TB62702P/F TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62702P,TB62702F 10BIT SERIAL−IN PARALLEL−OUT SHIFT REGISTER / LATCH / 10SEGMENT LED DRIVERS The TB62702P, TB62702F are specifically designed for 10−Segment LED Drivers and LED display. And these are monolithic integrated circuits designed to be used together with Bi−CMOS (DMOS) integrated circuit. The devices consist of a 10bit shift Register and 10bit Latches, and 10bit DMOS structures. TB62702P FEATURES 10bit serial−in parallel−out shift register / latch / 10segment LED driver (Bi−CMOS process) TB62702F CMOS compatible inputs Open−drain DMOS outputs Low steady−state power consumption Serial data output for cascade operation Packge ; P−type DIP−20−P−300A F−type SOP−20−P−300 Weight DIP20-P-300-2.54A: 2.25 g (typ.) SOP20-P-300-1.27: 0.48 g (typ.) PIN CONNECTION (TOP VIEW) 1 2006-06-14 TB62702P/F BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS (Ta = 25°C, VSS = 0 V) CHARACTERISTIC Supply Voltage Input Voltage SYMBOL RATING UNIT VDD −0.3~7.0 V VIN −0.3~VDD +0.3 V Output Drain−Source Voltage VOUT −0.4~30 V Output Current IOUT 30 mA / bit Power Dissipation P F PD (Note 1) 1.47 0.96 (Note 2) W Operating Temperature Topr −40~85 °C Storage Temperature Tstg −55~150 °C Note 1: Delated above 25°C in the proportion of 11.7 mW / °C(P−type), 7.7 mW / °C(F−type). Note 2: On Glass Epoxy (50 × 50 × 1.6mm Cu 40%) 2 2006-06-14 TB62702P/F RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C, VSS = 0 V) CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT VDD ― 4.5 5 5.5 V "H" Level VIH ― 0.7 VDD ― VDD "L" Level VIL ― 0 ― 0.3 VDD Output Drain−Source Voltage VOUT ― ― ― 30 V Output Current IOUT ― ― 24 mA / ch ― ― 760 ― ― 470 Supply Voltage Input Voltage P Power Dissipation F Duty = 100%, All output on ― PD (Note 1) V mW Note 1: On Glass Epoxy (50 × 50 × 1.6 mm Cu 40%) ELECTRICAL CHARACTERISTICS (Ta = −40~85°C, VDD = 4.5~5.5 V, VSS = 0 V) SYMBOL TEST CIR− CUIT "L" Level VDS1 ― "L" Level VDS1 "L" Level "L" Level CHARACTERISTIC MIN TYP. MAX IOUT = 15 mA, Ta = 25°C ― ― 0.18 ― IOUT = 15 mA ― ― 0.27 VDS2 ― IOUT = 26 mA, Ta = 25°C ― ― 0.31 VDS2 ― IOUT = 26 mA ― ― 0.47 RON ― Ta = 25°C, IOUT = 26 mA ― ― 12 IOZ1 ― VOUT = 30 V, EN = "L" 1 bit ― ― 10 IOZ2 ― VOUT = 30 V, EN = "L" 10 bit ― ― ±1 IIN ― VIN = VDD or VSS ― ― ±1 IIL ― ENABLE, VIN = VSS −27.5 −55.0 −110.0 "H" Level IOH ― S−OUT VDS = 4.6 V, VDD = 5.0 V −400 −600 ― "L" Level IOL ― S−OUT VDS = 0.4 V, VDD = 5.0 V 400 600 ― "H" Level VIH ― ― 0.7 VDD ― VDD "L" Level VIL ― ― 0 ― 0.3 VDD Operating Supply Current IDD1 ― ― ― 1500 Standby Supply Current IDD2 ― ― ― 500 Output Voltage Output Resistor Output Leakage Current Input Current Output Current TEST CONDITION Input Voltage fCLK = 5 MHz NO loads, 1 bit ― 3 UNIT V Ω µA µA µA V µA 2006-06-14 TB62702P/F SWITCHING CHARACTERISTICS (Ta = 25°C, VDD = 5 V, VOUT = 30 V, RL = 1150 Ω, CL = 15 pF, "H" = VIH, "L" = VIL) CHARACTERISTIC SYMBOL CLK− OUTn Propagation Delay Time (Low−to−High) CLK− OUTn LAT − OUTn tpLH EN− OUTn CLK− OUTn Propagation Delay Time (High−to−Low) LAT − OUTn tpHL EN− OUTn Set Up Time CLK− LAT tsetup (L) TEST CONDITION MIN TYP. MAX LAT = "H", CLR = "H", EN = "H" ― ― 250 LAT = "H", EN = "H" ― ― 250 CLR = "H", EN = "H" ― ― 200 LAT = "H", CLR = ”H” ― ― 150 LAT = "H", CLR = "H", EN = "H" ― ― 250 CLR = "H", EN = "H" ― ― 200 LAT = "H", CLR = "H" ― ― 150 ― ― 50 ― CLK−S−IN tsetup (D) ― ― ― 35 CLK− LAT thold (L) ― ― ― 105 CLK−S−IN thold (D) ― ― ― 50 Clock Pulse Width tw CLK ― ― ― 100 Latch Pulse Width tw LAT ― ― ― 50 Clear Pulse Width tw CLR ― ― ― 50 Hold Time Enable Pulse Width Output Rise Time Output Fall Time Maximum Clock Frequency tw EN ― ― 400 tor OUTn ― ― ― 1000 tr S−OUT, VSS = 0V ― ― 50 tof OUTn ― ― 150 S−OUT, VSS = 0V ― ― 50 fMAX1 Duty = 50% Cascade connected 5 8 ― fMAX2 Duty = 50% 6 12 ― tf UNIT ns ns ns ns ns MHz RECOMMENDED TIMING CONDITIONS (Ta = −40~85°C, VDD = 4.5~5.5 V, VSS = 0) CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT Clock Pulse Width tw CLK ― 100 ― ― ns Enable Pulse Width tw EN ― 400 ― ― µs Latch Pulse Width tw LAT ― 100 ― ― ns Clear Pulse Width tw CLR ― 100 ― ― ns Data Set Up Time tsetup ― 100 ― ― ns Data Hold Time thold ― 150 ― ― ns 4 2006-06-14 TB62702P/F TIMING DIAGRAM 1. Input timing diagram 2. Propagation delay time 5 2006-06-14 TB62702P/F PRECUATIONS for USING Utmost care is necessary in the design of the output line, VCC (VDD) and GND (L−GND, P−GND) line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 6 2006-06-14 TB62702P/F Package Dimensions Weight: 2.25 g (typ.) 7 2006-06-14 TB62702P/F Package Dimensions Weight: 0.48 g (typ.) 8 2006-06-14 TB62702P/F Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 9 2006-06-14 TB62702P/F Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 10 2006-06-14 TB62702P/F RESTRICTIONS ON PRODUCT USE 060116EBA • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C • The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E 11 2006-06-14