TOSHIBA TLYM1050

TL(RM,RMM,SM,OM,YM)1050(T20)
TOSHIBA LED Lamp
TLRM1050(T20),TLRMM1050(T20),TLSM1050(T20),
TLOM1050(T20),TLYM1050(T20)
Unit: mm
Panel Circuit Indicator
•
5.2 (L) × 5.2 (W) × 4.0 (H) mm
•
φ3.6 mm transparent lens top type
•
InGaAℓP LEDs
•
High luminous intensity and low power consumption.
•
Color : red, orange, yellow
•
High operating temperature
Topr : −40 to 100°C / Tstg: −40 to 110°C
•
Surface-mount devices
•
Standard embossed tape packing
8-mm component pitch: T20 (400 pcs/reel)
•
Reflow-soldering is available
•
Applications: amusement, message signboards, automotive interiors and
exteriors, etc.
Color and Material
Part Number
Color
Material
TLRM1050
Red
JEDEC
―
TLRMM1050
Red
JEITA
―
TLSM1050
Red
TLOM1050
Orange
TLYM1050
Yellow
TOSHIBA
InGaAℓP
4-5AU1
Weight : 0.085 g (typ.)
Marktech
Optoelectronics
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: [email protected]
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
Absolute Maximum Ratings (Ta = 25°C)
Product
Name
Forward Current
IF(mA)
Reverse Voltage
VR(V)
Power Dissipation
PD (mW)
Operating
Temperature
Topr (℃)
Storage
Temperature
Tstg (℃)
50
4
135
−40 to 100
−40 to 110
TLRM1050
TLRMM1050
TLSM1050
TLOM1050
TLYM1050
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated
failure rate, etc).
Note 1: Forward current derating
IF – Ta
(mA)
80
Allowable forward current
IF
60
40
20
0
0
20
40
60
80
Ambient temperature Ta
100
120
(°C)
Electrical Characteristics (Ta = 25°C)
Product Name
Forward Voltage
Min
Typ.
Max
TLRM1050
2.0
2.3
2.7
TLRMM1050
2.0
2.3
2.7
TLSM1050
2.0
2.3
2.7
TLOM1050
2.0
2.3
2.7
TLYM1050
2.0
2.3
2.7
Unit
V
Reverse Current
VF
IF
Max
VR
20
10
4
mA
μA
V
2
IR
2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
Optical Characteristics-1 (Ta = 25°C)
Product Name
Luminous Intensity IV
Corresponding brightness
rank sign (Note 2)
Min
Typ.
Max
TLRM1050
630
1800
3200
VA/WA/XA
TLRMM1050
1000
2000
5000
WA/XA/YA
TLSM1050
1600
2800
8000
TLOM1050
1600
3500
8000
XA/YA/ZA
TLYM1050
1600
3000
8000
XA/YA/ZA
Unit
IF
20
mcd
XA/YA/ZA
mA
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Brightness rank
Rank sign
Min
Max
VA
630
1250
WA
1000
2000
XA
1600
3200
YA
2500
5000
ZA
4000
8000
Unit
mcd
mcd
Optical Characteristics-2 (Ta = 25°C)
Emission Spectrum
Product Name
Peak Emission Wavelength λp
Δλ
Dominant Wavelength λd
Min
Typ.
Max
Typ
Min
Typ.
Max
TLRM1050
⎯
644
⎯
14
624
630
638
TLRMM1050
⎯
636
⎯
14
620
626
634
TLSM1050
⎯
623
⎯
14
607
613
621
TLOM1050
⎯
612
⎯
14
599
605
613
TLYM1050
⎯
592
⎯
13
583
590
595
Unit
nm
nm
nm
IF
20
mA
Caution
z
This product is a product developed as a display source of light usage, and the measurement standard matched to
the sensitivity of human eyes is applied.
Therefore, functional usages (source of light for the sensor and the communication) other than the source of light for
the display is not intended.
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
TLRM1050
IF – V F
IV – IF
100
Ta = 25°C
IV (mcd)
(mA)
Ta = 25°C
1000
Luminous intensity
Forward current
IF
30
3000
10
3
1
1.8
2.0
2.2
2.4
2.6
Forward voltage
VF
2.8
300
100
30
10
1
3.0
(V)
3
10
Forward current
IV – Tc
30
IF
100
(mA)
Wavelength characteristic
1.0
10
Ta = 25°C
5
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
Case temperature
80
Tc
0.8
0.6
0.4
0.2
0
580
100
600
620
640
Wavelength
(°C)
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
30°
20°
10°
0°
40°
20°
30°
40°
50°
50°
60°
60°
70°
70°
80°
90°
10°
80°
0
90°
0.2 0.4 0.6 0.8 1.0
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
TLRMM1050
IF – V F
IV – IF
100
Ta = 25°C
IV (mcd)
(mA)
Ta = 25°C
1000
Luminous intensity
Forward current
IF
30
3000
10
3
1
1.8
2.0
2.2
2.4
2.6
Forward voltage
2.8
VF
300
100
30
10
1
3.0
3
10
Forward current
(V)
IV – Tc
30
IF
100
(mA)
Wavelength characteristic
1.0
10
Ta = 25°C
5
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
Case temperature
80
Tc
0.8
0.6
0.4
0.2
0
580
100
(°C)
600
620
640
Wavelength
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
30°
20°
10°
0°
40°
20°
30°
40°
50°
50°
60°
60°
70°
70°
80°
90°
10°
80°
0
90°
0.2 0.4 0.6 0.8 1.0
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
TLSM1050
IF – V F
IV – IF
100
Ta = 25°C
IV (mcd)
(mA)
Ta = 25°C
1000
Luminous intensity
Forward current
IF
30
3000
10
3
1
1.8
2.0
2.2
2.4
2.6
Forward voltage
VF
2.8
300
100
30
10
1
3.0
(V)
3
10
Forward current
IV – Tc
30
IF
100
(mA)
Wavelength characteristic
1.0
10
Ta = 25°C
5
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
Case temperature
80
Tc
0.8
0.6
0.4
0.2
0
580
100
(°C)
600
620
640
Wavelength
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
30°
20°
10°
0°
40°
20°
30°
40°
50°
50°
60°
60°
70°
70°
80°
90°
10°
80°
0
90°
0.2 0.4 0.6 0.8 1.0
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
TLOM1050
IF – V F
IV – IF
100
Ta = 25°C
IV (mcd)
(mA)
Ta = 25°C
1000
Luminous intensity
Forward current
IF
30
3000
10
3
1
1.8
2.0
2.2
2.4
2.6
Forward voltage
VF
2.8
300
100
30
10
1
3.0
(V)
3
10
Forward current
IV – Tc
30
IF
100
(mA)
Wavelength characteristic
1.0
10
Ta = 25°C
5
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
Case temperature
80
Tc
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
600
Wavelength
620
0.4
640
660
λ (nm)
Radiation pattern
Ta = 25°C
30°
20°
10°
0°
40°
20°
30°
40°
50°
50°
60°
60°
70°
70°
80°
90°
10°
80°
0
90°
0.2 0.4 0.6 0.8 1.0
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
TLYM1050
IF – V F
IV – IF
100
Ta = 25°C
IV (mcd)
(mA)
Ta = 25°C
1000
Luminous intensity
Forward current
IF
30
3000
10
3
1
1.8
2.0
2.2
2.4
2.6
Forward voltage
VF
2.8
300
100
30
10
1
3.0
(V)
10
Forward current
IV – Tc
30
IF
100
(mA)
Wavelength characteristic
10
1.0
IF = 20 mA
IV
5
Relative luminous intensity
Relative luminous intensity
3
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
Case temperature
80
Tc
Ta = 25°C
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
600
Wavelength
620
640
660
λ (nm)
Radiation pattern
Ta = 25°C
30°
20°
10°
0°
40°
20°
30°
40°
50°
50°
60°
60°
70°
70°
80°
90°
10°
80°
0
90°
0.2 0.4 0.6 0.8 1.0
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
Packaging
These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent moisture
absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering
and they should therefore be stored under the following conditions:
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an environment
of 5°C to 30°C/70% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color changes to
pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 12 to 24 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be sure
to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do not
toss or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max(*)
10 s max (*)
(*)
(*)
260°C max
140 to 160°C max(*)
(*)
4°C/s max(*)
4°C/s max
60 to 120 s max(*)
Time
Package surface
temperature (°C)
Package surface
temperature (°C)
240°C max
4°C/s max(*)
max(*)
150 to 180°C 230°C
4°C/s max(*)
60 to 120 s max(*)
Time
(s)
30 to 50s max(*)
(s)
•
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the
above conditions.
•
Perform the first reflow soldering in accordance with the above temperature profile and within 168 hours of opening
the package.
•
Second time reflow
In case of second reflow soldering should be performed within 168 hours of the first reflow under the above conditions.
Storage conditions before the second reflow soldering: 5 to 30°C, 70% RH max
•
Do not perform flow soldering and dip soldering.
•
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: Less than 25 W
Temperature:
Less than 350°C or less
Time:
within 3 s (Up to one time per place)
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
Recommended soldering pattern
2.45
1.3
Unit: mm
2.45
2.7
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. Our dipping
tests (carried out under the recommended conditions) confirm that these solvents have no effect on
semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account the
cleaning conditions and usage conditions.
Cleaning Solvent
Manufacturer
ASAHI CLEAN AK-225AES
KAO CLEAN THROUGH 750H
PINE ALPHA ST-100S
ASAHI GLASS
KAO
ARAKAWA CHEMICAL
Precautions When Mounting
Do not apply force to plastic parts of the LED under high-temperature conditions.
The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.
When installing the PCB in a product, ensure that the device does not come into contact with other components.
This product doesn't apply mounting that solder flow. Please mount on recommended reflow solder mounting condition.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method of
classification is as below. (This method, however, does not apply to products whose electrical characteristics
differ from standard Toshiba specifications.)
(1) Tape Type: T20 (8-mm pitch)
(2) Example
TLSM1050
(T20)
Tape type
Toshiba product No.
2. Handling precautions
Tape material protected against static electricity. However, static electricity may occur depending on
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable
when peeling a tape cover.
(a) In process, taping materials may sustain an electrostatic charge, use an ionizer to
neutralize the ions.
(b) For transport and temporary storage of devices, use containers(boxes, jigs, and bags) that
are made of anti-static materials or of materials that dissipate electrostatic electricity.
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
3. Tape dimensions
(Unit: mm)
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
1.5
+0.1/−0
P2
2.0
±0.05
E
1.75
±0.1
W
12.0
±0.2
P0
4.0
±0.1
P
8.0
±0.1
t
0.4
±0.05
A0
5.5
±0.1
F
5.5
±0.05
B0
5.5
±0.1
D1
1.6
±0.1
K0
4.4
±0.1
K0
P0
D
t
P2
E
F
W
B0
P
D1
POLARITY
A0
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
4. Reel dimensions
Unit: mm
13 ± 0.3
φ60
2 ± 0.5
φ13
φ44
180 +0
−4
15.4 ± 1.0
5. Leader and trailer section of tape
40mm or more
40mm or more
Leading part 190 mm (min)
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
6. Packing form
(1) Packing quantity
Reel
400 pcs
Carton
2,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
7. Label format
(1) Example: TLSM1050 (T20)
P/N:
TOSHIBA
TYPE
TLSM1050
ADDC
(T20)
Q’TY
Lot Number
Key code for TSB
(RANK SYMBOL)
400 pcs
32C
400
Use under 5-30degC/70%RH within 168h
SEALED
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y380xxxxxxxxxxxxxxxxxx*
(2)Label location
•
Reel
•
Carton
Tape reel direction
Label position
Label position
•
The aluminum package in which the reel is supplied also has a copy of the label
attached to the center of one side.
*The Lot Number includes the following information.
Example: 270 9 D 3 G
a
→
“Packaged April 27, 2009”
bcde
a:
Domestic ID
b:
Last digit of the year (CE): “0” (Y2000), “1” (Y2001), “2” (Y2002) to “9” (Y2009)
c:
Month: “A” (Jan), “B” (Feb), “C” (Mar) to “L” (Dec)
d:
Decade of the month: “1” (First), “2” (Middle), “3” (Last)
e:
Day in d above: “A” (1st), “B” (2nd), “C” (3rd) to “J” (9th), “K” (10th)
Repeated for each decade
“L” denotes the 31st of the month
“I” is not used to denote a day in this date system
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2009-07-09
TL(RM,RMM,SM,OM,YM)1050(T20)
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this
document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to
property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with
(a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets
and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and
(b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own
product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs,
algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and
applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is
neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a
malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended
Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical
equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control
combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in
finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2)
DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR
INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,
ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for
the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and
Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are
strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2009-07-09