CLS03 TOSHIBA Schottky Barrier Diode CLS03 Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage) DC/DC Converter Applications Unit: mm ② • Forward voltage: VFM = 0.58 V (max) • Average forward current: IF (AV) = 10 A • Repetitive peak reverse voltage: VRRM = 60 V • Suitable for compact assembly due to small surface-mount package: “L−FLATTM” (Toshiba package name) ① Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 60 V Average forward current IF (AV) Non-repetitive peak surge current Junction temperature Storage temperature range 10 (Note 1) 3 .2±0.2 Absolute Maximum Ratings (Ta = 25°C) A IFSM 100 (50 Hz) A Tj −40~125 °C Tstg −40~150 °C Note 1: Tℓ = 70°C Rectangular waveform (α = 180°), VR = 30 V ①ANODE ① アノード ② カソード ②CATHODE JEDEC ⎯ JEITA ⎯ TOSHIBA 3-4F1A Note 2: Using continuously under heavy loads (e.g. the application of Weight: 0.15 g (typ.) high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristics Peak forward voltage Peak repetitive reverse current Junction capacitance Symbol Test Condition Min Typ. Max Unit VFM (1) IFM = 3.0 A (pulse test) ⎯ 0.36 ⎯ VFM (2) IFM = 5.0 A (pulse test) ⎯ 0.41 ⎯ VFM (3) IFM = 10 A (pulse test) ⎯ 0.53 0.58 IRRM (1) VRRM = 5 V (pulse test) ⎯ 7.0 ⎯ μA IRRM (2) VRRM = 60 V (pulse test) ⎯ 0.1 1.0 mA VR = 10 V, f = 1.0 MHz ⎯ 345 ⎯ pF Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm ⎯ ⎯ 100 °C/W ⎯ ⎯ 5 °C/W Cj Thermal resistance (junction to ambient) Rth (j-a) Thermal resistance (junction to lead) Rth (j-ℓ) ⎯ 1 V 2006-11-13 CLS03 Marking Abbreviation Code Part No. S03 CLS03 Standard Soldering Pad Unit: mm 2.9 2.5 5.9 1.8 2.6 4.8 Handling Precautions 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility that SBD will cause thermal runaway when used under high-temperature or high-voltage conditions. Be sure to take forward and reverse loss into consideration during design. 2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for when designing a circuit incorporating this device. VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device for operation at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF (AV) and that Tj be below 100°C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. IFSM: This rating specifies the non-repetitive peak current. This applies only to abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using the device in order to ensure high reliability. We recommend that the device be used at a Tj of below 100°C. 3) Thermal resistance between junction and ambient fluctuates depending on the mounting condition condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. 4) Refer to the databook on Rectifiers for further information. 2 2006-11-13 CLS03 PF (AV) – IF (AV) 10.0 Tj = 125°C 10 75°C 1 25°C 0.1 Pulse test 0.01 0.0 360° Average forward power dissipation PF (AV) (W) Instantaneous forward current iF (A) iF – vF 100 8.0 180° 120° 6.0 α = 60° 4.0 Rectangular waveform 2.0 0° α 360° Conduction angle α 0.0 0.2 0.4 0.8 0.6 Instantaneous forward voltage 1.0 vF 0 4 (V) 100 40 360° 0° α 360° IF (AV) Conduction angle α VR = 30 V 20 0 180° Rectangular waveform 60 0 4 8 12 Average forward current (A) IF (AV) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm 120 100 Ta max (°C) Maximum allowable temperature 120 80 Rectangular waveform 60 360° 40 0° α 360° IF (AV) Conduction angle α VR = 30 V 20 0 16 0 4 (A) 8 12 Average forward current IF (AV) 16 (A) rth (j-a) – t 1000 Transient thermal impedance rth (j-a) (°C/W) Maximum allowable lead temperature Tℓ max (°C) 140 120° IF (AV) 16 Ta max – IF (AV) Tℓ max – IF (AV) α = 60° 12 Average forward current 140 80 8 500 300 100 50 30 10 5 3 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm 1 0.5 0.3 0.1 0.001 0.003 0.01 0.03 0.1 0.3 Time 1 3 t 3 10 30 100 300 1000 (s) 2006-11-13 CLS03 Surge forward current (non-repetitive) (typ.) (A) Ta = 25°C 5000 f = 1 MHz Junction capacitance 1000 500 100 50 10 1 3 10 5 30 Reverse voltage VR 50 100 120 Ta = 25°C IFSM Cj (pF) 10000 100 Peak surge forward current Cj – V R 80 f = 50 Hz 60 40 20 0 1 3 (V) IR – Tj PR (AV) – VR (typ.) 100 (typ.) Rectangular waveform 360° 0° 100 10 60 V 1 40 V 30 V 20 V 0.1 10 V 0.01 VR = 5 V 0 20 40 60 80 100 Junction temperature 120 Tj 140 6.0 5.0 PR (AV) (W) Average reverse power dissipation (mA) IR 50 7.0 Pulse test Reverse current 30 10 Number of cycles 1000 0.001 5 4.0 360° α 300° Conduction angle α Tj = 125°C 3.0 240° 180° 2.0 120° 1.0 0.0 160 VR α = 60° 0 10 20 30 Reverse voltage (°C) 4 40 VR 50 60 (V) 2006-11-13 CLS03 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2006-11-13