PHILIPS TDA5330T

INTEGRATED CIRCUITS
DATA SHEET
TDA5330T
VHF, UHF and Hyperband
mixer/oscillator for TV and VCR
3-band tuners
Product specification
File under Integrated Circuits, IC02
January 1988
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for
TV and VCR 3-band tuners
TDA5330T
GENERAL DESCRIPTION
The TDA5330T is a monolithic integrated circuit that performs the band A, band B and band C mixer/oscillator functions
in TV and VCR tuners. This device gives the designer the capability to design an economical and physically small 3-band
tuner which will be capable of meeting the most stringent requirements e.g. FTZ or FCC. The tuner development time
can be drastically reduced by using this device.
Features
• Balanced mixer with a common emitter input for band A
• Amplitude-controlled oscillator for band A
• Balanced mixer with common base input for band B and C
• Balanced oscillator for band B and C
• Local oscillator buffer output for external prescaler
• SAW filter preamplifier with an output impedance of 100 Ω
• Bandgap voltage stabilizer for oscillator stability
• Electronic bandswitch
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage
V19−2, 26
−
12
−
V
Band A frequency range
fA
48
−
180
MHz
Band B frequency range
fB
160
−
470
MHz
Band C frequency range
fC
430
−
860
MHz
F
7
−
11
dB
Band A input voltage
1% cross-modulation
V24−26
−
100
−
dBµV
Band B and C input power
1% cross-modulation
PI
−
−21
−
dBm
Band A voltage gain
Gv
−
24
−
dB
Band B voltage gain
Gv
−
37
−
dB
Band C voltage gain
Gv
−
36
−
dB
Conversion noise
PACKAGE OUTLINE
28-lead mini-pack , plastic (SO20; SOT163A); SOT 163-1; 1996 November 28.
January 1988
2
Philips Semiconductors
Product specification
TDA5330T
Fig.1 Block diagram.
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
January 1988
3
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
PINNING
Fig.2 Pinning diagram.
1
A OSC
band A oscillator input
2
GND
ground (0 V)
3
A OSC
band A oscillator output
4
B OSC
band B oscillator input
5
B OSC
band B oscillator output
6
B OSC
band B oscillator output
7
B OSC
band B oscillator input
8
C OSC
band C oscillator input
9
C OSC
band C oscillator output
10
C OSC
band C oscillator output
11
C OSC
band C oscillator input
12
BS
electronic bandswitch
13
IF OUT
IF amplifier output
14
IF OUT
IF amplifier output
15
IF IN
IF amplifier input
16
IF IN
IF amplifier input
17
MIX OUT
mixer output
18
MIX OUT
mixer output
19
VP
positive supply voltage
20
C IN
band C input
21
C IN
band C input
22
B IN
band B input
23
B IN
band B input
24
A IN
band A input
25
A IN
band A input
26
RF GND
ground for RF inputs
27
LO OUT
local oscillator amplifier output
28
LO OUT
local oscillator amplifier output
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
VP = V19−2, 26
−0.3
14
V
Switching voltage
V12
0
14
V
Output current of each pin to ground
IO
−
−10
mA
Maximum short-circuit time (all pins)
tSC
−
10
s
Storage temperature range
Tstg
−55
+150
°C
Operating ambient temperature range
Tamb
−25
+80
°C
THERMAL RESISTANCE
From junction to ambient in free air
January 1988
Rth j-a
4
typ. 75 K/W
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
CHARACTERISTICS
VP = 12 V; Tamb = 25 °C; unless otherwise specified.
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage
V19−2, 26
10
−
13.2
V
Supply current
I19
−
42
55
mA
band A
V12
0
−
1.1
V
band B
V12
1.6
−
2.4
V
band C
V12
3.0
−
5.0
V
I12
−
−
50
µA
fA
48
−
180
MHz
50 MHz
NF
−
7.5
9
dB
180 MHz
NF
−
9
10
dB
50 MHz
G24−26
−
0.5
−
mS
180 MHz
G24−26
−
1.1
−
mS
Switching voltage;
Switching current;
band C
Band A Mixer
(including IF amplifier)
measured using
circuit shown in
Fig.9
Frequency range
Noise figure
note 1;
Optimum source
conductance
Input admittance
see Fig.9
Input capacitance
50 - 180 MHz
C24−26
−
2
−
pF
Input voltage
1% cross-modulation;
in channel
V24−26
97
100
−
dBµV
Input voltage
10 kHz pulling;
in channel
V24−26
100
108
−
dBµV
Voltage gain
20 log
(V13−14/V24)
Gv
22.5
25.0
27.5
dB
Sc24−17, 18
−
3.5
−
mS
−
0.1
−
mS
−
2
−
pF
Band A mixer
Conversion
transadmittance
Sc = I17/V24
mixer
= −I18/V24
Mixer output
admittance
pins 15 and 16
Mixer output
capacitance
January 1988
C17−18
5
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
PARAMETER
CONDITIONS
TDA5330T
SYMBOL
MIN.
TYP.
MAX.
UNIT
Band A oscillator
fA
80
−
216
MHz
Frequency shift
∆VP = 10%
∆f
−
−
200
kHz
Frequency drift
∆T = 25 °C
∆f
−
−
400
kHz
Frequency drift
5 s to 15 min after
switching on
∆f
−
200
kHz
fB
160
−
470
MHz
200 MHz
NF
−
8
10
dB
470 MHz
NF
−
8
10
dB
200 MHz
PAI
−24
−21
−
dBm
470 MHz
PAI
−24
−21
−
dBm
−
−11
−
dBm
−
−11
−
dBm
Frequency range
Band B mixer
(including IF)
−
measured using circuit
shown in
Fig.9
measurements
using hybrid;
note 2
Frequency range
Noise figure
pins 22 and 23;
Input admittance
see Fig.5
Available input power
1% cross-modulation;
in channel;
pins 22 and 23;
10 kHz pulling
pins 22 and 23;
in channel;
N+5 − 1 MHz pulling
note 3;
470 MHz
430 MHz
Voltage gain
note 4;
200 MHz
Gv
33
36
39
dB
470 MHz
Gv
33
36
39
dB
fB
200
−
500
MHz
Band B oscillator
Frequency range
Frequency shift
∆VP = 10%
∆f
−
−
400
kHz
Frequency drift
∆T = 25 °C
∆f
−
−
500
kHz
Frequency drift
5 s to 15 min after
switching on
∆f
−
−
200
kHz
January 1988
6
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
PARAMETER
Band C mixer
(including IF)
CONDITIONS
TDA5330T
SYMBOL
MIN.
TYP.
MAX.
UNIT
measured
using circuit shown in
Fig.9;
measurements
using hybrid;
note 2
fC
430
−
860
MHz
430 MHz
NF
−
9
11
dB
860 MHz
NF
−
9
11
dB
430 MHz
PAI
−25
−21
−
dBm
860 MHz
PAI
−25
−21
−
dBm
−
−20
−
dBm
−42
−35
−
dBm
Frequency range
Noise figure
pins 20 and 21;
Input admittance
see Fig.6
Available input power
1% cross-modulation
in channel;
pins 20 and 21;
10 kHz pulling
pins 20 and 21;
in channel;
860 MHz
N+5 − 1 MHz pulling
note 3;
820 MHz
Voltage gain
note 4;
430 MHz
Gv
33
36
39
dB
860 MHz
Gv
33
36
39
dB
fC
470
−
900
MHz
Band C oscillator
Frequency range
Frequency shift
∆Vb = 10%
∆f
−
−
400
kHz
Frequency drift
∆T = 25 °C
∆f
−
−
800
kHz
Frequency drift
5 s to 15 min after
switching on
∆f
−
−
200
kHz
IF Amplifier
mod.
phase
note 5; differentially
measured at 36 MHz;
see Fig.7
Input reflection
coefficient
S11
−
−0,5
−2.0
−
dB/deg
S12
−
−41
−7
−
dB/deg
S21
−
12
160
−
dB/deg
S22
−
−9
10
−
dB/deg
Reverse transmission
coefficient
Forward transmission
coefficient
Output reflection
coefficient
January 1988
see Fig.8
7
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
PARAMETER
CONDITIONS
TDA5330T
SYMBOL
MIN.
TYP.
MAX.
UNIT
LO output
Output voltage into
50 Ω resistor
V27−28
14
35
100
mV
note 6
SRF
−
−
−10
dB
measured at 50 Ω
SHD
−
−
−10
dB
Spurious signal on
LO output with
respect to LO
output signal
LO signal harmonics
with respect to
LO signal
Notes
1. Measured with an input circuit for optimum noise. (see Fig.3).
2. The values have been corrected for hybrid and cable losses. The symmetrical output impedance of the circuit is
100 Ω.
3. The input level of a N+5 − 1 MHz signal (just visible).
4. The gain is defined as the transducer gain (measured in Fig.9) plus the voltage transformation ratio of L6 to L7
(6:1, 16 dB).
5. All S parameters are referred to a 50 Ω system.
6. Measured with 50 Ω output impedance on pins 26 and 27 and a RF input signal level of:
RF level = 1 V at f < 180 MHz
RF power = 0.5 dBm at 100 MHz < f < 225 MHz
RF power = −10 dBm at 225 MHz < f < 860 MHz
Fig.3 Input circuit for optimum noise.
Table 1
Component values
COMPONENT
F = 50 MHz
F = 180 MHz
L
13 t, ∅ 5.5 mm, wire 0.7 mm
(note 1)
L2
rigid cable, 2.9 cm
(note 1)
L3
rigid cable, 4 cm
(note 1)
C
9.6 pF
(note 1)
Note
1. Value to be fixed.
January 1988
8
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
Table 2
TDA5330T
Electrical parameters of the circuit (for appropriate impedance and selectivity)
PARAMETER
F = 50 MHz
F = 180 MHz
UNIT
Insertion loss
0.3
(note 1)
dB
Bandwidth
8
(note 1)
MHz
Image suppression
15
(note 1)
dB
Output impedance (source for IC)
2
(note 1)
kΩ
Note
1. Value to be fixed.
Fig.4 S11 of the band A mixer input (40 to 220 MHz).
January 1988
9
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
Fig.5 S11 of the band B mixer input (150 to 500 MHz).
Fig.6 S11 of the band C mixer input (450 to 900 MHz).
January 1988
10
TDA5330T
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
Fig.7 S11 of the LO output (50 to 900 MHz).
Fig.8 S11, S12 and S22 of the IF amplifier (30 to 60 MHz).
January 1988
11
TDA5330T
Philips Semiconductors
Product specification
TDA5330T
Fig.9 Test circuit diagram.
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
January 1988
12
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Component values of the test circuit
resistors
R1 = 47 kΩ
R2 = 18 Ω
R3 = 22 kΩ
R4 = 22 kΩ
R5 = 22 Ω (SMD)
R6 = 22 kΩ
R7 = 1 kΩ
R8 = 2.2 kΩ
R9 = 22 kΩ
R10 = 15 kΩ
R11 = 22 kΩ
C1 = 1 nF
C2 = 1 nF
C3 = 1 nF
C4 = 1 nF
C5 = 1 nF
C6 = 1 nF
C7 = 1 nF
C8 = 1 nF
C9 = 1 nF
C10 = 1 nF
C11 = 1 nF
C12 = 15 pF (N750)
C13 = 15 pF (N750)
C14 = 1 nF
C15 = 1 nF
C16 = 1 nF
C17 = 0.68 pF (SMD)
C18 = 1 pF (SMD)
C19 = 100 pF (SMD)
C20 = 5.6 pF (SMD)
C21 = 1 pF
C22 = 0.68 pF (SMD)
C23 = 150 pF (N750)
C24 = 1.8 pF (N750)
C25 = 3.3 pF (SMD)
C26 = 3.3 pF (SMD)
C27 = 1.8 pF (SMD)
C28 = 1 nF
C29 = 1 pF (NPO)
C30 = 1 pF (NPO)
C31 = 82 pF (N750)
C32 = 1 nF
C33 = 1 µF (40 V)
Cm = 18 pF (N750)
capacitors
diodes and IC
D1 = BB911
D2 = BB909B
D3 = BB405B
L1 = 6.5 t (φ3)
L2 = 1.5 t (φ3)
L3 = 1.5 t (φ3)
L4 = 1.5 t (φ3)
L5 = 2 × 6 t (note 1)
L6 = 12 t (note 1)
L7 = 2 t (mounted on L6)
L8 = 5 µH (choke coil)
IC = TDA5330T
coils
wire size for L1 to L4 = 0.4 and for L5 to L7 = 0.1 mm.
Note
1. Coil type: TOKO 7 kN; material: 113 kN, screw core (03-0093), pot core (04-0026).
January 1988
13
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
January 1988
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
14
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between
50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique
should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less
than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
January 1988
15
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
January 1988
16