CMS17 TOSHIBA Schottky Barrier Diode CMS17 Switching Mode Power Supply Applications Portable Equipment Battery Applications • • • • Unit: mm Forward voltage: VFM = 0.48 V (max) Average forward current: IF (AV) = 2.0 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to a small surface-mount package: “M−FLATTM” (Toshiba package name)” Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Repetitive peak reverse voltage VRRM 30 V Average forward current IF (AV) Nonrepetitive peak surge current Junction temperature Storage temperature range 2.0 (Note 1) A IFSM 30 (50 Hz) A Tj −40~150 °C Tstg −40~150 °C Note 1: Ta = 77°C Device mounted on a ceramic board Board size: 50 mm × 50 mm Soldering size: 2 mm × 2 mm Board thickness: 0.64 t Rectangular waveform (α = 180°), VR = 15 V JEDEC ⎯ JEITA ⎯ TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristic Peak forward voltage Peak repetitive reverse current Junction capacitance Thermal resistance (junction to ambient) Thermal resistance (junction to lead) Symbol Test Condition Min Typ. Max VFM (1) IFM = 1.0 A (pulse test) ⎯ 0.42 ⎯ VFM (2) IFM = 2.0 A (pulse test) ⎯ 0.45 0.48 IRRM (1) VRRM = 5 V (pulse test) ⎯ 0.8 ⎯ IRRM (2) VRRM = 30 V (pulse test) ⎯ 10 100 VR = 10 V, f = 1.0 MHz ⎯ 90 ⎯ Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 t) ⎯ ⎯ 60 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 t) ⎯ ⎯ 135 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ ⎯ 210 ⎯ ⎯ ⎯ 16 Cj Rth (j-a) Rth (j-ℓ) 1 Unit V μA pF °C/W °C/W 2006-11-13 CMS17 Marking Abbreviation Code Part No. SG CMS17 Standard Soldering Pad 2.1 Unit: mm 1.4 3.0 1.4 Handling Precaution 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. SBDs can cause thermal runaway when used under high temperature or high voltage conditions. Be sure to take forward and reverse loss into consideration during design. 2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for designing a circuit incorporating this device. VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device for operation at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF (AV) and that Tj be below 120°C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. IFSM: This rating specifies the nonrepetitive peak current. This is applied only for abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using the device to ensure high reliability. We recommend that the device be used at a Tj of below 120°C. 3) Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. 4) Refer to the Rectifiers databook for further information. 2 2006-11-13 CMS17 iF – vF PF (AV) – IF (AV) 1.2 Pulse test DC Average forward power dissipation PF (AV) (W) Instantaneous forward current iF (A) 10 3 Tj = 150°C 125°C 1 25°C 75°C 0.3 0.1 0.03 1.0 180° 120° 0.8 α = 60° 0.6 Rectangular waveform 0.4 0° α 360° 0.2 Conduction angle α 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 Instantaneous forward voltage 0.7 vF 0 0.0 0.8 0.4 (V) 0.8 Maximum allowable lead temperature Tℓ max (°C) α = 60° 80 Rectangular waveform 120° 180° DC 60 40 0° α 360° IF (AV) 20 Conduction angle α VR = 15 V 0 0.0 0.4 0.8 1.2 1.6 Average forward current 2.0 2.4 IF (AV) 2.8 3.2 (A) Tℓ max – IF (AV) 100 2.4 IF (AV) 2.8 140 120 100 80 α = 60° Rectangular waveform 180° 120° DC 60 40 0° α 360° IF (AV) 20 Conduction angle α VR = 15 V 0 0.0 0.4 0.8 3.2 (A) 1.2 1.6 2.0 Average forward current 2.4 IF (AV) 2.8 3.2 (A) rth (j-a) – t 1000 Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm Soldering land: 2.1 mm × 1.4 mm board thickness: 1.6 t 500 Transient thermal impedance rth (j-a) (°C/W) Maximum allowable temperature Ta max (°C) 120 2.0 160 Device mounted on a ceramic board: board size: 50 mm × 50 mm soldering land: 2 mm × 2 mm board thickness: 0.64 t 140 1.6 Average forward current Ta max – IF (AV) 160 1.2 300 100 50 Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 t 30 10 5 Device mounted on a ceramic board: board size: 50 mm × 50 mm Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 t 3 1 0.001 0.003 0.01 0.03 0.1 0.3 1 3 10 30 100 300 1000 Time t (s) 3 2006-11-13 CMS17 Surge forward current C j – VR Ta = 25°C Cj (pF) Ta = 25°C f = 50 Hz 30 20 10 0 1 3 5 10 30 50 f = 1 MHz 500 300 100 50 30 10 1 100 3 5 IR – Tj (typ.) 0.8 Average reverse power dissipation PR (AV) (W) 10 (mA) VR = 30 V 1 20 V 10 V 5V 3V 0.001 0.0001 0 20 40 60 80 100 Junction temperature Tj 120 140 VR 0.7 (°C) 0.5 0.4 VR (V) (typ.) DC α 300° Conduction angle α Tj = 150°C 240° 180° 0.3 120° 60° 0.2 0.1 4 8 12 16 Reverse voltage 4 100 0.6 0 0 160 50 Rectangular waveform 0° 360° Pulse test 0.01 30 PR (AV) – VR 100 0.1 10 Reverse voltage Number of cycles Reverse current IR (typ.) 1000 Junction capacitance Peak surge forward current IFSM (A) (nonrepetitive) 40 20 VR 24 28 (V) 2006-11-13 CMS17 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2006-11-13