I/O register through a timed sequence. 12.4 12.4.1 WDT - Watchdog Timer Features • 11 selectable timeout periods, from 8 ms to 8s. • Two operation modes – Standard mode – Window mode • Runs from the 1 kHz output of the 32 kHz Ultra Low Power oscillator • Configuration lock to prevent unwanted changes 12.4.2 Overview The XMEGA A3B has a Watchdog Timer (WDT). The WDT will run continuously when turned on and if the Watchdog Timer is not reset within a software configurable time-out period, the microcontroller will be reset. The Watchdog Reset (WDR) instruction must be run by software to reset the WDT, and prevents microcontroller reset. The WDT has a Window mode. In this mode the WDR instruction must be run within a specified period called a window. Application software can set the minimum and maximum limits for this window. If the WDR instruction is not executed inside the window limits, the microcontroller will be reset. A protection mechanism using a timed write sequence is implemented in order to prevent unwanted enabling, disabling or change of WDT settings. For maximum safety, the WDT also has an Always-on mode. This mode is enabled by programming a fuse. In Always-on mode, application software can not disable the WDT. 23 8116B–AVR–12/08 XMEGA A3B 13. Battery Backup System 13.1 Features • Battery Backup voltage supply from dedicated VBAT power pin for: – One Ultra Low-power 32-bit Real Time Counter – One 32.768 kHz crystal oscillator with failure detection monitor – Two Backup Registers • Typical power consumption of 500nA with Real Time Counter (RTC) running • Automatic switching from main power to battery backup power at: – Brown-Out Detection (BOD) reset • Automatic switching from battery backup power to main power: – Device reset after Brown-Out Reset (BOR) is released – Device reset after Power-On Reset (POR) and BOR is released 13.2 Overview The AVR XMEGA family is already running in an ultra low leakage process with power-save current consumption below 2 µA with RTC, BOD and watchdog enabled. Still, for some applications where time keeping is important, the system would have one main battery or power source used for day to day tasks, and one backup battery power for the time keeping functionality. The Battery Backup System includes functionality that enable automatic power switching between main power and a battery backup power. Figure 13-1 on page 25 shows an overview of the system. The Battery Backup Module support connection of a backup battery to the dedicated VBAT power pin. This will ensure power to the 32-bit Real Time Counter, a 32.768 kHz crystal oscillator with failure detection monitor and two backup registers, when the main battery or power source is unavailable. Upon main power loss the device will automatically detect this and the Battery Backup Module will switch to be powered from the VBAT pin. After main power has been restored and both main POR and BOR are released, the Battery Backup Module will automatically switch back to be powered from main power again. The 32-bit Real Time Counter (RTC) must be clocked from the 1 Hz output of a 32.768 kHz crystal oscillator connected between the TOSC1 and TOSC2 pins when running from VBAT. For more details on the 32-bit RTC refer to the “RTC32 - 32-bit Real Time Counter” section in the XMEGA A Manual. 24 8116B–AVR–12/08 XMEGA A3B Figure 13-1. Battery Backup Module and its power domain implementation VBAT VBAT power supervisor Power switch Watchdog w/ independent RCOSC Main power supervision OCD & Programming Interface Oscillator & sleep controller VDD XTAL1 XTAL2 TOSC1 XOSC TOSC2 RTC Level shifters / Isolation XOSC monitor CPU & Peripherals Internal RAM GPIO FLASH, EEPROM & Fuses Backup Registers 25 8116B–AVR–12/08 XMEGA A3B 14. PMIC - Programmable Multi-level Interrupt Controller 14.1 Features • Separate interrupt vector for each interrupt • Short, predictable interrupt response time • Programmable Multi-level Interrupt Controller – 3 programmable interrupt levels – Selectable priority scheme within low level interrupts (round-robin or fixed) – Non-Maskable Interrupts (NMI) • Interrupt vectors can be moved to the start of the Boot Section 14.2 Overview XMEGA A3B has a Programmable Multi-level Interrupt Controller (PMIC). All peripherals can define three different priority levels for interrupts; high, medium or low. Medium level interrupts may interrupt low level interrupt service routines. High level interrupts may interrupt both lowand medium level interrupt service routines. Low level interrupts have an optional round robin scheme to make sure all interrupts are serviced within a certain amount of time. The built in oscillator failure detection mechanism can issue a Non-Maskable Interrupt (NMI). 14.3 Interrupt vectors When an interrupt is serviced, the program counter will jump to the interrupt vector address. The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in each peripheral. The base addresses for the XMEGA A3B devices are shown in Table 14-1. Offset addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA A manual. For peripherals or modules that have only one interrupt, the interrupt vector is shown in Table 14-1. The program address is the word address. Table 14-1. Reset and Interrupt Vectors Program Address (Base Address) Source 0x000 RESET 0x002 OSCF_INT_vect Crystal Oscillator Failure Interrupt vector (NMI) 0x004 PORTC_INT_base Port C Interrupt base 0x008 PORTR_INT_base Port R Interrupt base 0x00C DMA_INT_base DMA Controller Interrupt base 0x014 RTC32_INT_base 32-bit Real Time Counter Interrupt base 0x018 TWIC_INT_base Two-Wire Interface on Port C Interrupt base 0x01C TCC0_INT_base Timer/Counter 0 on port C Interrupt base 0x028 TCC1_INT_base Timer/Counter 1 on port C Interrupt base 0x030 SPIC_INT_vect SPI on port C Interrupt vector 0x032 USARTC0_INT_base USART 0 on port C Interrupt base 0x038 USARTC1_INT_base USART 1 on port C Interrupt base 0x03E AES_INT_vect AES Interrupt vector Interrupt Description 26 8116B–AVR–12/08 XMEGA A3B Table 14-1. Reset and Interrupt Vectors (Continued) Program Address (Base Address) Source Interrupt Description 0x040 NVM_INT_base Non-Volatile Memory Interrupt base 0x044 PORTB_INT_base Port B Interrupt base 0x048 ACB_INT_base Analog Comparator on Port B Interrupt base 0x04E ADCB_INT_base Analog to Digital Converter on Port B Interrupt base 0x056 PORTE_INT_base Port E Interrupt base 0x05A TWIE_INT_base Two-Wire Interface on Port E Interrupt base 0x05E TCE0_INT_base Timer/Counter 0 on port E Interrupt base 0x06A TCE1_INT_base Timer/Counter 1 on port E Interrupt base 0x074 USARTE0_INT_base USART 0 on port E Interrupt base 0x080 PORTD_INT_base Port D Interrupt base 0x084 PORTA_INT_base Port A Interrupt base 0x088 ACA_INT_base Analog Comparator on Port A Interrupt base 0x08E ADCA_INT_base Analog to Digital Converter on Port A Interrupt base 0x09A TCD0_INT_base Timer/Counter 0 on port D Interrupt base 0x0A6 TCD1_INT_base Timer/Counter 1 on port D Interrupt base 0x0AE SPID_INT_vector SPI on port D Interrupt vector 0x0B0 USARTD0_INT_base USART 0 on port D Interrupt base 0x0B6 USARTD1_INT_base USART 1 on port D Interrupt base 0x0D0 PORTF_INT_base Port F INT base 0x0D8 TCF0_INT_base Timer/Counter 0 on port F Interrupt base 0x0EE USARTF0_INT_base USART 0 on port F Interrupt base 27 8116B–AVR–12/08 XMEGA A3B 15. I/O Ports 15.1 Features • Selectable input and output configuration for each pin individually • Flexible pin configuration through dedicated Pin Configuration Register • Synchronous and/or asynchronous input sensing with port interrupts and events • • • • • • • • • • 15.2 – Sense both edges – Sense rising edges – Sense falling edges – Sense low level Asynchronous wake-up from all input sensing configurations Two port interrupts with flexible pin masking Highly configurable output driver and pull settings: – Totem-pole – Pull-up/-down – Wired-AND – Wired-OR – Bus-keeper – Inverted I/O Optional Slew rate control Configuration of multiple pins in a single operation Read-Modify-Write (RMW) support Toggle/clear/set registers for Output and Direction registers Clock output on port pin Event Channel 7 output on port pin Mapping of port registers (virtual ports) into bit accessible I/O memory space Overview The XMEGA A3B devices have flexible General Purpose I/O Ports. A port consists of up to 8 pins, ranging from pin 0 to pin 7. The ports implement several functions, including synchronous/asynchronous input sensing, pin change interrupts and configurable output settings. All functions are individual per pin, but several pins may be configured in a single operation. 15.3 I/O configuration All port pins (Pn) have programmable output configuration. In addition, all port pins have an inverted I/O function. For an input, this means inverting the signal between the port pin and the pin register. For an output, this means inverting the output signal between the port register and the port pin. The inverted I/O function can be used also when the pin is used for alternate functions. The port pins also have configurable slew rate limitation to reduce electromagnetic emission. 28 8116B–AVR–12/08 XMEGA A3B 15.3.1 Push-pull Figure 15-1. I/O configuration - Totem-pole DIRn OUTn Pn INn 15.3.2 Pull-down Figure 15-2. I/O configuration - Totem-pole with pull-down (on input) DIRn OUTn Pn INn 15.3.3 Pull-up Figure 15-3. I/O configuration - Totem-pole with pull-up (on input) DIRn OUTn Pn INn 15.3.4 Bus-keeper The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’. 29 8116B–AVR–12/08 XMEGA A3B Figure 15-4. I/O configuration - Totem-pole with bus-keeper DIRn OUTn Pn INn 15.3.5 Others Figure 15-5. Output configuration - Wired-OR with optional pull-down OUTn Pn INn Figure 15-6. I/O configuration - Wired-AND with optional pull-up INn Pn OUTn 30 8116B–AVR–12/08 XMEGA A3B 15.4 Input sensing • • • • Sense both edges Sense rising edges Sense falling edges Sense low level Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is shown in Figure 15-7 on page 31. Figure 15-7. Input sensing system overview Asynchronous sensing EDGE DETECT Interrupt Control IREQ Synchronous sensing Pn Synchronizer INn Q D D INVERTED I/O R Q EDGE DETECT Event R When a pin is configured with inverted I/O the pin value is inverted before the input sensing. 15.5 Port Interrupt Each port has two interrupts with separate priority and interrupt vector. All pins on the port can be individually selected as source for each of the interrupts. The interrupts are then triggered according to the input sense configuration for each pin configured as source for the interrupt. 15.6 Alternate Port Functions In addition to the input/output functions on all port pins, most pins have alternate functions. This means that other modules or peripherals connected to the port can use the port pins for their functions, such as communication or pulse-width modulation. ”Pinout and Pin Functions” on page 50 shows which modules on peripherals that enables alternate functions on a pin, and what alternate functions that is available on a pin. 31 8116B–AVR–12/08 XMEGA A3B 16. T/C - 16-bit Timer/Counter with PWM 16.1 Features • Seven 16-bit Timer/Counters • • • • • • • • • • • • 16.2 – Four Timer/Counters of type 0 – Three Timer/Counters of type 1 Four Compare or Capture (CC) Channels in Timer/Counter 0 Two Compare or Capture (CC) Channels in Timer/Counter 1 Double Buffered Timer Period Setting Double Buffered Compare or Capture Channels Waveform Generation: – Single Slope Pulse Width Modulation – Dual Slope Pulse Width Modulation – Frequency Generation Input Capture: – Input Capture with Noise Cancelling – Frequency capture – Pulse width capture – 32-bit input capture Event Counter with Direction Control Timer Overflow and Timer Error Interrupts and Events One Compare Match or Capture Interrupt and Event per CC Channel Supports DMA Operation Hi-Resolution Extension (Hi-Res) Advanced Waveform Extension (AWEX) Overview XMEGA A3B has seven Timer/Counters, four Timer/Counter 0 and three Timer/Counter 1. The difference between them is that Timer/Counter 0 has four Compare/Capture channels, while Timer/Counter 1 has two Compare/Capture channels. The Timer/Counters (T/C) are 16-bit and can count any clock, event or external input in the microcontroller. A programmable prescaler is available to get a useful T/C resolution. Updates of Timer and Compare registers are double buffered to ensure glitch free operation. Single slope PWM, dual slope PWM and frequency generation waveforms can be generated using the Compare Channels. Through the Event System, any input pin or event in the microcontroller can be used to trigger input capture, hence no dedicated pins are required for this. The input capture has a noise canceller to avoid incorrect capture of the T/C, and can be used to do frequency and pulse width measurements. A wide range of interrupt or event sources are available, including T/C Overflow, Compare match and Capture for each Compare/Capture channel in the T/C. PORTC, PORTD and PORTE each has one Timer/Counter 0 and one Timer/Counter1. PORTF has one Timer/Counter 0. Notation of these are TCC0 (Time/Counter C0), TCC1, TCD0, TCD1, TCE0, TCE1 and TCF0, respectively. 32 8116B–AVR–12/08 XMEGA A3B Figure 16-1. Overview of a Timer/Counter and closely related peripherals Timer/Counter Base Counter Prescaler clkPER Timer Period Control Logic Counter Event System clkPER4 Buffer Capture Control Waveform Generation DTI Dead-Time Insertion Pattern Generation Fault Protection PORT Comparator AWeX Hi-Res Compare/Capture Channel D Compare/Capture Channel C Compare/Capture Channel B Compare/Capture Channel A The Hi-Resolution Extension can be enabled to increase the waveform generation resolution by 2 bits (4x). This is available for all Timer/Counters. See ”Hi-Res - High Resolution Extension” on page 35 for more details. The Advanced Waveform Extension can be enabled to provide extra and more advanced features for the Timer/Counter. This are only available for Timer/Counter 0. See ”AWEX - Advanced Waveform Extension” on page 34 for more details. 33 8116B–AVR–12/08 XMEGA A3B 17. AWEX - Advanced Waveform Extension 17.1 Features • • • • • • • • 17.2 Output with complementary output from each Capture channel Four Dead Time Insertion (DTI) Units, one for each Capture channel 8-bit DTI Resolution Separate High and Low Side Dead-Time Setting Double Buffered Dead-Time Event Controlled Fault Protection Single Channel Multiple Output Operation (for BLDC motor control) Double Buffered Pattern Generation Overview The Advanced Waveform Extension (AWEX) provides extra features to the Timer/Counter in Waveform Generation (WG) modes. The AWEX enables easy and safe implementation of for example, advanced motor control (AC, BLDC, SR, and Stepper) and power control applications. Any WG output from a Timer/Counter 0 is split into a complimentary pair of outputs when any AWEX feature is enabled. These output pairs go through a Dead-Time Insertion (DTI) unit that enables generation of the non-inverted Low Side (LS) and inverted High Side (HS) of the WG output with dead time insertion between LS and HS switching. The DTI output will override the normal port value according to the port override setting. Optionally the final output can be inverted by using the invert I/O setting for the port pin. The Pattern Generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition, the waveform generator output from Compare Channel A can be distributed to, and override all port pins. When the Pattern Generator unit is enabled, the DTI unit is bypassed. The Fault Protection unit is connected to the Event System. This enables any event to trigger a fault condition that will disable the AWEX output. Several event channels can be used to trigger fault on several different conditions. The AWEX is available for TCC0. The notation is AWEXC. 34 8116B–AVR–12/08 XMEGA A3B 18. Hi-Res - High Resolution Extension 18.1 Features • Increases Waveform Generator resolution by 2-bits (4x) • Supports Frequency, single- and dual-slope PWM operation • Supports the AWEX when this is enabled and used for the same Timer/Counter 18.2 Overview The Hi-Resolution (Hi-Res) Extension is able to increase the resolution of the waveform generation output by a factor of 4. When enabled for a Timer/Counter, the Fast Peripheral clock running at four times the CPU clock speed will be as input to the Timer/Counter. The High Resolution Extension can also be used when an AWEX is enabled and used with a Timer/Counter. XMEGA A3B devices have four Hi-Res Extensions that each can be enabled for each Timer/Counters pair on PORTC, PORTD, PORTE and PORTF. The notation of these are HIRESC, HIRESD, HIRESE and HIRESF, respectively. 35 8116B–AVR–12/08 XMEGA A3B 19. RTC32 - 32-bit Real-Time Counter 19.1 Features • • • • • • 32-bit resolution One 32-bit Compare register One 32-bit Period register Clear Timer on overflow Optional Interrupt/ Event on overflow and compare match Selectable clock reference – 1.024 kHz – 1 Hz • Isolated VBAT power domain with dynamic switch over from/to VCC power domain’ 19.1.1 Overview The 32-bit Real Time Counter (RTC) is a 32-bit counter, counting reference clock cycles and giving an event and/or an interrupt request when it reaches a configurable compare and/or top value. The reference clock is generated from a high accuracy 32.768 kHz crystal, and the design is optimized for low power consumption. The RTC typically operate in low power sleep modes, keeping track of time and waking up the device at regular intervals. The RTC input clock can be taken from a 1.024 kHz or 1 Hz prescaled output from the 32.768 kHz reference clock. The RTC will give a compare interrupt request and/or event when the counter value equals the Compare register value. The RTC will give an overflow interrupt request and/or event when the counter value equals the Period register value. Counter overflow will also reset the counter value to zero. The 32-bit Real Time Counter (RTC) must be clocked from the 1 Hz output of a 32.768 kHz crystal oscillator connected between the TOSC1 and TOSC2 pins when running from VBAT. For more details on the 32-bit RTC refer to the “32-bit Real Time Counter” section in the XMEGA A Manual. Figure 19-1. Real Time Counter Overview 3 2 - b it P e r io d = O v e r f lo w 1 Hz 3 2 - b it C o u n te r 1 .0 2 4 k H z = C o m p a re M a tc h 3 2 - b it C o m p a r e 36 8116B–AVR–12/08 XMEGA A3B 20. TWI - Two Wire Interface 20.1 Features • • • • • • • • • • • • 20.2 Two Identical TWI peripherals Simple yet Powerful and Flexible Communication Interface Both Master and Slave Operation Supported Device can Operate as Transmitter or Receiver 7-bit Address Space Allows up to 128 Different Slave Addresses Multi-master Arbitration Support Up to 400 kHz Data Transfer Speed Slew-rate Limited Output Drivers Noise Suppression Circuitry Rejects Spikes on Bus Lines Fully Programmable Slave Address with General Call Support Address Recognition Causes Wake-up when in Sleep Mode I2C and System Management Bus (SMBus) compatible Overview The Two-Wire Interface (TWI) is a bi-directional wired-AND bus with only two lines, the clock (SCL) line and the data (SDA) line. The protocol makes it possible to interconnect up to 128 individually addressable devices. Since it is a multi-master bus, one or more devices capable of taking control of the bus can be connected. The only external hardware needed to implement the bus is a single pull-up resistor for each of the TWI bus lines. Mechanisms for resolving bus contention are inherent in the TWI protocol. PORTC and PORTE, each has one TWI. Notation of these peripherals are TWIC, and TWIE, respectively. 37 8116B–AVR–12/08 XMEGA A3B 21. SPI - Serial Peripheral Interface 21.1 Features • • • • • • • • • 21.2 Two Identical SPI peripherals Full-duplex, Three-wire Synchronous Data Transfer Master or Slave Operation LSB First or MSB First Data Transfer Seven Programmable Bit Rates End of Transmission Interrupt Flag Write Collision Flag Protection Wake-up from Idle Mode Double Speed (CK/2) Master SPI Mode Overview The Serial Peripheral Interface (SPI) allows high-speed full-duplex, synchronous data transfer between different devices. Devices can communicate using a master-slave scheme, and data is transferred both to and from the devices simultaneously. PORTC and PORTD each has one SPI. Notation of these peripherals are SPIC and SPID, respectively. 38 8116B–AVR–12/08 XMEGA A3B 22. USART 22.1 Features • • • • • • • • • • • • • • • 22.2 Six Identical USART peripherals Full Duplex Operation (Independent Serial Receive and Transmit Registers) Asynchronous or Synchronous Operation Master or Slave Clocked Synchronous Operation High-resolution Arithmetic Baud Rate Generator Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits Odd or Even Parity Generation and Parity Check Supported by Hardware Data OverRun Detection Framing Error Detection Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete Multi-processor Communication Mode Double Speed Asynchronous Communication Mode Master SPI mode for SPI communication IrDA support through the IRCOM module Overview The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a highly flexible serial communication module. The USART supports full duplex communication, and both asynchronous and clocked synchronous operation. The USART can also be set in Master SPI mode to be used for SPI communication. Communication is frame based, and the frame format can be customized to support a wide range of standards. The USART is buffered in both direction, enabling continued data transmission without any delay between frames. There are separate interrupt vectors for receive and transmit complete, enabling fully interrupt driven communication. Frame error and buffer overflow are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can also be enabled. One USART can use the IRCOM module to support IrDA 1.4 physical compliant pulse modulation and demodulation for baud rates up to 115.2 kbps. PORTC and PORTD each has two USARTs, while PORTE and PORTF each has one USART. Notation of these peripherals are USARTC0, USARTC1, USARTD0, USARTD1, USARTE0 and USARTF0, respectively. 39 8116B–AVR–12/08 XMEGA A3B 23. IRCOM - IR Communication Module 23.1 Features • Pulse modulation/demodulation for infrared communication • Compatible to IrDA 1.4 physical for baud rates up to 115.2 kbps • Selectable pulse modulation scheme – 3/16 of baud rate period – Fixed pulse period, 8-bit programmable – Pulse modulation disabled • Built in filtering • Can be connected to and used by one USART at the time 23.2 Overview XMEGA A3B contains an Infrared Communication Module (IRCOM) for IrDA communication with baud rates up to 115.2 kbps. This supports three modulation schemes: 3/16 of baud rate period, fixed programmable pulse time based on the Peripheral Clock speed, or pulse modulation disabled. There is one IRCOM available which can be connected to any USART to enable infrared pulse coding/decoding for that USART. 40 8116B–AVR–12/08 XMEGA A3B 24. Crypto Engine 24.1 Features • Data Encryption Standard (DES) CPU instruction • Advanced Encryption Standard (AES) Crypto module • DES Instruction – Encryption and Decryption – Single-cycle DES instruction – Encryption/Decryption in 16 clock cycles per 8-byte block • AES Crypto Module – Encryption and Decryption – Support 128-bit keys – Support XOR data load mode to the State memory for Cipher Block Chaining – Encryption/Decryption in 375 clock cycles per 16-byte block 24.2 Overview The Advanced Encryption Standard (AES) and Data Encryption Standard (DES) are two commonly used encryption standards. These are supported through an AES peripheral module and a DES CPU instruction. All communication interfaces and the CPU can optionally use AES and DES encrypted communication and data storage. DES is supported by a DES instruction in the AVR XMEGA CPU. The 8-byte key and 8-byte data blocks must be loaded into the Register file, and then DES must be executed 16 times to encrypt/decrypt the data block. The AES Crypto Module encrypts and decrypts 128-bit data blocks with the use of a 128-bit key. The key and data must be loaded into the key and state memory in the module before encryption/decryption is started. It takes 375 peripheral clock cycles before the encryption/decryption is done and decrypted/encrypted data can be read out, and an optional interrupt can be generated. The AES Crypto Module also has DMA support with transfer triggers when encryption/decryption is done and optional auto-start of encryption/decryption when the state memory is fully loaded. 41 8116B–AVR–12/08 XMEGA A3B 25. ADC - 12-bit Analog to Digital Converter 25.1 Features • • • • • • • • • • • • • 25.2 Two ADCs with 12-bit resolution 2 Msps sample rate for each ADC Signed and Unsigned conversions 4 result registers with individual input channel control for each ADC 8 single ended inputs for each ADC 8x4 differential inputs for each ADC 4 internal inputs: – Integrated Temperature Sensor – DAC Output – VCC voltage divided by 10 – Bandgap voltage Software selectable gain of 2, 4, 8, 16, 32 or 64 Software selectable resolution of 8- or 12-bit. Internal or External Reference selection Event triggered conversion for accurate timing DMA transfer of conversion results Interrupt/Event on compare result Overview XMEGA A3B devices have two Analog to Digital Converters (ADC), see Figure 25-1 on page 43. The two ADC modules can be operated simultaneously, individually or synchronized. The ADC converts analog voltages to digital values. The ADC has 12-bit resolution and is capable of converting up to 2 million samples per second. The input selection is flexible, and both single-ended and differential measurements can be done. For differential measurements an optional gain stage is available to increase the dynamic range. In addition several internal signal inputs are available. The ADC can provide both signed and unsigned results. This is a pipeline ADC. A pipeline ADC consists of several consecutive stages, where each stage convert one part of the result. The pipeline design enables high sample rate at low clock speeds, and remove limitations on samples speed versus propagation delay. This also means that a new analog voltage can be sampled and a new ADC measurement started while other ADC measurements are ongoing. ADC measurements can either be started by application software or an incoming event from another peripheral in the device. Four different result registers with individual input selection (MUX selection) are provided to make it easier for the application to keep track of the data. Each result register and MUX selection pair is referred to as an ADC Channel. It is possible to use DMA to move ADC results directly to memory or peripherals when conversions are done. Both internal and external analog reference voltages can be used. An accurate internal 1.0V reference is available. An integrated temperature sensor is available and the output from this can be measured with the ADC. The output from the DAC, VCC/10 and the Bandgap voltage can also be measured by the ADC. 42 8116B–AVR–12/08 XMEGA A3B Channel A MUX selection Channel B MUX selection Channel C MUX selection Channel D MUX selection Configuration Reference selection Pin inputs Channel A Register Channel B Register Pin inputs Internal inputs Figure 25-1. ADC overview ADC Channel C Register 1-64 X Event Trigger Channel D Register Each ADC has four MUX selection registers with a corresponding result register. This means that four channels can be sampled within 1.5 µs without any intervention by the application other than starting the conversion. The results will be available in the result registers. The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 3.5 µs for 12-bit to 2.5 µs for 8-bit result. ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when the result is represented as a signed integer (signed 16-bit number). PORTA and PORTB each have one ADC. Notation of these peripherals are ADCA and ADCB, respectively. 43 8116B–AVR–12/08 XMEGA A3B 26. DAC - 12-bit Digital to Analog Converter 26.1 Features • • • • • • • • 26.2 One DAC with 12-bit resolution Up to 1 Msps conversion rate for each DAC Flexible conversion range Multiple trigger sources 1 continuous output or 2 Sample and Hold (S/H) outputs for each DAC Built-in offset and gain calibration High drive capabilities Low Power Mode Overview The XMEGA A3B devices features two 12-bit, 1 Msps DACs with built-in offset and gain calibration, see Figure 26-1 on page 44. A DAC converts a digital value into an analog signal. The DAC may use an internal 1.1 voltage as the upper limit for conversion, but it is also possible to use the supply voltage or any applied voltage in-between. The external reference input is shared with the ADC reference input. Figure 26-1. DAC overview Configuration Reference selection Channel A Register Channel A DAC Channel B Channel B Register Event Trigger Each DAC has one continuous output with high drive capabilities for both resistive and capacitive loads. It is also possible to split the continuous time channel into two Sample and Hold (S/H) channels, each with separate data conversion registers. A DAC conversion may be started from the application software by writing the data conversion registers. The DAC can also be configured to do conversions triggered by the Event System to have regular timing, independent of the application software. DMA may be used for transferring data from memory locations to DAC data registers. The DAC has a built-in calibration system to reduce offset and gain error when loading with a calibration value from software. PORTB has one DAC. Notation of this is DACB. 44 8116B–AVR–12/08 XMEGA A3B 27. AC - Analog Comparator 27.1 Features • Four Analog Comparators • Selectable Power vs. Speed • Selectable hysteresis – 0, 20 mV, 50 mV • Analog Comparator output available on pin • Flexible Input Selection – All pins on the port – Output from the DAC – Bandgap reference voltage. – Voltage scaler that can perform a 64-level scaling of the internal VCC voltage. • Interrupt and event generation on – Rising edge – Falling edge – Toggle • Window function interrupt and event generation on – Signal above window – Signal inside window – Signal below window 27.2 Overview XMEGA A3B features four Analog Comparators (AC). An Analog Comparator compares two voltages, and the output indicates which input is largest. The Analog Comparator may be configured to give interrupt requests and/or events upon several different combinations of input change. Both hysteresis and propagation delays may be adjusted in order to find the optimal operation for each application. A wide range of input selection is available, both external pins and several internal signals can be used. The Analog Comparators are always grouped in pairs (AC0 and AC1) on each analog port. They have identical behavior but separate control registers. Optionally, the state of the comparator is directly available on a pin. PORTA and PORTB each have one AC pair. Notations are ACA and ACB, respectively. 45 8116B–AVR–12/08 XMEGA A3B Figure 27-1. Analog comparator overview Pin inputs Internal inputs + Pin 0 output AC0 Pin inputs - Internal inputs VCC scaled Interrupt sensitivity control Pin inputs Interrupts Events Internal inputs + AC1 Pin inputs - Internal inputs VCC scaled 46 8116B–AVR–12/08 XMEGA A3B 27.3 Input Selection The Analog comparators have a very flexible input selection and the two comparators grouped in a pair may be used to realize a window function. One pair of analog comparators is shown in Figure 27-1 on page 46. • Input selection from pin – Pin 0, 1, 2, 3, 4, 5, 6 selectable to positive input of analog comparator – Pin 0, 1, 3, 5, 7 selectable to negative input of analog comparator • Internal signals available on positive analog comparator inputs – Output from 12-bit DAC • Internal signals available on negative analog comparator inputs – 64-level scaler of the VCC, available on negative analog comparator input – Bandgap voltage reference – Output from 12-bit DAC 27.4 Window Function The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in Figure 27-2. Figure 27-2. Analog comparator window function + AC0 Upper limit of window Interrupt sensitivity control Input signal Interrupts Events + AC1 Lower limit of window - 47 8116B–AVR–12/08 XMEGA A3B 28. OCD - On-chip Debug 28.1 Features • Complete Program Flow Control – Go, Stop, Reset, Step into, Step over, Step out, Run-to-Cursor Debugging on C and high-level language source code level Debugging on Assembler and disassembler level 1 dedicated program address or source level breakpoint for AVR Studio / debugger 4 Hardware Breakpoints Unlimited Number of User Program Breakpoints Unlimited Number of User Data Breakpoints, with break on: – Data location read, write or both read and write – Data location content equal or not equal to a value – Data location content is greater or less than a value – Data location content is within or outside a range – Bits of a data location are equal or not equal to a value • Non-Intrusive Operation – No hardware or software resources in the device are used • High Speed Operation – No limitation on debug/programming clock frequency versus system clock frequency • • • • • • 28.2 Overview The XMEGA A3B has a powerful On-Chip Debug (OCD) system that - in combination with Atmel’s development tools - provides all the necessary functions to debug an application. It has support for program and data breakpoints, and can debug an application from C and high level language source code level, as well as assembler and disassembler level. It has full Non-Intrusive Operation and no hardware or software resources in the device are used. The ODC system is accessed through an external debugging tool which connects to the JTAG or PDI physical interfaces. Refer to ”Program and Debug Interfaces” on page 49. 48 8116B–AVR–12/08 XMEGA A3B 29. Program and Debug Interfaces 29.1 Features • • • • • 29.2 PDI - Program and Debug Interface (Atmel proprietary 2-pin interface) JTAG Interface (IEEE std. 1149.1 compliant) Boundary-scan capabilities according to the IEEE Std. 1149.1 (JTAG) Access to the OCD system Programming of Flash, EEPROM, Fuses and Lock Bits Overview The programming and debug facilities are accessed through the JTAG and PDI physical interfaces. The PDI physical uses one dedicated pin together with the Reset pin, and no general purpose pins are used. JTAG uses four general purpose pins on PORTB. 29.3 JTAG interface The JTAG physical layer handles the basic low-level serial communication over four I/O lines named TMS, TCK, TDI, and TDO. It complies to the IEEE Std. 1149.1 for test access port and boundary scan. 29.4 PDI - Program and Debug Interface The PDI is an Atmel proprietary protocol for communication between the microcontroller and Atmel’s development tools. 49 8116B–AVR–12/08 XMEGA A3B 30. Pinout and Pin Functions The pinout of XMEGA A3B is shown in ”Pinout/Block Diagram” on page 2. In addition to general I/O functionality, each pin may have several functions. This will depend on which peripheral is enabled and connected to the actual pin. Only one of the alternate pin functions can be used at time. 30.1 Alternate Pin Function Description The tables below shows the notation for all pin functions available and describes its function. 30.1.1 30.1.2 30.1.3 30.1.4 30.1.5 Operation/Power Supply VCC Digital supply voltage AVCC Analog supply voltage VBAT Battery Backup Module supply voltage GND Ground Port Interrupt functions SYNC Port pin with full synchronous and limited asynchronous interrupt function ASYNC Port pin with full synchronous and full asynchronous interrupt function Analog functions ACn Analog Comparator input pin n AC0OUT Analog Comparator 0 Output ADCn Analog to Digital Converter input pin n DACn Digital to Analog Converter output pin n AREF Analog Reference input pin Timer/Counter and AWEX functions OCnx Output Compare Channel x for Timer/Counter n OCxn Inverted Output Compare Channel x for Timer/Counter n Communication functions SCL Serial Clock for TWI SDA Serial Data for TWI SCLIN Serial Clock In for TWI when external driver interface is enabled SCLOUT Serial Clock Out for TWI when external driver interface is enabled SDAIN Serial Data In for TWI when external driver interface is enabled SDAOUT Serial Data Out for TWI when external driver interface is enabled 50 8116B–AVR–12/08 XMEGA A3B 30.1.6 30.1.7 XCKn Transfer Clock for USART n RXDn Receiver Data for USART n TXDn Transmitter Data for USART n SS Slave Select for SPI MOSI Master Out Slave In for SPI MISO Master In Slave Out for SPI SCK Serial Clock for SPI Oscillators, Clock and Event TOSCn Timer Oscillator pin n XTALn Input/Output for inverting Oscillator pin n CLKOUT Peripheral Clock Output EVOUT Event Channel 0 Output Debug/System functions RESET Reset pin PDI_CLK Program and Debug Interface Clock pin PDI_DATA Program and Debug Interface Data pin TCK JTAG Test Clock TDI JTAG Test Data In TDO JTAG Test Data Out TMS JTAG Test Mode Select 51 8116B–AVR–12/08 XMEGA A3B 30.2 Alternate Pin Functions The tables below show the primary/default function for each pin on a port in the first column, the pin number in the second column, and then all alternate pin functions in the remaining columns. The head row shows what peripheral that enable and use the alternate pin functions. Table 30-1. PORT A Port A - Alternate functions PIN # INTERRUPT ADCA POS ADCA NEG ADCA GAINPOS SYNC ADC0 ADC0 ADC0 ADCA GAINNEG ACA POS ACA NEG AC0 AC0 AC1 GND 60 AVCC 61 PA0 62 PA1 63 SYNC ADC1 ADC1 ADC1 AC1 PA2 64 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 PA3 1 SYNC ADC3 ADC3 ADC3 PA4 2 SYNC ADC4 ADC4 ADC4 AC4 PA5 3 SYNC ADC5 ADC5 ADC5 AC5 PA6 4 SYNC ADC6 ADC6 ADC6 AC6 PA7 5 SYNC ADC7 ADC7 ADC7 Table 30-2. PORT B AC3 REFA AREF AC3 AC5 AC7 AC0OUT Port B - Alternate functions PIN # INTERRUPT ADCB POS ADCB NEG ADCB GAINPOS PB0 6 SYNC ADC0 ADC0 PB1 7 SYNC ADC1 ADC1 PB2 8 SYNC/ASYNC ADC2 PB3 9 SYNC ADC3 PB4 10 SYNC ADC4 ADC4 ADC4 AC4 PB5 11 SYNC ADC5 ADC5 ADC5 AC5 PB6 12 SYNC ADC6 ADC6 ADC6 AC6 PB7 13 SYNC ADC7 ADC7 ADC7 Table 30-3. PORT C ACA OUT ADCB GAINNEG ACB POS ACB NEG ADC0 AC0 AC0 ADC1 AC1 AC1 ADC2 ADC2 AC2 ADC3 ADC3 AC3 ACB OUT DACB REFB JTAG AREF DAC0 AC3 DAC1 TMS AC5 TDI TCK AC7 AC0OUT TDO Port C - Alternate functions PIN # INTERRUPT TCC0 AWEXC TCC1 USARTC0 USARTC1 SPIC TWIC GND 14 AVCC 15 PC0 16 SYNC OC0A OC0A PC1 17 SYNC OC0B OC0A XCK0 SCL/SCL_IN PC2 18 SYNC/ASYNC OC0C OC0B RXD0 SDA_OUT PC3 19 SYNC OC0D OC0B TXD0 SCL_OUT PC4 20 SYNC OC0C OC1A PC5 21 SYNC OC0C OC1B PC6 22 SYNC PC7 23 SYNC CLOCKOUT EVENTOUT CLKOUT EVOUT SDA/SDA_IN SS XCK1 MOSI OC0D RXD1 MISO OC0D TXD1 SCK 52 8116B–AVR–12/08 XMEGA A3B Table 30-4. PORT D Port D - Alternate functions PIN # INTERRUPT TCD0 SYNC OC0A TCD1 USARTD0 USARTD1 SPID GND 24 VCC 25 PD0 26 PD1 27 SYNC OC0B XCK0 PD2 28 SYNC/ASYNC OC0C RXD0 PD3 29 SYNC OC0D TXD0 PD4 30 SYNC OC1A PD5 31 SYNC OC1B XCK1 MOSI PD6 32 SYNC RXD1 MISO PD7 33 SYNC TXD1 SCK Table 30-5. PORT E CLOCKOUT EVENTOUT CLKOUT EVOUT SS Port E - Alternate functions PIN # INTERRUPT TCE0 SYNC OC0A TCE1 USARTE0 TWIE GND 34 VCC 35 PE0 36 PE1 37 SYNC OC0B XCK0 SCL/SCL_IN PE2 38 SYNC/ASYNC OC0C RXD0 SDA_OUT PE3 39 SYNC OC0D TXD0 SCL_OUT PE4 40 SYNC OC1A PE5 41 SYNC OC1B TOSC2 42 TOSC1 43 Table 30-6. PORT F SDA/SDA_IN Port F - Alternate functions PIN # INTERRUPT TCF0 USARTF0 GND 44 VCC 45 PF0 46 SYNC OC0A PF1 47 SYNC OC0B XCK0 PF2 48 SYNC/ASYNC OC0C RXD0 PF3 49 SYNC OC0D TXD0 PF4 50 SYNC OC0A VBAT 51 GND 52 SYNC VCC 53 SYNC PF6 54 PF7 55 53 8116B–AVR–12/08 XMEGA A3B Table 30-7. PORT R PIN # Port R- Alternate functions INTERRUPT PDI XTAL PDI 56 PDI_DATA RESET 57 PDI_CLK PRO 58 SYNC XTAL2 PR1 59 SYNC XTAL1 54 8116B–AVR–12/08 XMEGA A3B 31. Peripheral Module Address Map The address maps show the base address for each peripheral and module in XMEGA A3B. For complete register description and summary for each peripheral module, refer to the XMEGA A Manual. Base Address 0x0000 0x0010 0x0014 0x0018 0x001C 0x0030 0x0040 0x0048 0x0050 0x0060 0x0068 0x0070 0x0078 0x0080 0x0090 0x00A0 0x00B0 0x00C0 0x00F0 0x0100 0x0180 0x01C0 0x0200 0x0240 0x0320 0x0380 0x0390 0x0420 0x0480 0x04A0 0x0600 0x0620 0x0640 0x0660 0x0680 0x06A0 0x07E0 0x0800 0x0840 0x0880 0x0890 0x08A0 0x08B0 0x08C0 0x08F8 0x0900 0x0940 0x0990 0x09A0 0x09B0 0x09C0 0x0A00 0x0A40 0x0A80 0x0A90 0x0AA0 0x0B00 0x0B90 0x0BA0 Name Description GPIO VPORT0 VPORT1 VPORT2 VPORT3 CPU CLK SLEEP OSC DFLLRC32M DFLLRC2M PR RST WDT MCU PMIC PORTCFG AES VBAT DMA EVSYS NVM ADCA ADCB DACB ACA ACB RTC32 TWIC TWIE PORTA PORTB PORTC PORTD PORTE PORTF PORTR TCC0 TCC1 AWEXC HIRESC USARTC0 USARTC1 SPIC IRCOM TCD0 TCD1 HIRESD USARTD0 USARTD1 SPID TCE0 TCE1 AWEXE HIRESE USARTE0 TCF0 HIRESF USARTF0 General Purpose IO Registers Virtual Port 0 Virtual Port 1 Virtual Port 2 Virtual Port 2 CPU Clock Control Sleep Controller Oscillator Control DFLL for the 32 MHz Internal RC Oscillator DFLL for the 2 MHz RC Oscillator Power Reduction Reset Controller Watch-Dog Timer MCU Control Programmable Multilevel Interrupt Controller Port Configuration AES Module VBAT Battery Backup Module DMA Controller Event System Non Volatile Memory (NVM) Controller Analog to Digital Converter on port A Analog to Digital Converter on port B Digital to Analog Converter on port B Analog Comparator pair on port A Analog Comparator pair on port B 32-bit Real Time Counter Two Wire Interface on port C Two Wire Interface on port E Port A Port B Port C Port D Port E Port F Port R Timer/Counter 0 on port C Timer/Counter 1 on port C Advanced Waveform Extension on port C High Resolution Extension on port C USART 0 on port C USART 1 on port C Serial Peripheral Interface on port C Infrared Communication Module Timer/Counter 0 on port D Timer/Counter 1 on port D High Resolution Extension on port D USART 0 on port D USART 1 on port D Serial Peripheral Interface on port D Timer/Counter 0 on port E Timer/Counter 1 on port E Advanced Waveform Extension on port E High Resolution Extension on port E USART 0 on port E Timer/Counter 0 on port F High Resolution Extension on port F USART 0 on port F 55 8116B–AVR–12/08 XMEGA A3B 32. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks Arithmetic and Logic Instructions ADD Rd, Rr Add without Carry Rd ← Rd + Rr Z,C,N,V,S,H 1 ADC Rd, Rr Add with Carry Rd ← Rd + Rr + C Z,C,N,V,S,H 1 ADIW Rd, K Add Immediate to Word Rd ← Rd + 1:Rd + K Z,C,N,V,S 2 SUB Rd, Rr Subtract without Carry Rd ← Rd - Rr Z,C,N,V,S,H 1 SUBI Rd, K Subtract Immediate Rd ← Rd - K Z,C,N,V,S,H 1 SBC Rd, Rr Subtract with Carry Rd ← Rd - Rr - C Z,C,N,V,S,H 1 SBCI Rd, K Subtract Immediate with Carry Rd ← Rd - K - C Z,C,N,V,S,H 1 SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd ← Rd + 1:Rd - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Rd ← Rd • Rr Z,N,V,S 1 ANDI Rd, K Logical AND with Immediate Rd ← Rd • K Z,N,V,S 1 OR Rd, Rr Logical OR Rd ← Rd v Rr Z,N,V,S 1 ORI Rd, K Logical OR with Immediate Rd ← Rd v K Z,N,V,S 1 EOR Rd, Rr Exclusive OR Rd ← Rd ⊕ Rr Z,N,V,S 1 COM Rd One’s Complement Rd ← $FF - Rd Z,C,N,V,S 1 NEG Rd Two’s Complement Rd ← $00 - Rd Z,C,N,V,S,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V,S 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • ($FFh - K) Z,N,V,S 1 INC Rd Increment Rd ← Rd + 1 Z,N,V,S 1 DEC Rd Decrement Rd ← Rd - 1 Z,N,V,S 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V,S 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V,S 1 SER Rd Set Register Rd ← $FF None 1 MUL Rd,Rr Multiply Unsigned R1:R0 ← Rd x Rr (UU) Z,C 2 MULS Rd,Rr Multiply Signed R1:R0 ← Rd x Rr (SS) Z,C 2 MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr (SU) Z,C 2 FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 ← Rd x Rr<<1 (UU) Z,C 2 FMULS Rd,Rr Fractional Multiply Signed R1:R0 ← Rd x Rr<<1 (SS) Z,C 2 FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 ← Rd x Rr<<1 (SU) Z,C 2 DES K Data Encryption if (H = 0) then R15:R0 else if (H = 1) then R15:R0 ← ← Encrypt(R15:R0, K) Decrypt(R15:R0, K) PC ← PC + k + 1 None 2 1/2 Branch Instructions RJMP k Relative Jump IJMP Indirect Jump to (Z) PC(15:0) PC(21:16) ← ← Z, 0 None 2 EIJMP Extended Indirect Jump to (Z) PC(15:0) PC(21:16) ← ← Z, EIND None 2 JMP k Jump PC ← k None 3 RCALL k Relative Call Subroutine PC ← PC + k + 1 None 2 / 3(1) ICALL Indirect Call to (Z) PC(15:0) PC(21:16) ← ← Z, 0 None 2 / 3(1) EICALL Extended Indirect Call to (Z) PC(15:0) PC(21:16) ← ← Z, EIND None 3(1) 56 8116B–AVR–12/08 XMEGA A3B Mnemonics Operands Description CALL k call Subroutine PC ← RET Subroutine Return PC RETI Interrupt Return CPSE Rd,Rr Compare, Skip if Equal CP Rd,Rr Compare CPC Rd,Rr Compare with Carry CPI Rd,K Compare with Immediate Operation Flags #Clocks k None 3 / 4(1) ← STACK None 4 / 5(1) PC ← STACK I 4 / 5(1) if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 Rd - Rr Z,C,N,V,S,H 1 Rd - Rr - C Z,C,N,V,S,H 1 Rd - K Z,C,N,V,S,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC ← PC + 2 or 3 None 1/2/3 SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC ← PC + 2 or 3 None 2/3/4 SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC ← PC + 2 or 3 None 2/3/4 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC ← PC + k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC ← PC + k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if (I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if (I = 0) then PC ← PC + k + 1 None 1/2 MOV Rd, Rr Copy Register Rd ← Rr None 1 MOVW Rd, Rr Copy Register Pair Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LDS Rd, k Load Direct from data space Rd ← (k) None 2(1)(2) LD Rd, X Load Indirect Rd ← (X) None 1(1)(2) LD Rd, X+ Load Indirect and Post-Increment Rd X ← ← (X) X+1 None 1(1)(2) LD Rd, -X Load Indirect and Pre-Decrement X ← X - 1, Rd ← (X) ← ← X-1 (X) None 2(1)(2) LD Rd, Y Load Indirect Rd ← (Y) ← (Y) None 1(1)(2) LD Rd, Y+ Load Indirect and Post-Increment Rd Y ← ← (Y) Y+1 None 1(1)(2) Data Transfer Instructions 57 8116B–AVR–12/08 XMEGA A3B Mnemonics Operands Description Flags #Clocks LD Rd, -Y Load Indirect and Pre-Decrement Y Rd ← ← Y-1 (Y) None 2(1)(2) LDD Rd, Y+q Load Indirect with Displacement Rd ← (Y + q) None 2(1)(2) LD Rd, Z Load Indirect Rd ← (Z) None 1(1)(2) LD Rd, Z+ Load Indirect and Post-Increment Rd Z ← ← (Z), Z+1 None 1(1)(2) LD Rd, -Z Load Indirect and Pre-Decrement Z Rd ← ← Z - 1, (Z) None 2(1)(2) LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2(1)(2) STS k, Rr Store Direct to Data Space (k) ← Rd None 2(1) ST X, Rr Store Indirect (X) ← Rr None 1(1) ST X+, Rr Store Indirect and Post-Increment (X) X ← ← Rr, X+1 None 1(1) ST -X, Rr Store Indirect and Pre-Decrement X (X) ← ← X - 1, Rr None 2(1) ST Y, Rr Store Indirect (Y) ← Rr None 1(1) ST Y+, Rr Store Indirect and Post-Increment (Y) Y ← ← Rr, Y+1 None 1(1) ST -Y, Rr Store Indirect and Pre-Decrement Y (Y) ← ← Y - 1, Rr None 2(1) STD Y+q, Rr Store Indirect with Displacement (Y + q) ← Rr None 2(1) ST Z, Rr Store Indirect (Z) ← Rr None 1(1) ST Z+, Rr Store Indirect and Post-Increment (Z) Z ← ← Rr Z+1 None 1(1) ST -Z, Rr Store Indirect and Pre-Decrement Z ← Z-1 None 2(1) STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2(1) Load Program Memory R0 ← (Z) None 3 LPM Operation LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Increment Rd Z ← ← (Z), Z+1 None 3 Extended Load Program Memory R0 ← (RAMPZ:Z) None 3 ELPM ELPM Rd, Z Extended Load Program Memory Rd ← (RAMPZ:Z) None 3 ELPM Rd, Z+ Extended Load Program Memory and PostIncrement Rd Z ← ← (RAMPZ:Z), Z+1 None 3 Store Program Memory (RAMPZ:Z) ← R1:R0 None - (RAMPZ:Z) Z ← ← R1:R0, Z+2 None - Rd ← I/O(A) None 1 I/O(A) ← Rr None 1 STACK ← Rr None 1(1) Rd ← STACK None 2(1) Rd(n+1) Rd(0) C ← ← ← Rd(n), 0, Rd(7) Z,C,N,V,H 1 Rd(n) Rd(7) C ← ← ← Rd(n+1), 0, Rd(0) Z,C,N,V 1 SPM SPM Z+ Store Program Memory and Post-Increment by 2 IN Rd, A In From I/O Location OUT A, Rr Out To I/O Location PUSH Rr Push Register on Stack POP Rd Pop Register from Stack Bit and Bit-test Instructions LSL Rd Logical Shift Left LSR Rd Logical Shift Right 58 8116B–AVR–12/08 XMEGA A3B Mnemonics Operands Description Operation ROL Rd Rotate Left Through Carry ROR Rd ASR Rd Flags #Clocks Rd(0) Rd(n+1) C ← ← ← C, Rd(n), Rd(7) Z,C,N,V,H 1 Rotate Right Through Carry Rd(7) Rd(n) C ← ← ← C, Rd(n+1), Rd(0) Z,C,N,V 1 Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0) ↔ Rd(7..4) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 SBI A, b Set Bit in I/O Register I/O(A, b) ← 1 None 1 CBI A, b Clear Bit in I/O Register I/O(A, b) ← 0 None 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C 1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N 1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z 1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I 1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S 1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Two’s Complement Overflow V ← 1 V 1 CLV Clear Two’s Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T 1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H 1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 MCU Control Instructions BREAK Break NOP No Operation SLEEP Sleep WDR Watchdog Reset Notes: (See specific descr. for BREAK) None 1 None 1 (see specific descr. for Sleep) None 1 (see specific descr. for WDR) None 1 1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface. 2. One extra cycle must be added when accessing Internal SRAM. 59 8116B–AVR–12/08 XMEGA A3B 33. Packaging information 33.1 64A PIN 1 B PIN 1 IDENTIFIER E1 e E D1 D C 0°~7° A1 A2 A L COMMON DIMENSIONS (Unit of Measure = mm) Notes: 1.This package conforms to JEDEC reference MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. SYMBOL MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e NOTE Note 2 Note 2 0.80 TYP 10/5/2001 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 64A, 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. REV. 64A B 60 8116B–AVR–12/08 XMEGA A3B 33.2 64M2 D Marked Pin# 1 ID E C SEATING PLANE A1 TOP VIEW A K 0.08 C L Pin #1 Corner D2 1 2 3 SIDE VIEW Pin #1 Triangle Option A COMMON DIMENSIONS (Unit of Measure = mm) E2 Option B Pin #1 Chamfer (C 0.30) SYMBOL MIN A 0.80 0.90 1.00 A1 – 0.02 0.05 0.18 0.25 0.30 b K Option C b e Pin #1 Notch (0.20 R) BOTTOM VIEW NOM MAX D 8.90 9.00 9.10 D2 7.50 7.65 7.80 E 8.90 9.00 9.10 E2 7.50 7.65 7.80 e NOTE 0.50 BSC L 0.35 0.40 0.45 K 0.20 0.27 0.40 Note: 1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD. 2. Dimension and tolerance conform to ASMEY14.5M-1994. 5/25/06 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 64M2, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, 7.65 mm Exposed Pad, Micro Lead Frame Package (MLF) DRAWING NO. 64M2 REV. D 61 8116B–AVR–12/08 XMEGA A3B 34. Electrical Characteristics - TBD 34.1 Absolute Maximum Ratings* Operating Temperature.................................. -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin with respect to Ground..-0.5V to VCC+0.5V Maximum Operating Voltage ............................................ 3.6V DC Current per I/O Pin ............................................... 20.0 mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Current VCC and GND Pins................................ 200.0 mA 34.2 DC Characteristics TA = -40°C to 85°C, VCC = 1.8V to 3.6V (unless otherwise noted) Symbol Parameter VIL Input Low Voltage, except XTAL1 pin V VIL1 Input Low Voltage, XTAL1 pins V VIH Input High Voltage, except XTAL1 pin V VIH1 Input High Voltage, XTAL1 pin V VOL Output Low Voltage VOH Output High Voltage IIL Input Leakage Current I/O Pin µA IIH Input Leakage Current I/O Pin µA RRST Reset Pull-up Resistor kΩ RPU I/O Pin Pull-up Resistor kΩ Power Supply Current ICC Power-down mode Condition Min. Typ. Max. Units Active 32 MHz mA Active 20 MHz mA Active 8MHz mA Idle 32 MHz mA Idle 20 MHz mA WDT disabled µA WDT slow sampling µA WDT fast sampling Note: 1. “Max” means the highest value where the pin is guaranteed to be read as low 2. “Min” means the lowest value where the pin is guaranteed to be read as high 62 8116B–AVR–12/08 XMEGA A3B 34.3 Speed The maximum frequency of the XMEGA A3B devices is depending on VCC. As shown in Figure 34-1 on page 63 the Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V. Figure 34-1. Maximum Frequency vs. Vcc MHz 32 Safe Operating Area 12 1.6 1.8 2.7 3.6 V 63 8116B–AVR–12/08 XMEGA A3B 34.4 ADC Characteristics – TBD Table 34-1. Symbol ADC Characteristics Parameter Condition Min Typ Max Resolution LSB Integral Non-Linearity (INL) LSB Differential Non-Linearity (DNL) LSB Gain Error LSB Offset Error LSB Conversion Time AVCC µs ADC Clock Frequency MHz DC Supply Voltage mA Source Impedance Ω Start-up time µs VCC - 0.3 Analog Supply Voltage Table 34-2. Symbol Units VCC + 0.3 V Max Units ADC Gain Stage Characteristics Parameter Condition Min Typ Gain Input Capacitance pF Offset Error mV Gain Error % Signal Range V DC Supply Current Start-up time mA # clk cycles 64 8116B–AVR–12/08 XMEGA A3B 34.5 DAC Characteristics – TBD Table 34-3. Symbol 34.6 DAC Characteristics Parameter Condition Min Typ Max Units Resolution LSB Integral Non-Linearity (INL) LSB Differential Non-Linearity (DNL) LSB Gain Error LSB Offset Error LSB Calibrated Gain/Offset Error LSB Output Range V Output Settling Time µs Output Capacitance nF Output Resistance kΩ Reference Input Voltage V Reference Input Capacitance pF Reference Input Resistance kΩ Current Consumption mA Start-up time µs Analog Comparator Characteristics – TBD Table 34-4. Symbol Analog Comparator Characteristics Parameter Condition Offset Min Typ Max Units mV No Hysteresis Low mV High High Speed mode Propagation Delay ns Low power mode High Speed mode Current Consumption µA Low power mode Start-up time µs 65 8116B–AVR–12/08 XMEGA A3B 35. Typical Characteristics - TBD 66 8116B–AVR–12/08 XMEGA A3B 36. Errata 36.1 36.1.1 ATxmega256A3B rev. A • • • • • • • • • • • Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously DAC is nonlinear and inaccurate if the external reference is above 2.4V or VCC - 0.6V ADC gain stage output range is limited to 2.4V Sampled BOD in Active mode will cause noise when bandgap is used as reference Flash Power Reduction Mode can not be enabled when entering sleep mode JTAG enable does not override Analog Comparator B output Bandgap measurement with the ADC is non-functional when VCC is below 2.7V DAC refresh may be blocked in S/H mode BOD will be enabled after any reset Both DFLLs and both oscillators has to be enabled for one to work Operating frequnecy and voltage limitations 1. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously If the bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input for the another AC, the first comparator will be affected for up to 1 us and could potentially give a wrong comparison result. Problem fix/Workaround If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling any of them. 2. DAC is nonlinear and inaccurate if the external reference is above 2.4V or Vcc-0.6V Using the DAC with a reference voltage above 2.4V or Vcc-0.6V give inaccurate output in the top 25% of the output range: – ±30 LSB for continuous mode – ±200 LSB for Sample and Hold mode Problem fix/Workaround None, avoid using a voltage reference above 2.4V or Vcc-0.6V. 3. ADC gain stage output range is limited to 2.4 V The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give correct output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of: – 1x gain: 2.4 V – 2x gain: 1.2 V – 4x gain: 0.6 V – 8x gain: 300 mV 67 8116B–AVR–12/08 XMEGA A3B – 16x gain: 150 mV – 32x gain: 75 mV – 64x gain: 38 mV Problem fix/Workaround Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep ADC voltage reference below 2.4 V. 4. Sampled BOD in Active mode will cause noise when bandgap is used as reference Using the BOD in sampled mode when the device is running in Active or Idle mode will add noise on the bandgap reference for ADC, DAC and Analog Comparator. Problem fix/Workaround If the bandgap is used as reference for either the ADC, DAC and Analog Comparator, the BOD must not be set in sampled mode. 5. Flash Power Reduction Mode can not be enabled when entering sleep mode If Flash Power Reduction Mode is enabled when a deep sleep mode, the device will only wake up on every fourth wake-up request. If Flash Power Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with up to 16 CPU clock cycles. Problem fix/Workaround Disable Flash Power Reduction mode before entering sleep mode. 6. JTAG enable does not override Analog Comparator B output When JTAG is enabled this will not override the Anlog Comparator B (ACB)ouput, AC0OUT on pin 7 if this is enabled. Problem fix/Workaround AC0OUT for ACB should not be enabled when JTAG is used. Use only analog comparator output for ACA when JTAG is used, or use the PDI as debug interface. 7. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V The ADC cannot be used to do bandgap measurements when VCC is below 2.7V. Problem fix/Workaround If internal voltages must be measured when VCC is below 2.7V, measure the internal 1.00V reference instead of the bandgap. 8. DAC refresh may be blocked in S/H mode If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is done at maximum rate (i.e. the DAC is always busy doing conversion for this channel), this will block refresh signals to the second channel. Problem fix/Workarund When using the DAC in S/H mode, ensure that none of the channels is running at maximum conversion rate, or ensure that the conversion rate of both channels is high enough to not require refresh. 68 8116B–AVR–12/08 XMEGA A3B 9 BOD will be enabled after any reset If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the programmed BOD level even if the BOD is disabled. Problem fix/Workaround Do not set the BOD level higher than VCC even if the BOD is not used. 10 Both DFLLs and both oscillators has to be enabled for one to work In order to use the automatic runtime calibration for the 2 MHz or the 32MHz internal oscillators, the DFLL for both oscillators and both oscillators has to be enabled for one to work. Problem fix/Workaround Enabled both the DFLLs and both oscillators when using automtics runtime calibartion for one of the internal oscillators. 11 Operating Frequancy and Voltage Limitation To ensure correct operation, there is a limit on operating frequnecy and voltage. Figure 36-1 on page 69 shows the safe operating area. Figure 36-1. Operating Frequnecy and Voltage Limitation MHz 30 15 Safe operating area 2.4 3.6 V Problem fix/Workaround None, avoid using the device outside these frequnecy and voltage limitations. 69 8116B–AVR–12/08 XMEGA A3B 37. Datasheet Revision History 37.1 37.2 8116B - 12/08 1. Added ”Errata” on page 67 for ATxmega256A3B rev A. 1. Initial version. 8116A - 11/08 70 8116B–AVR–12/08 XMEGA A3B Table of Contents Features ..................................................................................................... 1 Typical Applications ................................................................................ 1 1 Ordering Information ............................................................................... 2 2 Pinout/Block Diagram .............................................................................. 2 3 Overview ................................................................................................... 3 3.1Block Diagram ...........................................................................................................4 4 Resources ................................................................................................. 5 4.1Recommended reading .............................................................................................5 5 Disclaimer ................................................................................................. 5 6 AVR CPU ................................................................................................... 6 6.1Features ....................................................................................................................6 6.2Overview ...................................................................................................................6 6.3Register File ..............................................................................................................7 6.4ALU - Arithmetic Logic Unit .......................................................................................7 6.5Program Flow ............................................................................................................7 7 Memories .................................................................................................. 8 7.1Features ....................................................................................................................8 7.2Overview ...................................................................................................................8 7.3In-System Programmable Flash Program Memory ...................................................9 7.4Data Memory .............................................................................................................9 7.5Production Signature Row .......................................................................................11 7.6Production Signature Row .......................................................................................12 7.7User Signature Row ................................................................................................12 7.8Flash and EEPROM Page Size ...............................................................................13 8 DMAC - Direct Memory Access Controller .......................................... 14 8.1Features ..................................................................................................................14 8.2Overview .................................................................................................................14 9 Event System ......................................................................................... 15 9.1Features ..................................................................................................................15 9.2Overview .................................................................................................................15 10 System Clock and Clock options ......................................................... 17 i 8116B–AVR–12/08 XMEGA A3B 10.1Features ................................................................................................................17 10.2Overview ...............................................................................................................17 10.3Clock Options ........................................................................................................18 11 Power Management and Sleep Modes ................................................. 20 11.1Features ................................................................................................................20 11.2Overview ...............................................................................................................20 11.3Sleep Modes .........................................................................................................20 12 System Control and Reset .................................................................... 22 12.1Features ................................................................................................................22 12.2Resetting the AVR .................................................................................................22 12.3Reset Sources .......................................................................................................22 12.4WDT - Watchdog Timer .........................................................................................23 13 Battery Backup System ......................................................................... 24 13.1Features ................................................................................................................24 13.2Overview ...............................................................................................................24 14 PMIC - Programmable Multi-level Interrupt Controller ....................... 26 14.1Features ................................................................................................................26 14.2Overview ...............................................................................................................26 14.3Interrupt vectors ....................................................................................................26 15 I/O Ports .................................................................................................. 28 15.1Features ................................................................................................................28 15.2Overview ...............................................................................................................28 15.3I/O configuration ....................................................................................................28 15.4Input sensing .........................................................................................................31 15.5Port Interrupt .........................................................................................................31 15.6Alternate Port Functions ........................................................................................31 16 T/C - 16-bit Timer/Counter with PWM ................................................... 32 16.1Features ................................................................................................................32 16.2Overview ...............................................................................................................32 17 AWEX - Advanced Waveform Extension ............................................. 34 17.1Features ................................................................................................................34 17.2Overview ...............................................................................................................34 18 Hi-Res - High Resolution Extension ..................................................... 35 ii 8116B–AVR–12/08 XMEGA A3B 18.1Features ................................................................................................................35 18.2Overview ...............................................................................................................35 19 RTC32 - 32-bit Real-Time Counter ........................................................ 36 19.1Features ................................................................................................................36 20 TWI - Two Wire Interface ....................................................................... 37 20.1Features ................................................................................................................37 20.2Overview ...............................................................................................................37 21 SPI - Serial Peripheral Interface ............................................................ 38 21.1Features ................................................................................................................38 21.2Overview ...............................................................................................................38 22 USART ..................................................................................................... 39 22.1Features ................................................................................................................39 22.2Overview ...............................................................................................................39 23 IRCOM - IR Communication Module .................................................... 40 23.1Features ................................................................................................................40 23.2Overview ...............................................................................................................40 24 Crypto Engine ........................................................................................ 41 24.1Features ................................................................................................................41 24.2Overview ...............................................................................................................41 25 ADC - 12-bit Analog to Digital Converter ............................................. 42 25.1Features ................................................................................................................42 25.2Overview ...............................................................................................................42 26 DAC - 12-bit Digital to Analog Converter ............................................. 44 26.1Features ................................................................................................................44 26.2Overview ...............................................................................................................44 27 AC - Analog Comparator ....................................................................... 45 27.1Features ................................................................................................................45 27.2Overview ...............................................................................................................45 27.3Input Selection .......................................................................................................47 27.4Window Function ...................................................................................................47 28 OCD - On-chip Debug ............................................................................ 48 28.1Features ................................................................................................................48 28.2Overview ...............................................................................................................48 iii 8116B–AVR–12/08 XMEGA A3B 29 Program and Debug Interfaces ............................................................. 49 29.1Features ................................................................................................................49 29.2Overview ...............................................................................................................49 29.3JTAG interface ......................................................................................................49 29.4PDI - Program and Debug Interface ......................................................................49 30 Pinout and Pin Functions ...................................................................... 50 30.1Alternate Pin Function Description ........................................................................50 30.2Alternate Pin Functions .........................................................................................52 31 Peripheral Module Address Map .......................................................... 55 32 Instruction Set Summary ...................................................................... 56 33 Packaging information .......................................................................... 60 33.164A ........................................................................................................................60 33.264M2 .....................................................................................................................61 34 Electrical Characteristics - TBD ........................................................... 62 34.1Absolute Maximum Ratings* .................................................................................62 34.2DC Characteristics ................................................................................................62 34.3Speed ....................................................................................................................63 34.4ADC Characteristics – TBD ...................................................................................64 34.5DAC Characteristics – TBD ...................................................................................65 34.6Analog Comparator Characteristics – TBD ...........................................................65 35 Typical Characteristics - TBD ............................................................... 66 36 Errata ....................................................................................................... 67 36.1ATxmega256A3B ..................................................................................................67 37 Datasheet Revision History .................................................................. 70 37.18116B - 12/08 ........................................................................................................70 37.28116A - 11/08 ........................................................................................................70 Table of Contents....................................................................................... i iv 8116B–AVR–12/08 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2008 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, AVR ® and others are registered trademarks, XMEGATM and others are trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 8116B–AVR–12/08