Features • Serial Peripheral Interface (SPI) Compatible • Supports SPI Modes 0 (0,0) and 3 (1,1) – Data Sheet Describes Mode 0 Operation • Low-voltage and Standard-voltage Operation • • • • • • • • – VCC = 1.8V to 5.5V 20 MHz Clock Rate (5V) 8-byte Page Mode Block Write Protection – Protect 1/4, 1/2, or Entire Array Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software Data Protection Self-timed Write Cycle (5 ms max) High Reliability – Endurance: One Million Write Cycles – Data Retention: 100 Years Green (Pb/Halogen-free/Rohs Compliant) Packaging Options Die Sales: Wafer Form, Waffle Pack, Bumped Wafers Description The AT25010B/020B/040B provides 1024/2048/4096 bits of serial electrically erasable programmable read-only memory (EEPROM) organized as 128/256/512 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT25010B/020B/040B is available in space saving, JEDEC SOIC, UDFN, TSSOP, XDFN and VFBGA packages. SPI Serial EEPROM 1K (128x8) 2K (256x8) 4K (512x8) AT25010B AT25020B AT25040B The AT25010B/020B/040B is enabled through the Chip Select pin (CS) and accessed via a three-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK). All programming cycles are completely self-timed, and no separate erase cycle is required before write. Block write protection is enabled by programming the status register with one of four blocks of write protection. Separate Program Enable and Program disable instructions are provided for additional data protection. Hardware data protection is provided via the WP pin to protect against inadvertent write attempts. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence. Table 0-1. Pin Configuration SOIC, TSSOP Pin Name Function CS Chip Select SCK Serial Data Clock SI Serial Data Input SO Serial Data Output GND Ground VCC Power Supply WP Write Protect HOLD Suspends Serial Input CS 1 8 VCC SO WP GND 2 7 3 6 4 5 HOLD SCK SI 8-lead UDFN, XDFN VCC 8 HOLD 7 SCK 6 SI 5 1 CS 2 SO 3 WP 4 GND Bottom View 8-ball VFBGA VCC 8 HOLD 7 SCK 6 1 CS 2 3 SO WP SI 5 4 GND Bottom View 8707B–SEEPR–3/10 1. Absolute Maximum Ratings* Operating Temperature ............................ −40°C to + 125°C Storage Temperature................................ −65°C to + 150°C Voltage on Any Pin with Respect to Ground ................................ −1.0V to + 7.0V Maximum Operating Voltage.................................... 6.25V DC Output Current ................................................. 5.0 mA Figure 1-1. *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Block Diagram VCC STATUS REGISTER MEMORY ARRAY 128/256/512 X 8 ADDRESS DECODER DATA REGISTER OUTPUT BUFFER MODE DECODE LOGIC CLOCK GENERATOR 2 AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B Table 1-1. Pin Capacitance (1) Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted) Symbol Test Conditions COUT CIN Note: Max Units Conditions Output Capacitance (SO) 8 pF VOUT = 0V Input Capacitance (CS, SCK, SI, WP, HOLD) 6 pF VIN = 0V 1. This parameter is characterized and is not 100% tested. Table 1-2. DC Characteristics(1) Applicable over recommended operating range from: TAI = −40⋅C to +85⋅C, VCC = +1.8V to +5.5V, (unless otherwise noted) Symbol Parameter VCC1 Supply Voltage VCC2 Max Units 1.8 5.5 V Supply Voltage 2.5 5.5 V VCC3 Supply Voltage 4.5 5.5 V ICC1 Supply Current VCC = 5.0V at 20 MHz, SO = Open, Read 8.5 10.0 mA ICC2 Supply Current VCC = 5.0V at 10 MHz, SO = Open, Read, Write 4.5 5.0 mA ICC3 Supply Current VCC = 5.0V at 1 MHz, SO = Open, Read, Write 2.0 3.0 mA ISB1 Standby Current VCC = 1.8V, CS = VCC 0.1 0.5 µA ISB2 Standby Current VCC = 2.5V, CS = VCC 0.2 1.0 µA ISB3 Standby Current VCC = 5.0V, CS = VCC 2.0 3.5 µA IIL Input Leakage VIN = 0V to VCC −3.0 Output Leakage VIN = 0V to VCC, TAC = 0°C to 70°C −3.0 3.0 µA Input Low-voltage −0.6 VCC x 0.3 V VIH(1) Input High-voltage VCC x 0.7 VCC + 0.5 V VOL1 Output Low-voltage 0.4 V VOH1 Output High-voltage VOL2 Output Low-voltage VOH2 Output High-voltage IOL VIL (1) Note: Test Condition 3.6V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 3.6V Min IOL = 3.0 mA IOH = −1.6 mA µA VCC − 0.8 IOL = 0.15 mA IOH = −100 µA Typ V 0.2 VCC − 0.2 V V 1. VIL min and VIH max are reference only and are not tested. 3 8707B–SEEPR–3/10 Table 1-3. AC Characteristics Applicable over recommended operating range from TAI = −40 to +85°C, VCC = As Specified, CL = 1 TTL Gate and 30 pF (unless otherwise noted) 4 Symbol Parameter Voltage Min Max Units fSCK SCK Clock Frequency 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 0 0 0 20 10 5 MHz tRI Input Rise Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 2 2 2 µs tFI Input Fall Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 2 2 2 µs tWH SCK High Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 20 40 80 ns tWL SCK Low Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 20 40 80 ns tCS CS High Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 100 100 200 ns tCSS CS Setup Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 100 100 200 ns tCSH CS Hold Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 100 100 200 ns tSU Data In Setup Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 20 40 80 ns tH Data In Hold Time 4.5 − 5.5 2.5 - 5.5 1.8 - 5.5 20 40 80 ns tHD Hold Setup Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 20 40 80 ns tCD Hold Hold Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 20 40 80 ns tV Output Valid 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 0 0 0 tHO Output Hold Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 0 0 0 tLZ Hold to Output Low Z 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 0 0 0 20 40 80 ns ns 25 50 100 ns AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B Table 1-3. AC Characteristics (Continued) Applicable over recommended operating range from TAI = −40 to +85°C, VCC = As Specified, CL = 1 TTL Gate and 30 pF (unless otherwise noted) Symbol Parameter Voltage tHZ Hold to Output High Z tDIS tWC Endurance(1) Note: 2. Max Units 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 25 50 100 ns Output Disable Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 25 50 100 ns Write Cycle Time 4.5 − 5.5 2.5 − 5.5 1.8 − 5.5 5 5 5 ms 5.0V, 25⋅C, Page Mode Min 1M Write Cycles 1. This parameter is characterized and is not 100% tested. Serial Interface Description MASTER: The device that generates the serial clock. SLAVE: Because the serial clock pin (SCK) is always an input, the AT25010B/020B/040B always operates as a slave. TRANSMITTER/RECEIVER: The AT25010B/020B/040B has separate pins designated for data transmission (SO) and reception (SI). MSB: The Most Significant Bit (MSB) is the first bit transmitted and received. SERIAL OP-CODE: After the device is selected with CS going low, the first byte will be received. This byte contains the op-code that defines the operations to be performed. The op-code also contains address bit A8 in both the read and write instructions. INVALID OP-CODE: If an invalid op-code is received, no data will be shifted into the AT25010B/020B/040B, and the serial output pin (SO) will remain in a high impedance state until the falling edge of CS is detected again. This will reinitialize the serial communication. CHIP SELECT: The AT25010B/020B/040B is selected when the CS pin is low. When the device is not selected, data will not be accepted via the SI pin, and the SO pin will remain in a high impedance state. HOLD: The HOLD pin is used in conjunction with the CS pin to select the AT25010B/020B/040B. When the device is selected and a serial sequence is underway, HOLD can be used to pause the serial communication with the master device without resetting the serial sequence. To pause, the HOLD pin must be brought low while the SCK pin is low. To resume serial communication, the HOLD pin is brought high while the SCK pin is low (SCK may still toggle during HOLD). Inputs to the SI pin will be ignored while the SO pin is in the high impedance state. WRITE PROTECT: The write protect pin (WP) will allow normal read/write operations when held high. When the WP pin is brought low, all write operations are inhibited. WP going low while CS is still low will interrupt a write to the AT25010B/020B/040B. If the internal write cycle has already been initiated, WP going low will have no effect on any write operation. 5 8707B–SEEPR–3/10 Figure 2-1. SPI Serial Interface AT25010B/020B/040B 6 AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B 3. Functional Description The AT25010B/020B/040B is designed to interface directly with the synchronous serial peripheral interface (SPI) of the 6805 and 68HC11 series of microcontrollers. The AT25010B/020B/040B utilizes an 8-bit instruction register. The list of instructions and their operation codes are contained in Figure 3-1. All instructions, addresses, and data are transferred with the MSB first and start with a high-to-low CS transition. Table 3-1. Instruction Set for the AT25010B/020B/040B Instruction Name Instruction Format WREN 0000 X110 Set Write Enable Latch WRDI 0000 X100 Reset Write Enable Latch RDSR 0000 X101 Read Status Register WRSR 0000 X001 Write Status Register READ 0000 A011 Read Data from Memory Array WRITE 0000 A010 Write Data to Memory Array Note: Operation “A” represents MSB address bit A8. WRITE ENABLE (WREN): The device will power up in the write disable state when VCC is applied. All programming instructions must therefore be preceded by a Write Enable instruction. The WP pin must be held high during a WREN instruction. WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the Write Disable instruction disables all programming modes. The WRDI instruction is independent of the status of the WP pin. READ STATUS REGISTER (RDSR): The Read Status Register instruction provides access to the status register. The read/busy and write enable status of the device can be determined by the RDSR instruction. Similarly, the block write protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction. Table 3-2. Status Register Format Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 X X X X BP1 BP0 WEN RDY Table 3-3. Read Status Register Bit Definition Bit Definition Bit 0 (RDY) Bit 0 = “0” (RDY) indicates the device is ready. Bit 0 = “1” indicates the write cycle is in progress. Bit 1 (WEN) Bit 1 = “0” indicates the device is not write enabled. Bit 1 = “1” indicates the device is write enabled. Bit 2 (BP0) See Table 3-4. Bit 3 (BP1) See Table 3-4. Bits 4–7 are “0”s when device is not in an internal write cycle. Bits 0–7 are “1”s during an internal write cycle. 7 8707B–SEEPR–3/10 WRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select one of four levels of protection. The AT25010B/020B/040B is divided into four array segments. One-quarter, one-half, or all of the memory segments can be protected. Any of the data within any selected segment will therefore be read only. The block write protection levels and corresponding status register control bits are shown in Table 3-4. Bits BP1 and BP0 are nonvolatile cells that have the same properties and functions as the regular memory cells (e.g., WREN, tWC, RDSR). Table 3-4. Block Write Protect Bits Status Register Bits Array Addresses Protected Level BP1 BP0 AT25010B AT25020B AT25040B 0 0 0 None None None 1 (1/4) 0 1 60−7F C0−FF 180−1FF 2 (1/2) 1 0 40−7F 80−FF 100−1FF 3 (All) 1 1 00−7F 00−FF 000−1FF READ SEQUENCE (READ): Reading the AT25010B/020B/040B via the SO pin requires the following sequence. After the CS line is pulled low to select a device, the read op-code (including A8) is transmitted via the SI line followed by the byte address to be read (A7−A0). Upon completion, any data on the SI line will be ignored. The data (D7−D0) at the specified address is then shifted out onto the SO line. If only one byte is to be read, the CS line should be driven high after the data comes out. The read sequence can be continued since the byte address is automatically incremented and data will continue to be shifted out. When the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be read in one continuous read cycle. WRITE SEQUENCE (WRITE): In order to program the AT25010B/020B/040B, the Write Protect pin (WP) must be held high and two separate instructions must be executed. First, the device must be write enabled via the WREN instruction. Then a Write (WRITE) instruction may be executed. Also, the address of the memory location(s) to be programmed must be outside the protected address field location selected by the block write protection level. During an internal write cycle, all commands will be ignored except the RDSR instruction. A Write instruction requires the following sequence. After the CS line is pulled low to select the device, the WRITE op-code (including A8) is transmitted via the SI line followed by the byte address (A7−A0) and the data (D7−D0) to be programmed. Programming will start after the CS pin is brought high. The low-to-high transition of the CS pin must occur during the SCK low time immediately after clocking in the D0 (LSB) data bit. The ready/busy status of the device can be determined by initiating a Read Status Register (RDSR) instruction. If Bit 0 = “1”, the write cycle is still in progress. If Bit 0 = “0”, the write cycle has ended. Only the RDSR instruction is enabled during the write programming cycle. The AT25010B/020B/040B is capable of an 8-byte page write operation. After each byte of data is received, the three low-order address bits are internally incremented by one; the six high-order bits of the address will remain constant. If more than 8 bytes of data are transmitted, the address counter will roll over and the previously written data will be overwritten. The AT25010B/020B/040B is automatically returned to the write disable state at the completion of a write cycle. Note: 8 If the WP pin is brought low or if the device is not write enabled (WREN), the device will ignore the Write instruction and will return to the standby state, when CS is brought high. A new CS falling edge is required to reinitiate the serial communication. AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B 4. Timing Diagrams Figure 4-1. Synchronous Data Timing (for Mode 0) t CS VIH CS VIL t CSH tCSS VIH t WH SCK t WL VIL tH t SU VIH SI VALID IN VIL tV VOH SO t HO t DIS HI-Z HI-Z VOL Figure 4-2. WREN Timing CS SCK SI WREN OP-CODE HI-Z SO Figure 4-3. WRDI Timing CS SCK SI SO WRDI OP-CODE HI-Z 9 8707B–SEEPR–3/10 Figure 4-4. RDSR Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK SI INSTRUCTION DATA OUT HIGH IMPEDANCE SO 7 6 5 4 3 2 1 0 8 9 10 11 12 13 14 15 MSB Figure 4-5. WRSR Timing CS 0 1 2 3 4 5 6 7 SCK DATA IN SI 6 5 4 3 2 1 0 HIGH IMPEDANCE SO Figure 4-6. 7 INSTRUCTION READ Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCK INSTRUCTION SI BYTE ADDRESS 8 7 9th 6 5 4 3 2 1 0 BIT OF ADDRESS DATA OUT SO HIGH IMPEDANCE 7 6 5 4 3 2 1 0 MSB 10 AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B Figure 4-7. WRITE Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCK INSTRUCTION BYTE ADDRESS 8 SI 7 9th SO Figure 4-8. 6 5 4 3 2 DATA IN 1 0 7 6 5 4 3 2 1 0 BIT OF ADDRESS HIGH IMPEDANCE HOLD Timing CS t CD t CD SCK t HD HOLD t HD t HZ SO tLZ 11 8707B–SEEPR–3/10 5. Ordering Code Detail AT 2 5 0 1 0 B - S S H L - B Atmel Designator Shipping Carrier Option B or blank = Bulk (tubes) T = Tape and reel Product Family Operating Voltage L Device Density 010 = 1k 020 = 2k 040 = 4k Device Revision = 1.8V to 5.5V Package Device Grade or Wafer/Die Thickness H = Green, NiPdAu lead finish, Industrial Temperature Range (-40˚C to +85˚C) U = Green, matte Sn lead finish, Industrial Temperature range (-40˚C to +85˚C) 11 = 11mil wafer thickness Package Option SS = X = MA = ME = C = WWU WDT 12 JEDEC SOIC TSSOP UDFN XDFN VFBGA = Wafer unsawn = Die in Tape and Reel AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B 6. Part Markings AT25010B-SSHL |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 5 1 B L @ |---|---|---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---|---| | PIN 1 INDICATOR (DOT) LINE 1: LINE 2: LINE 3: ATML=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE 51B=AT25010B, L=1.8 to 5.5v, @=COUNTRY of ORIGIN ATMEL LOT NUMBER AT25010B-XHL PIN 1 INDICATOR(DOT) | |---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 5 1 B L @ |---|---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---| LINE 1: LINE 2: LINE 3: AT=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE 51B=AT25010B, L=1.8 to 5.5v, @=COUNTRY of ORIGIN ATMEL LOT NUMBER AT25010B-CUL |---|---|---|---| 5 1 B U |---|---|---|---| Y M X X |---|---|---|---| |<-PIN 1 THIS CORNER LINE 1: LINE 2: 51B=AT25010B, U=MATERIAL SET/GRADE YM=DATE CODE, XX=TRACE CODE 13 8707B–SEEPR–3/10 AT25010B-MAHL |---|---|---| 5 1 B |---|---|---| H L @ |---|---|---| Y X X |---|---|---| * | PIN 1 INDICATOR (DOT) LINE 1: LINE 2: LINE 3: 51B=AT25010B H=MATERIAL SET/GRADE, L=1.8 to 5.5V, @=COUNTRY OF ORIGIN Y=DATE CODE, XX=TRACE CODE AT25010B-MEHL |---|---|---| 5 1 B |---|---|---| Y X X |---|---|---| * | PIN 1 INDICATOR (DOT) LINE 1: LINE 2: 51B=AT25010B Y=DATE CODE, XX=TRACE CODE AT25020B-SSHL |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 5 2 B L @ |---|---|---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---|---| | PIN 1 INDICATOR (DOT) LINE 1: LINE 2: LINE 3: 14 ATML=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE 52B=AT25020B, L=1.8 to 5.5v, @=COUNTRY of ORIGIN ATMEL LOT NUMBER AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B AT25020B-XHL PIN 1 INDICATOR (DOT) | |---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 5 2 B L @ |---|---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---| LINE 1: LINE 2: LINE 3: AT=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE 52B=AT25020B, L=1.8 to 5.5v, @=COUNTRY of ORIGIN ATMEL LOT NUMBER AT25020B-CUL |---|---|---|---| 5 2 B U |---|---|---|---| Y M X X |---|---|---|---| |<-PIN 1 THIS CORNER LINE 1: LINE 2: 52B=AT25020B, U=MATERIAL SET/GRADE YM=DATE CODE, XX=TRACE CODE AT25020B-MAHL |---|---|---| 5 2 B |---|---|---| H L @ |---|---|---| Y X X |---|---|---| * | PIN 1 INDICATOR (DOT) LINE 1: LINE 2: LINE 3: 52B=AT25020B H=MATERIAL SET/GRADE, L=1.8 to 5.5V, @=COUNTRY OF ORIGIN Y=DATE CODE, XX=TRACE CODE 15 8707B–SEEPR–3/10 AT25020B-MEHL |---|---|---| 5 2 B |---|---|---| Y X X |---|---|---| * | PIN 1 INDICATOR (DOT) LINE 1: LINE 2: 52B=AT25020B Y=DATE CODE, XX=TRACE CODE AT25040B-SSHL PIN 1 INDICATOR (DOT) | |---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 5 4 B L @ |---|---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---| LINE 1: LINE 2: LINE 3: AT=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE 54B=AT25040B, L=1.8 to 5.5v, @=COUNTRY of ORIGIN ATMEL LOT NUMBER AT25040B-XHL PIN 1 INDICATOR (DOT) | |---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 5 4 B L @ |---|---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---| LINE 1: LINE 2: LINE 3: 16 AT=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE 54B=AT25040B, L=1.8 to 5.5v, @=COUNTRY of ORIGIN ATMEL LOT NUMBER AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B AT25040B-CUL |---|---|---|---| 5 4 B U |---|---|---|---| Y M X X |---|---|---|---| |<-PIN 1 THIS CORNER LINE 1: LINE 2: 54B=AT25040B, U=MATERIAL SET/GRADE YM=DATE CODE, XX=TRACE CODE AT25040B-MAHL |---|---|---| 5 4 B |---|---|---| H L @ |---|---|---| Y X X |---|---|---| * PIN 1 INDICATOR (DOT) LINE 1: LINE 2: LINE 2: 54B=AT25040B H=MATERIAL SET/GRADE, L=1.8 to 5.5V, @=COUNTRY OF ORIGIN Y=DATE CODE, XX=TRACE CODE AT25040B-MEHL |---|---|---| 5 4 B |---|---|---| Y X X |---|---|---| * | PIN 1 INDICATOR (DOT) LINE 1: LINE 2: 54B=AT25040B Y=DATE CODE, XX=TRACE CODE 17 8707B–SEEPR–3/10 7. Ordering Codes AT25010B Ordering Information(1) Ordering Code Voltage Package Operation Range AT25010B-SSHL-B (NiPdAu Lead Finish) AT25010B-SSHL-T(2) (NiPdAu Lead Finish) AT25010B-XHL-B(1) (NiPdAu Lead Finish) AT25010B-XHL-T(2) (NiPdAu Lead Finish) AT25010B-MAHL-T(2) (NiPdAu Lead Finish) AT25010B-MEHL-T(2) (NiPdAu Lead Finish) AT25010B-CUL-T(2) (SnAgCu Ball Finish) 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 8S1 8S1 8A2 8A2 8MA2 8ME1 8U3-1 Lead-free/Halogen-free/ Industrial Temperature (−40 to 85°C) AT25010B-WWU11L(3) 1.8V to 5.5V Die Sale Industrial Temperature (−40 to 85°C) (1) Note: 1. Bulk delivery in tubes (SOIC and TSSOP 100/tube). 2. Tape and reel delivery (SOIC 4k/reel. TSSOP, UDFN, XDFN and VFBGA 5k/reel). 3. Contact Atmel Sales for Wafer sales. Package Type 18 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP) 8MA2 8-lead, 2.00mm x 3.00mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN) 8ME1 8-lead (1.80x2.20mm body) Extra Thin DFN (XDFN) 8U3-1 8-ball die Ball Grid Array (VFBGA) AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B AT25020B Ordering Information(1) Ordering Code Voltage Package Operation Range AT25020B-SSHL-B (NiPdAu Lead Finish) AT25020B-SSHL-T(2) (NiPdAu Lead Finish) AT25020B-XHL-B(1) (NiPdAu Lead Finish) AT25020B-XHL-T(2) (NiPdAu Lead Finish) AT25020B-MAHL-T(2) (NiPdAu Lead Finish) AT25020B-MEHL-T(2) (NiPdAu Lead Finish) AT25020B-CUL-T(2) (SnAgCu Ball Finish) 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 8S1 8S1 8A2 8A2 8MA2 8ME1 8U3-1 Lead-free/Halogen-free/ Industrial Temperature (−40 to 85°C) AT25020B-WWU11L(3) 1.8V to 5.5V Die Sale Industrial Temperature (−40 to 85°C) (1) Note: 1. Bulk delivery in tubes (SOIC and TSSOP 100/tube). 2. Tape and reel delivery (SOIC 4k/reel. TSSOP, UDFN, XDFN and VFBGA 5k/reel). 3. Contact Atmel Sales for Wafer sales. Package Type 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP) 8MA2 8-lead, 2.00mm x 3.00mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN) 8ME1 8-lead (1.80x2.20mm body) Extra Thin DFN (XDFN) 8U3-1 8-ball die Ball Grid Array (VFBGA) 19 8707B–SEEPR–3/10 AT25040B Ordering Information Ordering Code Voltage Package Operation Range AT25040B-SSHL-B (NiPdAu Lead Finish) AT25040B-SSHL-T(2) (NiPdAu Lead Finish) AT25040B-XHL-B(1) (NiPdAu Lead Finish) AT25040B-XHL-T(2) (NiPdAu Lead Finish) AT25040B-MAHL-T(2) (NiPdAu Lead Finish) AT25040B-MEHL-T(2) (NiPdAu Lead Finish) AT25040B-CUL-T(2) (SnAgCu Ball Finish) 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 8S1 8S1 8A2 8A2 8MA2 8ME1 8U3-1 Lead-free/Halogen-free/ Industrial Temperature (−40 to 85°C) AT25040B-WWU11L(3) 1.8V to 5.5V Die Sale Industrial Temperature (−40 to 85°C) (1) Note: 1. Bulk delivery in tubes (SOIC and TSSOP 100/tube). 2. Tape and reel delivery (SOIC 4k/reel. TSSOP, UDFN, XDFN and VFBGA 5k/reel). 3. Contact Atmel Sales for Wafer sales. Package Type 20 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP) 8MA2 8-lead, 2.00mm x 3.00mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN) 8ME1 8-lead, 1.80mm x 2.20mm Body, Extra Thin DFN (XDFN) 8U3-1 8-ball die Ball Grid Array (VFBGA) AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B 8. Packaging Information 8S1 – JEDEC SOIC C GND NC NC NC 4 3 2 1 E 5 6 7 8 SDA SCL NC VCC E1 L Ø Top View e End View b COMMON DIMENSIONS (Unit of Measure = mm) A SYMBOL A1 D Side View MIN NOM MAX A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e Notes: 1. These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. NOTE 1.27 BSC L 0.40 – 1.27 θ 0˚ – 8˚ 12/11/09 TITLE Package Drawing Contact: [email protected] 8S1, 8-lead, (0.150” Wide Body), Plastic Gull Wing Outline (JEDEC SOIC) GPC SWB DRAWING NO. 8S1 REV. E 21 8707B–SEEPR–3/10 8A2 – TSSOP 4 3 2 1 GND NC NC NC Pin 1 indicator this corner A b E1 E e L1 A2 D Side View SDA SCL NC VCC 5 6 7 8 L Top View End View Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D 2.90 3.00 13.10 2, 5 3, 5 6.40 BSC E E1 4.30 4.40 4.50 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e L L1 4 0.65 BSC 0.45 0.75 0.60 1.00 RE3 12/11/09 TITLE Package Drawing Contact: 8A2, 8-lead, 4.4mm Body, Plastic Thin [email protected] Shrink Small Outline Package (TSSOP) 22 GPC TNR DRAWING NO. 8A2 REV. D AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B 8MA2 – UDFN E 8 1 Pin 1 ID 2 7 3 6 4 5 D C A2 A A1 E2 b (8x) 8 1 Pin#1 ID (R0.10) 7 0.35 COMMON DIMENSIONS (Unit of Measure = mm) 2 D2 6 3 5 4 e (6x) K L (8x) Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229 for proper dimensions, tolerances, datums, etc. 2. The terminal #1 ID is a laser-marked feature. 3. Dimensions b applies to metalized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. SYMBOL MIN NOM MAX D 2.00 BSC E 3.00 BSC D2 1.40 1.50 1.60 E2 1.20 1.30 1.40 A 0.50 0.55 0.60 A1 0.00 0.02 0.05 A2 – – 0.55 C L 0.152 REF 0.30 e b K NOTE 0.40 0.35 0.50 BSC 0.18 0.25 0.30 – – 0.20 3 4/15/08 TITLE Package Drawing Contact: 8MA2, 8-pad, 2 x 3 x 0.6 mm Body, Thermally [email protected] Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) GPC YNZ DRAWING NO. REV. 8MA2 A 23 8707B–SEEPR–3/10 8ME1 – XDFN e1 D 8 7 6 b 5 L E PIN #1 ID 0.10 PIN #1 ID 0.15 1 2 3 4 A1 b e A Top View Side View Bottom View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX A – – 0.40 A1 0.00 – 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 e 0.40 TYP e1 L NOTE 1.20 REF 0.26 0.30 0.35 8/3/09 TITLE Package Drawing Contact: [email protected] 24 8ME1, 8-lead (1.80 x 2.20 mm Body) Extra Thin DFN (XDFN) GPC DTP DRAWING NO. REV. 8ME1 A AT25010B/020B/040B 8707B–SEEPR–3/10 AT25010B/020B/040B 8U3-1 – VFBGA E D 1. b A1 PIN 1 BALL PAD CORNER A2 Top View A PIN 1 BALL PAD CORNER 1 2 3 End View 4 (d1) d COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL 8 7 6 5 e Bottom View (e1) (8 SOLDER BALLS) Notes: 1. This drawing is for general information only. 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu MIN NOM MAX A 0.73 0.79 0.85 A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 b 0.20 0.25 0.30 D 1.50 BSC E 2.00 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF NOTE 2 9/19/07 TITLE Package Drawing Contact: 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch, [email protected] VFBGA Package (dBGA2) DRAWING NO. PO8U3-1 REV. C 25 8707B–SEEPR–3/10 9. 26 Revision History Doc. Rev. Date Comments 8707B 10/2010 Remove Preliminary 8707B 3/2010 Replace 8Y6 with 8MA2 8707A 2/2010 Initial document release AT25010B/020B/040B 8707B–SEEPR–3/10 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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