CMC02 TOSHIBA RECTIFIER SILICON DIFFUSED TYPE CMC02 For Strobe Discharge Circuit Unit: mm • Repetitive peak reverse voltage: VRRM = 400 V • Average forward current: IF (AV) = 1.0 A • Low forward voltage: VFM = 1.0 V (max.) • Repetitive peak forward current: IFRM = 150 A (Note 2) • Small surface-mount package, the “M−FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Repetitive peak reverse voltage VRRM 400 V Average forward current IF (AV) 1.0 (Note 1) A Peak one-cycle surge forward current (non-repetitive) IFSM 30 (50 Hz) A Repetitive peak forward current (Note 2) IFRM 150 A Junction temperature Storage temperature range Tj −40~150 °C Tstg −40~150 °C JEDEC ― Note 1: Ta＝92°C JEITA ― Device mounted on a ceramic board Board size: 50 mm × 50 mm TOSHIBA 3-4E1A Soldering land: 2 mm ×2 mm Weight: 0.023 g (typ.) Board thickness: 0.64t Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristic Peak forward voltage Peak repetitive reverse current Thermal resistance (junction to ambient) Thermal resistance (junction to lead) Symbol VFM (1) IRRM Rth (j-a) Test Condition Min Typ. Max Unit IFM = 1.0 A (pulse test) ⎯ 0.88 1.0 V VRRM = 400 V (pulse test) ⎯ ⎯ 10 μA Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 t) ⎯ ⎯ 60 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 t) ⎯ ⎯ 110 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ ⎯ 180 ⎯ ⎯ 16 ⎯ Rth (j-ℓ) 1 °C/W °C/W 2006-11-06 CMC02 Note 2: Repetitive peak forward current waveform IFRM 0.368×IFRM t τ 0 τ =1ms 1pulse/3s (7000 cycle) IFRM = 150 A (CM = 500μF) Marking Type code C2 Product No. CMC02 Standard Soldering Pad 2.1 Unit: mm 1.4 3.0 1.4 2 2006-11-06 CMC02 Handling Precautions The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods we recommend for designing a circuit using this device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit, and no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/℃. Be sure to take this temperature coefficient into account when designing a device for use at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF (AV). Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by using an allowable Tamax- IF (AV) curve. This rating applies only to a strobe flash circuit. We recommend that the worst case current be kept within the absolute maximum rating of IFRM. The total number of repetitive currents should not exceed 7000 within the lifespan of the device. This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180°. Therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device. For this device, we recommend a Tj of below 120℃ under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information. 3 2006-11-06 CMC02 PF (AV) – IF (AV) 1.2 Average forward power dissipation PF (AV) (W) Pulse test Instantaneous forward current iF (A) iF – vF 100 10 150°C 75°C 1 Tj = 25°C 0.1 0.01 0 0.4 1.2 0.8 1.6 Instantaneous forward voltage 1.0 0° 180° Conduction angle 180° 0.8 0.6 0.4 0.2 0 0 2.0 vF Halfsine waveform 0.2 0.4 Ta max – IF (AV) 140 180° Conduction angle 180° 100 80 60 40 20 0.2 0.4 0.6 Average forward current 0.8 1.0 1.2 140 120 100 80 60 Halfsine waveform 40 20 0° 180° Conduction angle 180° 0 0 0.2 IF (AV) (A) 0.6 0.4 0.8 Average forward current 1.0 IF (AV) 1.2 (A) rth (j-a) – t 1000 40 Ta = 25°C Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm, f = 50 Hz Transient thermal impedance rth (j-a) (°C/W) (A) IFSM IF (AV) (A) 160 Surge forward current (non-repetitive) Peak surge forward current 1.2 Device mounted on a ceramic board (board size: 50 mm x 50 mm, soldering land 2 mm x 2 mm) Maximum allowable ambient temperature Ta max (°C) Maximum allowable ambient temperature Ta max (°C) Halfsine waveform 0 0 1.0 Ta max – IF (AV) 160 0° 0.8 Average forward current (V) Device mounted on a glass-epoxy board (board size:50 mm x 50 mm, soldering land 6 mm x 6 mm) 120 0.6 30 20 10 soldering land: 2.1 mm × 1.4 mm, board thickness: 1.6 t 100 10 Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm, soldering land: 6.0 mm × 6.0 mm, board thickness: 1.6 t 1 Device mounted on a ceramic board: board size: 50 mm × 50 mm, soldering land: 2.0 mm × 2.0 mm, board thickness: 0.64 t 0 1 10 0.1 0.001 100 Number of cycles 0.01 0.1 1 Time 4 10 t 100 1000 (s) 2006-11-06 CMC02 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2006-11-06