BOURNS CDSC706

NT
IA
PL
M
CO
S
oH
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Features
Applications
■ Lead free as standard
■ Personal Digital Assistants (PDAs)
■ RoHS compliant*
■ Notebook and PC computers
■ Low capacitance - 1.3 pF
■ Memory card protection
■ ESD protection >25 kV
■ SIM card port protection
■ Surge protection
■ Portable electronics
CDSC706-0504C - Surface Mount TVS Diode Array
General Information
The CDSC706-0504C device provides ESD, EFT and Surge protection for high speed
data ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5
(Surge) requirements. The Transient Voltage Suppressor array, protecting up to 4 data
lines, offers a Working Peak Reverse Voltage of 5 V and Minimum Breakdown Voltage
of 6 V.
The SC70-6L packaged device will mount directly onto the industry standard SC70-6
footprint. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle with
standard pick and place equipment and the flat configuration minimizes roll away.
5
1
3
4
6
2
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
CDSC706-0504C
Unit
IPP
6.5
A
Storage Temperature
TSTG
-55 to +150
ºC
Operating Temperature
TOPR
-55 to +85
ºC
VDC
6
V
Vesd IO
18
14
kV
Vesd VCC
30
30
kV
VIO
(GND-0.5) to (VCC+0.5)
V
Symbol
CDSC706-0504C
Unit
VRWM
5.0
V
IL
5.0
µA
ICD
1.0
µA
VBR
6.0
V
Maximum Forward Voltage 4 @ IF = 15 mA
VF
1.0
V
Maximum Clamping Voltage 2 @ 5 A 8/20us
VC
9.0
V
Vclamp io
12.5
V
CIN
1.6
pF
Max. Channel to Channel Input Capacitance 3
@ VPIN5=5 V, VPIN2=0 V, VIN=2.5 V, f=1 MHz
CCROSS
0.14
pF
Max. Variation of Channel Input Capacitance
@ VPIN5=5 V, VPIN2=0 V, VIN=2.5 V, f=1 MHz
(I/O Pin to GND)
ΔCIN
0.07
pF
Peak Pulse Power (tp = 8/20 µs)
Operating Supply Voltage
ESD per IEC61000-4-2 (Air) (I/O Pins)
ESD per IEC61000-4-2 (Contact) (I/O Pins)
ESD per IEC61000-4-2 (Air) (VCC to GND)
ESD per IEC61000-4-2 (Contact) (VCC to GND)
DC Voltage at any I/O Pin
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Maximum Reverse Standoff Voltage 1
Maximum Leakage Current
1
@ VRWM
Maximum Channel Leakage Current @ VRWM
Minimum Reverse Breakdown Voltage
@ IBV=1 mA
1
Typical ESD Clamping Voltage- I/O 2
Maximum Channel Input Capacitance 2
@ VPIN5=5 V, VPIN2=0 V, VIN=2.5 V, f=1 MHz
Notes:
1: Pin 5 to Pin 2 (ground)
2: Pin 1, 3, 4 or 6 to Pin 2 (ground)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
3: Between any two of pins 1, 3, 4, 6.
4: Pin 2 (ground) to Pin 5
CDSC706-0504C - Surface Mount TVS Diode Array
Product Dimensions
Recommended Footprint
This is a molded JEDEC SC70-6L package with lead free 100 %
Matte Sn on the lead frame. It weighs approximately 7 mg and has
a flammability rating of UL 94V-0.
1.72
(0.068)
0.15 - 0.30
(0.006 - 0.012)
0.65
(0.026)
6
5
1.30
(0.051)
4
2.00 - 2.20
(0.078 - 0.087)
1
2
0.10
(0.004)
0.50
(0.020)
3
0.08 - 0.25
(0.003 - 0.001)
1.15 - 1.35
(0.045 - 0.055)
1.30
(0.512)
0.65
(0.026)
0 - 10 °
0.60
(0.024)
0.26 - 0.46
(0.010 - 0.018)
1.90 - 2.15
(0.074 - 0.084)
DIMENSIONS = MILLIMETERS
(INCHES)
0.80 - 1.00
(0.031 - 0.040)
0.80 - 1.10
(0.031 - 0.043)
DIMENSIONS = MILLIMETERS
(INCHES)
Typical Part Marking
CDSC706-0504C ....................................................................... C05
How to Order
Configuration
CD SC706 - 05 04 C
I/O 4
VDD
I/O 3
6
5
4
Common Diode
Chip Diode
Package
SC706 = SC70-6L Package
Working Peak Reverse Voltage
05 = 5 VRWM (Volts)
Number of Lines
04 = 4 Data Lines
Suffix
C = Low Capacitance
1
2
3
I/O 1
GND
1/O 2
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
CDSC706-0504C - Surface Mount TVS Diode Array
Rating & Characteristic Curves
12
11
10
9
8
7
6
5
4
3
2
1
0
Pulse Waveform
IPP – Peak Pulse Current (% of IPP)
Clamping Voltage - Volts
Clamping Voltage vs. Peak Pulse Current
Waveform
Parameters:
tr = 8 µs
td = 20 µs
I/O pin to GND pin
120
80
et
60
40
td = t|IPP/2
20
0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
0
5
10
Peak Pulse Current (Amps)
25
15
0.2
5
2
% of Rated Power or IPP
5 Volts per Division
20
25
30
Power Derating Curve
30
-5
-72.000 ns
15
t – Time (µs)
Overshoot and Clamping Voltage
28.000 ns
128.000 ns
110
100
90
80
70
60
50
40
30
20
10
0
0
25
50
ESD Test Pulse: 25 kilovolt, 1/30 ns (waveshape)
75
100
125
150
Ambient Temperature, TA (°C)
Forward Voltage vs. Forward Current
Typical Variation of Cin vs. Vin
4.0
2.0
1.8
3.5
3.0
Input Capacitance (pF)
Forward Voltage - Volts
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
2.5
2.0
1.5
1.0
Waveform
Parameters:
tr = 8 µs
td = 20 µs
I/O pin to GND pin
0.5
0.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
Peak Pulse Current (Amps)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
1.6
1.4
1.2
1.0
0.8
0.6
VDD = 5 V, GND = 0 V, f = 1 MHz, T = 25 °C
0.4
0.2
0.0
0
1
2
3
Input Voltage (V)
4
6
CDSC706-0504C - Surface Mount TVS Diode Array
Packaging Information
The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-A standard.
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
.......
.......
Leader
.......
.......
W1
Start
DIMENSIONS:
MM
(INCHES)
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Item
Symbol
SC70-6L
Carrier Width
A
2.25 ± 0.10
(0.088 ± 0.004)
Carrier Length
B
2.34 ± 0.10
(0.092 ± 0.004)
Carrier Depth
C
1.22 ± 0.10
(0.048 ± 0.004)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
50.0
MIN.
(1.969)
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
8.00 ± 0.20
(0.315 ± 0.008)
Reel Width
W1
Quantity per Reel
--
14.4
MAX.
(0.567)
3000
07/09
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications