This product complies with the RoHS Directive (EU 2002/95/EC). DE3S062D Silicon epitaxial planar type For surge absorption circuits Features Package High electrostatic discharge ESD Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Code SSMini3-F3-B Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) Pin Name 1: Cathode-1 2: Cathode-2 3: Anode-1, 2 Absolute Maximum Ratings Ta = 25°C Marking Symbol: 41 Packaging Parameter Symbol Rating Unit PT 150 mW ESD ±30 kV Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Total power dissipation *1 Electrostatic discharge *2 Internal Connection 3 1 Note) *1: PT = 150 mW achieved with a printed circuit board. *2: Test method: IEC61000-4-2 (C = 150 pF, R = 330 W, Contact discharge: 10 times) 2 Common Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit 6.51 V 1 µA Zener voltage *1, 2 VZ IZ = 1 mA Reverse current IR VR = 4 V Terminal capacitance Ct VR = 0 V, f = 1 MHz 55 pF Temperature coefficient of zener voltage *3 SZ IZ = 1 mA 2.3 mV/°C 5.89 Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. *1: The temperature must be controlled 25°C for VZ measurement. VZ value measured at other temperature must be adjusted to VZ (25°C) * 2: VZ guaranteed 20 ms after current flow. *3: Tj = 25°C to 150°C Publication date: November 2010 Ver. AED 1 This product complies with the RoHS Directive (EU 2002/95/EC). DE3S062D DE3S062D_IF-VF 102 IZ VZ 102 Ta = 25°C 10−1 10−6 1 10−7 10−1 10−2 10−8 10−2 0 0.4 0.8 1.2 10−3 5 Forward voltage VF (V) DE3S062D_SZ-IZ Terminal capacitance Ct (pF) Temparature coefficient of zener voltage SZ (mV/°C) 4 2 0 −2 0 2 4 6 8 10 Ta = 25°C 60 40 20 0 0 1 2 3 4 Reverse voltage VR (V) Ver. AED 10−9 0 1 2 3 4 5 Reverse voltage VR (V) Ct VR 80 Zener current IZ (mA) 2 7 DE3S062D_Ct-VR SZ IZ −4 6 Zener voltage VZ (V) 6 Ta = 25°C Ta = 25°C Reverse current IR (mA) 1 IR VR 10−5 10 Zener current IZ (mA) Forward current IF (mA) 10 10−3 DE3S062D_IR-VR DE3S062D_IZ-VZ IF VF 5 6 This product complies with the RoHS Directive (EU 2002/95/EC). DE3S062D SSMini3-F3-B Unit: mm +0.05 1.60 −0.03 +0.05 0.375 ±0.05 0.26 −0.02 (5°) 1.60 ±0.05 0.85 −0.03 +0.05 3 1 2 (0.50) +0.05 0.13 −0.02 (0.50) (0.45) 1.00 ±0.05 0 to 0.10 0.70 −0.03 +0.05 (5°) Ver. AED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202