PL IA NT Features CO M ■ *R oH S ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* Protects 1 line Bidirectional configuration ESD protection ■ ■ ■ ■ Cell phones PDAs and notebooks Digital cameras MP3 players and GPS CD0402-TxxC – TVS Diode Array Series General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Transient Voltage Suppressor Array diodes for surge and ESD protection applications, in 0402 chip package size format. The Transient Voltage Supressor Array series offers a choice of voltage types ranging from 3 V to 36 V in a bidirectional configuration. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Peak Pulse Power (tp = 8/20 µs) 1 Symbol Value Unit PPP 250 W TJ -55 ˚C to 150 ˚C ˚C TSTG -55 ˚C to 150 ˚C ˚C Operating Temperature Storage Temperature CD0402Parameter Symbol T3.3C T05C T08C T12C T15C T24C T36C Unit Min. Breakdown Voltage @ 1 mA VBR 4.0 6.0 8.5 13.3 16.7 26.7 40.0 V Working Peak Voltage VWM 3.3 5.0 8.0 12.0 15.0 24.0 36.0 V Maximum Clamping Voltage @ IP2 VF 7.0 11.0 13.4 19.0 24 43 64 V Maximum Clamping Voltage @ 8/20 µs VC @ IPP2 VF 12.5 V @ 20 A 29.7 V @9A 35.7 V @7A 55 V @5A 84 V @3A V Maximum Leakage Current @ VWM ID 75 10 4 10 1 1 1 1 µA Typical Capacitance @ 0 V, 1 MHz C 150 100 75 50 40 30 25 pF 3 Notes: 1. See Peak Pulse Power vs. Pulse Time. 2. See Pulse Wave Form. 3. Max. Leakage Current <500 µA @ 2.8 V. 4. Max. Leakage Current <500 nA @ 3.3 V. 5. Max. Leakage Current <200 nA @ 5 V. All devices are bidirectional. Electrical Characteristics apply in both directions. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 14.7 V 19.2 V @ 17 A @ 13 A 5 CD0402-TxxC – TVS Diode Array Series Product Dimensions Recommended Footprint This is a 0402 package with lead free 100 % Sn plating on the bond pads. It weighs approximately 30 mg and has a flammability rating of UL 94V-0. A A B C B C D G Dimensions (Nominal) D A 0.69 0.027 B 0.46 0.018 C 0.20 0.008 D 0.46 0.018 E H F I Dimensions DIMENSIONS = A 0.41 - 0.51 0.016 - 0.020 B 0.81 - 0.91 0.032 - 0.036 C 0.96 - 1.02 0.038 - 0.040 D 0.10 NOM. 0.004 E 0.35 NOM. 0.014 F G 0.46 - 0.51 0.018 - 0.020 0.20 NOM. 0.008 H 0.076 - 0.127 0.003 - 0.005 I 0.401 - 0.411 0.014 - 0.018 DIMENSIONS = MILLIMETERS (INCHES) How To Order CD 0402 - T 05 C Common Code Chip Diode Package • 0402 = 0402 Chip Package Model T = Transient Voltage Supressor Working Peak Reverse Voltage 3.3 = 3.3 VRWM (Volts) 05 = 5 VRWM (Volts) 08 = 8 VRWM (Volts) 12 = 12 VRWM (Volts) 15 = 15 VRWM (Volts) 24 = 24 VRWM (Volts) 36 = 36 VRWM (Volts) Suffix C = Bidirectional Diode MILLIMETERS (INCHES) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD0402-TxxC – TVS Diode Array Series Performance Graphs Peak Pulse Power vs Pulse Time Pulse Wave Form 120 1,000 IPP – Peak Pulse Current (% of IPP) PPP – Peak Pulse Current (W) 10,000 250 W, 8/20 µs Waveform 100 10 0.01 1 10 100 1,000 80 et 60 40 td = t|IPP/2 20 0 10,000 0 td – Pulse Duration (µs) 5 10 15 20 25 30 t – Time (µs) Power Derating Curve Overshoot & Clamping Voltage 35 100 Peak Pulse Power 8/20 µs 80 5 Volts per Division % of Rated Power Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 60 40 20 Average Power 25 15 5 0 0 25 50 75 100 125 150 -5 -90.000 ns TL – Lead Temperature (°C) 10.000 ns ESD Test Pulse - 25 kilovolt, 1/30 ns (waveshape) Typical Clamping Voltage vs. Peak Pulse Current VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 IPP – Peak Pulse Current - Amps Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 20 110.000 CD0402-TxxC – TVS Diode Array Series Block Diagram Typical Part Marking There is no part marking on the back side of the devices. The part number for the device is located on the Tape and Reel label. Packaging The surface mount product is packaged in an 8 mm x 4 mm Tape and Reel format per EIA-481 standard. TOP SIDE VIEW (INTO COMPONENT POCKET) DIMENSIONS = MILLIMETERS (INCHES) 4.0 ± 0.1 (.16 ± .004) 0.3 ± 0.05 (.01 ± .002) 1.5 ± 0.1/-0 (.06 ± .004/-0) DIA. 2.0 ± 0.05 (.08 ± .002) R 1.75 ± 0.1 (.07 ± .004) 0.3 MAX. (0.01) 0.76 ± 0.1 (.03 ± .004) 8.0 ± 0.3 (.31 ± .01) 1.52 ± 0.1 (.06 ± .004) 3.5 ± 0.3 (.14 ± .01) 1.18 ± 0.1 (.05 ± .004) 4.0 ± 0.3 (.16 ± .01) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Reliable Electronic Solutions Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0524 10/05