TOSHIBA TLP191B

TLP191B
TOSHIBA Photocoupler
GaAℓAs Ired & Photo-Diode Array
TLP191B
Telecommunication
Programmable Controllers
Mos Gate Driver
MOS FET Gate Driver
Unit in mm
The TOSHIBA mini flat coupler TLP191B is a small outline coupler,
suitable for surface mount assembly.
The TLP191B consists of a GaAℓAs light emitting diode, optically
coupled to a series connected photo diode array with shunt resistor
which is suitable for MOS FET gate drive.
•
Open voltage: 7.0V(min.)
•
Short current: 24.0 μA (min.)
•
Isolation voltage: 2500 Vrms (min.)
•
UL recognized: UL1577,file no.E67349
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
IF
50
mA
ΔIF / °C
−0.5
mA / °C
Pulse forward current
(100μs pulse, 100 pps)
IFP
1
A
Reverse voltage
VR
3
V
Forward current
Forward current
derating (Ta ≥ 25°C)
LED
Tj
125
°C
IFD
50
μA
Reverse voltage
VRD
10
V
Tj
125
°C
Storage temperature range
Tstg
−55~125
°C
Operating temperature range
Topr
−40~80
°C
Lead soldering temperature (10s)
Tsol
260
°C
Isolation voltage
(AC, 1 min., R.H. ≤ 60%)
BVS
2500
Vrms
Detector
Junction temperature
(Note)
11−4C1
Weight: 0.09 g
Pin Configuration(top view)
Forward current
Junction temperature
TOSHIBA
1
6
3
4
1 . Anode
3 . Cathode
4 . Cathode
6 . Anode
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note) Device considered a two terminal device: Pins 1 and 3 shorted together and pins 4 and 6 shorted together.
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2007-10-01
TLP191B
Recommended Operating Conditions
Characteristic
Symbol
Min.
Typ.
Max.
Unit
IF
―
20
25
mA
Topr
−25
―
85
°C
Forward current
Operating temperature
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Individual Electrical Characteristics (Ta = 25°C)
Characteristic
LED
Detector
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Forward voltage
VF
IF = 10 mA
1.2
1.4
1.7
V
Reverse current
IR
VR = 3 V
—
—
10
μA
Capacitance
CT
V = 0, f = 1 MHz
—
30
60
pF
Forward voltage
VFD
IFD = 10 μA
—
7
—
V
Reverse current
IRD
VRD = 10 V
—
7
—
μA
Capacitance
(anode to cathode)
CTD
V = 0, f = 1 MHz
—
—
—
pF
MIn.
Typ.
Max.
Unit
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Open voltage
VOC
IF = 20 mA
7
8
—
V
Short current
ISC
IF = 20 mA
24
40
—
μA
Min.
Typ.
Max.
Unit
—
0.8
—
pF
—
Ω
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Capacitance input to output
CS
Isolation resistance
RS
Test Condition
VS = 0, f = 1 MHz
VS = 500 V, R.H. ≤ 60%
5×10
AC, 1 minute
Isolation voltage
BVS
10
10
14
2500
—
—
AC, 1 second in oil
—
5000
—
DC, 1 minute in oil
—
5000
—
Vdc
Min.
Typ.
Max.
Unit
—
0.2
—
ms
—
3
—
ms
Vrms
Switching Characteristics (Ta = 25°C)
Characteristic
Symbol
Turn−on time
tON
Turn−off time
Test Condition
IF = 20mA, CL = 1000 pF
tOFF
(Fig.1)
Fig. 1 Switching time test circuit
IF
VOUT
IF
CL
VOUT
5V
1V
0V
tON
2
tOFF
2007-10-01
TLP191B
IF – Ta
ΔVF /ΔTa – IF
100
−4.0
Forward voltage temperature
coefficient ΔVF /ΔTa (mV / °C)
Allowable forward current
IF (mA)
−3.6
80
60
40
20
−3.2
−2.8
−2.4
−2.0
−1.6
−1.2
−0.8
0
−20
20
0
60
40
80
100
0.3
0.1
Ambient temperature Ta (°C)
1
0.5
Forward current
IF – V F
Pulse forward current IFP (mA)
(mA)
Forward current IF
30
10
5
3
1.6
2.0
300
100
50
30
10
-3
3
(V)
10
-2
3
Duty cycle ratio
10
-1
0
3
10
50
100
DR
ISC – IF
300
Ta = 25 °C
100
(μA)
7
55 °C
6
Short current ISC
(V)
VOC
500
3
8
Open voltage
1000
2.2
VOC – IF
9
85 °C
5
4
3
2
50
30
10
Ta = 25 °C
5
3
55 °C
1
0
1
IF (mA)
Ta = 25 °C
10
1.8
Forward voltage VF
10
30
Pulse width ≦ 100μs
3000
50
1.4
10
5000
Ta = 25 °C
1.2
5
IFP – DR
100
1
1.0
3
85 °C
1
3
5
10
Forward current
30
50
1
100
IF (mA)
3
3
5
10
30
Forward current
IF (mA)
2007-10-01
TLP191B
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2007-10-01