BOURNS CG0603MLC-12E

Features
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0603 package
Rated for IEC 61000-4-2, level 4 ESD requirements for high speed USB 2.0 or
IEEE1394 applications
Withstands multiple ESD strikes
Low capacitance and leakage currents for invisible load protection
Tape and reel packaging
ChipGuard® MLC Series Varistor ESD Clamp Protectors
Electrical Characteristics @ 25 °C (unless otherwise noted)
Description
The ChipGuard® CG0603MLC Series has
been specifically designed to protect
sensitive electronic components from
electrostatic discharge damage. The MLC
family has been designed to protect
equipment to IEC61000-4-2, level 4 ESD
specifications targeted for high speed
USB 2.0 or IEEE1394 applications.
The ChipGuard® MLC Series has been
manufactured to provide very low capacitance
and leakage currents with excellent clamp
qualities, making the family almost transparent under normal working conditions.
Device Symbol
Parameter
Device
Typ.
Max.
Continuous operating voltage
CG0603MLC-05
CG0603MLC-12
5
12
6
Clamping voltage
(see notes 1,2,3)
CG0603MLC-05
CG0603MLC-12
20
30
35
50
V
Off-state capacitance,
f = 1 MHz, 1 Vrms bias
0.5
pF
IL
Off-state current,
VDC = max. rating
50
nA
VT
Trigger voltage (see notes 1,3,4)
VDC
VCLAMP
Coff
150
Unit
V
V
Notes: 1.Per IEC 61000-4-2, 30 A at 8 kV, level 4.
2.Measurement made 30 ns after initiation of pulse.
3.Test conducted in contact discharge mode.
4.Measurement made at maximum pulse voltage.
V
Environmental Characteristics
Response Time ................................................................................................................<1 ns
Operating Temperature ..................................................................................-55 °C to +85 °C
Storage Temperature ......................................................................................-55 °C to +85 °C
How to Order
CG 0603 MLC - 05 E
ChipGuard
Product Designator
®
Package Option
0603 = 0603 Package
Surge Withstand Ratings
Peak Voltage
Repetitions
(Min.)
ESD Voltage Capability,
Contact Discharge
8 kV
100 at 8 kV
ESD Voltage Capability,
Air Discharge
15 kV
100 at 15 kV
Parameter
Multilayer Series Designator
Operating Voltage
05 = 5 V
12 = 12 V
Packaging
E = Tape and Reel
5,000 pcs. per reel
Standard
Ni barrier terminations are standard on all
ChipGuard® part numbers.
Reliable Electronic Solutions
Asia-Pacific:
TEL +886-2 25624117
FAX +886-2 25624116
Europe:
TEL +41-41 7685555
FAX +41-41 7685510
The Americas:
TEL +1-951 781-5500
FAX +1-951 781-5700
www.bourns.com
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
IEC61000-4-2 Level 4
ChipGuard® MLC Series Varistor ESD Clamp Protectors
Recommended Pad Layout
Product Dimensions
0.75 ± 0.10
(0.03 ± 0.004)
0.50 ± 0.1
(0.020 ± 0.004)
0.80 ± 0.2
(0.032 ± 0.008)
DIMENSIONS =
MM
(INCHES)
0.30 ± 0.2
(0.012 ± 0.008)
1.60 ± 0.2
(0.064 ± 0.008)
0.75 ± 0.10
(0.03 ± 0.004)
0.75 ± 0.10
(0.03 ± 0.004)
Packaging Dimensions
1.10 ± 0.20
(0.044 ± 0.008)
2.00 ± 0.05
(0.08 ± 0.002)
13.0 ± 1.0
(0.52 ± 0.04)
3.50 ± 0.05
(0.14 ± 0.002)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
13.0 ± 0.50
(0.52 ± 0.02)
1.90 ± 0.20
(0.076 ± 0.008)
1.50 ± 0.10
(0.06 ± 0.004)
4.00 ± 0.10
(0.16 ± 0.004)
1.75 ± 0.10
(0.04 ± 0.004)
21.0 ± 0.80
(0.84 ± 0.032)
8.00 ± 0.30
(0.32 ± 0.012)
180.8 ± 2.0
(7.12 ± 0.08)
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
TAPE THICKNESS IS
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
9.0 ± 0.50
(0.36 ± 0.02)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
200
B
Stage 2 Preheat 140 °C to 160 °C
60 s to 120 s
150
C
Stage 3 Preheat Preheat to 200 °C
20 s to 40 s
D
Main Heating
200
210
220
230
240
60
55
50
40
30
E
Cooling
200 °C to 100 °C
Temperature (°C)
250
100
50
0
110 sec. (min.)
30-70
sec.
120 sec. (min.)
°C
°C
°C
°C
°C
s
s
s
s
s
to
to
to
to
to
70
65
60
50
40
s
s
s
s
s
1 °C/s to 4 °C/s
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
REV. D 01/05
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
“ChipGuard” is a registered trademark of Bourns, Inc.