TC74HCT174AP/AF/AFN TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74HCT174AP,TC74HCT174AF,TC74HCT174AFN Hex D-Type Flip Flop with Clear The TC74HCT174A is a high speed CMOS D-TYPE FLIP FLOP fabricated with silicon gate C2MOS technology. It achieves the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. This device may be used as a level converter for interfacing TTL or NMOS to High Speed CMOS. The inputs are compatible with TTL, NMOS and CMOS output voltage levels. Information signals applied to the D inputs are transferred to the Q outputs on the positive going edge of the clock pulse. When the CLR input is held low, the Q outputs are in the low logic level independent of the other inputs. All inputs are equipped with protection circuits against static discharge or transient excess voltage. Note: xxxFN (JEDEC SOP) is not available in Japan. TC74HCT174AP TC74HCT174AF Features • High speed: fmax = 56 MHz (typ.) at VCC = 5 V • Low power dissipation: ICC = 4 μA (max) at Ta = 25°C • Compatible with TTL outputs: VIH = 2.0 V (min) VIL = 0.8 V (max) • Wide interfacing ability: LSTTL, NMOS, CMOS • Output drive capability: 10 LSTTL loads • • Symmetrical output impedance: |IOH| = IOL = 4 mA (min) Balanced propagation delays: tpLH ∼ − tpHL • Pin and function compatible with 74LS174 TC74HCT174AFN Pin Assignment Weight DIP16-P-300-2.54A SOP16-P-300-1.27A SOL16-P-150-1.27 1 : 1.00 g (typ.) : 0.18 g (typ.) : 0.13 g (typ.) 2007-10-01 TC74HCT174AP/AF/AFN IEC Logic Symbol Truth Table Inputs Output Function CLR D CK Q L X X L Clear H L L ⎯ H H H ⎯ H X Qn No Change X: Don’t care System Diagram 2 2007-10-01 TC74HCT174AP/AF/AFN Absolute Maximum Ratings (Note 1) Characteristics Supply voltage range Symbol Rating Unit VCC −0.5 to 7 V VIN −0.5 to VCC + 0.5 V VOUT −0.5 to VCC + 0.5 V Input diode current IIK ±20 mA Output diode current IOK ±20 mA DC output current IOUT ±25 mA DC VCC/ground current ICC ±50 mA Power dissipation PD 500 (DIP) (Note 2)/180 (SOP) mW Storage temperature Tstg −65 to 150 °C DC input voltage DC output voltage Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be applied until 300 mW. Operating Ranges (Note) Characteristics Supply voltage Input voltage Symbol Rating Unit VCC 4.5 to 5.5 V VIN 0 to VCC V VOUT 0 to VCC V Operating temperature Topr −40 to 85 °C Input rise and fall time tr, tf 0 to 500 ns Output voltage Note: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Electrical Characteristics DC Characteristics Characteristics Symbol Ta = −40 to 85°C Ta = 25°C Test Condition VCC (V) Min Typ. Max Min Max Unit High-level input voltage VIH ⎯ 4.5 to 5.5 2.0 ⎯ ⎯ 2.0 ⎯ V Low-level input voltage VIL ⎯ 4.5 to 5.5 ⎯ ⎯ 0.8 ⎯ 0.8 V High-level output voltage VOH IOH = −20 μA VIN = VIH or IOH = −4 mA VIL Low-level output voltage VOL IOL = 20 μA VIN = VIH or IOL = 4 mA VIL IIN ICC Input leakage current Quiescent supply current IC 4.5 4.4 4.5 ⎯ 4.4 ⎯ 4.5 4.18 4.31 ⎯ 4.13 ⎯ 4.5 ⎯ 0.0 0.1 ⎯ 0.1 4.5 ⎯ 0.17 0.26 ⎯ 0.33 VIN = VCC or GND 5.5 ⎯ ⎯ ±0.1 ⎯ ±1.0 μA VIN = VCC or GND 5.5 ⎯ ⎯ 4.0 ⎯ 40.0 μA 5.5 ⎯ ⎯ 2.0 ⎯ 2.9 mA Per input: VIN = 0.5 V or 2.4 V Other input: VCC or GND 3 V V 2007-10-01 TC74HCT174AP/AF/AFN Timing Requirements (input: tr = tf = 6 ns) Characteristics Symbol Limit Limit 4.5 ⎯ 15 19 5.5 ⎯ 14 18 4.5 ⎯ 15 19 5.5 ⎯ 14 18 4.5 ⎯ 20 25 5.5 ⎯ 18 23 4.5 ⎯ 5 5 5.5 ⎯ 5 5 4.5 ⎯ 10 10 5.5 ⎯ 10 10 4.5 ⎯ 30 24 5.5 ⎯ 33 26 Test Condition Min Typ. Max Unit ⎯ ⎯ 12 15 ns ⎯ ⎯ 29 36 ns tpHL ⎯ ⎯ 29 36 ns fmax ⎯ 32 61 ⎯ MHz (CK) tW (H) ⎯ tW (L) ⎯ Minimum set-up time ts ⎯ Minimum hold time th ⎯ trem ⎯ f ⎯ Minimum removal time ( CLR ) Clock frequency Unit Typ. tW (L) ( CLR ) Ta = −40 to 85°C VCC (V) Minimum pulse width Minimum pulse width Ta = 25°C Test Condition ns ns ns ns ns MHz AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25°C, input: tr = tf = 6 ns) Characteristics Output transition time Symbol tTLH tTHL Propagation delay time tpLH (CK-Q) tpHL Propagation delay time ( CLR -Q) Maximum clock frequency 4 2007-10-01 TC74HCT174AP/AF/AFN AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns) Characteristics Output transition time Symbol tTLH tTHL Propagation delay time tpLH (CK-Q) tpHL Propagation delay time Min Typ. Max Min Max 4.5 ⎯ 8 15 ⎯ 19 5.5 ⎯ 7 14 ⎯ 18 4.5 ⎯ 20 34 ⎯ 43 5.5 ⎯ 17 31 ⎯ 39 4.5 ⎯ 20 34 ⎯ 43 5.5 ⎯ 17 31 ⎯ 39 4.5 30 54 ⎯ 24 ⎯ 5.5 33 57 ⎯ 26 ⎯ ⎯ ⎯ 5 10 ⎯ 10 pF ⎯ ⎯ 30 ⎯ ⎯ ⎯ pF ⎯ ⎯ Maximum clock frequency fmax ⎯ Input capacitance CIN Power dissipation capacitance CPD ( CLR -Q) Note: (Note) Unit VCC (V) ⎯ tpHL Ta = −40 to 85°C Ta = 25°C Test Condition ns ns ns MHz CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC/6 (per F/F) And the total CPD when n pcs. of flip flop operate can be gained by the following equation: CPD (total) = 18 + 12･n 5 2007-10-01 TC74HCT174AP/AF/AFN Package Dimensions Weight: 1.00 g (typ.) 6 2007-10-01 TC74HCT174AP/AF/AFN Package Dimensions Weight: 0.18 g (typ.) 7 2007-10-01 TC74HCT174AP/AF/AFN Package Dimensions (Note) Note: This package is not available in Japan. Weight: 0.13 g (typ.) 8 2007-10-01 TC74HCT174AP/AF/AFN RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 9 2007-10-01