TLP191B TOSHIBA Photocoupler GaAℓAs Ired & Photo-Diode Array TLP191B Telecommunication Programmable Controllers Mos Gate Driver MOS FET Gate Driver Unit in mm The TOSHIBA mini flat coupler TLP191B is a small outline coupler, suitable for surface mount assembly. The TLP191B consists of a GaAℓAs light emitting diode, optically coupled to a series connected photo diode array with shunt resistor which is suitable for MOS FET gate drive. • Open voltage: 7.0V(min.) • Short current: 24.0 μA (min.) • Isolation voltage: 2500 Vrms (min.) • UL recognized: UL1577,file no.E67349 Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit IF 50 mA ΔIF / °C −0.5 mA / °C Pulse forward current (100μs pulse, 100 pps) IFP 1 A Reverse voltage VR 3 V Forward current Forward current derating (Ta ≥ 25°C) LED Tj 125 °C IFD 50 μA Reverse voltage VRD 10 V Tj 125 °C Storage temperature range Tstg −55~125 °C Operating temperature range Topr −40~80 °C Lead soldering temperature (10s) Tsol 260 °C Isolation voltage (AC, 1 min., R.H. ≤ 60%) BVS 2500 Vrms Detector Junction temperature (Note) 11−4C1 Weight: 0.09 g Pin Configuration(top view) Forward current Junction temperature TOSHIBA 1 6 3 4 1 . Anode 3 . Cathode 4 . Cathode 6 . Anode Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note) Device considered a two terminal device: Pins 1 and 3 shorted together and pins 4 and 6 shorted together. 1 2007-10-01 TLP191B Recommended Operating Conditions Characteristic Symbol Min. Typ. Max. Unit IF ― 20 25 mA Topr −25 ― 85 °C Forward current Operating temperature Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Individual Electrical Characteristics (Ta = 25°C) Characteristic LED Detector Symbol Test Condition Min. Typ. Max. Unit Forward voltage VF IF = 10 mA 1.2 1.4 1.7 V Reverse current IR VR = 3 V — — 10 μA Capacitance CT V = 0, f = 1 MHz — 30 60 pF Forward voltage VFD IFD = 10 μA — 7 — V Reverse current IRD VRD = 10 V — 7 — μA Capacitance (anode to cathode) CTD V = 0, f = 1 MHz — — — pF MIn. Typ. Max. Unit Coupled Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Open voltage VOC IF = 20 mA 7 8 — V Short current ISC IF = 20 mA 24 40 — μA Min. Typ. Max. Unit — 0.8 — pF — Ω Isolation Characteristics (Ta = 25°C) Characteristic Symbol Capacitance input to output CS Isolation resistance RS Test Condition VS = 0, f = 1 MHz VS = 500 V, R.H. ≤ 60% 5×10 AC, 1 minute Isolation voltage BVS 10 10 14 2500 — — AC, 1 second in oil — 5000 — DC, 1 minute in oil — 5000 — Vdc Min. Typ. Max. Unit — 0.2 — ms — 3 — ms Vrms Switching Characteristics (Ta = 25°C) Characteristic Symbol Turn−on time tON Turn−off time Test Condition IF = 20mA, CL = 1000 pF tOFF (Fig.1) Fig. 1 Switching time test circuit IF VOUT IF CL VOUT 5V 1V 0V tON 2 tOFF 2007-10-01 TLP191B IF – Ta ΔVF /ΔTa – IF 100 −4.0 Forward voltage temperature coefficient ΔVF /ΔTa (mV / °C) Allowable forward current IF (mA) −3.6 80 60 40 20 −3.2 −2.8 −2.4 −2.0 −1.6 −1.2 −0.8 0 −20 20 0 60 40 80 100 0.3 0.1 Ambient temperature Ta (°C) 1 0.5 Forward current IF – V F Pulse forward current IFP (mA) (mA) Forward current IF 30 10 5 3 1.6 2.0 300 100 50 30 10 -3 3 (V) 10 -2 3 Duty cycle ratio 10 -1 0 3 10 50 100 DR ISC – IF 300 Ta = 25 °C 100 (μA) 7 55 °C 6 Short current ISC (V) VOC 500 3 8 Open voltage 1000 2.2 VOC – IF 9 85 °C 5 4 3 2 50 30 10 Ta = 25 °C 5 3 55 °C 1 0 1 IF (mA) Ta = 25 °C 10 1.8 Forward voltage VF 10 30 Pulse width ≦ 100μs 3000 50 1.4 10 5000 Ta = 25 °C 1.2 5 IFP – DR 100 1 1.0 3 85 °C 1 3 5 10 Forward current 30 50 1 100 IF (mA) 3 3 5 10 30 Forward current IF (mA) 2007-10-01 TLP191B RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 2007-10-01