VISHAY FX5959G701ADJB5

FX5959G701
Vishay
Power LED Driver the Smallest and Low Profile,
Constant Current Source 0 - 2.0A, 2.5V to 7V, with 450W/in3
Power Density and High Efficiency
FEATURES
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The Power LED Driver is dedicated for optimum
performance to drive Power LED’s. FX5959 is a complete
system solution for all Power LED’s with high current for e.g.
> 300mA. The driver provides a constant current without
exceeding the applicable LED voltage to ensure the
specified LED load life time. The integrated Current Source
provides flexibility of utilizing various battery configurations
and chemistries such as NiCd, NiMH, or Li+ with input
voltage range of 2.5v to 6v. An additional flexibility is
provided by using external resistors to adapt to various
voltage input levels and LED configurations. For ultra-high
efficiency, the Power LED Driver is designed to operate in
synchronous rectified PWM mode under full load while
transforming into externally controlled pulse-skipping mode
(PSM) under light load (e.g. for LED’s with 20 to 200mA).
Fully integrated Power LED driver
High efficiency over large load range
100% duty cycle
Power density - more than 450W/inch3
1µA shutdown current
Variable input voltage 2.5V to 6V (1Li+ or 3-cell NiCd or NiMH cells)
Controlled output current
Programmable PWM/PSM controls
Low output ripple
BGA construction
Temperature range: - 40°C to + 85°C
No external components required
Output power 15W
Maximum current 2.5A
Short circuit protection
Low profile
The FX5959 Current Source is available in 25-ports BGA
package. In order to satisfy the stringent ambient
temperature requirements, the Current Source is designed
to handle the industrial temperature range of - 40°C to 85°C.
APPLICATION
• Bike lamps
• Headlights and flashlights
• Medical instrumentation
• General and emergency/alarm lighting
• Design and architectural lighting
• Interior and runway lights
• Outdoor accent lighting
• Household appliances
ORDERING INFORMATION
FX
5959
G701
ADJ
FUNCTION
SIZE
CIRCUIT IDENTIFIER
OUTPUT VOLTAGE - ADJ for adjustable version - self selectable output voltage. (see note below)
PACKAGING - B1 = 10pcs in bulk; B5 = 50pcs in bulk; T5 = 500pcs in 13” ree.
For lead (Pb)-free solder please add E2 suffix.
* Note: for fixed output current please contact [email protected]
Document Number: 10135
Revision: 18-Jan-05
For technical questions, contact [email protected]
For marketing questions, contact [email protected]
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FX5959G701
Vishay
L
DIMENSIONS in inches [millimeters]
B
0.59 ± 0.01
[15 ± 0.25]
L
A
0.1 ± 0.01
[2.54 ± 0.25]
B
0.95 ± 0.01
[2.29 ± 0.25]
T
0.126 max
[3.2 max]
Ball Diameter
0.03 ± 0.001
[0.762 ± 0.025]
B
A
BGA
T
R1
Vin
A
L
R0
R1
VTP
R0
VL
SD
PWM/PSM
SYNC
GND
PIN CONFIGURATION*
UPPER SIDE
21
22
23
24
25
16
17
18
19
20
11
12
13
14
15
6
7
8
9
10
1
2
3
4
5
PIN
*Note: must be connected to Vin.
CONNECTION
4, 5
Vin
9, 14
SD*
10, 15
PWM/PSM*
20, 25
SYNC*
1-3, 7, 8,
13, 18, 23
GND
19, 24
R1ext
21, 22
VTP
16, 17
R0ext
6, 11, 12
Load
RECOMMENDED PAD PATTERN in inches [millimeters]
D
A
D
F
0.1 ± 0.01
[2.54 ± 0.25]
0.03 ± 0.001
[0.8 ± 0.02]
0.02 ± 0.001
[0.5 ± 0.02]
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25
A
F
1
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A
Document Number: 10135
Revision: 18-Jan-05
FX5959G701
Vishay
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
UNIT
Input
Voltage Range
Quiescent Current
Soft Start Time
CONDITION
µA
PSM mode
TSS for Vout = 6.0V
TSS for Vout = 5.0V
TSS for Vout = 3.3V
ms
ms
ms
V
V
Power
Voltage
Current Tolerance
Temp. Coefficient
Ripple and Noise
General
Package Weight
Oscillator
Frequency
SYNC Range
Temperature
Operation
Storage
Operating Junction Temp.
Thermal Impedance
MAX
6.0
200
22
22
19
2.4
ms
ms
ms
VH
VL
IDD
IDD
IDD
TSS for Vout = 6.0V
TSS for Vout = 5.0V
TSS for Vout = 3.3V
VAC
Ω
nA
60Hz 60sec
VISO = 500 VDC
VISO = 500 VDC
750
1 x 1011
W
W
W
VDC
%
%/°C
mVpp
at 25 °C Ambient Temperature
at 85 °C Ambient Temperature
µA
µA
µA
Insulation
Test Voltage
Resistance
Leakage Current
Output
(VTP - VL) LOUT
TYP
2.5
VDC
SD, PWM/PSM,SYNC
Logic High
Logic Low
Normal Mode
PSM Mode
Shutdown Mode
Shutdown Time
MIN
0.8
750
250
1
15
14
14
5
1.5
0.8
15
7
at 25 °C Ambient Temperature
± 10
DC to 20 MHz
45
0.03
gr.
1.65
KHz
670
FSYNC/FOSC
°C
°C
°C
°C/WD*
1.2
1.5
- 40
- 55
+ 85
+ 125
Tj
θJA
150
82
*Note: WD = Power Dissipated
Rise Time
Fall Time
Rise Time (PWM mode): Vin = 3V; VTP= 3.3V; lout = 2.5A
Fall Time (PWM mode): Vin = 3V; VTP = 3.3V; lout = 2.5A
Document Number: 10135
Revision: 18-Jan-05
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FX5959G701
Vishay
Rise Time
Fall Time
Rise Time (PWM mode): Vin = 4.5V; VTP= 5V; lout = 2A
Fall Time (PWM mode): Vin = 4.5V; VTP = 5V; lout = 2A
Rise Time (PWM mode): Vin = 3.5V; VTP = 5V; lout = 2A
Fall Time (PWM mode): Vin = 3.5V; VTP = 5V; lout = 2A
Rise Time (PWM mode): Vin = 3V; VTP = 3.3V; lout = 2A
Fall Time (PWM mode): Vin = 3V; VTP = 3.3V; lout = 2A
Rise Time (PWM mode): Vin = 5V; VTP = 6V; lout = 1A
Fall Time (PWM mode): Vin = 5V; VTP = 6V; lout = 1A
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For technical questions, contact [email protected]
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Document Number: 10135
Revision: 18-Jan-05
FX5959G701
Vishay
Rise Time
Fall Time
Rise Time (PWM mode): Vin = 4V; VTP = 6V; lout = 1A
Fall Time (PWM mode): Vin = 4V; VTP = 6V; lout = 1A
Rise Time (PWM mode): Vin = 4.5V; VTP = 5V; lout = 1A
Fall Time (PWM mode): Vin = 4.5V; VTP = 5V; lout = 1A
Rise Time (PWM mode): Vin = 3.5V; VTP = 5V; lout = 1A
Fall Time (PWM mode): Vin = 3.5V; VTP = 5V; lout = 1A
Rise Time (PWM mode): Vin = 3V; VTP = 3.3V; lout = 1A
Fall Time (PWM mode): Vin = 3V; VTP = 3.3V; lout = 1A
Document Number: 10135
Revision: 18-Jan-05
For technical questions, contact [email protected]
For marketing questions, contact [email protected]
www.vishay.com
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FX5959G701
Vishay
PWM MODE FOR 6V LED
PWM MODE FOR 3.2V LED
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Document Number: 10135
Revision: 18-Jan-05
FX5959G701
Vishay
PWM MODE 2.8V LED
Document Number: 10135
Revision: 18-Jan-05
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FX5959G701
Vishay
PIN DESCRIPTION
R1
Vin
R0
R1
VTP
R0
VL
SD
PWM/PSM
SYNC
GND
PIN
SD
PWM/PSM
SYNC
Vin
GND
DESCRIPTION
Logic low on SD pin shuts down the Current Source completely and decreases current consumption to less than 1uA
Logic high =PWM mode, logic low =PSM mode. In PSM mode synchronous rectification is disabled.
Externally controlled synchronization signal. Logic high to low transition forces the clock synchronization.
If not used must be connected to Vin or logic high.
Input supply voltage
Ground
R1
Included inside the package for fixed voltage. To be added externally for all self-selected voltages.
VTP
Voltage test point. To test the minimum gap above VL.
R0
To be added externally for selected output current.
VL
Output current. LED connection
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Document Number: 10135
Revision: 18-Jan-05
FX5959G701
Vishay
DEMONSTRATION BOARD
TEST SET-UP AND OPERATION
Pins SD (Shut Down), PWM and SYNC (Synchronization) are
internally connected on the demo board to Vin.
1. Connect the DB according to the circuit drawing below
without connecting the LED
2. Use DC power supply, with current capability of twice the
output current.
3. Adjust VTP with R1 trimmer to a typical voltage of 0.6V above
the VL (LED voltage).
4. Connect the LED or equivalent resistor value according to
the circuit drawing below and adjust R0 trimmer to the
required current.
5. Input voltage can be adjusted between 2.5V to VTP.
RECOMMENDED BOARD LAYOUT
1.223in
(31.07 mm)
0.332 in
8.44 mm)
0.1 in (2.54 mm)
R0
8
R1
0.1 in (2.54 mm)
0.1 in
(2.54 mm)
Ø0.105 in
(2.66 mm)
PIn 1
4
Standard Strip 0.1" (2.54 mm) Centers,
Double Row
All Positions Filled
0.31 in
(7.9 mm)
PIN (0.64 mm)
PIN No:
View from bottom side
1
Ø Pad Recommended 0.060 in
0.1 in
(2.54 mm)
0.23in
(5.84 mm)
Ø Drill size
0.040 10 (1.02 mm)
5
1.13 in
(28.7 mm)
T18
50K
T18
10R
Ø0.105 in
(2.66 mm)
VISHAY
FX5959G701ADJ
B0044
R0
Current Adjust
1
2
3
4
5
6
7
8
Description
GND
VL
GND
Vin
Vin
GND
VL
TP
V
R1
Vin
+
R0
R1
VTP
R0
VL
A
SD
PWM/PSM
SYNC
GND
-
V
FX5959G701ADJ Demo Board
Document Number: 10135
Revision: 18-Jan-05
For technical questions, contact [email protected]
For marketing questions, contact [email protected]
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FX5959G701
Vishay
SOLDERING PROFILE
All of the components must be dried prior to assembly as follows:
1.Samples and package type B1 and B5, bulk components - the recommended drying process is to be done at 125°C for 48 hours.
2. For package type T1 and T2 - per JEDEC J-STD-033 level5.
For taped components the recommended drying process is to be done at maximum 70°C.
RECOMMENDED SOLDERING PROFILE
217°C/sec
Max
250
200
2.5°C/sec
Max
Temperature (°C)
0.5-1°C/sec
Time above
liquidus
30-90sec
150
100
30-60sec
Pre-Heating
zone
0.5-2.5°C/sec
50
0
50
100
150
200
300
250
Time (sec)
RECOMMENDED LEAD (PB)-FREE SOLDERING PROFILE
+ 0°C
235°C - 5°C
250
200
Temperature (°C)
2.5°C/sec
Max
Time above
liquidus
30-90sec
0.5-1°C/sec
150
100
30-60sec
Pre-Heating
zone
0.5-2.5°C/sec
50
0
50
100
150
200
250
300
350
400
Time (sec)
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Document Number: 10135
Revision: 18-Jan-05
FX5959G701
Vishay
TAPE AND REEL INFORMATION
PER STANDARD EIA-481-2-A
(REVISION OF 481-2 AND INCLUSION OF EIA-481-3)
20.00 + 0.10
2.00 + 0.10
Ø 1.50 + 0.10
1.75 + 0.10
4.00 + 0.10
11.50 + 0.10
24.00 + 0.30
– 0.10
Ø 1.50 + 0.25
0.356 + 0.013
8° MAX
4° MAX
15.80 + 0.10
15.75 + 0.10
3.80 + 0.10
Ao
Ko
Bo
W3
W2
N1
N
L
Q
M
W1
T5 - 13’’ REEL DIMENSIONS in millimeters
DIMENSION
MIN
L
MAX
330
M
12.8
N
20.2
N1
1.5
Q
100
W1
24.4
13.2
26.4
W2
30.4
W3
27.4
Document Number: 10135
Revision: 18-Jan-05
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