Features • Low-voltage and Standard-voltage Operation • • • • • • • • • • • • • – VCC = 1.7V to 5.5V Internally Organized 2048 x 8 (16K) Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 1MHz (5V, 2.5V), 400kHz (1.7V) Compatibility Write Protect Pin for Hardware Data Protection 16-byte Page Write Modes Partial Page Writes Allowed Self-timed Write Cycle (5ms max) High-reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN, 8-lead XDFN, 5-lead SOT23 and 8-ball VFBGA Packages Lead-free/Halogen-free Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers Two-wire Serial Electrically Erasable and Programmable Read-only Memory 16K (2048 x 8) Atmel AT24C16C Description The Atmel® AT24C16C provides 16,384-bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 2,048 words of 8-bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C16C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN, 8-lead XDFN, 5-lead SOT23, and 8-ball VFBGA Packages and is accessed via a Two-wire serial interface. In addition, the AT24C16C operates from 1.7V to 5.5V. Figure 0-1. Pin Configurations 8-lead PDIP Pin Name Function NC No Connect NC NC NC GND SDA Serial Data SCL Serial Clock Input WP Write Protect GND Ground VCC Power Supply 1 8 2 7 3 6 4 5 8-lead SOIC VCC WP SCL SDA 1 2 3 4 8 7 6 5 1 8 2 7 3 6 4 5 VCC WP SCL SDA 8-lead UDFN 8-lead TSSOP NC NC NC GND NC NC NC GND VCC WP SCL SDA VCC WP SCL SDA 8 1 NC 7 2 NC 6 3 NC 5 4 GND Bottom View 5-lead SOT23 8-lead XDFN VCC WP SCL SDA 8 1 NC 7 2 NC 6 3 NC 5 4 GND Bottom View SCL 1 GND 2 SDA 3 5 4 8-ball VFBGA WP VCC VCC 8 WP 7 SCL 6 SDA 5 1 2 3 4 NC NC NC GND Bottom View 8719A–SEEPR–9/10 Absolute Maximum Ratings *NOTICE: Operating Temperature ........................–55°C to +125°C Storage Temperature ...........................–65°C to +150°C Voltage on Any Pin with Respect to Ground........................... –1.0V to +7.0V Maximum Operating Voltage................................. 6.25V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Output Current .............................................. 5.0 mA Figure 0-2. Block Diagram VCC GND WP START STOP LOGIC SERIAL CONTROL LOGIC LOAD H.V. PUMP/TIMING COMP DEVICE ADDRESS COMPARATOR R/W EN LOAD DATA RECOVERY INC DATA WORD ADDR/COUNTER Y DEC X DEC SCL SDA EEPROM SERIAL MUX DOUT/ACK LOGIC DIN DOUT 2 Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C 1. Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open-collector devices. DEVICE/PAGE ADDRESSES: The Atmel® AT24C16C does not use the device address pins, which limits the number of devices on a single bus to one. WRITE PROTECT (WP): The AT24C16C has a write protect pin that provides hardware data protection. The write protect pin allows normal read/write operations when connected to ground (GND). When the write protect pin is connected to VCC, the write protection feature is enabled and operates as shown in <blue>Table 1-1. Table 1-1. WP Pin Status Write Protect Part of the Array Protected 24C16C At VCC Full (16K) Array At GND Normal Read/Write Operations 3 8719A–SEEPR–9/10 2. Memory Organization Atmel AT24C16C, 16K SERIAL EEPROM: Internally organized with 128 pages of 16-bytes each, the 16K requires an 11-bit data word address for random word addressing. Table 2-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25⋅C, f = 1.0MHz, VCC = +1.7V Symbol Test Condition CI/O CIN Note: Max Units Conditions Input/Output Capacitance (SDA) 8 pF VI/O = 0V Input Capacitance (SCL) 6 pF VIN = 0V 1. This parameter is characterized and is not 100% tested Table 2-2. DC Characteristics Applicable over recommended operating range from: TAI = −40⋅C to +85⋅C, VCC = +1.7V to +5.5V (unless otherwise noted) Symbol Parameter VCC1 Supply Voltage ICC1 Supply Current VCC = 5.0V READ at 400kHz ICC2 Supply Current VCC = 5.0V WRITE at 400kHz ISB1 Standby Current ILI Input Leakage Current VCC = 5.0V VIN = VCC or VSS 0.10 3.0 µA ILO Output Leakage Current VCC = 5.0V VOUT = VCC or VSS 0.05 3.0 µA VIL Input Low Level(1) −0.6 VCC x 0.3 V Min Typ Max Units 5.5 V 1.0 2.0 mA 2.0 3.0 mA 1.0 µA VCC x 0.7 VCC + 0.5 V 1.7 VCC = 1.7V VCC = 5.5V VIN = VCC or VSS (1) 6.0 VIH Input High Level VOL1 Output Low Level VCC = 1.7V IOL = 0.15mA 0.2 V VOL2 Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V Note: 4 Test Condition 1. VIL min and VIH max are reference only and are not tested Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C Table 2-3. AC Characteristics (Industrial Temperature) Applicable over recommended operating range from TAI = −40⋅C to +85⋅C, VCC = +1.7V to +5.5V, CL = 100 pF (unless otherwise noted). Test conditions are listed in Note 2. 1.7V Min 2.5V, 5.0V Symbol Parameter fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low 1.3 0.4 µs tHIGH Clock Pulse Width High 0.6 0.4 µs tI Noise Suppression Time(1) tAA Clock Low to Data Out Valid 0.05 tBUF Time the bus must be free before a new transmission can start(1) 1.3 0.5 µs tHD.STA Start Hold Time 0.6 0.25 µs tSU.STA Start Set-up Time 0.6 0.25 µs tHD.DAT Data In Hold Time 0 0 µs tSU.DAT Data In Set-up Time 100 100 ns Inputs Rise Time tR Max Min 400 50 (1) (1) 0.9 0.05 Max Units 1000 kHz 50 ns 0.55 µs 0.3 0.3 µs 300 100 ns tF Inputs Fall Time tSU.STO Stop Set-up Time 0.6 0.25 µs tDH Data Out Hold Time 50 50 ns tWR Write Cycle Time Endurance(1) 25°C, Page Mode, 3.3V Notes: 5 5 1,000,000 ms Write Cycles 1. This parameter is characterized and is not 100% tested 2. AC measurement conditions: RL (connects to VCC): 1.3 kΩ (2.5V, 5.0V), 10 kΩ (1.7V) Input pulse voltages: 0.3 VCC to 0.7 VCC Input rise and fall times: ≤ 50ns Input and output timing reference voltages: 0.5 VCC 5 8719A–SEEPR–9/10 3. Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see <blue>Figure 3-4 on page 7). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see <blue>Figure 3-5 on page 8). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (see <blue>Figure 3-5 on page 8). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The Atmel® AT24C16C features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations. 2-WIRE SOFTWARE RESET: After an interruption in protocol, power loss or system reset, any 2-wire part can be protocol reset by following these steps: 1. Create a start bit condition 2. Clock nine cycles 3. Create another start bit followed by stop bit condition as shown below Figure 3-1. Software Reset Dummy Clock Cycles Start bit SCL 1 2 3 Start bit 8 Stop bit 9 SDA 6 Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C Figure 3-2. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O® tHIGH tF tR tLOW tLOW SCL tSU.STA tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA tDH tBUF SDA OUT Figure 3-3. Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT ACK WORDn (1) twr STOP CONDITION Note: START CONDITION The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle Figure 3-4. Data Validity SDA SCL DATA STABLE DATA STABLE DATA CHANGE 7 8719A–SEEPR–9/10 Figure 3-5. Start and Stop Definition SDA SCL START Figure 3-6. STOP Output Acknowledge 1 SCL 8 9 DATA IN DATA OUT START 8 ACKNOWLEDGE Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C 4. Device Addressing The 16K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (refer to <blue>Figure 6-1). The device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. This is common to all the EEPROM devices. The next three bits used for memory page addressing and are the most significant bits of the data word address which follows. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state. 5. Write Operations BYTE WRITE: A write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see <blue>Figure 6-2 on page 10). PAGE WRITE: The 16K EEPROM is capable of an 16-byte page write. A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see <blue>Figure 6-3 on page 11). The data word address lower four bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than sixteen data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. 9 8719A–SEEPR–9/10 6. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: current address read, random address read and sequential read. CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of the first page. The address “roll over” during write is from the last byte of the current page to the first byte of the same page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input zero but does generate a following stop condition (see <blue>Figure 6-4 on page 11). RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following stop condition (see <blue>Figure 6-5 on page 11). SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see <blue>Figure 6-6 on page 11). Figure 6-1. 16K 1 0 Device Address 1 0 P2 P1 P0 R/W MSB LSB Figure 6-2. Byte Write S T A R T DEVICE ADDRESS W R I T E WORD ADDRESS S T O P DATA SDA LINE M S B 10 R A / C W K A C K A C K Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C Figure 6-3. Page Write S T A R T W R I T E WORD ADDRESS (n) DEVICE ADDRESS DATA (n + 1) DATA (n) S T O P DATA (n + x) SDA LINE M S B Figure 6-4. R A / C WK A C K A C K A C K A C K Current Address Read S T A R T DEVICE ADDRESS S T O P R E A D SDA LINE M S B Figure 6-5. R A / C WK DATA N O A C K Random Read S T A R T DEVICE ADDRESS W R I T E S T A R T WORD ADDRESS n DEVICE ADDRESS R E A D S T O P SDA LINE M S B R A / C W K A C K A C K DATA n A C K DUMMY WRITE Figure 6-6. N O Sequential Read DEVICE ADDRESS R E A D A C K A C K S T O P A C K SDA LINE R A / C WK DATA n DATA n + 1 DATA n + 2 DATA n + x N O A C K 11 8719A–SEEPR–9/10 7. Ordering Code Detail AT 2 4 C 1 6 C - S S H M - B Atmel Designator Shipping Carrier Option B or blank = Bulk (tubes) T = Tape and reel Product Family Operating Voltage M Device Density 16 = 16k = 1.7 V to 5.5 V Package Device Grade or Wafer/Die Thickness H Device Revision U 11 = Green, NiPdAu lead finish Industrial Temperature range (-40°C to +85°C) = Green, matte Sn lead finish, Industrial Temperature range (-40°C to +85°C) = 11 mil wafer thickness Operating Voltage P SS X MA ME ST C WWU WDT 8. = = = = = = = = = PDIP JEDEC SOIC TSSOP UDFN XDFN SOT23 VFBGA Wafer unsawn Die in Tape and Reel Part Markings Atmel AT24C16C-PUM (TOP SIDE ONLY MARK) |---|---|---|---|---|---|---|---| A T M L U Y W W |---|---|---|---|---|---|---|---| 1 6 C M @ |---|---|---|---|---|---|---|---| ATMEL L O T N U M B E R |---|---|---|---|---|---|---|---| | PIN 1 INDICATOR (DOT) LINE 1: AT=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE LINE 2: 16C=AT24C16C, M=1.7V to 5.5V, @=COUNTRY OF ASSEMBLY LINE 3: ATMEL LOT NUMBER 12 Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C Atmel AT24C16C-SSHM |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 1 6 C M @ |---|---|---|---|---|---|---|---| ATMEL L O T N U M B E R |---|---|---|---|---|---|---|---| | PIN 1 INDICATOR (DOT) LINE 1: ATML=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE LINE 2: 16C=AT24C16C, M=1.7 to 5.5V, @=COUNTRY OF ASSEMBLY LINE 3: ATMEL LOT NUMBER Atmel AT24C16C-XHM PIN 1 INDICATOR (DOT) | |---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 1 6 C M @ |---|---|---|---|---|---|---| ATMEL L O T N U M B E R |---|---|---|---|---|---|---| LINE 1: AT=ATMEL, H=MATERIAL SET/GRADE, YWW=DATE CODE LINE 2: 16C=AT24C16C, M=1.7 to 5.5V, @=COUNTRY OF ASSEMBLY LINE 3: ATMEL LOT NUMBER Atmel AT24C16C-MAHM |---|---|---| 1 6 C |---|---|---| H M @ |---|---|---| Y X X |---|---|---| * | PIN 1 INDICATOR (DOT) LINE 1: 16C=AT24C16C LINE 2: H=MATERIAL SET/GRADE, M=1.7 to 5.5V, @=COUNTRY OF ASSEMBLY LINE 3: Y=DATE CODE, XX=Trace Code 13 8719A–SEEPR–9/10 Atmel AT24C16C-MEHM |---|---|---| 1 6 C |---|---|---| Y X X |---|---|---| * | PIN 1 INDICATOR (DOT) LINE 1: 16C=AT24C16C LINE 2: Y=DATE CODE, XX=Trace Code Atmel AT24C16C-STUM TOP MARK |---|---|---|---|---| 1 6 C M U |---|---|---|---|---| * | PIN 1 INDICATOR (DOT) Top Mark: 16C=AT24C16C, M=1.7v to 5.5V, U=MATERIAL SET/GRADE BOTTOM SIDE MARKING |---|---|---|---| Y M X X |---|---|---|---| Bottom Mark:YM=DATE CODE XX=Trace Code Atmel AT24C16C-CUM |---|---|---|---| 1 6 C U |---|---|---|---| Y M X X |---|---|---|---| |<-- PIN 1 This Corner LINE 1: 16C=AT24C16C, U=MATERIAL SET/GRADE LINE 2: YM=DATE CODE, XX=Trace Code 14 Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C 9. Ordering Codes Atmel AT24C16C Ordering Information Ordering Codes Voltage Package 1.7 to 5.5 8P3 (NiPdAu Lead Finish) 1.7 to 5.5 8S1 AT24C16C-SSHM-T(2) (NiPdAu Lead Finish) 1.7 to 5.5 8S1 AT24C16C-PUM (Bulk Form Only) AT24C16C-SSHM-B (1) (NiPdAu Lead Finish) 1.7 to 5.5 8A2 (2) (NiPdAu Lead Finish) 1.7 to 5.5 8A2 AT24C16C-XHM-B AT24C16C-XHM-T (1) AT24C16C-MAHM-T(2) (NiPdAu Lead Finish) 1.7 to 5.5 8Y6 AT24C16C-MEHM-T(2) (NiPdAu Lead Finish) 1.7 to 5.5 8ME1 AT24C16C-STUM-T(2) (matte Sn) 1.7 to 5.5 5TS1 1.7 to 5.5 8U3-1 1.7 to 5.5 Die Sales AT24C16C-CUM-T (2) (matte Sn) AT24C16C-WWU11M(3) Notes: Operating Range Lead-Free/Halogen-Free Industrial Temperature (-40°C to 85°C) Industrial Temperature (-40°C to 85°C) 1. "-B" denotes bulk delivery 2. "-T" denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23, and VFBGA = 5K/reel 3. For Wafer sales, please contact Atmel Sales Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8A2 8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP) 8Y6 8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN) 8ME1 8-lead, 1.80mm x 2.20mm Body, (XDFN) 5TS1 5-lead, 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT-23) 8U3-1 8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA) 15 8719A–SEEPR–9/10 10. Packaging Information 8P3 – PDIP E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A SYMBOL MIN MAX NOM A b2 b3 b 4 PLCS Side View L NOTE 2 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 D1 0.005 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 3 3 e 0.100 BSC eA 0.300 BSC L Notes: 0.210 0.115 0.130 4 0.150 2 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 07/19/10 TITLE Package Drawing Contact: 8P3, 8-lead, 0.300” Wide Body, Plastic Dual [email protected] In-line Package (PDIP) 16 GPC PTC DRAWING NO. 8P3 REV. C Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C 8S1 – JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b A COMMON DIMENSIONS (Unit of Measure = mm) A1 D SIDE VIEW SYMBOL MIN A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. MAX NOM NOTE 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° 5/19/10 TITLE Package Drawing Contact: 8S1, 8-lead (0.150” Wide Body), Plastic Gull [email protected] Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. 8S1 REV. F 17 8719A–SEEPR–9/10 8A2 – TSSOP 3 2 1 Pin 1 indicator this corner E1 E L1 N L Top View End View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL D A b e A2 NOM MAX NOTE 3.00 3.10 2, 5 3, 5 6.40 BSC E1 4.30 4.40 4.50 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e L Side View L1 4 0.65 BSC 0.45 0.60 0.75 1.00 REF 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/19/10 TITLE Package Drawing Contact: 8A2, 8-lead 4.4mm Body, Plastic Thin [email protected] Shrink Small Outline Package (TSSOP) 18 2.90 E D Notes: MIN GPC TNR DRAWING NO. 8A2 REV. E Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C 8Y6 – Mini Map D2 A b (8X) E E2 Pin 1 Index Area Pin 1 ID L (8X) D A2 e (6X) A1 1.50 REF. A3 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground MIN NOM MAX D 2.00 BSC E 3.00 BSC D2 1.40 1.50 1.60 E2 – – 1.40 A – – 0.60 A1 0.00 0.02 0.05 A2 – – 0.55 A3 L 0.20 REF 0.20 e b NOTE 0.40 0.30 0.50 BSC 0.20 0.25 0.30 2 11/21/08 TITLE 8Y6, 8-lead, 2.0x3.0 mm Body, 0.50 mm Pitch, Package Drawing Contact: [email protected] UltraThin Mini-MAP, Dual No Lead Package (Sawn)(UDFN) GPC YNZ DRAWING NO. REV. 8Y6 E 19 8719A–SEEPR–9/10 8ME1 – XDFN e1 D 8 7 6 b 5 L E PIN #1 ID 0.10 PIN #1 ID 0.15 1 2 3 4 A1 b e A Top View Side View Bottom View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX A – – 0.40 A1 0.00 – 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 e 0.40 TYP e1 L NOTE 1.20 REF 0.26 0.30 0.35 8/3/09 TITLE 8ME1, 8-lead (1.80 x 2.20 mm Body) Package Drawing Contact: [email protected] Extra Thin DFN (XDFN) 20 GPC DTP DRAWING NO. REV. 8ME1 A Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C 5TS1 – SOT23 e1 5 C 4 E1 CL E L1 1 3 2 End View Top View b A2 SEATING PLANE e A A1 COMMON DIMENSIONS (Unit of Measure = mm) D Side View SYMBOL Notes: 1. Dimensions D does not include mold flash, protrusions or gate burrs. Mold flash protrusions or gate burrs shall not exceed 0.15 mm per end. Dimensions E1 does not include interlead flash or protrusion. Interlead flasg or protrusion shall not exceed 0.15 mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are deteremined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.80 mm total in excess of the “b” dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. 5. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information. MIN NOM MAX A – – 1.10 A1 0.00 – 0.10 A2 0.70 0.90 1.00 c 0.08 – 0.20 NOTE 3 D 2.90 BSC 1, 2 E 2.80 BSC 1, 2 E1 1.60 BSC 1, 2 L1 0.60 REF e 0.95 BSC e1 b 1.90 BSC 0.30 – 0.50 3, 4 11/05/08 TITLE 5TS1, 5-lead, 1.60 mm Body, Plastic Thin Package Drawing Contact: [email protected] Shrink Small Outline Package (Shrink SOT) GPC TSZ DRAWING NO. REV. 5TS1 B 21 8719A–SEEPR–9/10 8U3-1 – dBGA2 E D 5. PIN 1 BALL PAD CORNER b A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 1 2 4 3 d (d1) 8 6 7 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) BOTTOM VIEW 8 SOLDER BALLS Notes: SYMBOL MIN NOM MAX A 0.73 0.79 0.85 A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 b 0.20 0.25 0.30 1. This drawing is for general information only. D 1.50 BSC 2. Dimension ‘b’ is measured at maximum solder ball diameter. E 2.0 BSC 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF NOTE 2 07/14/10 TITLE Package Drawing Contact: 8U3-1, 8-ball, 1.50 x 2.00 mm Body, [email protected] 0.50 pitch, VFBGA Package (dBGA2) 22 GPC GXU DRAWING NO. 8U3-1 REV. D Atmel AT24C16C 8719A–SEEPR–9/10 Atmel AT24C16C 11. Revision History Doc. Rev. Date Comments 8719A 09/2010 Initial document release 23 8719A–SEEPR–9/10 Product Contact Product Line [email protected] Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Atmel Corporation Atmel Asia Limited Atmel Munich GmbH Atmel Japan 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1) (408) 441-0311 Fax: (+1) (408) 487-2600 Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81) (3) 3523-3551 Fax: (+81) (3) 3523-7581 www.atmel.com © 2010 Atmel Corporation. All rights reserved. / Rev.: 8719A–SEEPR–9/10 Atmel ®, Atmel logo and combinations thereof and others, are registered tr ademarks or trademarks of Atmel Corporation or its subsidiaries. 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