TMPN3150B1AFG TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TMPN3150B1AFG Neuron ® Chip For Distributed Intelligent Control Networks (LONWORKS®) The TMPN3150B1AFG is a Neuron Chip which configures LONWORKS nodes in combination with external memory. Neuron Chips have all the built-in communications and control functions required to implement LONWORKS nodes. These nodes may then be easily integrated into highly-reliable distributed intelligent control networks. The typical functions for this chip are explained below. FEATURES I / O Functions • Eleven programmable I / O pins. • Two programmable 16-bit timers and counters built in. • 34 different types of I / O functions to handle a wide range of input and output. • ROM firmware image containing pre-programmed I / O drivers, greatly simplifying application programs. ( Stored in external ROM ) QFP64-P-1414-0.80C Weight : 1.0g (Typ.) Network functions • Two CPUs for communication protocol processing built in. The communications and application CPUs execute in parallel. • Equipped with a built-in LonTalk protocol which supports all seven levels of the OSI reference model with ISO. • Highly reliable communication protocol is supplied as firmware. • Built-in twisted-pair wire transceiver • Equipped with communications modes and communication speeds which support various types of external transceivers. Supports twisted-pair wire, power line, radio ( RF ), infrared, coaxial cables and fiber optics. • Communication port transceiver modes and logical addresses stored within the EEPROM. Can be amended via the network. 000707EBA1 • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • The products described in this document are subject to the foreign exchange and foreign trade laws. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. • The information contained herein is subject to change without notice. 2003-05-26 1/10 TMPN3150B1AFG Other functions • Application programs are also stored within the EEPROM. Can be updated by downloading over the network. EEPROM can be externally added. • Built-in watch-dog timer. • Each chip has a unique ID number. Effective during the logical installation of networks. • Low electrical consumption mode supported with a sleep mode. • Built-in low-voltage detection circuit. Prevents incorrect operations and writing errors in the EEPROM during drops in power voltage. • The package is QFP64-P-1414-0.80C (Lead-Free Type (Pd PrePlated Frame)). . 2003-05-26 2/10 TMPN3150B1AFG BLOCK DIAGRAM ITEM TMPN3150B1AFG CPU 8-bit CPU×3 RAM 2,048 bytes ROM ― EEPROM 512 bytes 16-bit Timer / Counter 2 channels External Memory Interface Package Available 64-pin SOP 2003-05-26 3/10 TMPN3150B1AFG PIN ASSIGNMENT T MPN3150B1AFG 2003-05-26 4/10 TMPN3150B1AFG PIN FUNCTION PIN No. PIN NAME I/O 24 CLK1 Input 23 CLK2 Output 6 ~RESET I/O (built-in pull-up) 17 ~SERVICE I/O (built-in configurable pull-up) 2~5 IO0~IO3 I/O 10~13 IO4~IO7 I/O (built-in configurable pull-up) General I / O port. One of IO4 to IO7 can be specified as No.1 timer / counter input. Output signal can be output to IO0. IO4 can be used as the No.2 timer / counter input with IO1 as output. 14~16 IO8~IO10 I/O General I / O port. Can be used for serial communication with other device. 43, 42, 38~33 D0, D1, D2~D7 I/O Data bus for memory expansion 45 R / ~W Output Output port for controlling read / write for memory expansion 46 ~E Output Output port for controlling memory expansion 47, 50~64 A15, A14~A0 Output Address output port for memory expansion 7, 20, 22, 26, 40, 41, 44 VDD Input Power input ( 5.0V Typ. ) 8, 9, 19, 21, 25, 39 VSS Input Power input (0V GND ) 1, 18, 27, 48, 49 NC ― 28~32 CP0~CP4 I/O *: PIN FUNCTION Oscillator connection, or external clock input. Oscillator connection. Leave open when external clock is input to CLK1. Reset pin. ( Active low ) Service pin. Indicator output during operation. Large current sink capacity ( 20mA ). General I / O port. Do not connect anything. Leave pins open. Bidirectional port for communications. Supports several communications protocols by specifying mode. ● The ~SERVICE and IO4 ~ IO7 terminals are programmable pull-ups. ● All VDD terminals must be externally connected. ● All VSS terminals must be externally connected. 2003-05-26 5/10 TMPN3150B1AFG MAXIMUM RATINGS ( VSS = 0V, VSS typ.) CHARACTERISTICS SYMBOL RATING UNIT Power Supply Voltage VDD −0.3~7.0 V Input Voltage VIN −0.3~VDD+0.3 V Power Dissipation PD 800 mW Storage Temperature Tstg −65~150 °C OPERATING CONDITIONS ITEM SYMBOL MIN TYP. MAX UNIT VDD 4.5 5.0 5.5 V VIH(1) 2.0 ― VDD V V IL(1) VSS ― 0.8 V V IH(2) VDD−0.8 ― VDD V V IL(2) VSS ― 0.8 V Operating Frequency fosc 0.625 ― 10 MHz Operating Temperature Topr −40 ― 85 °C Operating Voltage Input Voltage ( TTL ) Input Voltage ( CMOS ) ELECTRICAL CHARACTERISTICS DC characteristic ( VDD = 5.0 V ± 10%, VSS = 0 V, Ta = −40~85°C ) ( Above operating conditions apply unless otherwise states. ) CHARACTERISTICS SYMBOL PINS MIN MAX UNIT LOW Output Voltage (1) VOL (1) IO0~IO3 IOL=20mA 0 0.8 V IOL=10mA 0 0.4 V LOW Output Voltage (2) VOL (2) ~SERVICE Duty cycle=50% IOL=20mA 0 0.8 V IOL=10mA 0 0.4 V LOW Output Voltage (3) VOL (3) CP2, CP3 IOL=40mA 0 1.0 V LOW Output Voltage (4) VOL (4) Others (Note 1) IOL=1.4mA 0 0.4 V HIGH Output Voltage (1) VOH (1) IO0~IO3 IOH=−1.4mA VDD −0.4 VDD V HIGH Output Voltage (2) VOH (2) ~SERVICE IOH=−1.4mA VDD −0.4 VDD V HIGH Output Voltage (3) VOH (3) CP2, CP3 IOH=−40mA VDD −1.0 VDD V HIGH Output Voltage (4) VOH (4) Others (Note 1) IOH=−1.4mA VDD −0.4 VDD V Input Current IIN (Note 2) VIN=VSS~VDD −10 +10 µA Pull-up Current IPU VIN=0V −30 −300 µA 3.8 4.5 V Low-voltage Level Detection VLVD IO4~IO7 ~SERVICE, ~RESET VDD TEST (Note 3) CONDITION ― Note1 : Output voltage characteristics exclude the ~RESET pin and CLK2 pin. Note2 : Excludes pull-up input pins. Note3 : The IO4 to IO7 and ~SERVICE pins have programmable pull-ups. ~RESET has a fixed pull-up. 2003-05-26 6/10 TMPN3150B1AFG ITEM SYMBOL TYP. MAX 18 30 10 15 5 8 1.25 MHz Clock 2.5 5 0.625 MHz Clock 1.5 3 18 100 10 MHz Clock Operating Mode Current Consumption Sleep Mode Current Consumption Note: 5 MHz Clock 2.5 MHz Clock IDD (OP) IDD (SLP) UNIT mA µA Test conditions for current dissipation VDD=5V, all output=with no load, all input=0.2V or below or VDD−0.2V, programmable pull-up=off, crystal oscillator clock input, differential receiver disabled. The current value ( typ. ) is a typical value when Ta=25°C. The current value ( max ) applies to the rated temperature range at VDD=5.5V. 200µA ( typ. ) to 600µA ( max ) is added to the current of the differential receiver when the receiver is enabled. The differential receiver is enabled by either of the following conditions : ● When the Neuron chip is in Run mode and the communication ports are in Differential mode. ● When the Neuron chip is in Sleep mode, the communication ports are in Differential mode, and the Comm Port Wakeup is not masked. 2003-05-26 7/10 TMPN3150B1AFG Echelon, Neuron, LON, LonTalk, LonBuilder, NodeBuilder, LONWORKS, 3150, 3120 and LonManager are the registered trade marks of America’s Echelon Inc. The Neuron Chip is manufactured by Toshiba under license from Echelon Corporation, USA. A licensing agreement between the customer and Echelon Corporation must be concluded before purchasing any of the neuron chip products. The Neuron chip itself does not include the I2C object function. You need the “I2C Library” deliveried by Echelon. The Neuron chip and the I2C Library do not convey nor imply a right under any I2C patent rights of Philips Electronics N.V. ( “Philips” ) to make, use or sell any product employing such patent rights. Please refer all questions with respect to I2C patents and licenses to Philips at: Mr. Gert-Jan Hessenlmann Corporate Intellectual Property Philips International B.V. Prof. Holstlaan 6 Building WAH 1-100 P.O. Box 220 5600 AE, Eindhoven, The Netherlands Phone : +31 40 274 32 61 Fax : +31 40 274 34 89 E-mail : [email protected]. 2003-05-26 8/10 TMPN3150B1AFG PACKAGE DIMENSONS QFP64-P-1414-0.80C UNIT: mm 2003-05-26 9/10 TMPN3150B1AFG UNIT: mm Lead-Free Type (Pd PrePlated Frame) 2003-05-26 10/10