TA58LT00F TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA58LT00F 150 mA Output Current and Tracking Regulator with ON/OFF Control Switch The TA58LT00F consists of small-surface mount type tracking regulators with an output current of 150 mA (maximum) and an ON/OFF control switch. Control by an EN (ON/OFF) terminal enables the regulator to be operated only when required (output ON). The output voltage can be controlled to an arbitrary voltage between 2.5V and 13.4V by applying a necessary voltage to ADJ through a microcontroller, etc. It is also possible to enable or disable the regulator via the enable (ON/OFF) terminal. Enabling the regulator only when necessary contributes to the energy saving of equipment. HSIP5-P-1.27B Features • Built-in ON/OFF control function (active high) • Maximum output current • Output voltage : 2.5 V ∼ 13.4 V • Tracking voltage accuracy : ± 10mV (@Tj = 25°C) Weight : 0.36 g (Typ.) : 150mA • Low standby current (output OFF mode) : 1μA (Typ.) • Protection function : Over-current protection / thermal shutdown / Reverse connection of power supply / 60 V load dump • Package type : Surface-mount New PW-Mold5pin Pin Assignment Mark 1 IN Marking 2 3 4 5 EN GND ADJ OUT 3 58LT00F Part No. (or abbreviation code) Lot No. 1 2 3 4 5 A line indicates lead (Pb) - free package or lead (Pb) - free finish. 1 2006-11-06 TA58LT00F Pin Description Pin No. Symbol Description 1 IN Input terminal. Connected by capacitor (CIN) to GND. 2 EN Output ON/OFF control terminal. Output is ON when this pin is set to “High”, OFF when this pin is open or set to “Low”. 3 GND Ground terminal 4 ADJ Adjustment terminal 5 OUT Output terminal. Connected by capacitor (COUT) to GND. How to Order Product No. Package TA58LT00F(T6L1,Q) Package Type and Capacity New PW-Mold5pin : Surface-mount Tape (2000 pcs/reel) Block Diagram Over-voltage protection IN OUT Over-current protection EN Start circuit Thermal shutdown ADJ Reference voltage circuit GND 2 2006-11-06 TA58LT00F Absolute Maximum Rating (Ta = 25°C) Symbol Rating Unit Input voltage VIN -38∼38 V EN Input voltage VEN -0.3∼38 V ADJ Input voltage VADJ -0.3∼38 V Output current I OUT 150 mA Junction temperature Tj 150 °C Storage temperature Tstg −55~150 °C Characteristic Power dissipation Ta = 25°C Tc= 25°C 1 PD W 10 Note 1: Do not apply current and voltage (including reverse polarity) to any pin that is not specified. Note 2: If it is connected EN terminal to IN terminal, be careful so that the negative voltage is not impressed on EN terminal. Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristic Symbol Max Unit Thermal resistance, junction to ambient R th (j−a) 125 ℃/ W Thermal resistance, junction to case R th (j−c) 12.5 ℃/ W Recommended operating conditions Characteristic Input voltage Symbol Min Typ. Max Unit VIN 6 ⎯ 26 V ADJ Input voltage VADJ 2.5 ⎯ 13.4 V Operating junction temperature Tj(opr) -40 ⎯ 135 °C Protection Function (Reference) Characteristic Symbol TSD Thermal shutdown Thermal shutdown hysteresis width TSD(hys) Test Condition VIN = 14 V Min Typ. Max Unit 150 175 ⎯ °C ⎯ 15 ⎯ °C Peak circuit current I PEAK VIN = 14 V, Tj = 25°C ⎯ 210 ⎯ mA Short circuit current I SC VIN = 14 V, Tj = 25°C ⎯ 210 ⎯ mA Overvoltage protection VOV ⎯ 38 ⎯ ⎯ V Note 4: Ensure th at the devices operate within the limits of the maximum rating when in actual use. Note 5: When the input vo ltage exceeds 38 V, the overvoltage protection circuit is activated to turn off the output voltage. 3 2006-11-06 TA58LT00F Electrical Characteristics (Unless otherwise specified, 2.5 V ≦VADJ≦ 13.4 V, VEN = H, CIN = 0.33 μF, COUT = 10 μF, ESR = 1Ω, Tj = -40∼125°C) Characteristic Tracking accuracy Line regulation Load regulation Quiescent current Quiescent current (OFF mode) Dropout voltage Symbol Min Typ. Max VIN = 14 V, I OUT = 50 mA -10 ⎯ +10 6V< = 100m A, = VIN < = 26 V, 5 mA < = I OUT < -40°C < = Tj < = 125°C -20 ⎯ +20 Reg･line 6V< = VIN < = 26 V, I OUT = 50 mA ⎯ ⎯ 25 mV Reg･load VIN = 14 V, 5 mA < = 100 mA = I OUT < ⎯ ⎯ 35 mV 6V< = VIN < = 26 V, I OUT = 0 A ⎯ ⎯ 0.8 6V< = VIN < = 26 V, I OUT = 100 mA ⎯ ⎯ 15 6V< = VIN < = 26 V, VEN = 0 V ⎯ ⎯ 20 I OUT = 50 mA ⎯ ⎯ 0.3 I OUT = 100 mA ⎯ ⎯ 0.6 I OUT = 50 mA 3 ⎯ ⎯ V ⎯ ⎯ 0.5 V ⎯ ⎯ 120 μA ΔVOUT IB I B(OFF) VD Output control voltage (ON) VEN(ON) Output control voltage (OFF) VEN(OFF) Output control current (ON) I EN(ON) Test Condition ⎯ VIN = 14 V, VEN = 5 V, I OUT = 1mA 4 Unit mV mA μA V 2006-11-06 TA58LT00F Electrical Characteristics Common to All Products • Tj = 25°C in the measurement conditions of each item is a regulation for where the standard condition when a pulse test is carried out, and any drift in the electrical characteristic due to a rise in the junction temperature of the chip may be disregarded. Standard Application Circuit Reg.IC. CIN 0.33 μF IN OUT TA58LT00F ADJ EN GND COUT 10∼22 μF ESR 0.5∼2Ω Load CPU etc. • Place CIN as close as possible to the input terminal and GND. Place COUT as close as possible to the output terminal and GND. Although capacitor COUT acts to smooth the dc output voltage during suspension of output oscillation or load change, it might cause output oscillation in a cold environment due to increased capacitor ESR. It is therefore recommended to use a capacitor with small temperature sensitivity. Please connect the resistance of 0.5∼ 2Ω with the series when the ceramic capacitor is used. The IC may oscillate due to external conditions (output current, temperature, or the type of the capacitor used). The type of capacitor required must be determined by the actual application circuit in which the IC is used. The notice in case of application • Note that, depending on the load conditions, a steep increase in the input voltage (VIN) may cause a momentary rise in output voltage (VOUT) even if the EN (enable) pin is Low. 5 2006-11-06 TA58LT00F PDmax. – Ta VOUT – Tj 12 5.5 a ceramic substrate 8 Ta = Tc 6 50×50×0.8mmt 30×30×0.8mmt 4 Single 2 0 20 40 60 80 (V) Reflow soldering on 5.3 VOUT 10 0 VIN = 14 V I OUT = 50 mA VEN = 5 V VADJ = 5 V Number of IC = 1 5.1 Output Voltage Allowable Power Dissipation PDmax. (W) Condition: 100 Ambient Temperature 120 Ta 140 4.9 4.7 4.5 -50 160 0 50 Junction Temperature (°C ) VOUT – Tj (V) 5 VOUT VIN = 14 V I OUT = 50 mA VEN = 5 V VADJ = 2.5 V 2.4 2.2 2.0 -50 0 50 100 Junction Temperature 4 Tj 1 20 Input Voltage 30 VIN 40 (V) 2.5 V , 50 mA 5 VOUT 2.5 V , 100 mA 10 1 4 Output Voltage (V) VOUT Output Voltage 3 0 2.5 V , 50 mA 0 2 4 6 3 (V) (V) VADJ = 5 V 2 1 Tj = 25 °C VIN = 14 V VEN = 5 V 0 50 100 150 Output Current 6 VIN 10 2.5 V 0 50 8 VOUT – I OUT 6 5 V , 50 mA 2 2.5 V , 100 mA 2 Input Voltage VADJ = 5 V , I OUT = 100 mA 4 VADJ = 5 V , I OUT = 100 mA 5 V , 50 mA (°C) Tj = 25 °C VIN = 14 V VEN = 5 V 5 Tj = 25 °C VIN = 14 V VEN = 5 V 3 0 150 VOUT – VIN 6 0 (°C) 6 Output Voltage (V) VOUT Output Voltage 2.6 Tj 150 VOUT – VIN 3.0 2.8 100 200 I OUT 250 300 (mA ) 2006-11-06 TA58LT00F I B – VIN I B – VIN 20 I B (mA) Tj = 25 °C VEN = 5 V VADJ = 5 V 15 Quiescent Current Quiescent Current I B (mA) 20 10 5 I OUT = 100 mA Tj = 25 °C VEN = 5 V VADJ = 2.5 V 15 10 5 I OUT = 100 mA 50 mA 0 0 2 4 50 mA 6 Input Voltage VIN 0 8 0 2 (V) 4 Input Voltage I B – Tj I B (mA) I OUT = 100 mA 2 50 mA 1 1 mA 0 -50 0 50 100 Junction Temperature Tj I OUT = 100 mA 2 1 50 mA 1 mA 0 -50 150 0 50 100 Junction Temperature I B – I OUT Tj 150 (°C) VD – I OUT 0.6 VD 4 VEN = 5 V VADJ = 5 V (V) VIN = 14 V VEN = 5 V VADJ = 2.5 V 125°C 0.4 85°C 3 Dropout Voltage I B (mA) (V) VIN = 14 V VEN = 5 V VADJ = 2.5 V (°C) 5 Quiescent Current VIN 8 I B – Tj 3 VIN = 14 V VEN = 5 V VADJ = 5 V Quiescent Current Quiescent Current I B (mA) 3 6 I OUT = 100 mA 2 50 mA 1 25°C -40°C 0.2 1 mA 0 -50 0 50 Output Current 100 I OUT 0 150 (mA ) 0 50 Output Current 7 150 100 I OUT (mA) 2006-11-06 TA58LT00F VD – I OUT 0.6 VD – Tj 0.6 VEN = 5 V VADJ = 2.5 V (V) VD 125°C 0.4 85°C Dropout Voltage Dropout Voltage VD (V) VEN = 5 V 25°C -40°C 0.2 0 0 50 Output Current I OUT VADJ = 2.5 V / 5 V , I OUT = 100 mA 0.2 2.5 V / 5 V , 50 mA 0 -50 150 100 0.4 (mA) 0 I PEAK – Tj (°C) I PEAK – VD I PEAK (A) VADJ = 2.5 V / 5 V 200 150 VADJ = 2.5 V / 5 V 200 150 100 50 VIN = 14 V VEN = 5 V 0 -50 0 50 100 Junction Temperature Tj 100 50 0 150 Tj = 25 °C VIN = 14 V VEN = 5 V 0 (°C) 10 20 Dropout Voltage VEN – VIN 30 VD 40 (V) VEN – Tj 2.5 4 VIN = 14 V I OUT = 50 mA (V) (V) Tj = 25 °C I OUT = 50 mA VEN 3 VEN 2.3 EN Input voltage VEN(ON) , VADJ = 2.5 V / 5 V 2.0 VEN(OFF) , VADJ = 2.5 V / 5 V 1.8 1.5 Tj 150 250 Peak output current I PEAK (mA) Peak output current 100 Junction Temperature 250 EN Input voltage 50 0 10 Input Voltage 20 VIN VEN(OFF) , VADJ = 2.5 V / 5 V 1 0 -50 30 (V) VEN(ON) , VADJ = 2.5 V / 5 V 2 0 50 Junction Temperature 8 100 Tj 150 (°C) 2006-11-06 TA58LT00F Package Dimensions HSIP5-P-1.27B Unit : mm 1.5±0.2 0.7±0.1 0.8max 0.5±0.1 0.5±0.1 0.6max 2.3±0.2 0.7max 1.1±0.2 0.1±0.1 0.6±0.1 0.6max 9.5±0.3 5.5±0.2 1.5±0.2 6.5±0.2 5.2±0.2 1.27 Weight: 0.36 g (Typ.) 9 2006-11-06 TA58LT00F RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 10 2006-11-06