MATERIAL DECLARATION SHEET CD0603-TxxC Series Material Number Product Line Semiconductor Products 2007/9/28 Compliance Date RoHS Compliant No. 1 YES Construction Element (subpart) Homogeneous Material FR-4 Board Substrate/ Terminal MSL Material weight [mg] 1.357 2 Wafer Diode 0.029 3 Al wire Conductor 0.001 4 Silver paste Welding 0.006 5 Molding Compound Outer 1.881 Total weight 3.274 Headquarters Riverside CA 1 Homogeneous Material\ Substances Copper Nickel Gold Continuous Filament Fiber Glass Silicon Aluminum Titanium Silver Silicon dioxide Aluminum Silicon Modified Epoxy Resin Silver Imidazole Dicyandiamide Silica Epoxy Resin Phenolic Resin Carbon Black CASRN if applicable Materials Mass % 7440-50-8 7440-02-0 7440-57-5 29.34% 4.762% 0.155% Material Mass % of total unit wt. 0.39814 0.06463 0.00210 65997-17-3 65.74% 0.89213 7440-21-3 7429-90-5 7440-32-6 7440-22-4 14808-60-7 7429-90-5 7440-21-3 29690-82-2 7440-22-4 827-43-0 461-58-5 60676-86-0 29690-82-2 9003-35-4 1333-86-4 97.948% 2% 0.001% 0.001% 0.05% 99.00% 1% 16% 80% 2% 2% 80.00% 10.00% 9.50% 0.50% 0.02840492 0.00058 0.00000029 0.00000029 0.0000145 0.00099 0.00001 0.00096 0.0048 0.00012 0.00012 1.505 0.188 0.179 0.009 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Subpart mass of total wt. (%) 41.45 0.89 0.03 0.18 57.45 page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 2015/11/30 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2