TOSHIBA CRS09

CRS09
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS09
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
Unit: mm
•
Forward voltage: VFM = 0.46 V (max)
•
Average forward current: IF (AV) = 1.5 A
•
Repetitive peak reverse voltage: VRRM = 30 V
•
Suitable for compact assembly due to small surface-mount package
“S−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
VRRM
30
V
Average forward current
IF (AV)
Peak one cycle surge forward current
(non-repetitive)
1.5 (Note 1)
A
IFSM
30 (50 Hz)
A
Junction temperature
Tj
−40~150
°C
Storage temperature
Tstg
−40~150
°C
Note 1: Ta = 84°C
Device mounted on a ceramic board
(board size: 50 mm × 50 mm, land size: 2 mm × 2 mm)
JEDEC
―
JEITA
―
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance (junction to ambient)
Thermal resistance (junction to lead)
Symbol
Test Condition
Min
Typ.
Max
VFM (1)
IFM = 0.1 A
⎯
0.35
⎯
VFM (2)
IFM = 1.0 A
⎯
0.415
⎯
VFM (3)
IFM = 1.5 A
⎯
0.43
0.46
IRRM (1)
VRRM = 5 V
⎯
0.8
⎯
IRRM (2)
VRRM = 30 V
⎯
10
50
VR = 10 V, f = 1.0 MHz
⎯
90
⎯
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
⎯
⎯
70
Cj
Rth (j-a)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm × 6 mm)
⎯
Rth (j-ℓ)
1
Unit
V
μA
pF
°C/W
⎯
⎯
140
⎯
⎯
20
°C/W
2006-11-13
CRS09
Marking
Abbreviation Code
Part No.
S9
CRS09
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
VRRM:
Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
IF(AV):
We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of IF(AV) and Tj be below 120°C. When using this device, take the margin into consideration by
using an allowable Tamax-IF(AV) curve.
IFSM:
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
Tj:
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a Tj of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
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2006-11-13
CRS09
(A)
iF – vF
PF (AV) – IF (AV)
10
0.8
DC
(pF)
3
Tj = 150°C
Cj
125°C
1
25°C
75°C
Junction capacitance
Instantaneous forward current
iF
0.7
0.3
0.1
0.03
0.01
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Instantaneous forward voltage vF
(V)
180°
0.6
120°
0.5
α = 60°
0.4
Rectangular
waveform
0.3
0.2
0° α 360°
0.1
0
0
0.8
Conduction angle α
0.4
0.8
Average forward current
Ta MAX – IF (AV)
Ceramic substrate (substrate size 50 mm × 50 mm)
Maximum allowable lead temperature
Tℓ MAX (°C)
Maximum allowable temperature
Ta MAX (°C)
2.0
2.4
IF (AV) (A)
160
140
120
100
60
1.6
Tℓ max – IF (AV)
160
80
1.2
α = 60°
180°
120°
DC
Rectangular
waveform
40
0° α 360°
20
IF (AV)
Conduction angle α
VR = 15 V
0
0
0.4
0.8
1.2
1.6
Average forward current
2.0
140
120
100
α = 60°
80
60
IF (AV) (A)
180°
DC
40
20
0° α 360°
IF (AV)
Conduction angle α
VR = 15 V
0
0
2.4
120°
Rectangular
waveform
0.4
0.8
1.2
Average forward current
1.6
2.0
2.4
IF (AV) (A)
rth (j-a) – t
30000
Transient thermal impedance
rth (j-a) (°C/W)
10000
① Device mounted on a ceramic board:
Soldering land: 2 mm × 2 mm
② Device mounted on a glass-epoxy board:
Soldering land: 6 mm × 6 mm
1000
②
100
①
10
1
1
10
100
1000
10000
100000
Time t (ms)
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CRS09
Surge forward current
(non-repetitive)
Cj – VR
Ta = 25°C
30
20
10
3
5
10
30
50
f = 1 MHz
Ta = 25°C
(pF)
Half sine waveform
500
Cj
f = 50 Hz
0
1
300
100
50
30
100
10
1
Number of cycles
3
5
10
30
Reverse voltage
IR – Tj
(typ.)
0.8
VR = 30 V
1
20 V
10 V
5V
3V
0.001
0.0001
0
20
40
60
80
100
Junction temperature
120
Tj
50
140
0°
0.5
0.4
(°C)
VR
DC
Conduction angle α
Tj = 150°C
300°
240°
180°
120°
60°
0.2
0.1
4
8
12
16
Reverse voltage
4
(typ.)
Rectangular
waveform
360°
0.3
0
0
160
100
(V)
0.6
(W)
Reverse current IR
(mA)
10
0.7
PR (AV)
Average reverse power dissipation
Pulse test
0.01
VR
PR (AV) – VR
100
0.1
(typ.)
1000
Junction capacitance
Peak surge forward current
IFSM (A)
40
20
VR
24
28
(V)
2006-11-13
CRS09
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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