TOSHIBA TC74HC175AP_07

TC74HC175AP/AF/AFN
TOSHIBA CMOS Digital Integrated Circuit
Silicon Monolithic
TC74HC175AP,TC74HC175AF,TC74HC175AFN
Quad D-Type Flip Flop with Clear
The TC74HC175A is a high speed CMOS D-TYPE FLIP FLOP
fabricated with silicon gate C2MOS technology.
It achieves the high speed operation similar to equivalent
LSTTL while maintaining the CMOS low power dissipation.
Information signals applied to D inputs are transferred to the
Q and Q outputs on the positive going edge of the clock pulse.
When the CLR input is held low, the Q outputs are at the low
logic level and the Q outputs are at the high logic level
independent of the other inputs.
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
Note: xxxFN (JEDEC SOP) is not available in
Japan.
TC74HC175AP
TC74HC175AF
Features
•
High speed: fmax = 63 MHz (typ.) at VCC = 5 V
•
Low power dissipation: ICC = 4 μA (max) at Ta = 25°C
•
High noise immunity: VNIH = VNIL = 28% VCC (min)
•
Symmetrical output impedance: |IOH| = IOL = 4 mA (min)
Balanced propagation delays: tpLH ∼
− tpHL
•
•
Wide operating voltage range: VCC (opr) = 2 to 6 V
•
Pin and function compatible with 74LS175
TC74HC175AFN
Pin Assignment
Weight
DIP16-P-300-2.54A
SOP16-P-300-1.27A
SOL16-P-150-1.27
1
: 1.00 g (typ.)
: 0.18 g (typ.)
: 0.13 g (typ.)
2007-10-01
TC74HC175AP/AF/AFN
IEC Logic Symbol
Truth Table
Inputs
Outputs
Function
CLR
D
CK
Q
Q
L
X
X
L
H
Clear
H
L
L
H
⎯
H
H
H
L
⎯
H
X
Qn
Qn
No Change
X: Don’t care
System Diagram
2
2007-10-01
TC74HC175AP/AF/AFN
Absolute Maximum Ratings (Note 1)
Characteristics
Symbol
Rating
Unit
Supply voltage range
VCC
−0.5 to 7
V
DC input voltage
VIN
−0.5 to VCC + 0.5
V
VOUT
−0.5 to VCC + 0.5
V
Input diode current
IIK
±20
mA
Output diode current
IOK
±20
mA
DC output current
IOUT
±25
mA
DC VCC/ground current
ICC
±50
mA
Power dissipation
PD
500 (DIP) (Note 2)/180 (SOP)
mW
Storage temperature
Tstg
−65 to 150
°C
DC output voltage
Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or
even destruction.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be
applied until 300 mW.
Operating Ranges (Note)
Characteristics
Symbol
Rating
Unit
Supply voltage
VCC
2 to 6
V
Input voltage
VIN
0 to VCC
V
VOUT
0 to VCC
V
Operating temperature
Topr
−40 to 85
°C
Input rise and fall time
tr, tf
Output voltage
0 to 1000 (VCC = 2.0 V)
0 to 500 (VCC = 4.5 V)
ns
0 to 400 (VCC = 6.0 V)
Note:
The operating ranges must be maintained to ensure the normal operation of the device.
Unused inputs must be tied to either VCC or GND.
3
2007-10-01
TC74HC175AP/AF/AFN
Electrical Characteristics
DC Characteristics
Characteristics
High-level input
voltage
Low-level input
voltage
VCC (V)
Min
Typ.
Max
Min
Max
2.0
1.50
⎯
⎯
1.50
⎯
4.5
3.15
⎯
⎯
3.15
⎯
6.0
4.20
⎯
⎯
4.20
⎯
2.0
⎯
⎯
0.50
⎯
0.50
4.5
⎯
⎯
1.35
⎯
1.35
6.0
⎯
⎯
1.80
⎯
1.80
2.0
1.9
2.0
⎯
1.9
⎯
4.5
4.4
4.5
⎯
4.4
⎯
6.0
5.9
6.0
⎯
5.9
⎯
IOH = −4 mA
4.5
4.18
4.31
⎯
4.13
⎯
IOH = −5.2 mA
6.0
5.68
5.80
⎯
5.63
⎯
2.0
⎯
0.0
0.1
⎯
0.1
4.5
⎯
0.0
0.1
⎯
0.1
6.0
⎯
0.0
0.1
⎯
0.1
IOL = 4 mA
4.5
⎯
0.17
0.26
⎯
0.33
IOL = 5.2 mA
6.0
⎯
0.18
0.26
⎯
0.33
⎯
VIH
⎯
VIL
IOH = −20 μA
High-level output
voltage
VOH
VIN
= VIH or VIL
IOL = 20 μA
Low-level output
voltage
VOL
Ta =
−40 to 85°C
Ta = 25°C
Test Condition
Symbol
VIN
= VIH or VIL
Unit
V
V
V
V
Input leakage
current
IIN
VIN = VCC or GND
6.0
⎯
⎯
±0.1
⎯
±1.0
μA
Quiescent supply
current
ICC
VIN = VCC or GND
6.0
⎯
⎯
4.0
⎯
40.0
μA
4
2007-10-01
TC74HC175AP/AF/AFN
Timing Requirements (input: tr = tf = 6 ns)
Characteristics
Symbol
Minimum pulse width
tW (L)
(CK)
tW (H)
Minimum pulse width
( CLR )
Minimum set-up time
Minimum hold time
Minimum removal time
Clock frequency
Ta = 25°C
Test Condition
Typ.
Limit
Limit
2.0
⎯
75
95
4.5
⎯
15
19
6.0
⎯
13
16
2.0
⎯
75
95
4.5
⎯
15
19
6.0
⎯
13
16
2.0
⎯
75
95
4.5
⎯
15
19
6.0
⎯
13
16
2.0
⎯
0
0
4.5
⎯
0
0
6.0
⎯
0
0
2.0
⎯
75
95
4.5
⎯
15
19
6.0
⎯
13
16
2.0
⎯
6
5
4.5
⎯
31
25
6.0
⎯
36
29
Test Condition
Min
Typ.
Max
Unit
⎯
⎯
4
8
ns
⎯
⎯
16
24
ns
⎯
⎯
13
21
ns
⎯
36
63
⎯
MHz
⎯
⎯
ts
⎯
th
⎯
trem
⎯
f
Unit
VCC (V)
⎯
tW (L)
Ta =
−40 to
85°C
ns
ns
ns
ns
ns
MHz
AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25°C, input: tr = tf = 6 ns)
Characteristics
Output transition time
Symbol
tTLH
tTHL
Propagation delay time
tpLH
(CK-Q, Q )
tpHL
Propagation delay time
tpLH
( CLR -Q, Q )
tpHL
Maximum clock frequency
fmax
5
2007-10-01
TC74HC175AP/AF/AFN
AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns)
Characteristics
Output transition time
Symbol
tTLH
tTHL
Propagation delay time
tpLH
(CK-Q, Q )
tpHL
Propagation delay time
tpLH
( CLR -Q, Q )
tpHL
Maximum clock frequency
fmax
Input capacitance
CIN
Power dissipation
capacitance
CPD
Note:
(Note)
Ta =
−40 to 85°C
Ta = 25°C
Test Condition
Unit
VCC (V)
Min
Typ.
Max
Min
Max
2.0
⎯
30
75
⎯
95
4.5
⎯
8
15
⎯
19
6.0
⎯
7
13
⎯
16
2.0
⎯
70
140
⎯
175
4.5
⎯
19
28
⎯
35
6.0
⎯
16
24
⎯
30
2.0
⎯
50
125
⎯
160
4.5
⎯
16
25
⎯
32
6.0
⎯
12
22
⎯
27
2.0
6
14
⎯
5
⎯
4.5
31
53
⎯
25
⎯
6.0
36
63
⎯
29
⎯
⎯
⎯
5
10
⎯
10
pF
⎯
⎯
53
⎯
⎯
⎯
pF
⎯
⎯
⎯
⎯
ns
ns
ns
MHz
CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating
current consumption without load.
Average operating current can be obtained by the equation:
ICC (opr) = CPD・VCC・fIN + ICC/4 (per F/F)
And the total CPD when n pcs. of Flip Flop operate can be gained by the following equation:
CPD (total) = 32 + 21・n
6
2007-10-01
TC74HC175AP/AF/AFN
Package Dimensions
Weight: 1.00 g (typ.)
7
2007-10-01
TC74HC175AP/AF/AFN
Package Dimensions
Weight: 0.18 g (typ.)
8
2007-10-01
TC74HC175AP/AF/AFN
Package Dimensions (Note)
Note: This package is not available in Japan.
Weight: 0.13 g (typ.)
9
2007-10-01
TC74HC175AP/AF/AFN
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
10
2007-10-01