Point of note about solderability of lead free products (attach āGā to package name) Test Test condition Note Use of Sn-63Pb solder Bath Pass: Solder bath temperature = 230°C, Dipping time = 5 seconds solderability rate until forming The number of times = one, Use of R-type flux ā„ 95% parameter Solderability Use of Sn-3.0Ag-0.5Cu solder bath Solder bath temperature =245°C, Dipping time = 5 seconds The number of times = one, Use of R-type flux (use of lead free)