Features ■ ■ ■ ■ ■ 0402 and 0603 package options Rated for IEC 61000-4-2, for applications requiring up to 18 V DC Withstands multiple ESD strikes Low capacitance and leakage currents for invisible load protection Tape and reel packaging ChipGuard® MLE Series Varistor ESD Clamp Protectors Description The ChipGuard® CG0402MLE and CG0603MLE Series has been designed to provide high frequency attenuation, thereby providing suppression and filtering in a single device. The MLE family also offers protection to ESD standards such as IEC61000-4-2 for applications requiring up to 18 V DC and is available in the industry standard 0603 and 0402 type leadless surface mount packaging. Electrical Characteristics @ 25 °C (unless otherwise noted) Continuous Operating Voltage Vrms Model VDC (V) (V) Max. Clamping Voltage Typ. Off-state Current VCLAMP (V) Max. Capacitance IL (uA) Typ. CP (pF) Max. Max. 8 kV Contact 15 kV Air 1A @ 8/20 µs 3.5 V 5.5 V 9V 12 V 18 V 1 Vrms @ 1 MHz CG0402MLE-18G 8.5 12 18 100 120 50 0.3 0.4 0.5 1 10 9 CG0603MLE-18E 8.5 12 18 40 60 60 0.3 0.4 0.5 1 10 50 Environmental Characteristics Surge Withstand Ratings Operating Temperature ..-55 °C to +125 °C Storage Temperature......-55 °C to +125 °C Response Time ..................................<1 ns Standard..................IEC 61000-4-2 Level 4 Peak Current 8/20 µs (Max.) Peak Current @ 8 kV (Max.) CG0402MLE-18G 15 A 30 A CG0603MLE-18E 20 A 45 A Model Device Symbol Voltage-Current Characteristics V How to Order 10 2 CG 0402 MLE - 18 G CG0402MLE-18G ChipGuard® Product Designator CG0603MLE-18E Package Option 0402 = 0402 Package 0603 = 0603 Package Operating Voltage 18 = 18 V Tape & Reel Packaging E = 4,000 pcs. per reel (0603 package) G = 10,000 pcs. per reel (0402 package) Voltage (Volts) Multilayer Series Designator CG0402MLE-18G CG0603MLE-18E 10 1 Ni barrier terminations are standard on all ChipGuard® part numbers. 10 0 10-8 10-7 10-6 10-5 SOURCE = DC Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 10-4 10-3 10-2 10-1 10 0 10 1 10 2 SOURCE = 8/20 µs PULSE, IPEAK I Current (Amps) 10 3 10 4 ChipGuard® MLE Series Varistor ESD Clamp Protectors Recommended Pad Layout Product Dimensions A A W B L DIMENSIONS = B C MM (INCHES) D Dimension CG0402MLE Series CG0603MLE Series Dim. CG0402MLE Series CG0603MLE Series L 1.00 ± 0.15 (0.04 ± 0.006) 1.60 ± 0.20 (0.064 ± 0.008) A 0.51 (0.020) 0.76 (0.030) W 0.50 ± 0.10 (0.02 ± 0.004) 0.80 ± 0.20 (0.032 ± 0.008) B 0.61 (0.024) 1.02 (0.040) A 0.50 ± 0.10 (0.02 ± 0.004) 0.80 ± 0.20 (0.032 ± 0.008) C 0.51 (0.020) 0.50 (0.020) B 0.25 ± 0.15 (0.010 ± 0.006) 0.30 ± 0.20 (0.012 ± 0.008) D 1.70 (0.067) 2.54 (0.100) Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling A Stage 1 Preheat Ambient to Preheating 30 s to 60 s Temperature 200 B Stage 2 Preheat 140 °C to 160 °C 150 C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s 100 D Main Heating 200 210 220 230 240 60 55 50 40 30 E Cooling 200 °C to 100 °C Temperature (°C) 250 50 0 110 sec. (min.) 30-70 sec. 120 sec. (min.) °C °C °C °C °C 60 s to 120 s s s s s s to to to to to 70 65 60 50 40 s s s s s 1 °C/s to 4 °C/s Time (seconds) • This product can be damaged by rapid heating, cooling or localized heating. • Heat shocks should be avoided. Preheating and gradual cooling recommended. • Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. • Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard® MLE Series Varistor ESD Clamp Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) 8.00 ± 0.30 (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) C 1.50 ± 0.10 (0.06 ± 0.004) 62.0 ± 1.50 (2.48 ± 0.06) 2.0 ± 0.50 (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP TAPE G W 21.0 ± 0.80 (0.84 ± 0.032) D 180.8 ± 2.0 (7.12 ± 0.08) 3.50 ± 0.05 (0.14 ± 0.002) NOTES: TAPE MATERIAL IS PAPER. 0.60 ± 0.05 TAPE THICKNESS IS (0.024 ± 0.002) COVER TAPE ADHESION IS 40 ± 15 GRAMS. 9.0 ± 0.50 (0.36 ± 0.02) Dimension CG0402MLE Series CG0603MLE Series C 1.75 ± 0.05 (0.04 ± 0.002) 1.75 ± 0.10 (0.04 ± 0.004) D 2.00 ± 0.02 (0.08 ± 0.0008) 2.00 ± 0.05 (0.08 ± 0.002) L 1.12 ± 0.03 (0.045 ± 0.0012) 1.80 ± 0.20 (0.072 ± 0.008) W 0.62 ± 0.03 (0.025 ± 0.0012) 0.90 ± 0.20 (0.036 ± 0.008) G 2.0 ± 0.05 (0.08 ± 0.002) Reliable Electronic Solutions Asia-Pacific: TEL +886-2 25624117 • FAX +886-2 25624116 Europe: TEL +41-41 7685555 • FAX +41-41 7685510 North America: TEL +1-951 781-5500 • FAX +1-951 781-5700 www.bourns.com Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. REV. C “ChipGuard” is a registered trademark of Bourns, Inc.