TC74HC273AP/AF TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74HC273AP,TC74HC273AF Octal D-Type Flip Flop with Clear The TC74HC273A is a high speed CMOS OCTAL D-TYPE FLIP FLOP fabricated with silicon gate C2MOS technology. It achieves the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. Information signals applied to D inputs are transferred to the Q outputs on the positive going edge of the clock pulse. When the CLR input is held “L”, the Q outputs are at a low logic level independent of the other inputs. All inputs are equipped with protection circuits against static discharge or transient excess voltage. TC74HC273AF Features • TC74HC273AP High speed: fmax = 67 MHz (typ.) at VCC = 5 V • Low power dissipation: ICC = 4 μA (max) at Ta = 25°C • High noise immunity: VNIH = VNIL = 28% VCC (min) • Output drive capability: 10 LSTTL loads • • Symmetrical output impedance: |IOH| = IOL = 4 mA (min) ∼ tpHL Balanced propagation delays: tpLH − • Wide operating voltage range: VCC (opr) = 2~6 V • Pin and function compatible with 74LS273 Weight DIP20-P-300-2.54A SOP20-P-300-1.27A : 1.30 g (typ.) : 0.22 g (typ.) Pin Assignment 1 2007-10-01 TC74HC273AP/AF IEC Logic Symbol Truth Table Inputs Output Function CLR D CK Q L X X L Clear H L L ⎯ H H H ⎯ H X Qn No change X: Don’t care System Diagram 2 2007-10-01 TC74HC273AP/AF Absolute Maximum Ratings (Note 1) Characteristics Symbol Rating Unit Supply voltage range VCC −0.5~7 V DC input voltage VIN −0.5~VCC + 0.5 V VOUT −0.5~VCC + 0.5 V Input diode current IIK ±20 mA Output diode current IOK ±20 mA DC output current IOUT ±25 mA DC VCC/ground current ICC ±50 mA Power dissipation PD 500 (DIP) (Note 2)/180 (SOP) mW Storage temperature Tstg −65~150 °C DC output voltage Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40~65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be applied until 300 mW. Operating Ranges (Note) Characteristics Symbol Rating Unit Supply voltage VCC 2~6 V Input voltage VIN 0~VCC V VOUT 0~VCC V Operating temperature Topr −40~85 °C Input rise and fall time tr, tf Output voltage 0~1000 (VCC = 2.0 V) 0~500 (VCC = 4.5 V) ns 0~400 (VCC = 6.0 V) Note: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. 3 2007-10-01 TC74HC273AP/AF Electrical Characteristics DC Characteristics Ta = 25°C Test Condition Characteristics High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Symbol VOL Typ. Max Min Max 2.0 1.50 ⎯ ⎯ 1.50 ⎯ 4.5 3.15 ⎯ ⎯ 3.15 ⎯ 6.0 4.20 ⎯ ⎯ 4.20 ⎯ 2.0 ⎯ ⎯ 0.50 ⎯ 0.50 4.5 ⎯ ⎯ 1.35 ⎯ 1.35 6.0 ⎯ ⎯ 1.80 ⎯ 1.80 2.0 1.9 2.0 ⎯ 1.9 ⎯ 4.5 4.4 4.5 ⎯ 4.4 ⎯ 6.0 5.9 6.0 ⎯ 5.9 ⎯ IOH = −4 mA 4.5 4.18 4.31 ⎯ 4.13 ⎯ IOH = −5.2 mA 6.0 5.68 5.80 ⎯ 5.63 ⎯ 2.0 ⎯ 0.0 0.1 ⎯ 0.1 4.5 ⎯ 0.0 0.1 ⎯ 0.1 6.0 ⎯ 0.0 0.1 ⎯ 0.1 IOL = 4 mA 4.5 ⎯ 0.17 0.26 ⎯ 0.33 IOL = 5.2 mA 6.0 ⎯ 0.18 0.26 ⎯ 0.33 ⎯ VIL VOH Min ⎯ VIH VIN = VIH or VIL VIN = VIH or VIL Ta = −40~85°C VCC (V) IOH = −20 μA IOL = 20 μA Unit V V V V Input leakage current IIN VIN = VCC or GND 6.0 ⎯ ⎯ ±0.1 ⎯ ±1.0 μA Quiescent supply current ICC VIN = VCC or GND 6.0 ⎯ ⎯ 4.0 ⎯ 40.0 μA Ta = −40 ~85°C Unit Timing Requirements (input: tr = tf = 6 ns) Characteristics Symbol Minimum pulse width tW (L) (CK) tW (H) Minimum pulse width ( CLR ) Minimum set-up time Minimum hold time Minimum removal time ( CLR ) Clock frequency Ta = 25°C Test Condition ⎯ ⎯ tW (L) ⎯ ts ⎯ th ⎯ trem ⎯ f 4 VCC (V) Typ. Limit Limit 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 0 0 4.5 ⎯ 0 0 6.0 ⎯ 0 0 2.0 ⎯ 50 65 4.5 ⎯ 10 13 6.0 ⎯ 9 11 2.0 ⎯ 6 5 4.5 ⎯ 30 24 6.0 ⎯ 35 28 ns ns ns ns ns MHz 2007-10-01 TC74HC273AP/AF AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25°C, input: tr = tf = 6 ns) Characteristics Symbol Test Condition Min Typ. Max Unit ⎯ ⎯ 4 8 ns ⎯ ⎯ 15 25 ns ⎯ ⎯ 16 27 ns ⎯ 40 67 ⎯ MHz tTLH Output transition time tTHL Propagation delay time tpLH (CK-Q) tpHL Propagation delay time tpLH ( CLR -Q) tpHL Maximum clock frequency fmax AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns) Ta = 25°C Test Condition Characteristics Output transition time Symbol tTLH tTHL Propagation delay time tpLH (CK-Q) tpHL Propagation delay time tpLH ( CLR -Q) tpHL Maximum clock frequency fmax Input capacitance CIN Power dissipation capacitance CPD Note: (Note) Ta = −40~85°C Unit VCC (V) Min Typ. Max Min Max 2.0 ⎯ 25 75 ⎯ 95 4.5 ⎯ 7 15 ⎯ 19 6.0 ⎯ 6 13 ⎯ 16 2.0 ⎯ 54 145 ⎯ 180 4.5 ⎯ 18 29 ⎯ 36 6.0 ⎯ 15 25 ⎯ 31 2.0 ⎯ 60 160 ⎯ 200 4.5 ⎯ 20 32 ⎯ 40 6.0 ⎯ 17 27 ⎯ 34 2.0 6 18 ⎯ 5 ⎯ 4.5 30 56 ⎯ 24 ⎯ 6.0 35 66 ⎯ 28 ⎯ ⎯ ⎯ 5 10 ⎯ 10 pF ⎯ ⎯ 43 ⎯ ⎯ ⎯ pF ⎯ ⎯ ⎯ ⎯ ns ns ns MHz CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC/8 (per flip flop) And the total CPD when n pcs. of flip flop operate can be gained by the following equation: CPD (total) = 32 + 11･n 5 2007-10-01 TC74HC273AP/AF Package Dimensions Weight: 1.30 g (typ.) 6 2007-10-01 TC74HC273AP/AF Package Dimensions Weight: 0.22 g (typ.) 7 2007-10-01 TC74HC273AP/AF RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. 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Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 8 2007-10-01