PANASONIC DZ2705600L

DZ27056
Silicon epitaxial planar type
Unit: mm
For constant voltage / For surge absorption circuit
DZ2S056 in SSSMini2 type package
 Features
 Excellent rising characteristics of zener current IZ
 Low zener operating resistance RZ
 Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
 Marking Symbol: DJ
 Packaging
DZ2705600L Embossed type (Thermo-compression sealing): 10 000 pcs / reel (standard)
 Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
IFRM
200
mA
Total power dissipation *1
PT
120
mW
Electrostatic discharge *2
ESD
±15
kV
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Repetitive peak forward current
1: Cathode
2: Anode
Panasonic
JEITA
Code
SSSMini2-F4-B
SC-104A
SOD-723
Note) *1: Mounted on glass epoxy print board. (45 mm × 45 mm × 1 mm)
Solder in (0.4 mm × 0.3 mm)
*2: Test method:IEC61000-4-2 (C = 150 pF, R = 330 Ω, Contact discharge:10 times)
 Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.0
V
5.88
V
Forward voltage
VF
IF = 10 mA
Zener voltage *1, 2
VZ
IZ = 5 mA
Zener operating resistance
RZ
IZ = 5 mA
40
W
Zener rise operating resistance
RZK
IZ = 0.5 mA
200
W
Reverse current
IR
VR = 2.5 V
0.5
mA
Temperature coefficient of zener voltage *3
SZ
IZ = 5 mA
5.32
1.6
mV/°C
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 5 MHz.
3. *1: The temperature must be controlled 25°C for VZ measurement. VZ value measured at other temperature must be adjusted to VZ (25°C)
*2 : VZ guaranteed 20 ms after current flow.
*3 : Tj = 25°C to 150°C
Publication date: January 2013
Ver. DED
1
DZ27056
DZ27056_IF-VF
IF  VF
103
102
Ta = 25°C
IR  VR
Ta = 25°C
Ta = 25°C
10−4
1
10−1
Reverse current IR (mA)
10
1
10−1
10−2
10−2
0
0.4
0.8
10−3
1.2
Forward voltage VF (V)
0
2
4
10
100
4
2
1
0
−1
−2
−3
20
15
10
0
2
4
6
8
Zener current IZ (mA)
0
10
0
120
80
40
160
Ambient temperature Ta (°C)
200
(2)
102
10
1
10−3
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(45 mm × 45 mm × 1 mm)
Solder in : 0.4 mm × 0.3 mm
10−1
10
Time t (s)
Ver. DED
2
3
4
5
PZSM  tW
(1)
Rth(j-l) = 100°C/W
1
Reverse voltage VR (V)
DZ27__PZSM-tW
Rth  t
Thermal resistance Rth (°C/W)
Total power dissipation PT (mW)
25
5
103
120
Ta = 25°C
DZ27__Rth-t
Mounted on glass epoxy print board.
(45 mm × 45 mm × 1 mm)
Solder in : 0.4 mm × 0.3 mm
4
30
−4
PT  Ta
160
3
35
3
−5
2
40
DZ27__ PT-Ta
80
1
Reverse voltage VR (V)
Ct  VR
5
Zener current IZ (mA)
40
0
DZ27056_Ct-VR
Terminal capacitance Ct (pF)
1
Temparature coefficient of zener voltage SZ (mV/°C)
Zener operating resistance RZ (Ω)
Ta = 25°C
10
0
10−10
SZ  IZ
100
0
10
10−8
DZ27056_SZ-IZ
RZ  IZ
1
8
Zener voltage VZ (V)
DZ27056_RZ-IZ
0.1
0.1
6
10−6
103
Non-repetitive reverse surge power dissipation PZSM (W)
10−3
DZ2J056_IR-VR
IZ  VZ
10
Zener current IZ (mA)
Forward current IF (mA)
102
DZ2J056_IZ-VZ
102
Ta = 25°C
10
1
10−1 2
10
103
104
Pulse width tW (µs)
2
DZ27056
SSSMini2-F4-B
Unit: mm
 Land Pattern (Reference) (Unit: mm)
Ver. DED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
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Consult our sales staff in advance for information on the following applications:
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life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
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Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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