TLWF1100D(T11
LED Lamps
InGaN and Phosphor
TLWF1100D(T11
1. Applications
•
General Lighting
•
Backlighting
•
Pilot Lamps
2. Features
(1)
Size: 3.2 (L) mm × 2.9 (W) mm × 1.9 (H) mm
(2)
Luminous intensity: IV = 1800 mcd (typ.) @IF = 20 mA
(3)
LED chip and phosphor
(4)
Emitting material: InGaN
(5)
Color: White (Daylight)
(6)
High heat-resistant type: Topr/Tstg = -40 to 100
(7)
Designed to be mounted with automatic pick-and-place equipment
(8)
Reflow soldering is possible
(9)
Standard embossed tape packing: 4-mm pitch: T11 type (2,000 pcs/reel), 8-mm tape/reel
3. Packaging and Internal Circuit
1: Anode
2: Cathode
4-3V1S
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TLWF1100D(T11
)
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25
25
Characteristics
Symbol
Note
Max
Unit
Forward current (DC)
IF
See Fig. 4.1
30
mA
Reverse voltage
VR
5
V
Power dissipation
PD
120
mW
Operating temperature
Topr
-40 to 100
Storage temperature
Tstg
-40 to 100
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Fig. 4.1 Forward Current Derating, IF - Ta
5. Handling Precautions
•
ESD withstand voltage according to MIL STD 883D, Method 3015.7: ≥ 1000 V
When handling this LED, take the following measures to prevent the LED from being damaged or
otherwise adversely affected.
1. Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2. Operators handling laser diodes must be grounded via a high resistance (about 1 MΩ). A conductive
strap is good for this purpose.
3. Ground all tools including soldering irons.
•
Since this product is intended to be used for display lighting, the measurement standard is based on the
spectral sensitivity of the human eye. It is not intended to be used for any applications other than display
lighting (e.g., sensors and light communications systems.)
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6. Electrical Characteristics (Unless otherwise specified, Ta = 25
25
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Forward voltage
VF
IF = 20 mA
2.5
3.3
4.0
V
Reverse current
IR
VR = 5 V
10
µA
Min
Typ.
Max
Unit
1000
1800
4000
7. Optical Characteristics (Unless otherwise specified, Ta = 25
)
25
Characteristics
Chromaticity
Symbol
Note
Cx
See Fig. 7.1,
Table 7.1
IF = 20 mA
See Table 7.2
IF = 20 mA
Cy
Luminous intensity (on-axis)
IV
Test Condition
mcd
Fig. 7.1 Chromaticity Rank (Note)
Note:
Test conditions: IF = 20 mA, Ta = 25, Tolerance: ±0.01
Table 7.1 Chromaticity Rank (Note)
Rank
Cx
Cy
A0
0.280
0.248
0.296
0.276
0.283
0.305
0.264
0.267
0.296
0.276
0.311
0.294
0.307
0.315
0.287
0.295
0.311
0.294
0.330
0.318
0.330
0.339
0.307
0.315
B5
B6
Note:
This LED lamp is sorted into chromaticity coordinate groups shown above. Each reel includes the same rank
LEDs. Let the delivery ratio of each rank be unquestioned.
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Table 7.2 Luminous Intensity Rank (Note)
Rank
WA1
Note:
Test Condition
IF = 20 mA, Ta = 25
Luminous Intensity (Min)
Luminous Intensity (Max)
Unit
mcd
1000
1600
WA2
1250
2000
XA1
1600
2500
XA2
2000
3200
YA1
2500
4000
This LED lamp is sorted into luminous intensity ranks shown above. Each reel includes the same rank LEDs.
Let the delivery ratio of each rank be unquestioned.
Rank notations:The luminous intensity and chromaticity ranks are printed on labels as shown below:
Example: A0WA1
A0: Chromaticity rank
WA1: Luminous intensity rank
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8. Characteristics Curves (Note)
Note:
Fig. 8.1 IF - VF
Fig. 8.2 Relative Luminous Intensity - IF
Fig. 8.3 Relative Luminous Intensity - Ta
Fig. 8.4 Cx, Cy - IF
Fig. 8.5 Radiation Pattern
Fig. 8.6 Wavelength Characteristic
The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLWF1100D(T11
9. Packing
9.1. Moisture-Proof Packing
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air
before soldering and the device should therefore be stored under the following conditions:
•
This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5 to 30
Humidity: 90% (max)
•
After opening the moisture proof bag, the device should be assembled within 4 weeks in an environment of
5 to 30/60% RH or below.
•
If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60±5, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
•
Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
•
If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
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TLWF1100D(T11
10. Mounting Method
10.1. Precautions when Mounting
•
Do not apply force to the plastic part of the LED under high-temperature conditions.
•
To avoid damaging the LED plastic, do not apply friction using a hard material.
•
When installing the PCB in a product, ensure that the device does not come into contact with other
cmponents.
•
For this product, silicone is used as the encapsulated material. Therefore the top surface of this product is
soft. Please do not stress on the encapsulated part of LEDs to avoid affecting the reliability of the product.
When using the mounting devices, please use the picking up nozzle that does not affect the silicone resin.
10.2. Soldering
Following show examples of reflow soldering.
•
Temperature Profile (see following figures.)
Fig. 10.2.1 Temperature Profile for Pb Soldering Fig. 10.2.2 Temperature Profile for Lead(Pb)-free
Soldering (Example)
(Example)
•
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed
the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering
under the above conditions.
•
Please perform the first reflow soldering with reference to the above temperature profile and within 4
weeks of opening the package.
•
If a second reflow process is necessary, reflow soldering should be performed within 168 hours of the first
reflow under the above conditions. Storage conditions before the second reflow soldering: 30, 60% RH
(max)
•
Do not perform wave soldering.
•
Manual soldering with a soldering iron should meet the following conditions:
Temperature at tip of iron: 300 (max)
Soldering iron capacity: 25 W
Time: 3 seconds (max) (only once at each soldering point)
10.3. Land Pattern Dimensions for Reference Only
Fig. 10.3.1 Land Pattern Dimensions for Reference Only (Unit: mm)
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TLWF1100D(T11
11. Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed
that these solvents have no effect on semiconductor devices in our dipping test (under the recommended
conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition,
using condition and etc.
Recommended cleaning solvents
ASAHI CLEAN AK-225AES: (made by ASAHI GLASS)
KAO CLEANTHROUGH 750HS: (made by KAO)
PINE ALPHA ST-100S: (made by ARAKAWA CHEMICAL)
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12. Tape Specifications
12.1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the part number. The method of
classification is as below. (this method, however does not apply to products whose electrical characteristics differ
from standard Toshiba specifications)
Example: TLWF1100D(T11
Toshiba part number: TLWF1100D
Tape type: T11(4-mm pitch)
12.2. Tape Dimensions
Table 12.2.1 Tape Dimensions (Unit: mm)
Dimensions
D
E
P0
t
F
D1
P2
W
P
A0
B0
K0
1.5
1.75
4.0
0.3
3.5
1.5
2.0
8.0
4.0
2.9
3.7
2.3
±0.1
±0.1
±0.05
±0.05
±0.1
±0.05
±0.3
±0.1
±0.1
±0.1
±0.1
Tolerance +0.1/-0
Fig. 12.2.1 Tape Dimensions
12.3. Reel Specification
12.3.1. Reel Dimensions
Fig. 12.3.1.1 Reel Dimensions
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TLWF1100D(T11
12.3.2. Tape Leader and Trailer
Fig. 12.3.2.1 Tape Leader and Trailer
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TLWF1100D(T11
12.4. Packing Form
Each reel is sealed in an aluminum pack with silica gel. Packing quantity is as shown below.
•
Reel: 2,000 pcs
•
Carton: 10,000 pcs
12.5. Label Format
Label example for TLWF1100D(T11 and label location are as shown below.
12.5.1. Label Example
Fig. 12.5.1.1 Label Example
12.5.2. Label Details
No. (# refer to the
above label example)
Information for Toshiba Use
Remarks
(1)
Part No.
TLWF1100D(T11
(2)
ADD code
Notation explanation
(O Assembled in Japan, sales for domestic and overseas customers
(J Assembled in overseas factory, sales for domestic customers
(T Assembled in overseas factory, sales for overseas customers
(3)
Lot code
Example: 270xxxxx
(4)
Rank symbol
Example: A0WA1
(5)
Storage condition after opening
Use under 5 to 30/60%RH within 4 weeks
(6)
Packing quantity
Example: 2,000 pcs
(7)
Key code
Example: 12345
(8)
Country of origin
Example: JAPAN
12.5.3. Label Location
Fig. 12.5.3.1 Label Position on the Reel
Fig. 12.5.3.2 Label Position on the Carton
Aluminum pack: The aluminum pack in which the reel is supplied also has the label attached to center of one side.
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13. Internal Circuit
1: Anode
2: Cathode
Fig. 13.1 Internal Circuit
Package Dimensions
Unit: mm
Weight: 0.035 g (typ.)
Package Name(s)
TOSHIBA: 4-3V1S
Nickname: PLCC2
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TLWF1100D(T11
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product
is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/
or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace
industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,
equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange
and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology
are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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