TA31149FNG TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG 2004-09-01 TA31149FNG Notice for Pb free product About solderability, following conditions were confirmed Solderability (1) Use of Sn-36Pb solder bath ・ solder bath temperature = 230℃ ・ dipping time = 5seconds ・ the number of times = once ・ use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder bath ・ solder bath temperature = 245℃ ・ dipping time = 5seconds ・ the number of times = once ・ use of R-type flux 2004-09-01